ONSEMI MC75174BDW

Order this document by MC75172B/D
! The Motorola MC75172B/174B Quad Line drivers are differential high
speed drivers designed to comply with the EIA–485 Standard. Features
include three–state outputs, thermal shutdown, and output current limiting in
both directions. These devices also comply with EIA–422–A, and CCITT
Recommendations V.11 and X.27.
The MC75172B/174B are optimized for balanced multipoint bus
transmission at rates in excess of 10 MBPS. The outputs feature wide
common mode voltage range, making them suitable for party line
applications in noisy environments. The current limit and thermal shutdown
features protect the devices from line fault conditions. These devices offer
optimum performance when used with the MC75173 and MC75175 line
receivers.
Both devices are available in 16–pin plastic DIP and 20–pin wide body
surface mount packages.
• Meets EIA–485 Standard for Party Line Operation
•
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•
•
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QUAD EIA–485 LINE DRIVERS
SEMICONDUCTOR
TECHNICAL DATA
P SUFFIX
PLASTIC PACKAGE
CASE 648
Meets EIA–422–A and CCITT Recommendations V.11 and X.27
Operating Ambient Temperature: –40°C to +85°C
DW SUFFIX
PLASTIC PACKAGE
CASE 751D
(SO–20L)
High Impedance Outputs
Common Mode Output Voltage Range: –7 to 12 V
Positive and Negative Current Limiting
Transmission Rates in Excess of 10 MBPS
ORDERING INFORMATION
Thermal Shutdown at 150°C Junction Temperature, (± 20°C)
ā
Single 5.0 V Supply
Device
Pin Compatible with TI SN75172/4 and NS µA96172/4
Operating
Temperature Range
MC75172BDW
Interchangeable with MC3487 and AM26LS31 for EIA–422–A
Applications
Package
SO–20L
TA = – 40° to +85°C
MC75174BDW
MC75174BP
SO–20L
Plastic DIP
PIN CONNECTIONS
MC75172B
MC75174B
20 VCC
1A 1
16 VCC 1A 1
1Y 2
19 4A
1Y 2
15 4A
1Y 2
19 4A
14 4Y
NC 3
18 4Y
1Z 3
14 4Y NC 3
18 4Y
En 4
13 4Z
1Z 4
17 NC
13 4Z
1Z 4
17 NC
2Z 5
12 En
En 5
16 4Z
En 4
12
2Z 5
11 3Z
2Z 6
15 En
2Y 6
En 5
12
2Z 6
16 4Z
2Y 6
12 En
34
11 3Z
2A 7
10 3Y
NC 7
14 3Z
2A 7
10 3Y
Gnd 8
9 3A
2Y 8
13 NC
Gnd 8
9 3A
2A 9
12 3Y
Gnd 10
11 3A
1A 1
16 VCC 1A 1
1Y 2
15 4A
1Z 3
P Package
NC 7
15 En
34
14 3Z
2Y 8
13 NC
2A 9
12 3Y
Gnd 10
11 3A
P Package
DW Package
DW Package
 Motorola, Inc. 1996
MOTOROLA ANALOG IC DEVICE DATA
20 VCC
Rev 1
1
MC75172B MC75174B
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VCC
–0.5, +7.0
Vdc
Input Voltage (Data, Enable)
Vin
+7.0
Vdc
Input Current (Data, Enable)
Iin
–24
mA
Applied Output Voltage, when in 3–State Condition
(VCC = 5.0 V)
Vza
–10, +14
Vdc
Applied Output Voltage, when VCC = 0 V
Vzb
±14
IO
Self–Limiting
–
Tstg
–65, +150
°C
Power Supply Voltage
Output Current
Storage Temperature
Devices should not be operated at these limits. The “Recommended Operating Conditions” table provides
for actual device operation.
RECOMMENDED OPERATING CONDITIONS
Characteristic
Power Supply Voltage
Symbol
Min
Typ
Max
Unit
VCC
+4.75
+5.0
+5.25
Vdc
Input Voltage (All Inputs)
Vin
0
–
VCC
Vdc
Output Voltage in 3–State Condition, or when VCC = 0 V
Vcm
–7.0
–
+12
Vdc
Output Current (Normal data transmission)
IO
–65
–
+65
mA
Operating Ambient Temperature (see text)
EIA–485
EIA–422
TA
–40
0
–
–
+85
+85
°C
All limits are not necessarily functional concurrently.
