ETC AS5262

AS5262
12-Bit Magnetic Angle Position Sensor
1 General Description
2 Key Features
The AS5262 is a contactless magnetic angle position sensor for
accurate angular measurement over a full turn of 360°. A sub range
can be programmed to achieve the best resolution for the
application. It is a system-on-chip, combining integrated Hall
elements, analog front end, digital signal processing and best in
class automotive protection features in a single device.
360º contactless high resolution angular position sensing
To measure the angle, only a simple two-pole magnet, rotating over
the center of the chip, is required. The magnet may be placed above
or below the IC.
Powerful analog output
The absolute angle measurement provides instant indication of the
magnet’s angular position with a resolution of 0.022° = 16384
positions per revolution. According to this resolution the adjustment
of the application specific mechanical positions are possible. The
angular output data is available over a 12 bit ratiometric analog
output.
The AS5262 operates at a supply voltage of 5V and the supply and
output pins are protected against overvoltage up to +20V. In addition
the supply pins are protected against reverse polarity up to –20V.
Figure 1. Typical Arrangement of AS5262 and magnet
User programmable start and end point of the application region
+ linearization.
User programmable clamping levels and programming of the
transition point.
- Short circuit monitor
- High driving capability for resistive and capacitive loads
Wide temperature range: - 40°C to + 150°C
Small Pb-free package: MLF 16 6x6 (with dimple)
Broken GND and VDD detection over a wide range of different
load conditions.
Saw tooth mode 1,2,3,4 slopes per revolution
3 Benefits
Unique fully differential patented solution
Best protections for automotive applications
Easy to program
Additional linearization points for output characteristic
Ideal for applications in harsh environments due to contactless
position sensing
Robust system, tolerant to magnet misalignment, air gap
variations, temperature variations and external magnetic fields
High inherent accuracy
High driving capability of analog output (including diagnostics)
Broken GND and VDD detection for all external load cases
4 Applications
The AS5262 is ideal for automotive applications like throttle and
valve position sensing, gearbox position sensor, tumble flap, chassis
height level, pedal position sensing and contactless potentiometers.
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AS5262
Datasheet - A p p l i c a t i o n s
Figure 2. AS5262 Block Diagram
VDD3V3_T
VDD3V3_B
High Voltage/
Reverse Polarity
Protection
VDD_T
AS5262
VDD_B
Hall Array
Frontend
Amplifier
ADC
Sin
Cos
DSP
CORDIC
Controller
12
Single Pin
Interface
(UART)
12-bit
DAC
OUT
Driver
OUT_T
OUT_B
OTP Register
(Programming
Parameters)
GND_B
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GND_T
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AS5262
Datasheet - C o n t e n t s
Contents
1 General Description ..................................................................................................................................................................
1
2 Key Features.............................................................................................................................................................................
1
3 Benefits.....................................................................................................................................................................................
1
4 Applications...............................................................................................................................................................................
1
5 Pin Assignments .......................................................................................................................................................................
4
5.1 Pin Descriptions....................................................................................................................................................................................
4
6 Absolute Maximum Ratings ......................................................................................................................................................
5
7 Electrical Characteristics...........................................................................................................................................................
6
7.1 Operating Conditions............................................................................................................................................................................
6
7.2 Magnetic Input Specification.................................................................................................................................................................
6
7.3 Electrical System Specifications...........................................................................................................................................................
7
7.4 Timing Characteristics ..........................................................................................................................................................................
8
7.5 Power Management - Supply Monitor ..................................................................................................................................................
8
8 Detailed Description..................................................................................................................................................................
9
8.1 Operation..............................................................................................................................................................................................
9
8.1.1 VDD Voltage Monitor ................................................................................................................................................................... 9
8.2 Analog Output.......................................................................................................................................................................................
9
8.2.1 Programming Parameters..........................................................................................................................................................
8.2.2 Application Specific Angular Range Programming ....................................................................................................................
8.2.3 Application Specific Programming of the Break Point ...............................................................................................................
8.2.4 Full Scale Mode .........................................................................................................................................................................
8.2.5 Multiple Slope Output ................................................................................................................................................................
8.2.6 Linearization of the Output.........................................................................................................................................................
8.2.7 Resolution of Parameters ..........................................................................................................................................................
8.2.8 Analog Output Diagnostic Mode ................................................................................................................................................
8.2.9 Analog Output Driver Parameters..............................................................................................................................................
8.2.10 Noise Suppressor ....................................................................................................................................................................
8.2.11 Hysteresis Function .................................................................................................................................................................
10
10
11
11
12
13
13
15
15
16
16
9 Application Information ...........................................................................................................................................................
16
9.1 Recommended Application Schematic...............................................................................................................................................
9.2 Programming the AS5262 ..................................................................................................................................................................
9.2.1
9.2.2
9.2.3
9.2.4
9.2.5
9.2.6
UART Interface for Programming ..............................................................................................................................................
Frame Organization ...................................................................................................................................................................
WRITE (Command Description) ................................................................................................................................................
READ (Command Description)..................................................................................................................................................
Baud-rate Automatic Detection..................................................................................................................................................
Baud-rate Manual Setting (optional) ..........................................................................................................................................
16
18
18
18
20
21
21
21
9.3 OTP Programming Data .....................................................................................................................................................................
23
9.4 READ / WRITE Register Map.............................................................................................................................................................
27
9.5 READ Only Register Map...................................................................................................................................................................
28
9.6 Special Registers................................................................................................................................................................................
30
9.7 Programming Procedure ....................................................................................................................................................................
31
10 Package Drawings and Markings .........................................................................................................................................
32
11 Ordering Information .............................................................................................................................................................
35
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AS5262
Datasheet - P i n A s s i g n m e n t s
5 Pin Assignments
Figure 3. MLF-16 Pin Configuration (View from Top)
OUT_T
2
OUT_B
TP1_B
VDD_T
1
VDD_B
TP1_T
16
15
14
13
12
S_B
11
S_T
Epad
VDD3V3_T
3
10
TP3_B
VDD3V3_B
4
9
TP3_T
5
6
7
8
GND_T
GND_B
TP2_T
TP2_B
5.1 Pin Descriptions
Table 1. MLF-16 Pin Descriptions
Pin Number
Pin Name
Pin Type
Description
1
TP1_T
Test pin for fabrication. Connected to ground in the application.
