TI M3851030302B2A

PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
TBD
Lead/
Ball Finish
Call TI
MSL Peak Temp
OBSOLETE
CDIP
J
14
JM38510/30302B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
Call TI
POST-PLATE N / A for Pkg Type
JM38510/30302B2A
ACTIVE
LCCC
FK
20
1
TBD
JM38510/30302BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
JM38510/30302BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
JM38510/30302BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
JM38510/30302BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
M38510/30302B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
M38510/30302B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
M38510/30302BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
M38510/30302BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
M38510/30302BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
M38510/30302BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
SN5427J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
SN5427J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
SN54LS27J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
SN54LS27J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
SN7427N
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
Call TI
Call TI
SN7427N
OBSOLETE
PDIP
N
14
SN74LS27D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27DE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27DE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
Samples
(Requires Login)
JM38510/00404BCA
TBD
(3)
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27DRE4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27DRE4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27N
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS27N
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS27N3
OBSOLETE
PDIP
N
14
SN74LS27N3
OBSOLETE
PDIP
N
14
SN74LS27NE4
ACTIVE
PDIP
N
14
TBD
Call TI
Call TI
Call TI
Call TI
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
SN74LS27NE4
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
SN74LS27NSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27NSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27NSRE4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27NSRE4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27NSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS27NSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SNJ5427J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
SNJ5427J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
SNJ5427W
OBSOLETE
CFP
W
14
TBD
Call TI
Call TI
SNJ5427W
OBSOLETE
CFP
W
14
TBD
Call TI
Call TI
Addendum-Page 2
Samples
(Requires Login)
SN74LS27DR
TBD
(3)
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
25-Jan-2012
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SNJ54LS27FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS27FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS27J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
SNJ54LS27J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
SNJ54LS27W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
SNJ54LS27W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN5427, SN54LS27, SN7427, SN74LS27 :
• Catalog: SN7427, SN74LS27
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
• Military: SN5427, SN54LS27
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LS27DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74LS27NSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LS27DR
SN74LS27NSR
SOIC
D
14
2500
367.0
367.0
38.0
SO
NS
14
2000
367.0
367.0
38.0
Pack Materials-Page 2
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