ELECTRICAL CHARACTERISTICS (–40°C
p TA p 85°C, 4.75 V p VCC p 5.25 V, unless otherwise noted.)
Characteristic
Output Voltage
Single–Ended Voltage
IO = 0
High @ IO = –33 mA
Low @ IO = +33 mA
Differential Voltage
Open Circuit (IO = 0)
RL = 54 Ω (Figure 1)
Symbol
Min
Typ
Max
Unit
VO
VOH
VOL
0
–
–
–
4.0
1.6
6.0
–
–
 VOD1 
 VOD2 
1.5
1.5
3.4
2.3
6.0
5.0
 ∆VOD2 
 VOD2A 
 ∆VOD2A 
 VOD3 
 ∆VOD3 
VOS
 ∆VOS 
–
–
–
1.5
–
–
–
5.0
2.2
5.0
–
5.0
2.9
5.0
200
–
200
5.0
200
–
200
mVdc
Vdc
mVdc
Vdc
mVdc
Vdc
mVdc
IO(off)
IOZ
–50
–50
0
0
+50
+50
µA
IOSR
IOS
–150
–250
–
–
+150
+250
mA
Vdc
Change in Differential*, RL = 54 Ω (Figure 1)
Differential Voltage, RL = 100 Ω (Figure 1)
Change in Differential*, RL = 100 Ω (Figure 1)
Differential Voltage, –7.0 V
Vcm
12 V (Figure 2)
Change in Differential*, –7.0 V
Vcm
12 V (Figure 2)
Offset Voltage, RL = 54 Ω (Figure 1)
Change in Offset*, RL = 54 Ω (Figure 1)
p
p
p
p
Output Current (Each Output)
Power Off Leakage, VCC = 0, –7.0 V
VO
12 V
Leakage in 3–State Mode, –7.0 V
VO
12 V
p p
p p
Short Circuit Current to Ground
Short Circuit Current, –7.0 V
VO
p p 12 V
*Vin switched from 0.8 to 2.0 V.
Typical values determined at 25°C ambient and 5.0 V supply.
2
MOTOROLA ANALOG IC DEVICE DATA
MC75172B MC75174B
ELECTRICAL CHARACTERISTICS (–40°C
p TAp 85°C, 4.75 V p VCC p 5.25 V, unless otherwise noted.)
Symbol
Min
Typ
Max
VIL(A)
VIL(B)
VIH
0
0
2.0
–
–
–
0.7
0.8
VCC
Current @ Vin = 2.7 V (All Inputs)
Current @ Vin = 0.5 V (All Inputs)
IIH
IIL
–
–100
0.2
–15
20
–
µA
Clamp Voltage (All Inputs, Iin = –18 mA)
VIK
–1.5
–
–
Vdc
Thermal Shutdown Junction Temperature
Tjts
–
+150
–
°C
Power Supply Current (Outputs Open, VCC = 5.25 V)
Outputs Enable
Outputs Disabled
ICC
–
–
60
30
70
40
Symbol
Min
Typ
Max
tPLH
tPHL
–
–
23
18
30
30
Propagation Delay – Input to Differential Output (Figure 4)
Input Low–to–High
Input High–to–Low
tPLH(D)
tPHL(D)
–
–
15
17
25
25
Differential Output Transition Time (Figure 4)
tdr, tdf
–
19
25
tSK1
tSK2
tSK3
–
–
–
0.2
1.5
1.5
–
–
–
Characteristics
Inputs
Low Level Voltage (Pins 4 & 12, MC75174B only)
Low Level Voltage (All Other Pins)
High Level Voltage (All Inputs)
Unit
Vdc
mA
TIMING CHARACTERISTICS (TA = 25°C, VCC = 5.0 V)
Characteristics
Propagation Delay – Input to Single–ended Output (Figure 3)
Output Low–to–High
Output High–to–Low
Skew Timing
tPLHD – tPHLD  for Each Driver