2
TP1_B
DIO/AIO
Multi purpose pin
3
VDD3V3_T
4
VDD3V3_B
5
GND_T
6
GND_B
7
TP2_T
8
TP2_B
9
TP3_T
10
TP3_B
Test pin for fabrication. Left open in the application.
11
S_T
Test pin for fabrication. Connected to OUT_T in the application.
( special case for the connection possible → 4-wire mode)
12
S_B
13
OUT_T
14
OUT_B
15
VDD_T
16
VDD_B
Output of the LDO. 1µF required.
AIO
Supply pin
Output of the LDO. 1µF required.
Ground pin. Connected to ground in the application.
Ground pin. Connected to ground in the application.
Test pin for fabrication. Connected to ground in the application.
DIO/AIO
Multi purpose pin
AIO
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Test pin for fabrication. Connected to ground in the application.
Analog output pin
Supply pin
Test pin for fabrication. Connected to ground in the application.
Test pin for fabrication. Left open in the application.
Test pin for fabrication. Connected to OUT_B in the application.
( special case for the connection possible ® 4-wire mode)
Output pin analog output. Over this pin the programming is possible.
Output pin analog output. Over this pin the programming is possible.
Positive supply pin. This pin is over voltage protected.
Positive supply pin. This pin is over voltage protected.
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AS5262
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
6 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
VDD
DC supply voltage at pin VDD
Overvoltage
-20
20
V
No operation
VOUT
Output voltage OUT
-0.3
20
V
Permanent
Vdiff
Voltage difference at pin VDD and OUT
-20
20
V
VDD3V3
DC supply voltage at pin VDD3V3
-0.3
5
V
Iscr
Input current (latchup immunity)
-100
100
mA
Norm: AEC-Q100-004
±2
kV
Norm: AEC-Q100-002
+150
ºC
Min -67ºF; Max +257ºF
260
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020 “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”. The lead finish
for Pb-free leaded packages is matte tin (100%
Sn).
85
%
Electrical Parameters
Electrostatic Discharge
ESD
Electrostatic discharge
Temperature Ranges and Storage Conditions
Tstrg
Storage temperature
TBody
Body temperature
H
Humidity non-condensing
MSL
Moisture Sensitive Level
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-55
5
3
Revision 1.1
Represents a maximum floor life time of 168h
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AS5262
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
7 Electrical Characteristics
7.1 Operating Conditions
In this specification, all the defined tolerances for external components need to be assured over the whole operation conditions range and also
over lifetime.
Table 3. Operating Conditions
Symbol
Parameter
TAMB
Ambient temperature
Isupp
Supply current
VDD
Supply voltage at pin VDD
Conditions
Min
Typ
-40
Only for one die. Must be multiplied by 2
Max
Units
+150
ºC
12
mA
4.5
5.0
5.5
V
Typ
Max
Units
7.2 Magnetic Input Specification
TAMB = -40 to +150ºC, VDD = 4.5 to 5.5V (5V operation), unless otherwise noted.
Two-pole cylindrical diametrically magnetized source:
Table 4. Magnetic Input Specification
Symbol
Parameter
Conditions
Min
Bpk
Magnetic input field amplitude
Required vertical component of the
magnetic field strength on the die’s surface,
measured along a concentric circle with a
radius of 1.25 mm
30
70
mT
Bpkext
Magnetic input field amplitude
(extended) default setting
Required vertical component of the
magnetic field strength on the die’s surface,
measured along a concentric circle with a
radius of 1.25 mm. Increased sensor output
noise.
10
90
mT
Boff
Magnetic offset
Constant magnetic stray field
±5
mT
Field non-linearity
Including offset gradient
5
%
Displacement radius
Offset between defined device center and
magnet axis. Dependent on the selected
magnet. Including Eccentricity.
Disp
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AS5262
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
7.3 Electrical System Specifications
TAMB = -40 to +150ºC, VDD = 4.5 - 5.5V (5V operation), Magnetic Input Specification, unless otherwise noted.
Table 5. Electrical System Specifications
Symbol
Parameter
RES
Resolution Analog Output
INLopt
Conditions
Min
Typ
Max
Units
Range > 90º
1LSB=1.221mV typ
12
bit
Integral non-linearity (optimum)
Best aligned reference magnet at 25ºC
over full turn 360º.
0.5
deg
INLtemp
Integral non-linearity (optimum)
Best aligned reference magnet over
temperature -40 -150º over full turn 360º.
0.9
deg
INL
Integral non-linearity
Best aligned reference magnet over
temperature -40 -150º over full turn 360º
and displacement
1.4
deg
DNL
Differential non-linearity
ON
Output noise (360º segment)
tPwrUp
Power-up time 0-5V
tdelay
System propagation delay
absolute output: delay of ADC,
DSP and absolute interface
Monolitic
0.05
deg
1 LSB after filter peak/peak rms value
0.2
%/VDD
See Figure 4
10
ms
10kOhm, 100 µF RC filter
300
µs
Figure 4. Power-up timing Diagram
VDD
4.5V
OUT pin in HiZ
First Valid Data on OUT pin
tPwrUp
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AS5262
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
7.4 Timing Characteristics
Table 6. Timing Conditions
Symbol
Parameter
TDETWD
WachDog error detection time
Conditions
Min
Typ
Max
Units
12
ms
7.5 Power Management - Supply Monitor
Table 7. Power Management - Supply Monitor Conditions
Symbol
Parameter
VDDUVTH
Min
Typ
Max
Units
VDD undervoltage upper threshold
3.5
4.0
4.5
V
VDDUVTL
VDD undervoltage lower threshold
3.0
3.5
4.0
V
VDDUVHYS
VDD undervoltage hysteresis
300
500
900
mV
VDDUVDET
VDD undervoltage detection time
10
50
250
µs
VDDUVREC
VDD undervoltage recovery time
10
50
250
µs
VDDOVTH
VDD overvoltage upper threshold
6.0
6.5
7.0
V
VDDOVTL
VDD overvoltage lower threshold
5.5
6
6.5
V
VDDOVHYS
VDD overvoltage hysteresis
300
500
900
mV
ANATOVDET
VDD overvoltage detection time (analog
path)
10
50
250
µs
ANATOVREC
VDD overvoltage recovery time (analog
path)
10
50
250
µs
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Conditions
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AS5262
Datasheet - D e t a i l e d D e s c r i p t i o n
8 Detailed Description
The AS5262 is manufactured in a CMOS process and uses a spinning current Hall technology for sensing the magnetic field distribution across
the surface of the chip.
