DIODES DSS30101L-7

DSS30101L
Features
Mechanical Data
•
•
•
•
•
•
•
Ideal for Medium Power Amplification and Switching
Ultra Low Collector-Emitter Saturation Voltage
Lead, Halogen and Antimony Free, RoHS Compliant (Note 1)
“Green” Device (Note 2)
ESD rating: 400V-MM, 8KV-HBM
•
•
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Case: SOT-23
Case Material: Molded Plastic, "Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish — Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
C
C
B
Top View
E
B
E
Device Symbol
Pin Configuration
Ordering Information
Part Number
DSS30101L-7
Notes:
Case
SOT-23
Packaging
3000/Tape & Reel
1. No purposefully added lead. Halogen and Antimony Free.
2. Diodes Inc’s “Green” Policy can be found on our website at http://www.diodes.com
Marking Information
ZN3
Date Code Key
Year
Code
Month
Code
2008
V
Jan
1
2009
W
Feb
2
DSS30101L
Document number: DS31588 Rev. 3 - 2
Mar
3
YM
ADVANCE INFORMATION
LOW VCE(SAT) NPN SURFACE MOUNT TRANSISTOR
2010
X
Apr
4
ZN3 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: V = 2008)
M = Month (ex: 9 = September)
2011
Y
May
5
Jun
6
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2012
Z
Jul
7
2013
A
Aug
8
Sep
9
2014
B
Oct
O
2015
C
Nov
N
Dec
D
August 2010
© Diodes Incorporated
DSS30101L
@TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Peak Pulse Current
Continuous Collector Current
Symbol
VCBO
VCEO
VEBO
ICM
IC
Value
50
30
5
2
1
Unit
V
V
V
A
A
Value
600
209
-55 to +150
Unit
mW
°C/W
°C
Thermal Characteristics
Characteristic
Power Dissipation (Note 3) @ TA = 25°C
Thermal Resistance, Junction to Ambient Air (Note 3) @ TA = 25°C
Operating and Storage Temperature Range
Notes:
Symbol
PD
RθJA
TJ, TSTG
3. Device mounted on FR-4 PCB MRP
400
P(pk), PEAK TRANSIENT POWER (W)
0.8
PD, POWER DISSIPATION (W)
0.6
0.4
RθJA = 209°C/W
0.2
0
0
20
40
60
80 100 120 140 160
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Dissipation vs. Ambient Temperature (Note 3)
Single Pulse
RθJA(t) = r(t) * RθJA
RθJA = 175°C/W
300
T J - T A = P * RθJA(t)
Duty Cycle, D = t1/t2
200
100
0
0.00001
0.001
0.1
10
1,000
t1, PULSE DURATION TIME (s)
Fig. 2 Single Pulse Maximum Power Dissipation
1
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCE INFORMATION
Maximum Ratings
D = 0.9
D = 0.7
D = 0.5
0.1
D = 0.3
D = 0.1
RθJA(t) = r(t) * RθJA
RθJA = 175°C/W
D = 0.05
0.01
P(pk)
D = 0.02
t1
t2
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1/t2
D = 0.01
D = 0.005
D = Single Pulse
0.001
0.00001
0.0001
DSS30101L
Document number: DS31588 Rev. 3 - 2
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (s)
Fig. 3 Transient Thermal Response
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100
1,000
10,000
August 2010
© Diodes Incorporated
DSS30101L
Characteristic
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage (Note 4)
Emitter-Base Breakdown Voltage
Collector-Emitter Saturation Voltage (Note 4)
VCE(sat)
Equivalent On-Resistance (Note 4)
Base-Emitter Saturation Voltage (Note 4)
Base-Emitter Turn-on Voltage (Note 4)
RCE(sat)
VBE(sat)
VBE(on)
Min
50
30
5
⎯
⎯
⎯
300
300
200
⎯
⎯
⎯
⎯
⎯
⎯
Symbol
V(BR)CBO
V(BR)CEO
V(BR)EBO
Transition Frequency
fT
100
250
⎯
Output Capacitance
Input Capacitance
Turn-On Time
Delay Time
Rise Time
Turn-Off Time
Storage Time
Fall Time
Cobo
Cibo
ton
td
tr
toff
ts
tf
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
9
65
57
19
38
340
315
25
15
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Collector-Base Cutoff Current
ICBO
Emitter-Base Cutoff Current
IEBO
DC Current Gain (Note 4)
hFE
Typ
⎯
⎯
⎯
⎯
⎯
⎯
⎯
450
⎯
⎯
⎯
⎯
⎯
0.93
0.80
Max
⎯
⎯
⎯
100
50
100
⎯
900
⎯
75
125
200
200
1.1
1.1
Unit
V
V
V
nA
μA
nA
Test Conditions
IC = 100μA
IC = 10mA
IE = 100μA
VCB = 30V, IE = 0
VCB = 30V, IE = 0, TA = 150°C
VEB = 4V, IC = 0
VCE = 5V, IC = 50mA
⎯ VCE = 5V, IC = 0.5A
VCE = 5V, IC = 1A
IC = 0.1A, IB = 1mA
mV IC = 0.5A, IB = 50mA
IC = 1.0A, IB = 100mA
mΩ IE = 1A, IB = 100mA
V
IC = 1A, IB = 100mA
V
VCE = 2V, IC = 1A
VCE = 5V, IC = 100mA,
MHz
f = 100MHz
pF VCB = 10V, f = 1MHz
pF VEB = 5V, f = 1MHz
ns
ns
ns
VCC = 5V, IC = 500mA,
ns
IB1 = -IB2 = 50mA
ns
ns
4. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤2%.
