DTS3401 www.din-tek.jp P-Channel 30-V (D-S) MOSFET FEATURES PRODUCT SUMMARY VDS (V) - 30 RDS(on) (Ω) ID (A)a, b 0.088 at VGS = - 10 V - 2.7 0.130 at VGS = - 4.5 V - 2.2 Qg (Typ.) • Halogen-free Option Available • TrenchFET® Power MOSFET RoHS 4.1 nC APPLICATIONS COMPLIANT • Load Switch for Portable Devices TO-236 (SOT-23) S G 1 3 S G D 2 Top View D DTS3401 P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol Limit Drain-Source Voltage VDS - 30 Gate-Source Voltage VGS ± 20 TC = 25 °C TC = 70 °C Continuous Drain Current (TJ = 150 °C)a, b TA = 25 °C - 2.8 ID - 2.7a, b - 2.2a, b IDM TC = 25 °C Continuous Source-Drain Diode Currenta, b TA = 25 °C Maximum Power Dissipationa, b - 1.5 IS - 0.91a, b 1.8 TC = 70 °C 1.14 PD Soldering Recommendations (Peak Temperature) W 1.1a, b 0.7a, b TA = 70 °C TJ, Tstg Operating Junction and Storage Temperature Range A - 12 TC = 25 °C TA = 25 °C V - 3.5 TA = 70 °C Pulsed Drain Current (10 µs Pulse Width) Unit - 55 to 150 c °C 260 THERMAL RESISTANCE RATINGS Symbol Typical Maximum Maximum Junction-to-Ambienta, c t≤5s RthJA 90 115 Maximum Junction-to-Foot (Drain) Steady State RthJF 55 70 Parameter Unit °C/W Notes: a. Surface Mounted on 1" x 1" FR4 board. b. t = 5 s. c. Maximum under Steady State conditions is 166 °C/W. 1 DTS3401 www.din-tek.jp SPECIFICATIONS TJ = 25 °C, unless otherwise noted Parameter Symbol Test Conditions Min. VDS VGS = 0 V, ID = - 250 µA - 30 Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS Temperature Coefficient ΔVDS/TJ VGS(th) Temperature Coefficient ΔVGS(th)/TJ Gate-Source Threshold Voltage ID = - 250 µA VGS(th) VDS = VGS, ID = - 250 µA Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V Zero Gate Voltage Drain Current IDSS On-State Drain Currenta ID(on) Drain-Source On-State Resistancea Forward Transconductancea gfs mV/°C 4.5 -1 -3 V - 100 nA VDS = - 30 V, VGS = 0 V -1 VDS = - 30 V, VGS = 0 V, TJ = 55 °C - 10 VDS ≤ 5 V, VGS = - 10 V RDS(on) V - 32 -6 µA A VGS = - 10 V, ID = - 3.5 A 0.073 0.088 VGS = - 4.5 V, ID = - 2.5 A 0.110 0.138 VDS = - 10 V, ID = - 3.5 A 7 Ω S Dynamicb Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss 51 Total Gate Charge Qg 4.1 Gate-Source Charge Qgs Gate-Drain Charge Qgd Gate Resistance Rg Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time 340 VDS = - 15 V, VGS = 0 V, f = 1 MHz VDS = - 15 V, VGS = - 4.5 V, ID = - 2.5 A 67 pF 6.2 nC 1.3 1.8 f = 1 MHz td(on) VDD = - 15 V, RL = 15 Ω ID ≅ - 1 A, VGEN = - 4.5 V, Rg = 1 Ω tr td(off) Ω 10 40 60 40 60 20 40 tf 17 30 td(on) 5.5 10 13 25 VDD = - 15 V, RL = 15 Ω ID ≅ - 1 A, VGEN = - 10 V, Rg = 1 Ω tr td(off) tf 17 30 7.7 15 ns Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current TC = 25 °C IS Pulse Diode Forward Current ISM Body Diode Voltage VSD Body Diode Reverse Recovery Time trr Body Diode Reverse Recovery Charge Qrr Reverse Recovery Fall Time ta Reverse Recovery Rise Time tb - 1.5 - 12 IS = - 0.75 A, VGS = 0 V IF = - 2.5 A, dI/dt = 100 A/µs, TJ = 25 °C A - 0.8 - 1.2 V 17 30 ns 11 20 nC 12 5 ns Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2 DTS3401 www.din-tek.jp TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 12 2.0 VGS = 10 thru 6 V VGS = 5 V I D - Drain Current (A) I D - Drain Current (A) 10 VGS = 4 V 8 6 4 1.0 TC = 25 °C 0.5 VGS = 3 V 2 1.5 TC = 125 °C TC = - 55 °C VGS = 2 V 0 0.0 0.5 1.0 1.5 0.0 1.0 2.0 1.5 VDS - Drain-to-Source Voltage (V) 2.0 3.0 3.5 4.0 VGS - Gate-to-Source Voltage (V) Output Characteristics Transfer Characteristics 0.20 600 0.15 450 C - Capacitance (pF) R DS(on) - On-Resistance (Ω) 2.5 VGS = 4.5 V 0.10 VGS = 10 V Ciss 300 0.05 150 0.00 0 Coss Crss 0 3 6 9 0 12 6 12 24 30 VDS - Drain-to-Source Voltage (V) ID - Drain Current (A) On-Resistance vs. Drain Current and Gate Voltage Capacitance 10 1.8 ID = 2.5 A ID = 3.2 A VDS = 15 V VGS = 10 V 1.6 VDS = 7.5 V 6 VDS = 22.5 V 4 2 (Normalized) 8 R DS(on) - On-Resistance VGS - Gate-to-Source Voltage (V) 18 1.4 VGS = 4.5 V 1.2 1.0 0.8 0 0 2 4 6 Qg - Total Gate Charge (nC) Gate Charge 8 0.6 - 50 - 25 0 25 50 75 100 125 150 TJ - Junction Temperature (°C) On-Resistance vs. Junction Temperature 3 DTS3401 www.din-tek.jp TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 10 0.4 ID = 3.5 A R DS(on) - On-Resistance (Ω) I S - Source Current (A) TJ = 25 °C 1 TJ = 150 °C 0.1 TJ = - 50 °C 0.01 0.3 0.2 TJ = 125 °C 0.1 TJ = 25 °C 0.001 0.0 0.0 0.3 0.6 0.9 1.2 1.5 0 2 VSD - Source-to-Drain Voltage (V) Source-Drain Diode Forward Voltage 8 10 10 8 0.4 ID = 250 µA Power (W) ID = 1 mA 0.2 0.0 6 4 -0.2 -0.4 - 50 TA = 25 °C 2 - 25 0 25 50 75 100 125 0 0.01 150 0.1 1 10 100 TJ - Temperature (°C) Time (s) Threshold Voltage Single Pulse Power, Junction-to-Ambient 100 I D - Drain Current (A) Limited by RDS(on)* 100 µs 10 1 ms 1 10 ms 0.1 100 ms TA = 25 °C Single Pulse BVDSS Limited 0.01 0.1 1 10 1 s, 10 s 100 s, DC 100 VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified Safe Operating Area, Junction-to-Ambient 4 6 On-Resistance vs. Gate-to-Source Voltage 0.6 VGS(th) Variance (V) 4 VGS - Gate-to-Source Voltage (V) 1000 DTS3401 www.din-tek.jp THERMAL RATINGS (TA = 25 °C, unless otherwise noted) 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 100 10 1000 Square Wave Pulse Duration (s) 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 Notes: 0.1 0.1 PDM 0.05 t1 0.02 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJF = 70 °C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 10 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Foot Note • The characteristics shown in the two graphs - Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C) - Normalized Transient Thermal Impedance Junction-to-Foot (25 °C) are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities can widely vary depending on actual application parameters and operating conditions. 5 Package Information www.din-tek.jp SOT-23 (TO-236): 3-LEAD b 3 E1 1 E 2 e S e1 D 0.10 mm C 0.004" A2 A C q Gauge Plane Seating Plane Seating Plane C A1 Dim 0.25 mm L L1 MILLIMETERS INCHES Min Max Min Max A 0.89 1.12 0.035 0.044 A1 0.01 0.10 0.0004 0.004 A2 0.88 1.02 0.0346 0.040 b 0.35 0.50 0.014 0.020 c 0.085 0.18 0.003 0.007 D 2.80 3.04 0.110 0.120 E 2.10 2.64 0.083 0.104 E1 1.20 1.40 0.047 e e1 L 1.90 BSC 0.40 L1 q 0.0748 Ref 0.60 0.016 0.64 Ref S 0.024 0.025 Ref 0.50 Ref 3° 0.055 0.0374 Ref 0.95 BSC 0.020 Ref 8° 3° 8° ECN: S-03946-Rev. K, 09-Jul-01 DWG: 5479 1 Application Note www.din-tek.jp 0.049 (1.245) 0.029 0.022 (0.559) (0.724) 0.037 (0.950) (2.692) 0.106 RECOMMENDED MINIMUM PADS FOR SOT-23 0.053 (1.341) 0.097 (2.459) Recommended Minimum Pads Dimensions in Inches/(mm) Return to Index Return to Index APPLICATION NOTE 1 Legal Disclaimer Notice Disclaimer www.din-tek.jp ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Din-Tek Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Din-Tek”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Din-Tek makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Din-Tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Din-Tek’s knowledge of typical requirements that are often placed on Din-Tek products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Din-Tek’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Din-Tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Din-Tek product could result in personal injury or death. Customers using or selling Din-Tek products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Din-Tek personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Din-Tek. Product names and markings noted herein may be trademarks of their respective owners. Material Category Policy Din-Tek Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Din-Tek documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Din-Tek Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Din-Tek documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. 1