This IC consists of two galvanic isolated dies. All following in and register names refers to one die.
The integrated Hall elements are placed around the center of the device and deliver a voltage representation of the magnetic field at the surface
of the IC.
Through Sigma-Delta Analog / Digital Conversion and Digital Signal-Processing (DSP) algorithms, the AS5262 provides accurate high-resolution
absolute angular position information. For this purpose a Coordinate Rotation Digital Computer (CORDIC) calculates the angle and the
magnitude of the Hall array signals.
The DSP is also used to provide digital information at the outputs that indicate movements of the used magnet towards or away from the device’s
surface.
A small low cost diametrically magnetized (two-pole) standard magnet provides the angular position information.
The AS5262 senses the orientation of the magnetic field and calculates a 14-bit binary code. This code is mapped to a programmable output
characteristic in analog voltage format. This signal is available at the pin (OUT).
The application angular region can be programmed in a user friendly way. The start angle position T1 and the end point T2 can be set and
programmed according the mechanical range of the application with a resolution of 14 bits. In addition the T1Y and T2Y parameter can be set
and programmed according the application. The transition point 0 to 360 degree can be shifted using the break point parameter BP. The voltage
for clamping level low CLL and clamping level high CLH can be programmed with a resolution of 9 bits. Both levels are individually adjustable.
Two additional linearization points can be used to improve the system linearity. These points C1 and C2 are programmable.
The output parameters can be programmed in an OTP register. No additional voltage is required to program the AS5262. The setting may be
overwritten at any time and will be reset to default when power is cycled. To make the setting permanent, the OTP register must be programmed
by using a lock bit the content could be frozen for ever.
The AS5262 is tolerant to magnet misalignment and unwanted external magnetic fields due to differential measurement technique and Hall
sensor conditioning circuitry.
8.1 Operation
8.1.1
VDD Voltage Monitor
VDD Over Voltage Management. If the supply voltage at pin VDD exceeds the over-voltage upper threshold for longer than the detection
time the output is turned off. When the over voltage event has passed and the voltage applied to pin VDD falls below the over-voltage lower
threshold for longer than the recovery time the device enters the normal mode and the output is enabled.
VDD Under Voltage Management. When the voltage applied to the VDD pin falls below the under-voltage lower threshold for longer than
the detection time the output is turned off. When the voltage applied to the VDD pin exceeds the under-voltage upper threshold for longer than
the detection time the device enters the normal mode and the output is enabled.
8.2 Analog Output
By default (after programmed CUST_LOCK OTP bit) the analog output mode is selected. The pin OUT provides an analog voltage that is
proportional to the angle of the rotating magnet and ratiometric to the supply voltage VDD. It can source or sink currents up in normal operation.
A short circuit protection is in place and will switch the output driver in high Z in case of an overload event. Due to an intelligent approach a
permanent short circuit will not damage the device. This is also feasible in a high voltage condition up to 20 V and at the highest specified
ambient temperature.
After the digital signal processing (DSP) a 12-bit Digital-to-Analog converter and output stage provides the output signal.
The DSP maps the application range to the output characteristic. An inversion of the slope is also programmable to allow inversion of the rotation
direction.
The reference voltage for the Digital-to-Analog converter (DAC) is taken from VDD. In this mode, the output voltage is ratiometric to the supply
voltage.
An on-chip diagnostic feature handles the error state at the output. Depending on the failure the output is in HiZ condition or is driven in the
failure band. (see Table 9).
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AS5262
Datasheet - D e t a i l e d D e s c r i p t i o n
8.2.1
Programming Parameters
The analog output characteristic is programmable by OTP. Depending on the application, the analog output can be adjusted. The user can
program the following application specific parameters:
T2
Mechanical angle start point
Mechanical angle end point
T1Y
Voltage level at the T1 position
T2Y
Voltage level at the T2 position
CLL
Clamping Level Low
CLH
Clamping Level High
BP
Break point (transition point 0 to 360º)
C1
Calibration Point 1
C2
Calibration Point 2
C1Y
Trim value for C1
C2Y
Trim value for C2
T1
These parameters are input parameters. Using the available programming software and programmer these parameters are converted and finally
written into the AS5262 128 bit OTP memory.
8.2.2
Application Specific Angular Range Programming
The application range can be selected by programming T1 with a related T1Y and T2 with a related T2Y into the AS5262. The clamping levels
CLL and CLH can be programmed independent from the T1 and T2 position and both levels can be separately adjusted.
Figure 5. Programming of an Individual Application Range
Application range
90 degree
electrical range
T2
mechanical range
T1
100%VDD
clamping range
high
CLH
CLL
0 degree
T2Y
180 degree
CLH
T1Y
BP
CLL
0
270 degree
clamping range
low
T1
T2
Figure 5 shows a simple example of the selection of the range. The mechanical starting point T1 and the mechanical end point T2 are defining
the mechanical range. A sub range of the internal Cordic output range is used and mapped to the needed output characteristic. The analog
output signal has 12 bit, hence the level T1Y and T2Y can be adjusted with this resolution. As a result of this level and the calculated slope the
clamping region low is defined. The break point BP defines the transition between CLL and CLH. In this example the BP is set to 0 degree. The
BP is also the end point of the clamping level high CLH. This range is defined by the level CLH and the calculated slope. Both clamping levels
can be set independently form each other.
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AS5262
Datasheet - D e t a i l e d D e s c r i p t i o n
8.2.3
Application Specific Programming of the Break Point
The break point BP can be programmed as well with 14 bits. This is important when the default transition point is inside the application range. In
such a case the default transition point must be shifted out of the application range. The parameter BP defines the new position.
Figure 6. Individual Programming of the Break Point BP
8.2.4
Full Scale Mode
Figure 7. Full Scale Mode
Analog output Voltage
100 % VDD
0
360
For simplification, Figure 7 describes a linear output voltage from rail to rail (0V to VDD) over the complete rotation range. In practice, this is not
feasible due to saturation effects of the output stage transistors. The actual curve will be rounded towards the supply rails (as indicated Figure 7).
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AS5262
Datasheet - D e t a i l e d D e s c r i p t i o n
8.2.5
Multiple Slope Output
The AS5262 can be programmed to multiple slopes. Where one programmed reference slope characteristic is copied to multiple slopes. Two,
three and four slopes are selectable by the user OTP bits QUADEN (1:0). In addition to the steepness of the slope the clamping levels can be
programmed as well.
