REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add two packages, C-5 and C-4. Make changes to table I, and throughout. For case X, the dimensions have been changed and figure 2 has been replaced with D-10 configuration. Inactivate devices 01XX and 02XX for new design. Use M38510 device. Add a truth table. 90-01-24 M. A. Frye B Add device types 05, 06, 07, and 08. Add vendors CAGES 1ES66, OH9K9, and 33256. Editorial changes throughout. 93-03-15 M. A. Frye C Add class V devices. Add Z package. Editorial changes throughout. 97-04-15 R. Monnin D Changes in accordance with NOR 5962-R368-97. – drw 97-06-23 Raymond Monnin E Change descriptive designator for case outline Z from GDFP2-F28 to CDFP3-F28. Editorial changes throughout. Redrawn. - drw 99-12-30 Raymond Monnin F Sheet 7, table I, VIL test, change max limit from –0.8 V to 0.8 V. - drw 00-03-01 Raymond Monnin G Add radiation features and post irradiation limits. - drw 01-05-16 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED REV SHEET REV G G G G G G SHEET 15 16 17 18 19 20 REV STATUS REV G G G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Sandra B. Rooney STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil CHECKED BY Charles E. Besore APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE Michael A. Frye DRAWING APPROVAL DATE MICROCIRCUIT, LINEAR, MICROPROCESSOR COMPATIBLE, 12-BIT ANALOG-TO-DIGITAL CONVERTERS, MONOLITHIC SILICON 86-07-10 AMSC N/A REVISION LEVEL G SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 1 OF 5962-85127 20 5962-E374-01 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - 85127 Federal stock class designator \ RHA designator (see 1.2.1) 01 X X Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number For device class V: 5962 - 85127 Federal stock class designator \ RHA designator (see 1.2.1) 01 V X X Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 574AU 02 574AT 03 574AU 04 574AT 05 574ZA 06 574ZB 07 574AU 08 574AT Monolithic, high performance, 12-bit A/D converter with microprocessor interface Monolithic, medium performance, 12-bit A/D converter with microprocessor interface Multi-chip, high performance, 12-bit A/D converter with microprocessor interface Multi-chip, medium performance, 12-bit A/D converter with microprocessor interface Monolithic, high performance, low power, 12-bit A/D converter with microprocessor interface Monolithic, medium performance, low power, 12-bit A/D converter with microprocessor interface Monolithic, high performance, low power, 12-bit A/D converter with microprocessor interface Monolithic, medium performance, low power, 12-bit A/D converter with microprocessor interface STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 2 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter X Y Z 3 Descriptive designator Terminals GDIP1-T28 or CDIP2-T28 CQCC1-N44 CDFP3-F28 CQCC1-N28 28 44 28 28 Package style dual-in-line square leadless chip carrier flat pack square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ VCC to digital common .................................................................................................... VEE to digital common .................................................................................................... VLOG to digital common .................................................................................................. Analog to digital common: Device types 01, 02, 03, 04 ........................................................................................ Device types 05, 06, 07, 08 ........................................................................................ Control inputs (CE, CS, AO, 12/8, R/C) to digital common............................................. Analog inputs (REF IN, BIP OFF, 10 VIN) to analog common........................................ 20 VIN analog input voltage to analog common ............................................................. VREF OUT .......................................................................................................................... Power dissipation at 75qC: Device types 01, 02, 05, 06, 07, 08 ............................................................................ Device types 03, 04 .................................................................................................... Lead temperature (soldering, 10 seconds) .................................................................... Storage temperature ...................................................................................................... Thermal resistance, junction-to-ambient (TJA): Cases X and 3 ............................................................................................................ Case Y........................................................................................................................ Case Z ........................................................................................................................ Thermal resistance, junction-to-case (TJC)..................................................................... Junction temperature (TJ) .............................................................................................. 1/ 2/ 0 to +16.5 V dc 0 to -16.5 V dc 0 to +7 V dc +1 V dc -0.5 V dc to +1 V dc -0.5 V dc to V LOG +0.5 V dc V EE to VCC +24 V dc Indefinite short to common, 10 ms short to VCC 1,000 mW 2/ 2,080 mW 2/ +300qC -65qC to +150qC 70qC/W 38qC/W 60qC/W See MIL-STD-1835 +175qC Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. For cases X and 3, derate linearly above TA = +75qC at 20.8 mW/qC. For cases Y, derate linearly above TA = +75qC at 22.7 mW/qC. For cases Z, derate linearly above TA = +115qC at 17 mW/qC. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 3 1.4 Recommended operating conditions. Power supply Operating voltage range: Positive supply (VLOG) ............................................................................................. Positive supply (VCC) ............................................................................................... Negative supply (VEE).............................................................................................. Ambient operating temperature range ........................................................................... +4.5 V dc to +5.5 V dc +11.4 V dc to +16.5 V dc -11.4 V dc to -16.5 V dc -55 qC to +125qC 1.5 Radiation features Maximum total dose available (dose rate = 50 – 300 rad/s) .......................................... d100 Krads 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 4 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Block or logic diagrams. The block or logic diagrams shall be as specified on figure 3. 3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 81 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55qC d TA d+125qC VCC = +15 V, VLOG = +5 V, VEE = -15 V 1/ Group A subgroups Device type 1, 2, 3 01, 02, 03, 04 1 02 40 1, 2, 3 05, 06, 07, 08 1 1, 2, 3 01, 02 5 1 02 5 03, 04 15 05, 06, 07, 08 9 unless otherwise specified Power supply current From VLOG Min ILOG M, D, L, R Power supply current ICC M, D, L, R From VCC 1, 2, 3 Power supply current IEE 1, 2, 3 M, D, L, R From VEE Resolution Integral linearity error ILE 01, 02, 03, 04 -30 1 02 -30 1, 2, 3 05, 06, 07, 08 0 1, 2, 3 All 12 1 All 2, 3 M, D, L, R Differential linearity error (minimum resolution for which no missing codes guaranteed) 2/ Unipolar offset voltage error DLE TA = +25qC M, D, L, R Unipolar offset drift 2/ Bipolar offset voltage error 'VIO 'T BZ Using internal reference TA = +25qC M, D, L, R Bipolar zero offset drift 2/ 'BZ Using internal reference T Unit Max 40 0.5 1.0 1.0 -1.0 1 All 12 mA Bits -0.5 02 mA mA -1.0 1 2, 3 VIO Limits LSB Bits 12 1 All -2.0 2.0 1 02 -3.0 3.0 LSB 12 01 -1.0 1.0 2, 3 All -1.0 1.0 LSB 1 All -4.0 4.0 LSB 1 02 -5.0 5.0 12 01 -2.0 2.0 2, 3 01, 03, 05, 07 -1.0 1.0 02, 04, 06, 08 -2.0 2.0 LSB See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 6 TABLE I. Electrical performance characteristics – continued. Test Gain error Symbol Conditions -55qC d TA d+125qC VCC = +15 V, VLOG = +5 V, VEE = -15 V 1/ 'AE unless otherwise specified TA = +25qC Group A subgroups Device type 1 01, 02 Max 0.25 % of 1 02 0.35 F.S. With 50: resistor from REF OUT to REF IN 1 03, 04, 05, 06, 07, 08 0.30 12 01 Using internal reference 2, 3 01, 03, Min M, D, L, R Gain error drift 2/ 'AE 'T Power supply sensitivity (Maximum change in +PSS1 full scale calibration) 2/ +PSS2 Limits Unit 0.125 -12.5 12.5 02, 04, 06, 08 -25.0 25.0 1 All -1.0 1.0 1 All -0.5 0.5 1 All -1.0 1.0 10 V span, TA = +25qC 4 All 3 7 20 V span, TA = +25qC 4 01, 02, 03, 04 6 14 05, 06, 07, 08 15 25 ppm/qC 05, 07 +13.5 V < VCC < +16.5 V LSB TA = +25qC +11.4 V < VCC < +12.6 V TA = +25qC +PSS3 +4.5 V < VLOG < +5.5 V TA = +25qC -PSS1 -16.5 V < VEE < -13.5 V TA = +25qC -PSS2 -12.6 V < VEE < -11.4 V TA = +25qC Input Impedance ZIN 2/ Internal reference voltage Output current 2/, 4/ VREF IO TA = +25qC 3/ 1 01, 02 9.98 10.02 M, D, L, R 1 02 9.95 10.05 1 03, 04 07, 08 9.90 10.10 05, 