1,200
2.2
1,100
2.0
IB = 5mA
1.8
IB = 4mA
1.6
1.4
IB = 3mA
1.2
1.0
IB = 2mA
0.8
0.6
1,000
hFE, DC CURRENT GAIN
Notes:
IC, COLLECTOR CURRENT (A)
ADVANCE INFORMATION
Electrical Characteristics @TA = 25°C unless otherwise specified
IB = 1mA
900
TA = 125°C
800
TA = 85°C
700
600
400
300
200
0.2
100
0
Document number: DS31588 Rev. 3 - 2
TA = -55°C
0
0.001
1
2
3
4
5
VCE, COLLECTOR-EMITTER VOLTAGE (V)
Fig. 4 Typical Collector Current
vs. Collector-Emitter Voltage
DSS30101L
TA = 25°C
500
0.4
0
TA = 150°C
0.01
0.1
1
10
IC, COLLECTOR CURRENT (A)
Fig. 5 Typical DC Current Gain vs. Collector Current
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DSS30101L
500
RCE(SAT), EQUIVALENT ON-RESISTANCE (V)
VCE(SAT), COLLECTOR-EMITTER
SATURATION VOLTAGE (V)
IC/IB = 10
0.2
0.1
T A = 150°C
TA = 85°C
TA = 125°C
TA = 25°C
TA = -55°C
0
0.001
VCE = 5V
1.0
0.8
TA = -55°C
0.6
TA = 25°C
0.4
T A = 85°C
T A = 150°C
0.2
TA = 125°C
0
0.001
0.01
0.1
1
10
IC, COLLECTOR CURRENT (A)
Fig. 8 Typical Base-Emitter Turn-On Voltage
vs. Collector Current
VBE(SAT), BASE-EMITTER SATURATION VOLTAGE (V)
VBE(ON), BASE-EMITTER TURN-ON VOLTAGE (V)
1.2
IC/IB = 10
450
400
350
300
250
T A = 125°C
200
150
T A = 150°C
TA = 85°C
T A = 25°C
100
TA = -55°C
50
0
0.01
0.01
0.1
1
10
IC, COLLECTOR CURRENT (A)
Fig. 6 Typical Collector-Emitter Saturation Voltage
vs. Collector Current
0.1
1
IC, COLLECTOR CURRENT (A)
Fig. 7 Typical Equivalent On-Resistance
vs. Collector Current
10
1.4
1.2
IC/IB = 10
1.0
0.8
TA = -55°C
0.6
TA = 25°C
TA = 85°C
0.4
TA = 150°C
TA = 125°C
0.2
0
0.001
0.01
0.1
1
10
IC, COLLECTOR CURRENT (A)
Fig. 9 Typical Base-Emitter Saturation Voltage
vs. Collector Current
150
120
CAPACITANCE (pF)
ADVANCE INFORMATION
0.3
f = 1MHz
90
Cibo
60
30
Cobo
0
0
5
10
15
20
25
30
35 40
VR, REVERSE VOLTAGE (V)
Fig. 10 Typical Capacitance Characteristics
DSS30101L
Document number: DS31588 Rev. 3 - 2
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© Diodes Incorporated
DSS30101L
ADVANCE INFORMATION
Package Outline Dimensions
A
B C
H
K
M
K1
D
J
F
L
G
SOT-23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.903 1.10
1.00
K1
0.400
L
0.45
0.61
0.55
M
0.085 0.18
0.11
0°
8°
α
All Dimensions in mm
Suggested Pad Layout
Y
Z
C
X
DSS30101L
Document number: DS31588 Rev. 3 - 2
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35
E
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DSS30101L
ADVANCE INFORMATION
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
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DSS30101L
Document number: DS31588 Rev. 3 - 2
6 of 6
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August 2010
© Diodes Incorporated