TI LM1877

LM1877
www.ti.com
SNAS550B – FEBRUARY 1995 – REVISED APRIL 2013
LM1877 Dual Audio Power Amplifier
Check for Samples: LM1877
FEATURES
DESCRIPTION
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The LM1877 is a monolithic dual power amplifier
designed to deliver 2W/channel continuous into 8Ω
loads. The LM1877 is designed to operate with a low
number of external components, and still provide
flexibility for use in stereo phonographs, tape
recorders and AM-FM stereo receivers. Each power
amplifier is biased from a common internal regulator
to provide high power supply rejection, and output Q
point centering. The LM1877 is internally
compensated for all gains greater than 10.
1
2
2W/Channel
−65 dB Ripple Rejection, Output Referred
−65 dB Channel Separation, Output Referred
Wide Supply Range, 6V–24V
Very Low Cross-Over Distortion
Low Audio Band Noise
AC Short Circuit Protected
Internal Thermal Shutdown
APPLICATIONS
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Multi-Channel Audio Systems
Stereo Phonographs
Tape Recorders and Players
AM-FM Radio Receivers
Servo Amplifiers
Intercom Systems
Automotive Products
Connection Diagram
Figure 1. 14-Pin SOIC or PDIP (Top View)
See NPA0014B or NFF0014A Package
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1995–2013, Texas Instruments Incorporated
LM1877
SNAS550B – FEBRUARY 1995 – REVISED APRIL 2013
www.ti.com
Equivalent Schematic Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
Supply Voltage
26V
Input Voltage
±0.7V
Operating Temperature
0°C to +70°C
−65°C to +150°C
Storage Temperature
Junction Temperature
Lead Temperature
150°C
PDIP Package Soldering (10 sec.)
260°C
SOIC Package Infrared (15 sec.)
220°C
SOIC Package Vapor Phase (60 sec.)
Thermal Resistance
(1)
(2)
2
215°C
θJC (PDIP Package)
30°C/W
θJA (PDIP Package)
79°C/W
θJC (SOIC Package)
27°C/W
θJA (SOIC Package)
114°C/W
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
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Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM1877
LM1877
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SNAS550B – FEBRUARY 1995 – REVISED APRIL 2013
Electrical Characteristics
VS = 20V, TA = 25°C (1) RL = 8Ω, AV = 50 (34 dB) unless otherwise specified
Parameter
Conditions
Total Supply Current
PO = 0W
Output Power
THD = 10%
LM1877
VS = 20V, RL = 8Ω
Min
LM1877
Max
Units
25
50
mA
2.0
VS = 12V, RL = 8Ω
Total Harmonic Distortion
Typ
W/Ch
1.3
W/Ch
PO = 50 mW/Channel
0.075
%
PO = 500 mW/Channel
0.045
%
f = 1 kHz, VS = 14V
PO = 1 W/Channel
0.055
%
Output Swing
RL = 8Ω
VS −6
Vp-p
Channel Separation
CF = 50 μF, CIN = 0.1 μF,
−70
dB
−60
dB
−65
dB
−40
dB
2.5
μV
RS = 0, CN = 0.1 μF, AV 200
0.80
mV
RS = 0, f = 100 kHz, RL = 8Ω
70
dB
Input Offset Voltage
15
mV
Input Bias Current
50
nA
f = 1 kHz, Output Referred
VS = 20V, VO = 4 Vrms
−50
VS = 7V, VO = 0.5 Vrms
PSRR Power Supply
CF = 50 μF, CIN = 0.1 μF,
Rejection Ratio
f = 120 Hz, Output Referred
VS = 20V, VRIPPLE = 1 Vrms
−50
VS = 7V, VRIPPLE = 0.5 Vrms
Noise
Equivalent Input Noise
RS = 0, CIN = 0.1 μF,
BW = 20 Hz–20 kHz, Output Noise Wideband
Open Loop Gain
Input Impedance
Open Loop
DC Output Level
VS = 20V
4
9
Slew Rate
10
MΩ
11
V
2.0
V/μs
Power Bandwidth
65
kHz
Current Limit
1.0
A
(1)
For operation at ambient temperature greater than 25°C, the LM1877 must be derated based on a maximum 150°C junction
temperature.
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Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM1877
3
LM1877
SNAS550B – FEBRUARY 1995 – REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics
4
Device Dissipation vs Ambient Temperature
Power Supply Rejection Ratio (Referred to the Output) vs
Frequency
Figure 2.
Figure 3.
Power Supply Rejection Ratio (Referred to the Output) vs
Frequency
Power Supply Rejection Ratio (Referred to the Output) vs
Supply Voltage
Figure 4.
Figure 5.
Channel Separation (Referred to the Output) vs Frequency
Channel Separation (Referred to the Output) vs Frequency
Figure 6.
Figure 7.
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Product Folder Links: LM1877
LM1877
www.ti.com
SNAS550B – FEBRUARY 1995 – REVISED APRIL 2013
Typical Performance Characteristics (continued)
Average Supply Current vs POUT
Total Harmonic Distortion vs Frequency
Figure 8.
Figure 9.
Total Harmonic Distortion vs Frequency
Power Dissipation (W) Both Channels Operating
Figure 10.
Figure 11.
Open Loop Gain vs Frequency
Output Swing vs Supply Voltage
Figure 12.
Figure 13.
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Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM1877
5
LM1877
SNAS550B – FEBRUARY 1995 – REVISED APRIL 2013
www.ti.com
Typical Applications
Figure 14. Stereo Phonograph Amplifier with Bass Tone Control
6
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Product Folder Links: LM1877
LM1877
www.ti.com
SNAS550B – FEBRUARY 1995 – REVISED APRIL 2013
Figure 15. Frequency Response of Bass Tone
Control
Figure 16. Inverting Unity Gain Amplifier
Figure 17. Stereo Amplifier with AV = 200
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Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM1877
7
LM1877
SNAS550B – FEBRUARY 1995 – REVISED APRIL 2013
www.ti.com
Figure 18. Non-Inverting Amplifier Using Split
Supply
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Figure 19. Typical Split Supply
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Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM1877
LM1877
www.ti.com
SNAS550B – FEBRUARY 1995 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision A (April 2013) to Revision B
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Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
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Copyright © 1995–2013, Texas Instruments Incorporated
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9
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LM1877M-9/NOPB
ACTIVE
SOIC
NPA
14
50
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
0 to 70
LM1877M
-9
LM1877MX-9/NOPB
ACTIVE
SOIC
NPA
14
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
0 to 70
LM1877M
-9
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LM1877MX-9/NOPB
Package Package Pins
Type Drawing
SOIC
NPA
14
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
16.4
Pack Materials-Page 1
10.9
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
9.5
3.2
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM1877MX-9/NOPB
SOIC
NPA
14
1000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
NPA0014B
www.ti.com
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