ETC H26259

HA-2620, HA-2625
®
Data Sheet
August 2002
100MHz, High Input Impedance, Very
Wideband, Uncompensated Operational
Amplifiers
Features
• Gain Bandwidth Product (AV ≥ 5) . . . . . . . . . . . . . 100MHz
HA-2620/2625 are bipolar operational amplifiers that feature
very high input impedance (500MΩ, HA-2620) coupled with
wideband AC performance. The high resistance of the input
stage is complemented by low offset voltage (0.5mV,
HA-2620) and low bias and offset current (1nA, HA-2620) to
facilitate accurate signal processing. Input offset can be
reduced further by means of an external nulling
potentiometer. The 100MHz gain bandwidth product
(HA-2620/2625 are stable for closed loop gains greater than
5), 35V/µs slew rate and 150kV/V open loop gain enables
HA-2620/2625 to perform high gain amplification of very fast,
wideband signals. These dynamic characteristics, coupled
with fast settling times, make these amplifiers ideally suited
to pulse amplification designs as well as high frequency
(e.g., video) applications. The frequency response of the
amplifier can be tailored to exact design requirements by
means of an external bandwidth control capacitor connected
from the Comp pin to GND.
In addition to its application in pulse and video amplifier
designs, HA-2620/2625 is particularly suited to other high
performance designs such as high-gain low distortion audio
amplifiers, high-Q and wideband active filters and highspeed comparators. For more information, please refer to
Application Notes AN509, AN519 and AN546.
Ordering Information
PART NUMBER
(BRAND)
TEMP.
RANGE (oC)
PACKAGE
PKG.
NO.
HA2-2620-2
-55 to 125
8 Pin Metal Can
T8.C
HA2-2625-5
0 to 75
8 Pin Metal Can
T8.C
HA3-2625-5
0 to 75
8 Ld PDIP
E8.3
HA9P2625-9
(H26259)
-40 to 85
8 Ld SOIC
M8.15
FN2903.5
• High Input Impedance . . . . . . . . . . . . . . . . . . . . . 500MΩ
• Low Input Bias Current. . . . . . . . . . . . . . . . . . . . . . . . 1nA
• Low Input Offset Current . . . . . . . . . . . . . . . . . . . . . . 1nA
• Low Input Offset Voltage . . . . . . . . . . . . . . . . . . . . 0.5mV
• High Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150kV/V
• Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35V/µs
• Output Short Circuit Protection
• Compensation Pin for Unity Gain Capability
Applications
• Video and RF Amplifier
• Pulse Amplifier
• Audio Amplifiers and Filters
• High-Q Active Filters
• High Speed Comparators
• Low Distortion Oscillator
Pinouts
HA-2625 (PDIP, SOIC)
TOP VIEW
BAL
1
-IN
2
+IN
3
V-
4
+
8
COMP
7
V+
6
OUT
5
BAL
HA-2620, HA-2625 (METAL CAN)
TOP VIEW
COMP
8
BAL 1
-IN
+
2
+IN
7
V+
6 OUT
5 BAL
3
4
V-
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
HA-2620, HA-2625
Absolute Maximum Ratings
Thermal Information
Supply Voltage (Between V+ and V- Terminals) . . . . . . . . . . . . 45V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V
Peak Output Current . . . . . . . . . . . . . . . Full Short Circuit Protection
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
θJC (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . .
117
N/A
SOIC Package . . . . . . . . . . . . . . . . . . .
165
N/A
Metal Can Package . . . . . . . . . . . . . . .
165
80
Maximum Junction Temperature (Hermetic Package) . . . . . . . .175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range
HA-2620-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
HA-2625-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC
HA-2625-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
VSUPPLY = ±15V, Unless Otherwise Specified
PARAMETER
HA-2620-2
HA-2625-5, -9
TEMP.
