Preliminary Technical Data Sheet EHP-5393/UT31C-P01 Features ․Popular 10mm package. ․Typical color temperature 6500K ․View angle:25° . ․High light flux output ․Soldering methods: Dip soldering. ․Grouping parameter: total luminous flux, color coordinates. ․Optical efficiency: 30 lm/W ․Thermal resistance (junction to lead): 13K/W ․The product itself will remain within RoHS compliant version. ․ESD-withstand voltage: up to 4KV Descriptions ․The series is specially designed for applications requiring higher brightness. ․EHP-5393 is a revolution, energy efficient and ultra compact new light source, combining the lifetime and reliability advantages of Light Emitting Diodes with the brightness of conventional lighting. Applications ․Flash ․Sunshine light. ․Advertising Signs. ․Back lighting. Device Selection Guide LED Part No. EHP-5393/UT31C-P01 Chip Material Emitted Color InGaN White Everlight Electronics Co., Ltd. http\\:www.everlight.com Device Number : Prepared date:1-15-2008 Lens Color Water Clear Rev: Page: 1 of 12 Prepared by: Dante Chen Preliminary Technical Data Sheet EHP-5393/UT31C-P01 Package Dimensions .30 ± 45 . 21 10±0.3 1 .3 n i M .2 0 ± 2 3 .0 ± 8 8 . 3 5 1 .n i M 2. 0 ± 5. 1 2. 0 ± 5. 1 1 2 0. .1 ni M 1±0.2 1 Anode 1±0.2 2 Cathode 10±0.3 Notes: ․Other dimensions are in millimeters, tolerance is 0.25mm except being specified. ․Protruded resin under flange is 1.5mm Max LED. ․Bare copper alloy is exposed at tie-bar portion after cutting. Everlight Electronics Co., Ltd. http\\:www.everlight.com Device Number : Prepared date:1-15-2008 Rev: Page: 2 of 12 Prepared by: Dante Chen Preliminary Technical Data Sheet EHP-5393/UT31C-P01 Absolute Maximum Rating (Ta=25℃ ℃) Parameter Forward Current Symbol IF Absolute Maximum Rating 350 Unit mA Junction to heat-sink thermal resistance Rth 13 K/W Operating Temperature Storage Temperature Electrostatic Discharge Topr Tstg ESD -40 ~ +85 -40 ~ +100 4K ℃ ℃ V Soldering Temperature Tsol 260 ℃ Power Dissipation Pd 1.4 Reverse Voltage Zener Reverse Current VR Iz 5 100 W V mA Notes: Soldering time≦5 seconds. Electro-Optical Characteristics (Ta=25℃ ℃) Parameter Symbol Min. Typ. Max. Unit Luminous Flux Flux 33 --- 52 lm Viewing Angle 2θ1/2 --- 25 --- deg Forward Voltage VF 3.0 3.5 4.0 V Reverse Current IR --- --- 10 µA VR=5V Zener Reverse Voltage Vz 5.2 --- --- V Iz=5mA Color Temperature CCT 4500 6500 10000 K IF=350mA x --- 0.29 --- --- Chromaticity Coordinates Condition IF=350mA IF=350mA y --- 0.28 Everlight Electronics Co., Ltd. http\\:www.everlight.com Device Number : Prepared date:1-15-2008 --- --- Rev: Page: 3 of 12 Prepared by: Dante Chen Preliminary Technical Data Sheet EHP-5393/UT31C-P01 Rank Combination (IF=350mA) Rank J3 J4 J5 K1 Luminous Flux 33~39 39~45 45~52 52~60 *Measurement Uncertainty of Luminous Intensity: ±15% Unit:mcd Forward Voltage Combination (V at 350mA) Rank 1 2 3 4 5 Forward Voltage 3.0~3.2 3.2~3.4 3.4~3.6 3.6~3.8 3.8~4.0 *Measurement Uncertainty of Forward Voltage: ±0.1V Everlight Electronics Co., Ltd. http\\:www.everlight.com Device Number : Prepared date:1-15-2008 Unit:V Rev: Page: 4 of 12 Prepared by: Dante Chen Preliminary Technical Data Sheet EHP-5393/UT31C-P01 Color Combination ( at 350mA) Y6-1 Y6-2 Y9-1 Y9-2 X Y X Y 0.289 0.291 0.295 0.276 0.281 0.309 0.289 0.291 0.29 0.318 0.297 0.3 0.297 0.3 0.302 0.283 Reference CCT: 8000~9000K X Y X Y 0.283 0.284 0.29 0.27 0.274 0.301 0.283 0.284 0.281 0.309 0.289 0.291 0.289 0.291 0.295 0.276 Reference CCT: 9000~10000K Y6-3 Y9-3 X Y X Y 0.308 0.311 0.311 0.293 0.297 0.3 0.302 0.283 0.29 0.318 0.297 0.3 0.303 0.333 0.308 0.311 Reference CCT: 7000~8000K X4 X 0.301 0.314 0.315 0.303 X5 Y 0.342 0.355 0.344 0.333 X 0.305 0.303 0.315 0.316 W4 X 0.329 0.329 0.315 0.314 W5 Y 0.369 0.357 0.344 0.355 X 0.329 0.316 0.315 0.329 X6 X7 Y X Y 0.322 0.308 0.311 0.333 0.305 0.322 0.344 0.316 0.333 0.333 0.317 0.32 Reference CCT: 6300~7000K W6 Y X Y X 0.345 0.329 0.345 0.329 0.333 0.329 0.331 0.329 0.344 0.317 0.32 0.318 0.357 0.316 0.333 0.317 Reference CCT: 5650~6300K Everlight Electronics Co., Ltd. http\\:www.everlight.com Device Number : Prepared date:1-15-2008 X 0.308 0.317 0.319 0.311 Y 0.311 0.32 0.3 0.293 W7 W8 Y 0.331 0.32 0.31 0.32 Rev: X 0.329 0.329 0.319 0.318 Y 0.321 0.31 0.3 0.31 Page: 5 of 12 Prepared by: Dante Chen Preliminary Technical Data Sheet EHP-5393/UT31C-P01 V4 X 0.329 0.329 0.348 0.347 V5 Y 0.357 0.369 0.385 0.372 X 0.329 0.329 0.347 0.346 V7 Y X Y 0.345 0.329 0.331 0.357 0.329 0.345 0.372 0.346 0.359 0.359 0.344 0.344 Reference CCT: 5000~5650K U4 X 0.364 0.367 0.348 0.347 V6 X 0.329 0.344 0.343 0.329 U5 Y 0.383 0.4 0.385 0.372 