Figure 8. Two Slope Mode
Analogue output Voltage
100 % VDD
0
360
Figure 9. Four Slope Mode
Analogue output Voltage
100 % VDD
0
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360
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AS5262
Datasheet - D e t a i l e d D e s c r i p t i o n
8.2.6
Linearization of the Output
To improve the system linearity an additional 2 point linearization function is implemented in the AS5262.
Figure 10. Linearization of the Output Characteristic
100%VDD
CLH
T2Y
C2Y
C1Y
T1Y
CLL
0
T1
8.2.7
C1
C2
T2
Resolution of Parameters
The programming parameters have a wide resolution of up to 14 bits.
Table 8. Resolution of the Programming Parameters
Symbol
Parameter
Resolution
T1
Mechanical angle start point
14 bits
T2
Mechanical angle stop point
14 bits
T1Y
Mechanical start voltage level
12 bits
T2Y
Mechanical stop voltage level
12 bits
CLL
Clamping level low
9 bits
CLH
Clamping level high
9 bits
BP
Break point
14 bits
C1
Calibration Point 1
4 bits
C2
Calibration Point 2
4 bits
C1Y
Trim value C1
3 bits
C2Y
Trim value C2
3 bits
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AS5262
Datasheet - D e t a i l e d D e s c r i p t i o n
Figure 11. Overview of the Angular Output Voltage
100
96
Failure Band High
Clamping Region High
Output Voltage in percent of VDD
CLH
T2Y
Application Region
T1Y
CLL
Clamping Region Low
4
0
Failure Band Low
Figure 11 gives an overview of the different ranges. The failure bands are used to indicate a wrong operation of the AS5262. This can be caused
due to a broken supply line. By using the specified load resistors, the output level will remain in these bands during a fail. It is recommended to
set the clamping level CLL above the lower failure band and the clamping level CLH below the higher failure band.
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AS5262
Datasheet - D e t a i l e d D e s c r i p t i o n
8.2.8
Analog Output Diagnostic Mode
Due to the low pin count in the application a wrong operation must be indicated by the output pin OUT. This could be realized using the failure
bands. The failure band is defined with a fixed level. The failure band low is specified from 0 to 4% of the supply range over the total operation
range. The failure band high is defined always from 96 to 100%. Several failures can happen during operation. The output signal remains in
these bands over the specified operating and load conditions. All different failures can be grouped into the internal alarms (failures) and the
application related failures.
CLOAD ≤ 33 nF, RPU= 4k…10kΩ
RPD= 4k…10kΩ load pull-up
Table 9. Different Failure Cases of AS5262
Type
Internal alarms (failures)
Application related
failures
Failure Mode
Symbol
Failure Band
Note
Out of magnetic range
(too less or too high magnetic input)
MAGRng
High/Low
Programmable by OTP bit DIAG_HIGH
Cordic overflow
COF
High/Low
Programmable by OTP bit DIAG_HIGH
Offset compensation finished
OCF
High/Low
Programmable by OTP bit DIAG_HIGH
Watchdog fail
WDF
High/Low
Programmable by OTP bit DIAG_HIGH
Oscillator fail
OF
High/Low
Programmable by OTP bit DIAG_HIGH
Overvoltage condition
OV
High/Low
Dependant on the load resistor
Pull up → failure band high
Pull down → failure band low
High/Low
Switch off → short circuit dependent
Broken VDD
BVDD
Broken VSS
BVSS
Short circuit output
SCO
For efficient use of diagnostics, it is recommended to program to clamping levels CLL and CLH.
8.2.9
Analog Output Driver Parameters
The output stage is configured in a push-pull output. Therefore it is possible to sink and source currents.
CLOAD ≤ 33 nF, RPU= 4k…10kΩ ; RPD= 4k…10kΩ load pull-up
Table 10. General Parameters for the Output Driver
Symbol
Parameter
Min
Typ
Max
Unit
Note
IOUTSCL
Short circuit output current (low side driver)
5
10
20
mA
VOUT=20V
IOUTSCH
Short circuit output current (high side driver)
-20
-10
-5
mA
VOUT=0V
TSCDET
Short circuit detection time
20
600
µs
output stage turned off
TSCREC
Short circuit recovery time
2
20
ms
output stage turned on
ILEAKOUT
Output Leakage current
-20
20
µA
VOUT=VDD=5V
BGNDPU
Output voltage broken GND with pull-up
96
100
%VDD
BGNDPD
Output voltage broken GND with pull-down
0
4
%VDD
BVDDPU
Output voltage broken VDD with pull-up
96
100
%VDD
BVDDPD
Output voltage broken VDD with pull-down
0
4
%VDD
OUTRATIO
Output ratiometric error
-0.5
0.5
%VDD
OUTDNL
Output DNL
OUTINL
Output INL
10
-10
(2)
10
(1)
LSB
Between 4% and 96% of VDD
(2)
LSB
Between 4% and 96% of VDD
Notes:
1. This parameter will be finally defined after temperature characterisation.
2. Design target for this value is reduced.
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AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.2.10 Noise Suppressor
The noise suppressor is inserted after the angle calculation (first stage) and after range expansion (second stage). This function is capable to
reduce the noise level down to 1 LSB peak to peak over different programing ranges.
4 possible configurations of the noise suppressor can be selected via the OTP bits FILTERCFG<1:0>.
8.2.11 Hysteresis Function
AS5262 device includes a hysteresis function to avoid sudden jumps from CLH to CLL and vice versa caused by noise in the full turn
configuration.
The hysteresis amplitude can be selected via the OTP bits HYSTSEL<1:0>.
9 Application Information
9.1 Recommended Application Schematic
Figure 12 shows the recommended schematic in the application. All components marked with (*) are optional and can be used to further
increase the EMC.
