IC589 Series Dual Inline Memory Module (DIMM, 184 pins) Specifications Part Number (Details) Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: IC-589 - 1 - MF 1,000M W min. at 500V DC 700V AC for 1 minute 30m W max. at 10mA/20mV max. –55°C to +170°C 10,000 insertions minimum 184 contact pins Series No. Design No. MF = Flanged Unmarked = Not Flanged Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features í Card thickness 1.27mm í For 184 contact pins with 1.27mm pitch Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 162.70 ±0.1 120.65 ±0.2 120.65 ±0.1 1.27x51=64.77 ±0.2 1.27x39=49.53 ±0.2 1.27±0.05 6.35 184-Æ0.80 Thru hole + 0.1 0 8.28±0.05 1.27 ±0.15 1.27 ±0.15 129.50 + 0.2 0 153.70 ±0.4 5.08±0.05 13.00 17.00 1.27x39=49.53 ±0.1 1.27x51=64.77 ±0.1 6.35 ref. Æ3.20 Thru hole 1.27 ±0.05 Æ3.20 0 Thru hole + 0.1 162.70 ±0.2 171.70 ±0.4 Matching Module Dimensions 153.70 ref 1.27 1.80 10.00 17.80 30.48 19.80 W0.40 x t0.30 4.00 4.00 2.50±0.2 3.70 ±0.5 2.30±0.1 15.48 ±0.1 6.00 4.00 11.00 34.10 ref 128.00 ref 1.27x51=64.77 ±0.1 6.35 120.65 133.35 B-6 Test & Burn-In 1.27x39=49.53 ±0.1 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER 3.00