(oC)
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
25
-
0.5
4
-
3
5
mV
INPUT CHARACTERISTICS
Offset Voltage
(Note 3)
Full
-
2
6
-
-
7
mV
Average Offset
Voltage Drift
Full
-
5
-
-
5
-
µV/oC
Bias Current
25
-
1
15
-
5
25
nA
Full
-
10
35
-
-
40
nA
1
15
-
5
25
nA
Offset Current
25
Full
-
5
35
-
-
40
nA
Differential Input
Resistance (Note 2)
25
65
500
-
40
300
-
MΩ
Input Noise Voltage Density
(f = 1kHz)
25
-
11
-
-
11
-
nV/√Hz
Input Noise Current Density
(f = 1kHz)
25
-
0.16
-
-
0.16
-
pA/√Hz
Common Mode Range
Full
±11
±12
-
±11
±12
-
V
25
100
150
-
80
150
-
kV/V
TRANSFER CHARACTERISTICS
Large Signal Voltage Gain
(Notes 4, 5)
Full
70
-
-
70
-
-
kV/V
Common Mode Rejection Ratio
(Note 6)
Full
80
100
-
74
100
-
dB
Minimum Stable Gain
25
5
-
-
5
-
-
V/V
Gain Bandwidth Product
(Notes 4, 7, 8)
25
-
100
-
-
100
-
MHz
Output Voltage Swing (Note 4)
Full
±10
±12
-
±10
±12
-
V
Output Current (Note 5)
25
±15
±22
-
±10
±18
-
mA
Full Power Bandwidth
(Notes 4, 5, 9, 13)
25
400
600
-
320
600
-
kHz
Rise Time
(Notes 4, 9, 10)
25
-
17
45
-
17
45
ns
Slew Rate
(Notes 4, 9, 10, 12)
25
±25
±35
-
±20
±35
-
V/µs
OUTPUT CHARACTERISTICS
TRANSIENT RESPONSE (Note 8)
2
HA-2620, HA-2625
Electrical Specifications
VSUPPLY = ±15V, Unless Otherwise Specified (Continued)
TEMP.
(oC)
PARAMETER
HA-2620-2
MIN
HA-2625-5, -9
TYP
MAX
MIN
TYP
MAX
UNITS
POWER SUPPLY CHARACTERISTICS
Supply Current
25
-
3
3.7
-
3
4
mA
Power Supply Rejection Ratio
(Note 11)
Full
80
90
-
74
90
-
dB
NOTES:
2. This parameter value guaranteed by design calculations.
3. Offset may be externally adjusted to zero.
4. RL = 2kΩ.
5. VOUT = ±10V.
6. VCM = ±10V.
7. VOUT < 90mV.
8. 40dB Gain.
9. See Transient Response Test Circuits and Waveforms.
10. AV = 5 (The HA-2620 family is not stable at unity gain without external compensation).
11. ∆VS = ±5V.
12. VOUT = ±5V.
Slew Rate
13. Full Power Bandwidth guaranteed by slew rate measurement: FPBW = ----------------------------- .
2πV PEAK
Test Circuits and Waveforms
0V
±40mV
INPUT
-1V
±200mV
90%
OUTPUT
10%
0V
RISE TIME
1V
INPUT
+5V
90%
OUTPUT
10%
-5V
∆V
∆t
SLEW RATE
= ∆V/∆t
NOTE: Measured on both positive and negative transitions from 0V
to +200mV and 0V to -200mV at output.
TRANSIENT RESPONSE
IN
SLEW RATE
V+
OUT
+
-
100kΩ
1.6kΩ
50pF
400Ω
IN
BAL
OUT
COMP
CC
V-
NOTE: Tested Offset Adjustment is |VOS + 1mV| minimum referred to
output. Typical range is ±10mV with RT = 100kΩ.