Max – Min tPLHD Within a Package
Max – Min tPHLD Within a Package
Enable Timing
Single–ended Outputs (Figure 5)
Enable to Active High Output
Enable to Active Low Output
Active High to Disable (using Enable)
Active Low to Disable (using Enable)
Enable to Active High Output (MC75172B only)
Enable to Active Low Output (MC75172B only)
Active High to Disable (using Enable, MC75172B only)
Active Low to Disable (using Enable, MC75172B only)
Differential Outputs (Figure 6)
Enable to Active Output
Enable to Active Output (MC75172B only)
Enable to 3–State Output
Enable to 3–State Output (MC75172B only)
MOTOROLA ANALOG IC DEVICE DATA
Unit
ns
ns
ns
ns
ns
tPZH(E)
tPZL(E)
tPHZ(E)
tPLZ(E)
tPZH(E)
tPZL(E)
tPHZ(E)
tPLZ(E)
–
–
–
–
–
–
–
–
48
20
35
30
58
28
38
36
60
30
45
50
70
35
50
50
tPZD(E)
tPZD(E)
tPDZ(E)
tPDZ(E)
–
–
–
–
47
56
32
40
–
–
–
–
ns
3
MC75172B MC75174B
Figure 1. VDD Measurement
Figure 2. Common Mode Test
VCC
VCC
375
RL/2
Vin
(0.8 or 2.0 V)
Vin
(0.8 or 2.0 V)
VOD2,A
RL/2
VOD3
58
+
VCM = 12 to –7.0 V
375
VOS
Figure 3. Propagation Delay, Single–Ended Outputs
3.0 V
1.5 V
1.5 V
0V
tPLH
27 Ω
Y
Vin
Vin
2.3 V
VCC
tPHL
Output
Z
15 pF
3.0 V
3.0 V
Output Y
S.G.
VOL
VOH
tPLH
Output Z
tPHL
3.0 V
3.0 V
Figure 4. Propagation Delay, Differential Outputs
3.0 V
VCC
Vin
Vin
54
50 pF
1.5 V
0V
tPLHD
VOD
VOD
S.G.
p
1.5 V
p
tPHLD
1.5 V
50%
– 1.5 V
1.5 V
50%
– 1.5 V
[4.6 V
tdf
tdr
NOTES: 1. S.G. set to: f
1.0 MHz; duty cycle = 50%; tr, tf,
5.0 ns.
2. tSK1 =  tPLHD – tPHLD for each driver.
3. tSK2 computed by subtracting the shortest tPLHD from the longest tPLHD of the 4 drivers within a package.
4. tSK3 computed by subtracting the shortest tPHLD from the longest tPHLD of the 4 drivers within a package.
4
MOTOROLA ANALOG IC DEVICE DATA
MC75172B MC75174B
Figure 5. Enable Timing, Single–Ended Outputs
3.0 V
VCC
0 or 3.0 V
Vin
1.5 V
1.5 V
Vin
0V
tPZH(E)
Vout
110Ω
tPHZ(E)
50 pF
3.0 V
VOH
0.5 V
2.3 V
Vout
S.G.
VCC
VCC
3.0 V
110Ω
0 or 3.0 V
1.5 V
1.5 V
Vin
0V
tPZL(E)
Vout
tPLZ(E)
50 pF
Vin
3.0 V
Vout
2.3 V
0.5 V
S.G.
VOL
Figure 6. Enable Timing, Differential Outputs
3.0 V
VCC
1.5 V
Vin
0 or 3.0 V
Vin
54
50 pF
1.5 V
0V
tPZD(E)
VOD
tPDZ(E)
3.0 V
VOD
1.5 V
S.G.
0
Disabled
p
NOTES: 1. S.G. set to: f
1.0 MHz; duty cycle = 50%; tf, tf,
2. Vin is inverted for Enable measurements.
MOTOROLA ANALOG IC DEVICE DATA
1.5 V
0
Active
Disabled
p 5.0 ns.