Figure 12. AS5262 6-Wire Connection with Pull-Down / Pull-Up Resistors
Sensor PCB
Electric Control Unit
VDD1
VDD2
R1_x*
R2_x*
TP1_T
TP1_B
VDD3V3_T
C2_x
VDD3V3_B
15
14
OUT1
OUT_T
C4_x*
OUT_B
C1_x
VDD_T
VDD_B
16
13
1
12
2
11
AS5262
3
OUT2
10
4
9
5
6
7
8
S_B
S_T
TP3_B
C3_x
CL_T RLPD_T
CL_B RLPD_B
TP3_T
GND_T
GND_B
TP2_T
TP2_B
GND1
GND2
Sensor PCB
Electric Control Unit
VDD1
VDD2
R1_x*
R2_x*
TP1_T
TP1_B
VDD3V3_T
C2_x
VDD3V3_B
15
14
RLPU_B
CL_T
CL_B
13
1
12
2
11
AS5262
3
RLPU_T
OUT1
OUT_T
C4_x*
OUT_B
C1_x
VDD_T
VDD_B
16
OUT2
10
4
9
5
6
7
8
S_B
S_T
TP3_B
C3_x
TP3_T
GND_T
GND_B
TP2_T
TP2_B
GND1
GND2
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Revision 1.1
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AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 11. External Components
Symbol
Parameter
Min
Typ
Max
Unit
Note
C1
VDD buffer capacitor
0.8
1
1.2
µF
Low ESR 0.3 Ω
C2
VDD3V3 regulator capacitor
0.8
1
1.2
µF
Low ESR 0.3 Ω
C3
OUT load capacitor (sensor PCB)
0
4.7
nF
C4
R1
*
VDD capacitor (optional)
4.7
nF
*
VDD serial resistor (optional)
10
Ω
CL
R2
*
OUT load capacitor (ECU)
0
OUT serial resistor (optional)
33
nF
Ω
50
RLPU
OUT pull-up resistance
4
10
kΩ
RLPD
OUT pull-down resistance
4
10
kΩ
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Revision 1.1
Do not increase due to
programming over output.
17 - 36
AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
9.2 Programming the AS5262
The AS5262 programming is a one-time-programming (OTP) method, based on polysilicon fuses. The advantage of this method is that no
additional programming voltage is needed. The internal LDO provides the current for programming.
The OTP consists of 128 bits; several bits are available for user programming. In addition factory settings are stored in the OTP memory. Both
regions are independently lockable by build in lock bits.
A single OTP cell can be programmed only once. Per default, the cell is “0”; a programmed cell will contain a “1”. While it is not possible to reset
a programmed bit from “1” to “0”, multiple OTP writes are possible, as long as only unprogrammed “0”-bits are programmed to “1”.
Independent of the OTP programming, it is possible to overwrite the OTP register temporarily with an OTP write command. This is possible only
if the user lock bit is not programmed.
Due to the programming over the output pin the device will initially start in the communication mode. In this mode the digital angle value can be
read with a specific protocol format. It is a bidirectional communication possible. Parameters can be written into the device. A programming of the
device is triggered by a specific command. With another command (pass2func) the device can be switched into operation mode. In case of a
programmed user lock bit the AS5262 automatically starts up in the functional operation mode. No communication of the specific protocol is
possible after this.
A standard half duplex UART protocol is used to exchange data with the device in the communication mode.
9.2.1
UART Interface for Programming
The AS5262 uses a standard UART interface with an address byte and two data bytes. The read or write mode is selected with bit R/Wn in the
first byte. The timing (baudrate) is selected by the AS5262 over a synchronization frame. The baud rate register can be read and overwritten
(optional). Every start bit is used for synchronisation.
A time out function detects not complete commands and resets the AS5262 UART after the timeout period.
9.2.2
Frame Organization
Each frame is composed by 24 bits. The first byte of the frame specifies the read/write operation with the register address. 16 data bits contains
the communication data. There will be no operation in case of the usage of a not specified CMD. The UART programming interface block of the
AS5262 can operate in slave communication or master communication mode. In the slave communication mode the AS5262 receives the data.
The programming tool is the driver of the single communication line. In case of the master communication mode the AS5262 transmits data in
the frame format. The single communication line can be pulled down by the AS5262.
The UART frame consists of 1 start bit (low level), 8 data bit, 1 even-parity bit and 1 stop bit (high level). Data are transferred from LSB to MSB
Figure 13. General UART Frame
start
D0
D1
D2
D3
D4
D5
D6
D7 par stop
Table 12. Bit Timing
Symbol
Parameter
START
Start bit
1
TBIT
Dx
Data bit
1
TBIT
PAR
Parity bit
1
TBIT
STOP
Stop bit
TSW
Slave/Master Switch Time
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Min
Typ
1
Max
Unit
Note
TBIT
7
Revision 1.1
TBIT
18 - 36
AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Each communication starts with the reception of a request from the external controller. The request consists of two frames: one synchronization
frame and the command frame.
The synchronization frame contains the data 0x55 and allows the UART to measure the external controller baud rate:
Figure 14. Synchronization Frame
start
D0
D1
D2
D3
D4
D5
D6
D7
par
stop
The second frame contains the command Read/ Write (1 bit) and the address (7 bits):
Figure 15. Address and Command Frame
start
AD
0
AD
1
AD
2
AD
3
AD
4
AD
5
AD
R/Wn
6
par
stop
Only two commands are possible. In case of read command the idle phase between the command and the answer is the time TSW. In case of
parity error command is not executed.
Table 13. Possible Commands
Possible Interface
Commands
Description
AS5X63
Communication Mode
Command
CMD
WRITE
Write data to the OTP memory or Registers
SLAVE
0
READ
Read data to the OTP memory or Registers
SLAVE & MASTER
1
Notes:
1. In case of Write command the request is followed by the frames containing the data to write.
2. In case of Read command the communication direction will change and the AS5262 will answer with the frames containing the
requested data.
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Revision 1.1
19 - 36
AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
9.2.3
WRITE (Command Description)
Figure 16. Full Write Command
Synchronization frame
start
D0
D1
D2
D3
D4
D5
AD0
AD1
AD2
AD3
AD4
AD5
D6
D7
par
stop
par
stop
Write command frame
start
AD6
R/
Wn
Data0 frame (data to write on address AD<6:0>)
start
D00
D01
D03
D04
D05
D06
D07
par
stop
D03
D04
D05
D06
D07
par
stop
D02
Data1 frame (data to write on address AD<6:0>+1)
start
D00
D01
D02
Writing the AS5262 KEY in the fuse register (address 0x41) triggers the transfer of the data from the OTP RAM into the Poly Fuse cell.
Writing the AS5262 KEY in the Pass2Func Register (address 0x60) forces the device into normal mode.
