LAMINATES & GROUNDING PRODUCTS ® CHO-FOIL & CHO-FAB Shielding Tapes TM CHO-FOIL EMI Shielding Tape with Conductive Adhesive (Copper, Aluminum or Tinned Copper) CHO-FAB EMI Shielding Fabric Tape with Conductive Adhesive Chomerics’ CHO-FOIL tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive*. Typical properties are shown in Table 1 on the next page, and reliability data appears in Table CHO-FAB tape is a corrosion resistant nickel-plated cloth coated with Chomerics’ highly conductive pressure-sensitive adhesive*. CHO-FAB tape is extremely strong and lightweight, and has excellent conformability/wrapability to enhance shielding performance and appearance. Use of corrosion resistant nickelplated cloth and Chomerics’ superior metal-particle-filled conductive adhesive technology produces a tape used in a wide variety of EMI shielding and grounding applications. Typical properties are shown in Table 1 on the next page, and reliability data appears in Table 4 on page 148. 4 on page 148. CHO-FOIL copper tape is available with a non-conductive adhesive for applications requiring surface conductivity only. An embossed version of CHO-FOIL copper tape is also available, for a more attractive appearance up to 6 inches (152 mm) wide. Standard length rolls and die-cut custom shapes can be ordered. Typical Applications for CHO-FOIL and CHO-FAB EMI Shielding Tapes ■ ■ ■ 1 Provide a low impedance connection between a braided cable shield and the metal connector backshell in molded cables. An effective EMI shielded assembly can be achieved without soldering the tape to the braid or backshell EMI radiation measurement troubleshooting, using CHOFOIL tape to shield ventilation slots or seam gaps Provide electrical continuity in seams of EMI shielded rooms and electronic enclosures ■ ■ ■ ■ ■ Supply electrical contact to surfaces that can’t be soldered to, such as conductive plastic or aluminum EMI shield for cables by wrapping the tape around the cable. An overlap is recommended ESD shielding Provide corrosion-resistant ground contact points Fabric tape available where weight and flexibility are important, such as for wrapping cables Ordering Procedure Refer to Tables 2 and 3. All CHOFOIL and CHO-FAB tapes are available in standard 36 yard (32.9 m) rolls or die-cut custom configurations. Call Chomerics’ Applications Engineering Department for assistance with a custom configuration. * Recognized Under the Component Program of Underwriters Laboratories, Inc. US Headquarters TEL +(1) 781-935-4850 FAX +(1) 781-933-4318 • www.chomerics.com Europe TEL +(44) 1628 404000 FAX +(44) 1628 404090 Asia Pacific TEL +(852) 2 428 8008 FAX +(852) 2 423 8253 South America TEL +(55) 11 3917 1099 FAX +(55) 11 3917 0817 Table 1 PROPERTIES Property Test Method Typical Values Part Number Prefix –– CCH CCE CCJ CCK CCD CAD CFT Foil/Fabric Type –– 1 oz. RA Copper 1 oz. Embossed RA Copper Aluminum 1 oz. TinPlated Copper 1 oz. RA Copper Aluminum Nickel-Plated Fabric Foil/Fabric Thickness, mils (mm) –– 1.4 (0.0356) 1.4 (0.0356) 2 (0.0508) 1.6 (0.0406) 1.4 (0.0356) 2 (0.0508) 5 (0.127) Adhesive Type –– Adhesive Thickness, mils (mm) –– Total Thickness, mils (mm) –– Temperature Range, °F (°C) __ Electrically Conductive, Pressure-Sensitive Acrylic 2 sides: 1.5 each (0.0381 each) 1.5 (0.0381) 2.9 (0.0737) 4* (0.1102) 3.5 (0.0889) 3.1 (0.0787) 4.4 (0.1118) 5 (0.127) –40 to 400 (–40 to 205) 1.5 (0.0381) 6.5 (0.165) –40 to 180 (–40 to 82) Electrical Resistance, ohms/in2 (ohms/cm2) MIL-STD-202C <0.003 (<0.0005) <0.003 (<0.0005) <0.010 (<0.0016) <0.003 (<0.0005) <0.010 (<0.0016) <0.010 (<0.0016) <0.100 (<0.016) Flame Resistance UL Subject 510 Adhesion to Aluminum oz./inch [ppi] (N/m) PASS MEETS PASS PASS ASTM D1000 MEETS MEETS N/A >40 [2.5] (438) *Embossing adds 1.1 mil Table 2 PART NUMBER TAPE DESCRIPTION CCH – 36 – 101 – ZZZZ Copper foil, conductive adhesive version CCE – 36 – 101 – ZZZZ Copper foil, conductive adhesive, embossed