Description High-speed InGaAs photodiodes from PerkinElmer Optoelectronics are designed for use in OEM fiber optic communications systems and highspeed receiver applications including trunk line, LAN, fiber-in-the-loop and data communications. Ceramic submount packages are available for easy integration into high-speed SONET, FDDI, or datalink receiver modules, or as back-facet power monitors in laser diode modules. Photodiodes are available in hermetic TO-18 packages, or in connectorized receptacle packages with industry standard ST, FC or SC connectors. These are designed for mating to either single or multimode fibers. Photodiodes are also available in a fibered package with either single or multimode fiber pigtail, which can be terminated with either an ST, FC or SC connector. Receptacled and fibered packages use a ball-lens TO-18 package to maximize coupling efficiency. All devices are planar passivated and feature proven high reliability mounting and contacting. An MTTF of >109 hours (approximately 105 years) at 50oC has been demonstrated to date from standard production samples. Quality and Reliability High-Speed InGaAs PIN Photodiodes C30616, C30637, C30617, C30618 IN A NEW LIGHT. demonstrated with an extended high temperature burnin at 200oC for 168 hours (VR = 10V), ensuring an MTTF > 107 hours at 50oC (EA = 0.7eV). Finally, all production devices are screened with a 16 hour, 200oC burn-in (VR = 10V) and tested to meet responsivity, spectral noise and dark current specifications. Features • 50, 75, 100, 350 µm diameters • High responsivity at 1300 and 1550nm • Low capacitance for high bandwidths (to 3.5GHz) • Available in various package options PerkinElmer Optoelectronics is committed to supplying the highest quality product to our customers, and we are certified to meet ISO-9001 and operate to MIL-Q-9858A and AQAP-1 quality standards. Process control is maintained through annual requalification of production units and includes extensive electrical, thermal and mechanical stress as well as an extended lifetest. In addition, every wafer lot is individually qualified to meet responsivity, capacitance and dark current specifications, and reliability is EVERYTHING Applications • High-speed communications • SONET/ATM, FDDI • Datalinks & LANs • Fiber optic sensors Performance Specifications (at VR = VOP typical), 22°C Parameter Min Operating Voltage Breakdown Voltage Active Diameter Responsivity at 1300 nm Ceramic (D1) Responsivity at 1550 nm Ceramic (D1) Dark Current Spectral Noise Current (10 kHz, 1.0 Hz) Capacitance at VR = VOP (typ) Ceramic (D1) Rise/Fall Time (10% to 90%) Bandwidth (-3 dB, RL = 50Ω) Available Package Types C30616 Typ 1 25 5 100 50 0.80 0.90 0.85 0.95 < 1.0 < 0.02 0.35 0.07 3.5 D1 C30637 Typ Max Min 10 1 25 5 100 75 0.80 0.90 0.85 0.95 < 1.0 < 0.02 2.0 0.15 0.55 0.5 0.40 0.07 3.5 D1 Max 10 Units V V µm A/W 2.0 0.15 A/W nA pA/√Hz 0.60 0.5 pF ns GHz 10 100 125 125 mA mW °C °C Maximum Ratings Maximum Forward Current Power Dissipation Storage Temperature Operating Temperature -60 -40 10 100 125 125 Figure 1: Typical spectral responsivity vs wavelength. Dotted line shows response in D2 package (silicon window) -60 -40 Figure 2: Typical capacitance vs operating voltage. Note 1: Ceramic submount. Specifications (at VR = VOP typical), 22°C Parameter Min Operating Voltage Breakdown Voltage Active Diameter Responsivity at 1300 nm Ceramic (D1)/TO-18 (D2) Fiber (D6)/FC (D4)/ST (D3)/SC (D5)1 Responsivity at 1550 nm Ceramic (D1)/TO-18 (D2) Fiber (D6)/FC (D4)/ST (D3)/SC (D5)1 Dark Current Spectral Noise Current (10 kHz, 1.0 Hz) Capacitance at VR = VOP (typ) C30618 Typ Max Min 10 1 25 5 80 350 Max 5 100 100 0.80 0.65 0.90 0.75 0.80 0.65 0.90 0.75 A/W 0.85 0.70 0.95 0.80 < 1.0 < 0.02 0.85 0.70 A/W 2.0 0.15 0.95 0.80 2.0 0.02 5.0 0.20 nA pA/√Hz 0.6 0.8 4.0 6.0 pF TO-18 (D2) Rise/Fall Time (10% to 90%) Bandwidth (-3 dB, RL = 50 Ω) 10 Units 1 25 (D1),(D6),(D3),(D5) Available Package Types C30617 Typ 0.8 1.0 4.0 6.0 0.07 0.5 0.5 1.0 3.5 0.75 D1, D2, D3, D4, D5, D6, V V µm ns GHz D1, D2, D3, D4, D21 - Maximum Ratings Maximum Forward Current Power Dissipation Storage Temperature 2 Operating Temperature 2 -60 -40 10 100 125 125 -60 -40 10 100 125 125 mA mW °C °C Note 1. Coupled from 62.5 Fm, 0.28 NA graded index multi-mode fiber using 1300 nm SLED source. Note 2. Maximum storage and operating temperature for connectorized and fibered devices is +85°C. C30618 C30617 C30637 C30616 Figure 3: Typical dark current vs. voltage Figure 4: Typical dark current vs. temperature at VOP = -5V. Standard Packages Figure 5: Package D1: Ceramic Submount Figure 6: Package D2: TO-18 low profile Figure 7: Package D3: ST receptacle module Figure 8: Package D4: FC detector module Figure 9: Package D5: SC receptacle module Figure 10: Package D6: Fibered detector module Standard Packages Figure 11: Termination D8: ST connector Figure 12: Termination D9: FC connector Figure 13: Termination D10: SC connector Figure 14: Package D21: TO-18 ball-lens package Ordering Guide C30 # # # L M M M - X X - N N Connector Connector Connector Fiber Termination ST: FC: SC: Fiber Type (Core/cladding/jacket in µm, NA) 04: 07: 62.5/125/900,0.29 9/125/900,0.10 Package Type ST: FC: SC: QC: CER: Receptacle Receptacle Receptacle Fibered -XX-NN Ceramic Lens Type E: B: Flat window, ceramic TO-18, ceramic submount submount Connector/fibered/ball Ball lenslens, TO-18, stand alone or with fiber / connector Chip Type 616, 637, 617, 618 Note: Specific package types available for each photodiode are listed in the table of specifications. For more information e-mail us at [email protected] or visit our web site at www.perkinelmer.com/opto All values are nominal; specifications subject to change without notice. ©2000 PerkinElmer, Inc. All rights reserved. 0400 is a registered trademark of PerkinElmer, Inc. PerkinElmer Optoelectronics 22001 Dumberry Road Vaudreuil (QC) Canada J7V 8P7 Phone: (450) 424-3300 Fax: (450) 424-3411