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AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
9.2.4
READ (Command Description)
Figure 17. Full Read Command
Synchronization frame:
start
D0
D1
D2
D3
D4
D5
D6
D7
par
stop
AD0
AD1
AD2
AD3
AD4
AD5
AD6
R/Wn
par
stop
Read command frame:
start
Data0 frame (data read from address AD<6:0>) (MASTER):
start
D00
D01
D02
D03
D04
D05
D06
D07
par
stop
D04
D05
D06
D07
par
stop
Data1 frame (data read from address AD<6:0>+1) (MASTER):
start
9.2.5
D00
D01
D02
D03
Baud-rate Automatic Detection
The UART includes a built-in baud-rate monitor that uses the synchronization frame to detect the external controller baud-rate. This baud-rate is
used after the synchronization byte to decode the following frame and to transmit the answer and it is stored in the BAUDREG register.
9.2.6
Baud-rate Manual Setting (optional)
The BAUDREG register can be read and over-written for a possible manual setting of the baud-rate: in case the register is overwritten with a
value different from 0, this value will be used for the following UART communications and the synchronization frame must be removed from the
request.
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AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
S 0 0 0 0 0 0 0 0 0 P IDLE
Even Parity
Stop
Start
High Byte
MSB
LSB
Low Byte
S 0 1 0 1 1 1 0 0 0 P IDLE
Start
P IDLE
Even Parity
Stop
0
R/n
Even Parity
Stop
S
MSB
LSB
MSB
LSB
WR BAUDREG
Address
Start
R/n
Even Parity
Stop
S 1 0 1 0 1 0 1 0 0 P IDLE
Start
IDLE
synch frame
MSB
LSB
Figure 18. Manual Baud-rate Setting
AS5262 in Receiving Mode (Write Access)
AS5262 in Receiving
Mode
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MSB
High Byte
Even Parity
IDLE
Stop
P
Start
S
High Byte
S
P
IDLE
Stop
IDLE
Even Parity
Even Parity
Stop
P
MSB
LSB
Low Byte
S
Start
LSB
IDLE
Start
P
Stop
1
IDLE
AS5262 in Receiving Mode (Write Access)
MSB
Reg. Address
R/Wn
Even Parity
LSB
Start
S
LSB
P
Even Parity
Stop
S
AS5262 in Receiving
Mode
IDLE
Low Byte
MSB
LSB
IDLE
MSB
R/n
Even Parity
P
Start
0
Stop
Reg. Address
S
Start
IDLE
MSB
LSB
Figure 19. Simple Read and Write
AS5262 in transmitting mode (Read Access)
Revision 1.1
22 - 36
AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
9.3 OTP Programming Data
Table 14. OTP Memory Map
Data Byte
DATA15 (0x0F)
Bit Number
1
0
2
0
3
0
4
0
5
0
6
0
7
0
DATA11 (0x0B)
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0
0
2
0
3
0
4
0
5
0
6
0
7
0
0
0
1
0
2
CUSTID<0>
0
3
CUSTID<1>
0
4
CUSTID<2>
0
5
CUSTID<3>
0
6
CUSTID<4>
0
7
CUSTID<5>
0
0
CUSTID<6>
0
1
X2LIN<0>
0
2
X2LIN<1>
0
3
X2LIN<2>
0
4
X2LIN<3>
0
5
X1LIN<0>
0
6
X1LIN<1>
0
7
X1LIN<2>
0
0
X1LIN<3>
0
1
Y1LIN<0>
0
Revision 1.1
AMS (reserved)
Customer Identifier
Second linearization point (X-axis)
Customer Settings
DATA12 (0x0C)
Factory Settings
Description
Factory Settings
0
1
DATA13 (0x0D)
Default
0
0
DATA14 (0x0E)
Symbol
First linearization point (X-axis)
First linearization point (Y-axis)
23 - 36
AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 14. OTP Memory Map
Data Byte
DATA10 (0x0A)
DATA8 (0x08)
DATA7 (0x07)
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Symbol
Default
2
Y1LIN<1>
0
3
Y1LIN<2>
0
4
Y2LIN<0>
0
5
Y2LIN<1>
0
6
Y2LIN<2>
0
7
CLH<0>
0
0
CLH<1>
0
1
CLH<2>
0
2
CLH<3>
0
3
CLH<4>
0
4
CLH<5>
0
5
CLH<6>
0
6
CLH<7>
0
7
CLH<8>
0
0
CLL<0>
0
1
CLL<1>
0
2
CLL<2>
0
3
CLL<3>
0
4
CLL<4>
0
5
CLL<5>
0
6
CLL<6>
0
7
CLL<7>
0
0
CLL<8>
0
1
OFFSET<0>
0
2
OFFSET<1>
0
3
OFFSET<2>
0
4
OFFSET<3>
0
5
OFFSET<4>
0
6
OFFSET<5>
0
7
OFFSET<6>
0
0
OFFSET<7>
0
1
OFFSET<8>
0
2
OFFSET<9>
0
3
OFFSET<10>
0
4
OFFSET<11>
0
5
OFFSET<12>
0
6
OFFSET<13>
0
7
OFFSET<14>
0
Revision 1.1
Description
First linearization point (Y-axis)
Second linearization point (Y-axis)
Clamping Level High
Clamping Level Low
Customer Settings
DATA9 (0x09)
Bit Number
Offset
24 - 36
AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 14. OTP Memory Map
Data Byte
DATA6 (0x06)
DATA5 (0x05)
DATA3 (0x003)
Symbol
Default
0
OFFSET<15>
0
1
OFFSET<16>
0
2
OFFSET<17>
0
3
OFFSET<18>
0
4
OFFSET<19>
0
5
GAIN<0>
0
6
GAIN<1>
0
7
GAIN<2>
0
0
GAIN<3>
0
1
GAIN<4>
0
2
GAIN<5>
0
3
GAIN<6>
0
4
GAIN<7>
0
5
GAIN<8>
0
6
GAIN<9>
0
7
GAIN<10>
0
0
GAIN<11>
0
1
GAIN<12>
0
2
GAIN<13>
0
3
GAIN<14>
0
4
GAIN<15>
0
5
GAIN<16>
0
6
BP<0>
0
7
BP<1>
0
0
BP<2>
0
1
BP<3>
0
2
BP<4>
0
3
BP<5>
0
4
BP<6>
0
5
BP<7>
0
6
BP<8>
0
7
BP<9>
0
0
BP<10>
0
1
BP<11>
0
2
BP<12>
0
3
BP<13>
0
4
ANGLERNG
0
Sector selection
0=Angular Sector≥22.5 degrees;
1=Angular Sector<22.5 degrees
5
DIAG_HIGH
0
Failure Band Selection
0=Failure Band Low 1=Failure Band
High
DATA2 (0x02)
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Revision 1.1
Description
Offset
Scale Factor
Customer Settings
DATA4 (0x04)
Bit Number
Break Point
25 - 36
AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 14. OTP Memory Map
Data Byte
DATA2 (0x02)
DATA1 (0x01)
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Symbol
Default
Description
6
QUADEN<0>
0
7
QUADEN<1>
0
Quadrant Mode Enable
00=1quadrant;01=2quadrants;
10=3 quadrants;11=4 quadrants
0
AIRGAPSEL
