ETC PUMA68FV16006XI-90

Issue 5.0 January 2000
Description
The PUMA68 range of devices provide a high density
surface mount industry standard memory solution
which may accommodate various memory
technologies including SRAM, EEPROM and Flash.
The devices are designed to offer a defined upgrade
path and may be user configured as 8, 16 or 32 bits
wide.
The PUMA68FV16006X is a 512Kx32 FLASH
module housed in a 68 Jleaded package which
complies with the JEDEC 68 PLCC standard.
Access times of 70, 90 or 120ns are available. The
3.3V device is available to commercial and industrial
temperature grade.
1M x 32, and 2Mx32 FLASH PUMA68 devices are
available in the same footprint to offer a defined
upgrade path.
Features
• Access times of 70, 90 and 120ns.
• 3.3V + 10%.
• Commercial and Industrial temperature grades
• JEDEC Standard 68 PLCC footprint.
• Industry standard pinout.
• May be organised as 512Kx32, 1Mx16 or 2Mx8
• User configurable as 8 / 16 / 32 bits wide.
• 10 Year Data Retention
• Write Erase Cycle Endurance 100,000 (min)
• Automatic Write/Erase by Embedded Algorithm
• Uniform Sector Device.
Package Details
Plastic ‘J’ Leaded JEDEC PLCC
Max. Dimensions (mm) - 25.27 x 25.27 x 5.08
Block Diagram
A0~A18
/OE
/WE
512K x 8
FLASH
512K x 8
FLASH
512K x 8
512K x 8
FLASH
FLASH
/CS1
/CS2
/CS3
/CS4
D0~7
D8~15
D16~23
D24~31
Pin Definition
See page 2.
Pin Functions
Description
Signal
Address Input
Data Input/Output
Chip Select
Write Enable
Output Enable
No Connect
Power
Ground
A0~A18
D0~D31
/CS1~4
/WE
/OE
NC
VCC
VSS
11403 West Bernardo Court, Suite 100, San Diego, CA92127.
TEL (001) 858 674 2233, Fax No. (001) 858 674 2230 E-mail: [email protected]
512 K x 32 FLASH Module
PUMA68FV16006X - 70/90/12
Pin Definition - PUMA68FV16006X
PAGE 2
Pin
Signal
Pin
Signal
1
VCC
35
VCC
2
NC
36
A13
3
/CS1
37
A12
4
/CS2
38
A11
5
/CS3
39
A10
6
/CS4
40
A9
7
A17
41
A8
8
A18
42
A7
9
D16
43
D0
10
D17
44
D1
11
D18
45
D2
12
D19
46
D3
13
VSS
47
VSS
14
D20
48
D4
15
D21
49
D5
16
D22
50
D6
17
D23
51
D7
18
VCC
52
VCC
19
D24
53
D8
20
D25
54
D9
21
D26
55
D10
22
D27
56
D11
23
VSS
57
VSS
24
D28
58
D12
25
D29
59
D13
26
D30
60
D14
27
D31
61
D15
28
A6
62
A14
29
A5
63
A15
30
A4
64
A16
31
A3
65
/WE
32
A2
66
/OE
33
A1
67
NC
34
A0
68
NC
Issue 5.0 January 2000
Package Details
PUMA 68 pin JEDEC Surface Mounted PLCC
Pin 1
Pin 68
25.27 (0.995)
25.02 (0.985)
5.08
(0.200)
max
0.46
(0.018)
1.27 (0.050)
0.90
(0.035)
typ
23.11 (0.910)
24.13 (0.950)
PAGE 3
Issue 5.0 January 2000
Ordering Information
Speed
Temp. Range/Screening
70
90
12
Blank
I
=
=
=
=
=
70ns
90ns
12ns
Commercial
Industrial
Pinout Configuration
X = Industry Standard
Pinout
Memory Organisation
16006 = configurable as
512K x 32, 1M x 16 or
2M x 8
Technology
Package
FV = FLASH, 3.3V + 10%
PUMA 68 = 68 pin ‘J’ Leaded PLCC
Note :
Although this data is believed to be accurate the information contained herein is not intended to and does not create
any warranty of merchantibility or fitness for a particular purpose.
Our products are subject to a constant process of development. Data may be changed without notice.
Products are not authorised for use as critical components in life support devices without the express written
approval of a company director.
PAGE 4
http://www.mosaicsemi.com/
Issue 5.0 January 2000
Ordering Information
PUMA 68FV16006XI - 70
Specified as +/- 2 thou max.
Visual Inspection Standard
All devices inspected to ANSI/J-STD-001B Class 2 standard
Moisture Sensitivity
Devices are moisture sensitive.
Shelf Life in Sealed Bag 12 months at <40OC and <90% relative humidity (RH).
After this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or
equivalent processing (peak package body temp 220OC) must be :
A : Mounted within 72 Hours at factory conditions of <30OC/60% RH
OR
B : Stored at <20% RH
If these conditions are not met or indicator card is >20% when read at 23OC +/-5% devices require baking
as specified below.
If baking is required, devices may be baked for :A : 24 hours at 125OC +/-5% for high temperature device containers
OR
B : 192 hours at 40OC +5OC/-0OC and <5% RH for low temperature device containers.
Packaging Standard
Devices packaged in dry nitrogen, JED-STD-020.
Packaged in trays as standard.
Tape and reel available for shipment quantities exceeding 200pcs upon request.
Soldering Recomendations
IR/Convection -
Ramp Rate
Temp. exceeding 183OC
Peak Temperature
Time within 5OC of peak
Ramp down
6OC/sec max.
150 secs. max.
225OC
20 secs max.
6OC/sec max.
Vapour Phase -
Ramp up rate
Peak Temperature
Time within 5OC of peak
Ramp down
6OC/sec max.
215 - 219OC
60 secs max.
6OC/sec max.
The above conditions must not be exceeded.
Note : The above recommendations are based on standard industry practice. Failure to comply with
the above recommendations invalidates product warranty.
PAGE 5
Issue 5.0 January 2000
Customer Guidelines
Co Planarity