5
MC75172B MC75174B
Figure 7. Single–Ended Output Voltage
versus Output Sink Current
Figure 8. Single–Ended Output Voltage
versus Temperature
2.0
VOL, OUTPUT VOLTAGE (V)
VOL, OUTPUT VOLTAGE (V)
2.0
1.5
1.0
0.5
p
4.75 V VCC
TA = 25°C
p 5.25 V
IOL = 20.0 mA
1.5
1.25
4.75 V
1.0
– 40
0
0
10
20
30
40
50
IOL, OUTPUT CURRENT (mA)
60
70
Figure 9. Single–Ended Output Voltage
versus Output Source Current
– 20
p VCC p 5.25 V
0
20
40
60
TA, AMBIENT TEMPERATURE (°C)
85
Figure 10. Single–Ended Output
Voltage versus Temperature
VCC = 5.25 V
4.0
VCC = 5.00 V
VOH, OUTPUT VOLTAGE (V)
VOH, OUTPUT VOLTAGE (V)
5.0
IOL = 27.8 mA
1.75
4.0
VCC = 4.75 V
3.0
2.0
TA = 25°C
IOH = –20.0 mA
3.75
IOH = –27.8 mA
3.5
VCC = 4.75 V
3.25
1.0
0
– 10
– 20
– 30
– 40
– 50
IOH, OUTPUT CURRENT (mA)
– 60
– 70
– 40
4.0
3.0
VCC = 5.25 V
VCC = 5.0 V
2.0
VCC = 4.75 V
1.0
0.8 or
2.0 V
VOD
TA = 25°C
0
0
6
IO
10
20
30
40
50
IO, OUTPUT CURRENT (mA)
20
0
40
60
TA, AMBIENT TEMPERATURE (°C)
85
Figure 12. Output Differential Voltage
versus Temperature
VOD , DIFFERENTIAL OUTPUT VOLTAGE (V)
VOD , DIFFERENTIAL OUTPUT VOLTAGE (V)
Figure 11. Output Differential Voltage
versus Load Current
– 20
60
70
4.0
3.0
IO = 20.0 mA
IO = 27.8 mA
2.0
1.0
0.8 or
2.0 V
0
–40
–20
IO
VOD
VCC = 4.75 V
0
20
40
60
TA, AMBIENT TEMPERATURE (°C)
85
MOTOROLA ANALOG IC DEVICE DATA
MC75172B MC75174B
Figure 13. Output Leakage Current
versus Output Voltage
Figure 14. Output Leakage Current
versus Temperature
20
IOX, IOZ, LEAKAGE CURRENT ( µ A)
IOZ, LEAKAGE CURRENT ( µ A)
2.0
1.0
0
15
10
5.0
Vout = 7.0 V
–5.0
–1.0
TA = 25°C
En = Low, En = High
–2.0
–7.0
–3.0
1.0
5.0
9.0
Vz, APPLIED OUTPUT VOLTAGE (V)
–10
–20
–40
12
–20
40
0
20
TA, AMBIENT TEMPERATURE (°C)
85
60
Figure 16. Short Circuit Current
versus Common Mode Voltage
150
IOS , SHORT CIRCUIT CURRENT (mA)
5.0
0
Enable
Pins
– 5.0
Driver
Inputs
– 10
p
– 15
4.75 VCC
TA = 25°C
– 20
– 25
– 0.5
En = Low, En = High
or VCC = 0 V
–15
Figure 15. Input Current
versus Input Voltage
I in , INPUT CURRENT ( µ A)
Vout = +12 V
0
0.5
1.5
2.5
3.5
Vin, INPUT VOLTAGE (V)
MOTOROLA ANALOG IC DEVICE DATA
p 5.25 V
4.5
5.5
Normally Low Output
90
30
0
Normally High Output
– 30
– 90
–150
–7.0
p
–3.0
TA = 25°C
4.75 VCC
p 5.25 V
1.0
5.0
9.0
Vz, APPLIED OUTPUT VOLTAGE (V)
12
7
MC75172B MC75174B
APPLICATIONS INFORMATION
Description
The MC75172B and MC75174B are differential line drivers
designed to comply with EIA–485 Standard (April 1983) for
use in balanced digital multipoint systems containing multiple
drivers. The drivers also comply with EIA–422–A and CCITT
Recommendations V.11 and X.27. The drivers meet the
EIA–485 requirement for protection from damage in the event
that two or more drivers attempt to transmit data
simultaneoulsy on the same cable. Data rates in excess of 10
MBPS are possible, depending on the cable length and cable
characteristics. A single power supply, 5.0 V, ±5%, is required
at a nominal current of 60 mA, plus load currents.