0
1
HYSTSEL<0>
0
2
HYSTSEL<1>
0
3
FILTERCFG<0>
0
4
FILTERCFG<1>
0
5
Not used
0
6
Not used
0
7
Not used
0
0
RED_ADD<0>
0
1
RED_ADD<1>
0
2
RED_ADD<2>
0
3
RED_ADD<3>
0
4
RED_BIT<0>
0
5
RED_BIT<1>
0
6
RED_BIT<2>
0
Redundancy Bit
Identify the position of the bit to be
changed in the byte at the address
RED_ADD<3:0>
7
CUST_LOCK
0
Lock bit for Customer Area
Revision 1.1
Magnetic input range extension
0:extended range;1=normal range
Hysteresis selection
00=no hysteresis; 01: 56LSB;
10=91LSB; 11=137LSB
Filter Configuration
00=no filter; 01= fast;
10=moderate; 11=slow
Customer Settings
DATA0 (0x00)
Bit Number
Redundancy Address
Identify the address of the byte
containing the bit to be changed
26 - 36
AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
9.4 READ / WRITE Register Map
Table 15. Read / Write Registers
Data Byte
DATA0 (0x20)
DATA1 (0x21)
DATA3 (0x23)
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Symbol
Default
0
BAUDREG<0>
0
1
BAUDREG<1>
0
2
BAUDREG<2>
0
3
BAUDREG<3>
0
4
BAUDREG<4>
0
5
BAUDREG<5>
0
6
BAUDREG<6>
0
7
BAUDREG<7>
0
0
BAUDREG<8>
0
1
Not used
0
2
Not used
0
3
Not used
0
4
Not used
0
5
Not used
0
6
Not used
0
7
Not used
0
0
DAC12IN<8>
0
1
DAC12IN<9>
0
2
DAC12IN<10>
0
3
DAC12IN<11>
0
4
DAC12INSEL
0
DAC12 buffer selection
5
R1K10K<0>
0
6
R1K10K<1>
0
Selection of the reference resistance
used for OTP download
7
DSPRN
0
Resetn of the Digital Signal Processing
circuit
0
DAC12IN<0>
0
1
DAC12IN<1>
0
2
DAC12IN<2>
0
3
DAC12IN<3>
0
4
DAC12IN<4>
0
5
DAC12IN<5>
0
6
DAC12IN<6>
0
7
DAC12IN<7>
0
Revision 1.1
Description
UART Baud Rate Register
A read command returns all data bits
at 0
DAC12 buffer value
Read/Write Area
DATA2 (0x22)
Bit Number
DAC12 buffer value
27 - 36
AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
9.5 READ Only Register Map
Table 16. Read Only Registers
Data Byte
Bit Number
Symbol
Default
Description
0
Not used
0
A read command returns 0
1
OFFSETFINISHED
0
Offset compensation finished
2
AGCFINISHED
0
AGC loop compensation finished
3
CORDICOVF
0
Overflow of the Cordic
4
AGCALARML
0
AGC loop saturation because of B field
too strong
5
AGCALARMH
0
AGC loop saturation because of B field
too weak
DATA0 (0x28)
DATA1 (0x29)
DATA3 (0x2B)
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OTP_RES
0
7
PARITY_ERR
0
UART parity error flag
0
CORDICOUT<0>
0
1
CORDICOUT<1>
0
2
CORDICOUT<2>
0
3
CORDICOUT<3>
0
4
CORDICOUT<4>
0
5
CORDICOUT<5>
0
6
CORDICOUT<6>
0
7
CORDICOUT<7>
0
0
CORDICOUT<8>
0
1
CORDICOUT<9>
0
2
CORDICOUT<10>
0
3
CORDICOUT<11>
0
4
CORDICOUT<12>
0
5
CORDICOUT<13>
0
6
Not used
0
7
Not used
0
0
DSPOUT<0>
0
1
DSPOUT<1>
0
2
DSPOUT<2>
0
3
DSPOUT<3>
0
4
DSPOUT<4>
0
5
DSPOUT<5>
0
6
DSPOUT<6>
0
7
DSPOUT<7>
0
Revision 1.1
Cordic Output
Read Area
DATA2 (0x2A)
6
0=1K resistance selected for OTP
download;
1=10K resistance selected for OTP
download
A read command returns all data bits
at 0
DSP Output
28 - 36
AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 16. Read Only Registers
Data Byte
DATA4 (0x2C)
DATA5 (0x2D)
DATA7 (0x2F)
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Symbol
Default
0
DSPOUT<8>
0
1
DSPOUT<9>
0
2
DSPOUT<10>
0
3
DSPOUT<11>
0
4
Not used
0
5
Not used
0
6
Not used
0
7
Not used
0
0
AGCVALUE<0>
0
1
AGCVALUE<1>
0
2
AGCVALUE<2>
0
3
AGCVALUE<3>
0
4
AGCVALUE<4>
0
5
AGCVALUE<5>
0
6
AGCVALUE<6>
0
7
AGCVALUE<7>
0
0
MAG<0>
0
1
MAG<1>
0
2
MAG<2>
0
3
MAG<3>
0
4
MAG<4>
0
5
MAG<5>
0
6
MAG<6>
0
7
MAG<7>
0
0
Not used
0
1
Not used
0
2
Not used
0
3
Not used
0
4
Not used
0
5
Not used
0
6
Not used
0
7
Not used
0
Revision 1.1
Description
DSP Output
A read command returns all data bits
at 0
AGC Value
Read Area
DATA6 (0x2E)
Bit Number
Magnitude of magnetic field
A read command returns all data bits
at 0
29 - 36
AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
9.6 Special Registers
Table 17. Special Registers
Data Byte
DATA0 (0x41)
DATA1 (0x61)
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Default
0
AS5262KEY<0>
0
1
AS5262KEY<1>
0
2
AS5262KEY<2>
0
3
AS5262KEY<3>
0
4
AS5262KEY<4>
0
5
AS5262KEY<5>
0
6
AS5262KEY<6>
0
7
AS5262KEY<7>
0
0
AS5262KEY<8>
0
1
AS5262KEY<9>
0
2
AS5262KEY<10>
0
3
AS5262KEY<11>
0
4
AS5262KEY<12>
0
5
AS5262KEY<13>
0
6
AS5262KEY<14>
0
7
AS5262KEY<15>
0
0
AS5262KEY<0>
0
1
AS5262KEY<1>
0
2
AS5262KEY<2>
0
3
AS5262KEY<3>
0
4
AS5262KEY<4>
0
5
AS5262KEY<5>
0
6
AS5262KEY<6>
0
7
AS5262KEY<7>
0
0
AS5262KEY<8>
0
1
AS5262KEY<9>
0
2
AS5262KEY<10>
0
3
AS5262KEY<11>
0
4
AS5262KEY<12>
0
5
AS5262KEY<13>
0
6
AS5262KEY<14>
0
7
AS5262KEY<15>
0
Revision 1.1
Description
AS5262 KEY<15:0>=0101 0001 0110
0010
A write command with data different
from AS5262 KEY is not executed
A read command returns all data bits
at 0
AS5262 KEY<15:0>=0101 0001 0110
0010
A write command with data different
from AS5262 KEY is not executed
A read command returns all data bits
at 0
Pass2Func Register
DATA0 (0x60)
Symbol
Fuse Register
DATA1 (0x42)
Bit Number
30 - 36
AS5262
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
9.7 Programming Procedure
Pull-up on out pin
VDD=5V
Wait 10ms (after the startup time device enters communication mode)