X Y 0.364 0.383 0.362 0.372 0.346 0.359 0.347 0.372 Reference CCT: 4500~5000K Y 0.331 0.344 0.331 0.32 U6 X 0.362 0.36 0.344 0.346 Y 0.372 0.357 0.344 0.359 CIE Chromaticity Diagram Everlight Electronics Co., Ltd. http\\:www.everlight.com Device Number : Prepared date:1-15-2008 Rev: Page: 6 of 12 Prepared by: Dante Chen Preliminary Technical Data Sheet EHP-5393/UT31C-P01 Typical Electro-Optical Characteristics Curves Everlight Electronics Co., Ltd. http\\:www.everlight.com Device Number : Prepared date:1-15-2008 Rev: Page: 7 of 12 Prepared by: Dante Chen Preliminary Technical Data Sheet EHP-5393/UT31C-P01 Packing Specification Anti-electrostatic bag EVERLIGHT Label CPN: P/N:XXXXXXXXXX RoHS XXX/XXXX-XXXX QTY：XXXX Pb EL ECTROSTATIC ELECTRONAGNETIC MAGNETIC OR RADIOACTIVE RELDS CAT:XX anti-static for 750 HUE:XX ● LOT NO： XXXXXXXX Inner Carton REF:XX MADE IN TAIWAN ● ● Outside Carton Label Form Specification CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks of Total Flux and Forward Voltage HUE: Color Rank REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place ● Packing Quantity 1. 250 PCS/1 Bag，5 Bags/1 Inner Carton 2. 10 Inner Cartons/1 Outside Carton Everlight Electronics Co., Ltd. http\\:www.everlight.com Device Number : Prepared date:1-15-2008 Rev: Page: 8 of 12 Prepared by: Dante Chen Preliminary Technical Data Sheet EHP-5393/UT31C-P01 Notes 1. Lead Forming During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Lead forming should be done before soldering. Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs. Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs. When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2. Storage The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3. Soldering Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. Recommended soldering conditions: Hand Soldering DIP Soldering Temp. at tip of iron 300℃ Max. (30W Max.) Preheat temp. Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min.(From solder joint to epoxy bulb) Distance Everlight Electronics Co., Ltd. http\\:www.everlight.com Device Number : Prepared date:1-15-2008 100℃ Max. (60 sec Max.) 3mm Min. (From solder joint to epoxy bulb) Rev: Page: 9 of 12 Prepared by: Dante Chen Preliminary Technical Data Sheet EHP-5393/UT31C-P01 Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering. Dip and hand soldering should not be done more than one time After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the LEDs. Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED 5. Circuit Protection Below the zener reference voltage Vz, all the current flows through LED and as the voltage rises to Vz, the zener diode “breakdown." If the voltage tries to rise above Vz current flows through the zener branch to keep the voltage at exactly Vz. When the LED is connected using serial circuit, if either piece of LED is no light up but current can’t flow through causing others to light down. In new design, the LED is parallel with zener diode. if either piece of LED is no light up but current can flow through causing others to light up. Everlight Electronics Co., Ltd. http\\:www.everlight.com Device Number : Prepared date:1-15-2008 Rev: Page: 10 of 12 Prepared by: Dante Chen Preliminary Technical Data Sheet EHP-5393/UT31C-P01 6. Heat Management Heat management of LEDs must be taken into consideration during the design stage of LED application. The current should be de-rated appropriately by referring to the de-rating curve found in each product specification. The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating curve. If the emitter is operated, consider using metal heat sink with the lowest possible thermal resistance. For the thermal performance using a flat heat sink, allow an exposed surface area of about 25mm2 at least. 7. ESD (Electrostatic Discharge) Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs. An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs. All devices, equipment and machinery must be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing. Everlight Electronics Co., Ltd. http\\:www.everlight.com Device Number : Prepared date:1-15-2008 Rev: Page: 11 of 12 Prepared by: Dante Chen Technical Data Sheet Preliminary EHP-5393/UT31C-P01 8. Other Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent. Everlight Electronics Co., Ltd. CO., LTD.http\\:www.everlight.com Rev: 2267-9936 Page: 12 of 12 EVERLIGHT ELECTRONICS Tel: 886-2-2267-2000, Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306 Device Number : Prepared date:1-15-2008 Prepared by: Dante Chen Tucheng, Taipei 236, Taiwan, R.O.C http:\\www.everlight.com