Outputs
Each output (when active) will be a low or a high voltage,
which depends on the input state and the load current (see
Table 1, 2 and Figures 7 to 10). The graphs apply to each
driver, regardless of how many other drivers within the
package are supplying load current.
Table 1. MC75172B Truth Table
Enables
Outputs
Data Input
EN
EN
Y
Z
H
L
H
L
X
H
H
X
X
L
X
X
L
L
H
H
L
H
L
Z
L
H
L
H
Z
Table 2. MC75174B Truth Table
Outputs
Data Input
Enable
Y
H
L
X
H
H
L
H
L
Z
Z
L
H
Z
H = Logic high, L = Logic low, X = Irrelevant, Z = High impedance
The two outputs of a driver are always complementary. A
“high” output can only source current out, while a “low” output
can only sink current (except for short circuit current – see
Figure 16).
The outputs will be in the high impedance mode when:
a) the Enable inputs are set according to Table 1 or 2;
b) VCC is less than 1.5 V;
c) the junction temperature exceeds the trip point of the
thermal shutdown circuit (see below). When in this
condition, the output’s source and sink capability are
shut off, and only leakage currents will flow (see
Figures 13, 14). Disabled outputs may be taken to any
voltage between –7.0 V and 12 V without damage.
8
The drivers are protected from short circuits by two
methods:
a) Current limiting is provided at each output, in both the
source and sink direction, for shorts to any voltage
within the range of 12 V to –7.0 V, with respect to circuit
ground (see Figure 16). The short circuit current will flow
until the fault is removed, or until the thermal shutdown
circuit activates (see below). The current limiting circuit
has a negative temperature coefficient and requires no
resetting upon removal of the fault condition.
b) A thermal shutdown circuit disables the outputs when
the junction temperature reaches 150°C, ± 20°C. The
thermal shutdown circuit has a hysteresis of ≈ 12°C to
prevent oscillations. When this circuit activates, the
output stage of each driver is put into the high
impedance mode, thereby shutting off the output
currents. The remainder of the internal circuitry remains
biased. The outputs will become active once again as
the IC cools down.
ā
Driver Inputs
The driver inputs determine the state of the outputs in
accordance with Tables 1 and 2. The driver inputs have a
nominal threshold of 1.2 V, and their voltage must be kept
within the range of 0 V to VCC for proper operation. If the
voltage is taken more than 0.5 V below ground, excessive
currents will flow, and proper operation of the drivers will be
affected. An open pin is equivalent to a logic high, but good
design practices dictate that inputs should never be left open.
The characteristics of the driver inputs are shown in Figure
15. This graph is not affected by the state of the Enable pins.
Enable Logic
Each driver’s outputs are active when the Enable inputs
(Pins 4 and 12) are true according to Tables 1 and 2.
The Enable inputs have a nominal threshold of 1.2 V and
their voltage must be kept within the range of 0 V to VCC for
proper operation. If the voltage is taken more than 0.5 V
below ground, excessive currents will flow, and proper
operation of the drivers will be affected. An open pin is
equivalent to a logic high, but good design practices dictate
that inputs should never be left open. The Enable input
characteristics are shown in Figure 15.
Operating Temperature Range
The minimum ambient operating temperature is listed as
–40°C to meet EIA–485 specifications, and 0°C to meet
EIA–422–A specifications. The higher VOD required by
EIA–422–A is the reason for the narrower temperature range.
MOTOROLA ANALOG IC DEVICE DATA
MC75172B MC75174B
The maximum ambient operating temperature (applicable
to both EIA–485 and EIA–422–A) is listed as 85°C. However,
a lower ambient may be required depending on system use
(i.e. specifically how many drivers within a package are used)
and at what current levels they are operating. The maximum
power which may be dissipated within the package is
determined by:
PD max
where:
–T
A
+ TJmax
R
reducing the load current, reducing the ambient temperature,
and/or providing a heat sink.
