PD - 94242 IRFC43N50KB D HEXFET® Power MOSFET Die in Wafer Form 500V RDS(on)=0.090Ω 6" Wafer G S Electrical Characteristics Parameter V(BR)DSS RDS(on) VGS(th) IDSS IGSS TJ TSTG Description Drain-to-Source Breakdown Voltage Static Drain-to-Source On-Resistance Gate Threshold Voltage Drain-to-Source Leakage Current Gate-to-Source Leakage Current Operating Junction and Storage Temperature Range Guaranteed (Min/Max) 500V Min. 0.090Ω Max. 3.0V Min., 5.0V Max. 50µA Max. ± 100nA Max. -55°C to 150°C Max. Test Conditions VGS = 0V, ID = 250µA VGS = 10V, ID = 28A VDS = VGS , ID = 250µA VDS = 500V, VGS = 0V, TJ = 25°C VGS = ±30V Mechanical Data Nominal Back Metal Composition, Thickness: Nominal Front Metal Composition, Thickness: Dimensions: Wafer Diameter: Wafer Thickness: Relevant Die Mechanical Drawing Number Minimum Street Width Reject Ink Dot Size Recommended Storage Environment: Recommended Die Attach Conditions: Referenced Package Part: Cr-NiV-Ag ( 0.1µm-0.2µm-0.5µm ) Al with 1% Si (0.004 mm) 0.315" x 0.470" [ 8.00 mm x 11.94 mm ] 150 mm 0.375 mm ± 0.025 mm 01-5444 0.004" 0.005" Diameter Minimum Store in original container, in dessicated nitrogen, with no contamination For optimum electrical results, die attach temperature should not exceed 300 °C IRFPS43N50K Die Outline 1.65 [.065] NOT ES: 1. ALL DIMENS IONS ARE S HOWN IN MILLIMETERS [INCHES ]. 2. CONTROLLING DIMENS ION: [INCH]. 3. LET TER DESIGNATION: 2.08 [.082] S = S OURCE S K = S OURCE KELVIN G = GAT E IS = CURRENT SENS E E = EMITT ER 4. DIMENS IONAL T OLERANCES : 11.94 [.470] S BONDING PADS : WIDT H & LENGT H OVERALL DIE: G 0.49 [.019] 0.65 [.026] 8.00 [.315] < 0.635 T OLERANCE = + /- 0.013 < [.0250] T OLERANCE = + /- [.0005] > 0.635 T OLERANCE = + /- 0.025 > [.0250] T OLERANCE = + /- [.0010] < 1.270 T OLERANCE = + /- 0.102 WIDT H < [.050] TOLERANCE = + /- [.004] & > 1.270 T OLERANCE = + /- 0.203 LENGT H > [.050] TOLERANCE = + /- [.008] 5. DIE T HICKNES S = 0.254 [.010] * Notes: Electrical characteristics are reported for the reference packaged part (see above) and cannot guaranteed in die sales form due to variations in packaging materials, dimension. www.irf.com 1 07/18/01