SLEW RATE AND TRANSIENT RESPONSE
3
SUGGESTED VOS ADJUSTMENT AND
COMPENSATION HOOK-UP
HA-2620, HA-2625
Schematic Diagram
COMPENSATION
V+
R1
1K
BAL
R2
4.18K
R3
1.56K
R4
1.56K
R5
600
C2
9pF
BAL
Q60
Q1
Q40
Q2
Q3
Q39
Q42
Q37
Q6
Q30
Q7
+INPUT
Q11
Q8
Q29
Q13
Q36
Q28
Q32
Q18
Q43
Q33
Q57
Q55
Q25
Q54
Q45
Q15
R18
30
Q53
R17
30
Q47
Q46
Q52
R11
4.0K
Q19
R19
2.5K
Q56
OUT
Q24
Q27
R7
1.35
RP1
Q58
Q35
Q44
Q26
Q59
Q17
Q12
Q16
Q31
Q9
Q10
Q61
Q41
Q38
Q4
Q5
R6
15
Q22
Q21
R8
1K
Q23
Q48
Q49
R9
4.5K
Q20
R10
2.0K
C1
16pF
Q50
R12
1.6K
R13
1.6K
R14
1.6K
Q51
R15
800
R16
15
V-
-INPUT
Typical Applications
2.2kΩ
2.2kΩ
+15V
2.2kΩ
VIN
3
2
+
+
7
HA-2620
8
4
6
VOUT
+5.0V, 0V
4.25V
HA-2600
R1
10kΩ
R2
100kΩ
-15V
C
0.01µF
OUTPUT
FIGURE 1. HIGH INPUT IMPEDANCE COMPARATOR
4
50pF
(NOTE)
50pF (NOTE)
1N916
1N916
VREF
+
HA-2620
COMP
f=
1
4 (R1 + R2) C
~OUTPUT
FIGURE 2. FUNCTION GENERATOR
HA-2620, HA-2625
Typical Applications
(Continued)
5pF
22Ω
2.2kΩ
VIN
HA- 2620
+
VOUT
50pF (NOTE)
BW = 1MHz
GAIN = 40dB
NOTE: A small load capacitance of at least 30pF (including stray capacitance) is recommended to prevent possible high frequency oscillations.
FIGURE 3. VIDEO AMPLIFIER
Typical Performance Curves
VS = ±15V, TA = 25oC, Unless Otherwise Specified
15
EQUIVALENT INPUT NOISE (µV)
100
CURRENT (nA)
10
5
0
OFFSET
-5
BIAS
-10
-25
0
25
50
75
10
10kΩ SOURCE
RESISTANCE
0Ω SOURCE
RESISTANCE
1
THERMAL NOISE OF
10K RESISTOR
-1
100Hz
-15
-50
EQUIVALENT INPUT
NOISE vs BANDWIDTH
100
1kHz
10kHz
100kHz
1MHz
UPPER 3dB FREQUENCY
LOWER 3dB FREQUENCY = 10Hz
TEMPERATURE (oC)
FIGURE 4. INPUT BIAS CURRENT AND OFFSET CURRENT
vs TEMPERATURE
10MHz
FIGURE 5. BROADBAND NOISE CHARACTERISTICS
100
80
GAIN
60
60
40
PHASE
100
20
140
0
180
-20
10Hz 100Hz
1kHz
10kHz 100kHz
1MHz 10MHz 100MHz
FREQUENCY
FIGURE 6. OPEN LOOP FREQUENCY RESPONSE
5
INPUT IMPEDANCE (MΩ)
1000
0
20
PHASE ANGLE (DEGREES)
OPEN LOOP VOLTAGE GAIN (dB)
120
800
600
400
200
0
-55
-35
-15
5
25
45
65
85
105
125
TEMPERATURE (oC)
FIGURE 7. INPUT IMPEDANCE vs TEMPERATURE, 100Hz
HA-2620, HA-2625
Typical Performance Curves
VS = ±15V, TA = 25oC, Unless Otherwise Specified (Continued)
OPEN LOOP VOLTAGE GAIN (dB)
120
20V
PEAK VOLTAGE SWING (±V)
10V
1V
±20V SUPPLY
±15V SUPPLY
±10V SUPPLY
0.1V
100
0pF
10pF
35pF
50pF
80
60
115pF
40
300pF
1000pF
20
0
-20
10Hz
0.01V
10kHz
100kHz
1MHz
10MHz
100MHz
FREQUENCY
100Hz
1kHz
100kHz
10kHz
FREQUENCY
1MHz
10MHz
NOTE: External Compensation is required for closed loop gain < 5.
If external compensation is used, also connect 100pF capacitor from
output to ground.