System Requirements
EIA–485 requires each driver to be capable of transmitting
data differentially to at least 32 unit loads, plus an equivalent
DC termination resistance of 60Ω, over a common mode
voltage of –7.0 to 12 V. A unit load (U.L.), as defined by
EIA–485, is shown in Figure 17.
qJA
Figure 17. Unit Load Definition
RθJA = package thermal resistance (typical
70°C/W for the DIP package, 85°C/W for SOIC
package);
TJmax = max. operating junction
temperature, and
TA = ambient temperature.
I
1.0 mA
–7.0 V
–3.0 V
V
Since the thermal shutdown feature has a trip point of
150°C, ± 20°C, TJmax is selected to be 130°C. The power
dissipated within the package is calculated from:
PD
where:
= {[(VCC – VOH) • IOH] + VOL • IOL)} each driver
= + (VCC • ICC)
VCC = the supply voltage;
VOH, VOL are measured or estimated from
Figures 7 to 10;
ICC = the quiescent power supply current
(typical 60 mA).
As indicated in the equation, the first term (in brackets)
must be calculated and summed for each of the four drivers,
while the last term is common to the entire package.
Example 1: TA = 25°C, IOL = IOH = 55 mA for each driver,
VCC = 5.0 V, DIP package. How many drivers per package
can be used?
Maximum allowable power dissipation is:
PD max
* 25°C + 1.5 W
+ 130°C
70°CńW
Since the power supply current of 60 mA dissipates
300 mW, that leaves 1.2 W (1.5 W – 0.3 W) for the drivers.
From Figures 7 and 9, VOL 1.75 V, and VOH 3.85 V. The
power dissipated in each driver is:
{(5.0 – 3.85) • 0.055} + (1.75 • 0.055) = 160 mW.
Since each driver dissipates 160 mW, the four drivers per
package could be used in this application
Example 2: TA = 85°C, IOL = 27.8 mA, IOH = 20 mA for each
driver, VCC = 5.0 V, SOIC package. How many drivers per
package can be used?
Maximum allowable power dissipation is:
[
PD max
+ 13085°C°C*ńW85°C +
[
0.53 W
Since the power supply current of 60 mA dissipates
300 mW, that leaves 230 mW (530 mW – 300 mW) for the
drivers. From Figures 8 and 10 (adjusted for VCC = 5.0 V),
VOL 1.38 V, and VOH 4.27 V. The power dissipated in
each driver is:
[
[
{(5.0 – 4.27) • 0.020} + (1.38 • 0.0278) = 53 mW
12 V
5.0 V
–0.8 mA
Reprinted from EIA–485, Electronic Industries Association,
Washington,DC.
A load current within the shaded regions represents an
impedance of less than one U.L., while a load current of a
magnitude outside the shaded area is greater than one U.L.
A system’s total load is the sum of the unit load equivalents
of each receiver’s input current, and each disabled driver’s
output leakage current. The 60Ω termination resistance
mentioned above allows for two 120Ω terminating resistors.
Using the EIA–485 requirements (worst case limits), and
the graphs of Figures 7 and 9, it can be determined that the
maximum current an MC75172B or MC75174B driver will
source or sink is 65 mA.
[
System Example
An example of a typical EIA–485 system is shown in
Figure 18. In this example, it is assumed each receiver’s input
characteristics correspond to 1.0 U.L. as defined in Figure 17.
Each “off” driver, with a maximum leakage of ±50 µA over the
common mode range, presents a load of 0.06 U.L. The
total load for the active driver is therefore 8.3 unit loads, plus
the parallel combination of the two terminating resistors
(60Ω). It is up to the system software to control the driver
Enable pins to ensure that only one driver is active at any
time.
[
Termination Resistors
Transmission line theory states that, in order to preserve
the shape and integrity of a waveform traveling along a cable,
the cable must be terminated in an impedance equal to its
characteristic impedance. In a system such as that depicted
in Figure 18, in which data can travel in both directions, both
physical ends of the cable must be terminated. Stubs, leading
to each receiver and driver, should be as short as possible.
