1N5614US thru 1N5622US VOIDLESS-HERMETICALLY-SEALED SURFACE MOUNT STANDARD RECOVERY GLASS RECTIFIERS SCOTTSDALE DIVISION APPEARANCE This “standard recovery” surface mount rectifier diode series is military qualified to MILPRF-19500/427 and is ideal for high-reliability applications where a failure cannot be tolerated. These industry-recognized 1.0 Amp rated rectifiers for working peak reverse voltages from 200 to 1000 volts are hermetically sealed with voidless-glass construction using an internal “Category I” metallurgical bond. These devices are also available in axial-leaded thru-hole package configurations (see separate data sheet for 1N5614 thru 1N5622). Microsemi also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speed requirements including fast and ultrafast device types in both through-hole and surface mount packages. Package “A” or D-5A IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES • • • • • • • APPLICATIONS / BENEFITS Surface mount package series equivalent to the JEDEC registered 1N5614 to 1N5622 series Voidless hermetically sealed glass package Triple-Layer Passivation Internal “Category I” Metallurgical bonds Working Peak Reverse Voltage 200 to 1000 Volts. JAN, JANTX, JANTXV, and JANS available per MILPRF-19500/427 Axial-leaded equivalents also available (see separate data sheet for 1N5614 thru 1N5622) • • • • • • • • MAXIMUM RATINGS • • • • • • o WWW . Microsemi .C OM DESCRIPTION Standard recovery 1 Amp rectifiers 200 to 1000 V Military and other high-reliability applications General rectifier applications including bridges, halfbridges, catch diodes, etc. High forward surge current capability Extremely robust construction Low thermal resistance Controlled avalanche with peak reverse power capability Inherently radiation hard as described in Microsemi MicroNote 050 MECHANICAL AND PACKAGING o Junction & Storage Temperature: -65 C to +200 C Thermal Resistance: 7oC/W junction to end cap Thermal Impedance: 4.5oC/W @ 10 ms heating time Average Rectified Forward Current (IO): 1.0 Amps @ TA = 55ºC and 0.75 Amps @ TA = 100ºC Forward Surge Current: 30 Amps @ 8.3 ms half-sine Solder Temperatures: 260ºC for 10 s (maximum) • • • • • • CASE: Hermetically sealed voidless hard glass with Tungsten slugs TERMINALS: End caps are solid Silver with Tin/Lead (Sn/Pb) finish. Note: Previous inventory has solid Silver end caps with Tin/Lead (Sn/Pb) finish. MARKING & POLARITY: Cathode band only TAPE & REEL option: Standard per EIA-481-B WEIGHT: 193 mg See package dimensions and recommended pad layout on last page ELECTRICAL CHARACTERISTICS 1N5614US 1N5616US 1N5618US 1N5620US 1N5622US MINIMUM BREAKDOWN VOLTAGE VBR @ 50μA VOLTS VOLTS 200 400 600 800 1000 220 440 660 880 1100 AVERAGE RECTIFIED CURRENT IO @ T A (NOTE 1) AMPS o o 55 C 100 C 1.00 .750 1.00 .750 1.00 .750 1.00 .750 1.00 .750 FORWARD VOLTAGE (MAX.) VF @ 3A REVERSE CURRENT (MAX.) IR @ VRWM μA VOLTS o 0.8 MIN. 1.3 MAX. 25 C 0.5 0.5 0.5 0.5 0.5 MAXIMUM SURGE CURRENT IFSM (NOTE 2) AMPS REVERSE RECOVERY (NOTE 3) trr 30 30 30 30 30 2.0 2.0 2.0 2.0 2.0 μs o 100 C 25 25 25 25 25 NOTE 1: From 1 Amp at TA = 55oC, derate linearly at 5.56 mA/ oC to 0.75 Amp at TA = 100oC. From TA = 100oC, derate linearly at 7.5 mA/oC to 0 Amps at TA = 200 oC. These ambient ratings are for PC boards where thermal o resistance from mounting point to ambient is sufficiently controlled where TJ(max) does not exceed 175 C. o NOTE 2: TA = 100 C, f = 60 Hz, IO = 750 mA for ten 8.3 ms surges @ 1 minute intervals NOTE 3: IF = 0.5A, IRM = 1A, IR(REC) = 0.250A Copyright © 2007 1-15-2007 REV B Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 1 1N5614US – 1N5622US TYPE WORKING PEAK REVERSE VOLTAGE VRWM 1N5614US thru 1N5622US VOIDLESS-HERMETICALLY-SEALED SURFACE MOUNT STANDARD RECOVERY GLASS RECTIFIERS SCOTTSDALE DIVISION VBR VRWM VF IR C trr Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range. Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current. Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and temperature. Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from the forward direction to the reverse direction and a specified decay point after a peak reverse current occurs. WWW . Microsemi .C OM Symbol SYMBOLS & DEFINITIONS Definition GRAPHS Copyright © 2007 1-15-2007 REV B 1N5614US – 1N5622US FIGURE 1 TYPICAL FORWARD VOLTAGE vs FORWARD CURRENT FIGURE 2 TYPICAL REVERSE CURRENT vs PIV Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 2 1N5614US thru 1N5622US SCOTTSDALE DIVISION VOIDLESS-HERMETICALLY-SEALED SURFACE MOUNT STANDARD RECOVERY GLASS RECTIFIERS WWW . Microsemi .C OM PACKAGE DIMENSIONS AND PAD LAYOUT NOTE: This Package Outline has also previously been identified as “D-5A” INCHES BD BL PAD LAYOUT mm INCHES mm A 0.246 6.25 MIN MAX MIN MAX B 0.067 1.70 .097 .103 2.46 2.62 C 0.105 2.67 .185 .200 4.70 5.08 ECT .019 .028 0.48 0.71 S .003 --- 0.08 --- Note: If mounting requires adhesive separate from the solder, an additional 0.060 inch diameter contact may be placed in the center between the pads as an optional spot for cement. 1N5614US – 1N5622US Copyright © 2007 1-15-2007 REV B Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 3