FIGURE 8. OUTPUT VOLTAGE SWING vs FREQUENCY
FIGURE 9. OPEN LOOP FREQUENCY RESPONSE FOR
VARIOUS VALUES OF CAPACITORS FROM
COMP. PIN TO GND
20
120
±20V SUPPLY
15
±15V SUPPLY
GAIN (dB)
10
±10V SUPPLY
100
±5V SUPPLY
5
5
10
15
SUPPLY VOLTAGE (±V)
80
-55
20
FIGURE 10. COMMON MODE VOLTAGE RANGE vs SUPPLY
VOLTAGE
-35
-15
INPUT NOISE VOLTAGE (nV/√Hz)
25
INPUT NOISE CURRENT
10
1.0
0.1
INPUT NOISE VOLTAGE
1
1
10
65
85
105
125
FIGURE 11. OPEN LOOP VOLTAGE GAIN vs TEMPERATURE
10
100
45
TEMPERATURE (oC)
1000
100
1K
FREQUENCY (Hz)
10K
FIGURE 12. NOISE DENSITY vs FREQUENCY
6
5
0.01
100K
INPUT NOISE CURRENT (pA/√Hz)
COMMON MODE RANGE (±V)
-55oC TO 125oC
HA-2620, HA-2625
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12kÅ ±2kÅ
Nitride Thickness: 3.5kÅ ±1.5kÅ
69 mils x 56 mils x 19 mils
1750µm x 1420µm x 483µm
METALLIZATION:
TRANSISTOR COUNT:
Type: Al, 1% Cu
Thickness: 16kÅ ±2kÅ
140
SUBSTRATE POTENTIAL (POWERED UP):
PROCESS:
Unbiased
Bipolar Dielectric Isolation
Metallization Mask Layout
HA-2620, HA-2625
COMP
V+
BAL
OUT
-IN
+IN
BAL
V-
7
HA-2620, HA-2625
Dual-In-Line Plastic Packages (PDIP)
E8.3 (JEDEC MS-001-BA ISSUE D)
N
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AD
E
BASE
PLANE
-C-
SEATING
PLANE
A2
A
L
D1
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8, 10
eA
C
0.008
0.014
0.204
C
D
0.355
0.400
9.01
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
eA
0.300 BSC
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
eB
-
L
0.115
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
8
5
D1
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
0.355
10.16
N
8
2.54 BSC
7.62 BSC
0.430
-
0.150
2.93
8
6
10.92
7
3.81
4
9
Rev. 0 12/93
HA-2620, HA-2625
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
N
INDEX
AREA
0.25(0.010) M
H
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
B M
E
INCHES
-B-
1
2
SYMBOL
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
µα
A1
B
0.25(0.010) M
C
C A M
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
9
MILLIMETERS
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
8o
0o
N
NOTES:
MAX
A1
e
0.10(0.004)
MIN
α
8
0o
8
7
8o
Rev. 0 12/93
HA-2620, HA-2625
Metal Can Packages (Can)
T8.C MIL-STD-1835 MACY1-X8 (A1)
REFERENCE PLANE
A
8 LEAD METAL CAN PACKAGE
e1
L
L2
L1
INCHES
SYMBOL
ØD2
A
A
k1
Øe
ØD ØD1
2
N
1
β
Øb1
Øb
F
α
k
C
L
BASE AND
SEATING PLANE
Q
BASE METAL
Øb1
LEAD FINISH
Øb2
SECTION A-A
NOTES:
1. (All leads) Øb applies between L1 and L2. Øb1 applies between
L2 and 0.500 from the reference plane. Diameter is uncontrolled
in L1 and beyond 0.500 from the reference plane.
2. Measured from maximum diameter of the product.
MIN
MILLIMETERS
MAX
MIN
MAX
NOTES
A
0.165
0.185
4.19
4.70
-
Øb
0.016
0.019
0.41
0.48
1
Øb1
0.016
0.021
0.41
0.53
1
Øb2
0.016
0.024
0.41
0.61
-
ØD
0.335
0.375
8.51
9.40
-
ØD1
0.305
0.335
7.75
8.51
-
ØD2
0.110
0.160
2.79
4.06
-
e
e1
0.200 BSC
5.08 BSC
0.100 BSC
-
2.54 BSC
-
F
-
0.040
-
1.02
-
k
0.027
0.034
0.69
0.86
-
k1
0.027
0.045
0.69
1.14
2
12.70
19.05
1
1.27
1
L
0.500
0.750
L1
-
0.050
L2
0.250
-
6.35
-
1
Q
0.010
0.045
0.25
1.14
-
-
β
45o BSC
45o BSC
45o BSC
45o BSC
N
8
8
α
3. α is the basic spacing from the centerline of the tab to terminal 1
and β is the basic spacing of each lead or lead position (N -1
places) from α, looking at the bottom of the package.
3
3
4
Rev. 0 5/18/94
4. N is the maximum number of terminal positions.
5. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
6. Controlling dimension: INCH.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from
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For information regarding Intersil Corporation and its products, see web site www.intersil.com
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