BOURNS CD214C-F350

PL
IA
NT
Features
Lead free device (RoHS compliant*)
Glass passivated chip
■ Low reverse leakage current
■ Low forward voltage drop
■ High current capability
S
CO
M
■
*R
oH
■
CD214C-F350~F3600 Fast Response Rectifiers
General Information
The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop
increasingly smaller electronic components. Bourns offers Glass Passivated Rectifiers for rectification applications, in compact chip
DO-214AB (SMC) size format, which offers PCB real estate savings and are considerably smaller than competitive parts. The Glass
Passivated Rectifier Diodes offer a forward current of 3.0 A with a choice of repetitive peak reverse voltage of 50 V up to 600 V.
Bourns Chip Diodes® conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration
minimizes roll away.
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Maximum Repetitive
Peak Reverse Voltage
Maximum RMS Voltage
CD214C-
Unit
F350
F3100
F3200
F3400
F3600
VRRM
50
100
200
400
600
V
VRMS
35
70
140
280
420
V
Maximum DC Blocking Voltage
VDC
50
100
200
400
600
V
Maximum Average Forward
Rectified Current (@ TL = 100 °C)1
I(AV)
3.0
A
DC Reverse Current @ Rated DC
Blocking Voltage (@TJ = 25 °C)
IR
10.0
µA
DC Reverse Current @ Rated DC
Blocking Voltage (@TJ = 125 °C)
IR
500.0
µA
Typical Junction Capacitance2
CJ
45
pF
Maximum Instantaneous
Forward Voltage @ 3 A
VF
0.92
1.25
1.30
V
Typical Thermal Resistance3
RθJA
15
°C/W
Peak forward surge current 8.3 ms
single half sine-wave superimposed
on rated load (JEDEC Method)
IFSM
100
A
Trr
25
ns
Maximum Reverse Recovery Time
Notes:
1 See Forward Derating Curve.
2 Measured at 1 MHz and an applied reverse voltage of 4.0 V.
3 Thermal resistance from junction to lead.
Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Operating Temperature Range
Storage Temperature Range
Symbol
CD214C-F350~F3600
Unit
TJ
-55 to +150
°C
TSTG
-55 to +150
°C
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD214C-F350~F3600 Fast Response Rectifiers
Product Dimensions
Recommended Pad Layout
This is a lead free product using 100 % Sn termination. It is a
molded plastic package. A cathode band indicates the polarity.
The package weighs approximately 0.21 g. The package and
dimensions are shown below.
2.69
MAX.
(0.106)
6.60 - 7.11
(0.260 - 0.280)
2.10
MIN.
(0.083)
2.92 - 3.18
(0.115 - 0.125)
5.59 - 6.22
(0.220 - 0.240)
1.27
MIN.
(0.050)
DIMENSIONS:
MM
(INCHES)
How To Order
CD 214C - F 3 50
2.01 - 2.62
(0.080 - 0.103)
0.05 - 0.20
(0.002 - 0.008)
0.76 - 1.52
(0.03 - 0.06)
7.75 - 8.13
(0.305 - 0.320)
DIMENSIONS:
MM
(INCHES)
0.15 - 0.31
(0.006 - 0.012)
Common Code
CD = Chip Diode
Package
214C = SMC/DO-214AB
Model Series
F = Fast Rectifier
Forward Current I(AV)
3=3A
Reverse Voltage
50 = 50 V
100 = 100 V
200 = 200 V
400 = 400 V
600 = 600 V
Typical Part Marking
CD214C-F350 ............................................................................
CD214C-F3100 ..........................................................................
CD214C-F3200 ..........................................................................
CD214C-F3400 ..........................................................................
CD214C-F3600 ..........................................................................
F3A
F3B
F3D
F3G
F3J
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD214C-F350~F3600 Fast Response Rectifiers
Packaging Information
The product will be dispensed in Tape and Reel format (see diagram below).
P
0
P
1
d
T
E
Index Hole
120
F
D2
W
B
D1 D
P
A
Trailer
.......
.......
End
C
Device
.......
.......
.......
.......
Leader
.......
.......
W1
Start
DIMENSIONS:
10 pitches (min.)
10 pitches (min.)
Direction of Feed
Item
Symbol
Carrier Width
A
Carrier Length
B
Carrier Depth
C
Sprocket Hole
d
Reel Outside Diameter
D
Reel Inner Diameter
D1
Feed Hole Diameter
D2
Sprocket Hole Position
E
Punch Hole Position
F
Punch Hole Pitch
P
Sprocket Hole Pitch
P0
Embossment Center
P1
Overall Tape Thickness
T
Tape Width
W
Reel Width
W1
Quantity per Reel
—
SMC (DO-214AB)
7.22 ±0.10
(0.284 ±0.004)
8.11 ±0.10
(0.319 ±0.004)
2.36 ±0.10
(0.093 ±0.004)
1.55 ±0.05
(0.061 ±0.002)
330
(12.992)
50.0
Min.
(1.969)
13.0 ±0.20
(0.512 ±0.008)
1.75 ±0.10
(0.069 ±0.004)
7.50 ±0.10
(0.295 ±0.004)
4.00 ±0.10
(0.157 ±0.004)
4.00 ±0.10
(0.157 ±0.004)
2.00 ±0.10
(0.079 ±0.004)
0.30 ±0.10
(0.012 ±0.004)
16.00 ±0.20
(0.630 ±0.008)
22.4
Max.
(0.882)
3,000
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MM
(INCHES)
Devices are packed in accordance with EIA standard
RS-481-A and specifications shown here.
CD214C-F350~F3600 Fast Response Rectifiers
Performance Graphs
Maximum Non-Repetitive Surge Current
Forward Current Derating Curve
Peak Forward Surge Current (Amps)
Average Forward Current (Amps)
3.0
2.5
2.0
1.5
1.0
Single Phase Half Wave 60 Hz
Resistive or Inductive Load
0.5
0
25
50
75
100
125
150
175
100
80
60
40
Pulse Width 8.3 ms
Single Half Sine-Wave
(JEDEC Method)
20
0
1
2
Lead Temperature (°C)
5
10
20
50
100
Number of Cycles at 60 Hz
Typical Forward Characteristics
Typical Reverse Characteristics
1000
10.0
F3400
Instantaneous Reverse Leakage Current (mA)
Instantaneous Forward Current (Amps)
F350-F3200
F3600
1.0
0.1
Pulsewidth: 300 µs
TJ = 25 °C
100
TJ = 125 °C
10
TJ = 25 °C
1.0
0.1
0.01
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Instantaneous Forward Voltage (Volts)
1.6
1.8
0
20
40
60
80
100
120
140
Percent of Rated Peak Reverse Voltage (%)
Reliable Electronic Solutions
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A., IPA0508 10/05
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.