06 9.97 10.03 12 01 9.99 10.01 1 01, 02, 03, 04 1.5 05, 06, 07, 08 2.0 Available for external loads TA = +25qC k: V mA See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 7 TABLE I. Electrical performance characteristics – continued. Group A subgroups Device type unless otherwise specified Logic “1”, TA = +25qC 1 01, 02, 05, 06, 07, 08 Logic “0”, TA = +25qC 1 TA = +25qC 1 VOL Logic “0”, TA = +25qC, ISINK = +1.6 mA 1 All VOH Logic “1”, TA = +25qC, 1 All 2.4 ISOURCE = +500 PA 1 High-Z state, TA = +25qC, DB11 – DB0 only 1 01, 02, 03, 04, 07, 08 -20 +20 05, 06 -5 +5 Test Symbol Input voltage (CE, CS, 12/8, R/C, AO) 2/, 5/ VIH VIL IIN Input current Conditions -55qC d TA d+125qC VCC = +15 V, VLOG = +5 V, VEE = -15 V 1/ 2/ Output voltage (DB11-DB0, STS) 2/ Output voltage (DB11-DB0) 2/ High impedance state output current 2/ IZ See 4.4.1b, TA = +25qC Functional tests See figure 4 Low R/C pulse width STS delay from R/C High R/C pulse width 5.5 -0.5 0.8 01, 02, 03, 04, 07, 08 -20 +20 05,06 -1 03, 04 350 05, 06, 07, 08 50 9, 10, 11 9, 10, 11 tHDR 200 01, 02, 05, 06, 07, 08 25 03, 04 15 300 1000 1200 03, 04 300 See figure 4 9, 10, 11 01, 02, 03, 04 300 05, 06, 07, 08 150 2/, 7/ PA ns 05, 06, 07, 08 01, 02, 05, 06, 07, 08 V V 600 9, 10, 11 tHRH PA 1 01, 02, 03, 04 See figure 4 tHS V 0.4 250 2/, 6/ STS delay after valid data 2/, 6/ 2.4 All All 2/, 6/ Data valid after R/C low 03, 04 01, 02 tDS See figure 4 Max 5.5 7 2/, 6/ Unit Min 2.0 9, 10, 11 tHRL See figure 4 Limits ns ns ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 8 TABLE I. Electrical performance characteristics – continued. Conditions Test Data access time 2/, 7/ STS delay from CE 2/, 7/ CE pulse width 2/, 7/ Conversion time Symbol tDDR tDSC tHEC tC -55qC d TA d+125qC VCC = +15 V, VLOG = +5 V, VEE = -15 V 1/ Group A subgroups Device type 9, 10, 11 01, 02, 03, 04 unless otherwise specified See figure 4 Min See figure 4 9, 10, 11 See figure 5 9, 10, 11 8-bit cycle 9, 10, 11 See figure 5 2/, 8/ 12-bit cycle 9, 10, 11 See figure 5 Access time (from CE) tDD Limits See figure 6 9, 10, 11 2/, 6/ Unit Max 250 05, 06, 07, 08 150 01, 02, 03, 04 350 05, 06, 07, 08 200 01, 02, 03, 04 300 05, 06, 07, 08 50 ns ns 01,02 4/ 10 24 03, 04, 05, 06, 07, 08 10 17 01,02 4/ 15 35 03, 04, 05, 06, 07, 08 15 25 01, 02 200 03, 04 250 05, 06, 07, 08 150 Data valid after CE low 2/, 6/ tHD See figure 6 9, 10, 11 01, 02, 05, 06, 07, 08 25 03, 04 15 Output float delay tHL See figure 6 9, 10, 11 01, 02 100 03, 04, 05, 06, 07, 08 150 2/, 6/ ns Ps ns ns ns 1/ Devices supplied to this drawing have been characterized through all levels M, D, L, and R of irradiation. However, this device is only tested at the “R” level. Pre and post irradiation values are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TA = +25qC. 2/ This parameter is not tested post irradiation. 3/ The reference voltage external load current shall be a constant dc and shall not exceed 1.5 mA. 4/ Reference should be buffered for operation on +12 V supplies. External load should not change during conversion. 5/ For devices 01 and 02, 12/8 is not TTL compatible and must be hard wired to VLOG or digital ground. 6/ Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits. 7/ Parameters tHRH, tDDR, tDSC, and tHEC, if not tested, shall be guaranteed to the specified limits. 8/ For devices 03 and 04, time measured from 50 percent level of digital transitions, tested with 50 pF and 3.0 k: load. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 9 Device types Case outlines Terminal number 1 All X 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 01, 02 01, 02, 05, 06, 07, 08 Z 3 Terminal symbol VLOG 03, 04 Y Terminal symbol VLOG 12/8 12/8 CS AO CS AO R/C CE VCC REF OUT AGND REF IN VEE BIP OFF 10 VIN 20 VIN DGND DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 DB8 DB9 DB10 DB11 (MSB) STS NC NC NC NC R/C CE VCC REF OUT AGND REF IN VEE NC BIP OFF 10 VIN 20 VIN NC NC NC NC DGND NC NC DB0 DB1 DB2 NC DB3 DB4 DB5 DB6 DB7 DB8 DB9 NC NC NC NC DB10 DB11 (MSB) STS FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 10 CE CS R/C 12/8 AO Operation 0 X X 1 X X X X X X None None 1 1 0 0 0 0 X X 0 1 Initiate 12-bit conversion Initiate 8-bit conversion 1 0 1 1 X Enable 12-bit parallel output 1 1 0 0 1 1 0 0 0 1 Enable 8 most significant bits Enable 4 LSBs + 4 trailing zeros FIGURE 2. Truth table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 11 Device types 01, 02, 03, and 04 NOTE: For device types 03 and 04, the resistor value is 9.95 k:. FIGURE 3. Block diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 12 Device types 05, 06, 07, and 08 FIGURE 3. Block diagram - continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 13 B O FIGURE 4. High/low pulse for R/C outputs. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 14 FIGURE 5. Convert start diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 15 FIGURE 6. Read cycle timing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 16 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA = +125qC, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Optional subgroup 12, for device 01, is used for grading the part selection at 25qC. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 17 TABLE IIA. Electrical test requirements. Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M Device class Q Device class V Interim electrical parameters (see 4.2) 1 1 1 Final electrical parameters (see 4.2) 1/ 1, 2, 3, 4, 12 1/ 1, 2, 3, 4, 12 1/, 2/ 1, 2, 3, 4, 12 1, 2, 3, 4, 7, 9, 10, 11, 12 1, 2, 3, 4, 7, 9, 10, 11, 12 1, 2, 3, 4, 7, 9, 10, 11, 12 Group C end-point electrical parameters (see 4.4) 1, 4 1, 4 2/ 1, 4 Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) 1, 4 1, 4 1, 4 --- --- 1 Test requirements Group A test requirements (see 4.4) Subgroups (in accordance with MIL-PRF-38535, table III) 1/ PDA applies to subgroup 1. 2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits shall be computed with reference to the previous interim electrical parameters. TABLE IIB. 240 hour burn-in and group C end-point electrical parameters. Test title Endpoint limits Delta limits Units 2 +0.5 LSB -5.5 4.5 +1 LSB -0.35 0.35 +.10 %FSR Min Max Uni Vio -1 Bpze Ae 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. For device class M, subgroups 7 tests shall be sufficient to verify the truth table. For device classes Q and V, subgroups 7 shall include verifying the functionality of the device. c. Subgroups 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. d. Optional subgroup 12, for device type 01, is used for grading the part selection at 25qC. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 18 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. b. TA = +125qC, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25qC r5qC, after exposure, to the subgroups specified in table IIA herein. c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 19 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0525. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. VLOG 12/8 CS A0 R/C CE VCC REF OUT AGND REF IN VEE BIP OFF VIN DGND D0-D11 STS NC Logic supply Data mode select input Chip select input Byte address/short cycle input Read/convert input Chip enable input Positive power supply Reference output Analog ground Reference input Negative power supply Bipolar offset input Span input Digital ground Tree-state data outputs Status output No connection 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-85127 A REVISION LEVEL G SHEET 20 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 01-05-16 Approved sources of supply for SMD 5962-85127 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-85127013A 24355 AD574AUE/883B 24355 AD574AUD/883B 1ES66 MX574AUQ/883B 5962-8512701XC 1ES66 MX574AUD/883B 5962-8512701VXA 24355 AD574AUD/QMLV 5962-8512701VZA 24355 AD574AUF/QMLV 24355 AD574ATE/883B 1ES66 MX574ATE/883B 5962-8512701XA 5962-85127023A 24355 AD574ATD/883B 1ES66 MX574ATQ/883B 5962-8512702XC 1ES66 MX574ATD/883B 5962-8512702VXA 24355 AD574ATD/QMLV 5962-8512702XA 5962-8512702VZA 24355 AD574ATF/QMLV 5962R8512702VXA 24355 AD574ATD/QMLR 5962R8512702VZA 24355 AD574ATF/QMLR 5962-8512703XA 34371 HI1-574AUD/883 5962-8512703YA 34371 HI4-574AUE/883 5962-8512704XA 34371 HI1-574ATD/883 5962-8512704YA 34371 HI4-574ATE/883 5962-85127053A 3/ HADC574ZAMC/883 5962-8512705XC 3/ HADC574ZAMJ/883 5962-85127063A 3/ HADC574ZBMC/883 5962-8512706XC 3/ HADC574ZBMJ/883 5962-85127073C 3/ HS574AU/B-LCC 5962-8512707XC 3/ HS574AU/B 5962-85127083C 3/ HS574AT/B-LCC 5962-8512708XC 3/ HS574AT/B 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source. Sheet 1 of 2 STANDARD MICROCIRCUIT DRAWING BULLETIN - continued Vendor CAGE number Vendor name and address 24355 Analog Devices Incorporated Route 1 Industrial Park PO Box 9106 Norwood, MA 02062-9106 Point of contact: 1500 Space Park Drive PO Box 58020 Santa Clara, CA 95050-8020 1ES66 Maxim Integrated Products 120 San Gabriel Drive Sunnyvale, CA 94086-5126 34371 Intersil Corporation 2401 Palm Bay Blvd PO Box 883 Melbourne, FL 32902-0883 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.