Write command: Trimming bits are written in the OTP RAM
Read command: All the trimming bits are read back to check the correctness of the writing procedure.
Write
AS5262KEY in the Fuse register: The OTP RAM content is permanently transferred into the Poly Fuse cells.
Wait 10 ms (fuse time)
Write command, R1K_10K<1:0>=(11)b: Poly Fuse cells are downloaded into the RAM memory using a 10K resistance as reference.
Wait 5 ms (download time)
Read R1K_10K register, the expected value is 00b
Write command, R1K_10K<1:0>=(11)b
Read R1K_10K register, the expected value is (11)b. NB: Step11 and Step12 have to be consecutive.
Read command: all the fused bits downloaded with 10K resistance are read back.
Write command, R1K_10K=<1:0>=(10)b: Poly Fuse cells are downloaded into the RAM memory using a 1K resistance as reference.
Wait 5 ms (download time)
Read R1K_10K register, the expected value is (00)b
Write command register, R1K_10K<1:0>=(10)b
Read R1K_10K register, the expected value is (10)b NB: Step18 and Step19 have to be consecutive.
Read command: All the fused bits downloaded with 1K resistance are read back.
Check that read commands at Steps 5, 13 and 19 are matching
Write
AS5262KEY in the Pass2Func register: Device enters normal mode.
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AS5262
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
10 Package Drawings and Markings
The device is available in a MLF-16 package.
Figure 20. Package Drawings and Dimensions
Symbol
A
A1
A2
A3
L
L1
L2
Θ
b
b1
D
E
e
D1
E1
D2
E2
aaa
bbb
ccc
ddd
eee
fff
N
Notes:
1.
2.
3.
4.
5.
Dimensions and tolerancing confirm to ASME Y14.5M-1994.
All dimensions are in miilimeters. Angles are in degrees.
Bilaretal coplanarity zone applies to the exposed pad as well as the terminal.
Radius on the terminal is optional.
N is the total number of terminals.
Min
0.80
0
0.50
0.05
0.05
0º
0.35
0.20
4.10
4.10
-
Nom
0.90
0.02
0.65
0.20 REF
0.60
0.15
0.10
0.40
0.25
6.00 BSC
6.00 BSC
1.00 BSC
5.75 BSC
5.75 BSC
4.20
4.20
0.15
0.10
0.10
0.05
0.08
0.10
16
Max
1.00
0.05
1.00
0.70
0.25
0.15
14º
0.45
0.30
4.30
4.30
-
Marking: YYWWVZZ.
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YY
WW
V
ZZ
Year
Week
Assembly plant identifier
Assembly traceability code
Revision 1.1
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AS5262
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Figure 21. Vertical Cross Section of MLF-16
Notes:
1.
2.
3.
4.
All dimensions in mm.
Die thickness 0.150mm nom.
Adhesive thickness 0.011mm.
Spacer thickness 0.203mm typ.
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Revision 1.1
33 - 36
AS5262
Datasheet - R e v i s i o n H i s t o r y
Revision History
Revision
Date
1.0
Oct 30, 2012
1.1
Oct 31, 2012
Owner
mub
Description
Initial revision
Updated Figure 3, Table 1, Table 2, Table 10 and Figure 12
Note: Typos may not be explicitly mentioned under revision history.
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Revision 1.1
34 - 36
AS5262
Datasheet - O r d e r i n g I n f o r m a t i o n
11 Ordering Information
The devices are available as the standard products shown in Table 18.
Table 18. Ordering Information
Ordering Code
Description
Delivery Form
Package
AS5262-HMFP
12-bit programmable redundant angle position sensor with analog outputs
Tape&Reel
MLF 16 6x6
Note: All products are RoHS compliant and ams green.
Buy our products or get free samples online at www.ams.com/ICdirect
Technical Support is available at www.ams.com/Technical-Support
For further information and requests, email us at sales@ams.com
(or) find your local distributor at www.ams.com/distributor
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Revision 1.1
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AS5262
Datasheet - C o p y r i g h t s
Copyrights
Copyright © 1997-2012, ams AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®. All rights
reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the
copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. ams AG makes no
warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described
devices from patent infringement. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in normal
commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability
applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing
by ams AG for each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard
production flow, such as test flow or test location.
The information furnished here by ams AG is believed to be correct and accurate. However, ams AG shall not be liable to recipient or any third
party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the
technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other
services.
Contact Information
Headquarters
ams AG
Tobelbaderstrasse 30
A-8141 Unterpremstaetten, Austria
Tel
Fax
: +43 (0) 3136 500 0
: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
http://www.ams.com/contact
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Revision 1.1
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