CCJ – 36 – 201 – ZZZZ Aluminum foil, conductive adhesive CCK – 36 – 101 – ZZZZ Tin-plated copper foil, conductive adhesive CCD – 36 – 101 – ZZZZ Copper foil, conductive adhesive 2 sides CAD – 36 – 201 – ZZZZ Aluminum foil, conductive adhesive 2 sides CFT – 36 – 101 – ZZZZ Nickel-plated fabric, conductive adhesive Table 3 TAPE WIDTH CODES (ZZZZ) inch (mm) 0050 0100 0150 0200 0300 0400 0600 0800 1200 2400 0.5 (12.7) 1.0 (25.4) 1.5 (38.1) 2.0 (50.8) 3.0 (76.2) 4.0 (102) 6.0 (152) 8.0 (203) 12 (305) 24 (610) Custom widths available up to 24 inches (61 cm) Slit rolls are available through Chomerics' authorized distributors. Please consult Chomerics’ Applications Engineering Department for assistance with a custom application involving a need for material in other than slit roll form. continued US Headquarters TEL +(1) 781-935-4850 FAX +(1) 781-933-4318 • www.chomerics.com Europe TEL +(44) 1628 404000 FAX +(44) 1628 404090 Asia Pacific TEL +(852) 2 428 8008 FAX +(852) 2 423 8253 South America TEL +(55) 11 3917 1099 FAX +(55) 11 3917 0817 2 CHO-FOIL & CHO-FAB™ Tapes ® continued NOTE: The following table represents actual experimental test data taken according to Chomerics internal test procedures. This data differs from Table 1 due to differences in test methods. Table 4 RELIABILITY DATA Test Test Method Initial Surface Resistivity (SR) (milliohms)* CHO-TP-57*** CCH CCE CCJ CCK CCD CAD CFT <2 <2 <2 <2 N/A N/A <100 <3 <35 <2 <15**** <100**** <100 48 [3] (525) 70.4 [4.4] (710) 44.8 [2.8] (490) Initial Through Resistivity (TR) (milliohms)* CHO-TP-57*** Initial Peel Strength in oz./inch [ppi] (N/m) ** ASTM D1000 <3 Initial Taber Abrasion Surface Resistivity (SR) (milliohms) CHO-TP-57*** <6 <3 <6 <9 N/A N/A <100 Heat Aging 185°F (85°C)/ 168 hrs. SR (milliohms)* TR (milliohms)* Peel, oz./in. [ppi] (N/m) ** CHO-TP-57*** CHO-TP-57*** ASTM D1000 <10 <16 57.6 [3.6] (630) <2 <3 62.4 [3.9] (683) <20 <22 76.8 [8] (840) <2 <2 67.2 [4.2] (735) N/A <7**** 73.6 [4.6] (805) N/A <60**** 78.4 [4.8] (840) <100 <150 59.2 [3.7] (648) Heat Aging 250°F (121°C)/ 168 hrs. SR (milliohms)* TR (milliohms)* Peel, oz./in. [ppi] (N/m) ** CHO-TP-57*** CHO-TP-57*** ASTM D1000 <10 <70 57.6 [3.6] (630) <3 <20 <2 <3 <23 <2 59.2 75.2 51.2 [3.7] (648) [4.7] (823) [3.2] (560) N/A <3**** 70.4 [4.4] (770) N/A <10**** 84.8 [5.3] (928) <100 <150 43.2 [2.7] (473) Heat Aging with Humidity 95% RH/ 185°F (85°C)/ SR (milliohms)* TR (milliohms)* Peel, oz./in. [ppi] (N/m) ** CHO-TP-57*** CHO-TP-57*** ASTM D1000 N/A N/A N/A N/A N/A N/A N/A N/A N/A <2 <2 78.4 [4.9] (858) N/A <115**** 78.4 [4.9] (858) N/A <150**** 84.8 [5.3] (928) <100 <150 46.4 [2.9] (508) Salt fog corrosion/ 168 hrs. SR (milliohms)* TR (milliohms)* Peel, oz./in. [ppi] (N/m) ** CHO-TP-57*** CHO-TP-57*** ASTM D1000 N/A N/A N/A N/A N/A N/A N/A N/A N/A <2 <2 76.8 [4.8] (840) N/A <275**** 62.4 [3.9] (683) N/A <600**** 80 [5] (875) <100 <1000 33.6 [2.1] (368) Taber abrasion 500 gramweight, CS-10 wheel, 500 cycles SR (milliohms)* CHO-TP-57*** <3 <5 <2 <6 N/A N/A <175 44.8 [2.8] (490) 44.8 51.2 46.4 [2.8] (490) [3.2] (560) [2.9] (508) N/A = Not Applicable * All measurements of surface resistivity and through resistivity made at ambient temperature with tapes mounted on tinned copper substrate, except for taber abrasion where a plastic substrate was used. ** 90° peel strength tests were done on an Instron at 2 inches per minute with tapes on a 2024 aluminum substrate. *** CHO-TP-57 available from Chomerics on request. **** Through resistivity measurement of double sided adhesive tapes done with tapes flanged between 2024 aluminum substrates. Contact our Applications Engineering Department to discuss your requirements. 3 US Headquarters TEL +(1) 781-935-4850 FAX +(1) 781-933-4318 • www.chomerics.com Europe TEL +(44) 1628 404000 FAX +(44) 1628 404090 Asia Pacific TEL +(852) 2 428 8008 FAX +(852) 2 423 8253 South America TEL +(55) 11 3917 1099 FAX +(55) 11 3917 0817