Leaving off the terminations will generally result in
reflections which can have amplitudes of several volts above
VCC or below ground. These overshoots and undershoots
can disrupt the driver and/or receiver operation, create false
data, and in some cases damage components on the bus.
Since each driver dissipates 53 mW, the use of all four
drivers in a package would be marginal. Options include
MOTOROLA ANALOG IC DEVICE DATA
9
MC75172B MC75174B
Figure 18. Typical EIA–485 System
En
R
R
TTL
TTL
TTL
D
#2
#1
#3
En
TTL
D
RT
#1
5 “off” drivers (@ 0.06 U.L. each),
+8 receivers (@ 1.0 U.L. each) = 8.3 Unit Loads
RT = 120 Ω at each end of the cable.
120 Ω
Twisted
Pair
En
TTL
D
R
TTL
#2
#3
En
D
TTL
#4
R
TTL
#4
TTL
R
#6
En
TTL
D
RT
#6
En
R
TTL
#8
R
TTL
#7
R
TTL
#5
TTL
D
#5
NOTES: 1. Terminating resistors RT must be located at the physical ends of the cable.
2. Stubs should be as short as possible.
3. Circuit ground of all drivers and receivers must be connected via a dedicated wire within the cable.
Do not rely on chassis ground or power line ground.
10
MOTOROLA ANALOG IC DEVICE DATA
MC75172B MC75174B
Comparing System Requirements
Characteristic
Symbol
EIA–485
GENERATOR (DRIVER)
Output Impedance (Note 1)
Open Circuit Voltage
Differential
Single–Ended
Loaded Differential Voltage
Zout
VOCD
VOCS
VOD
50 10 100 Ω
1.5 to 5.0 V, w/54 Ω load
p 6.0 V
p 6.0 V
q 2.0 V or q 0.5
p 6.0 V, w/3.9 kΩ, Load
p 6.0 V, w/3.9 kΩ, Load
q 2.0 V or q 0.5 VOCD,
p 400 mV
t 400 mV
1.5 to 6.0 V
6.0 V
t
∆VOD
t 200 mV
Output Common Mode Range
VCM
–7.0 to +12 V
Offset Voltage
VOS
–1.0
Short Circuit Current
∆VOS
IOS
Output Rise/Fall Time (Note 2)
IOLK
tr, tf
VOCD, w/100 Ω load
w/100 Ω load
Not Specified
t 200 mV
p 250 mA for –7.0 to
p 3.0 V
p 400 mV
p 150 mA to ground
Not Specified
Not Specified
p 100 µA to –0.25 V
p 100 µA to ± 0.25 V
t VOS t 3.0 V
12 V
Leakage Current (VCC = 0)
V.11 and X.27
t 100 Ω
Not Specified
Differential Voltage Balance
Offset Voltage Balance
EIA–422–A
thru 6.0 V
p 3.0 V
t 400 mV
p 150 mA to ground
p 0.3 TB, w/54 Ω/1150 pF
p 0.1 TB or p 20 ns,
w/100 Ω load
0.1 TB or
20 ns,
w/100 Ω load
± 200 mV
± 200 mV
± 300 mV
–7.0 to 7.0 V
–7.0 to 7.0 V
load
p
p
RECEIVER
Input Sensitivity
Vth
Input Bias Voltage
Vbias
p 3.0 V
Input Common Mode Range
Vcm
–7.0 to 12 V
Dynamic Input Impedance
Rin
Spec number of U.L.
p 3.0 V
q 4 kΩ
p 3.0 V
q 4 kΩ
NOTES: 1. Compliance with V.11 and X.27 (Blue book) output impedance requires external resistors in series with the outputs of the MC75172B and MC75174B.
2. TB = Bit time.
Additional Information
Copies of the EIA Recommendations (EIA–485 and EIA–422–A) can be obtained from the Electronics Industries Association,
Washington, D.C. (202–457–4966). Copies of the CCITT Recommendations (V.11 and X.27) can be obtained from the United
States Department of Commerce, Springfield, VA (703–487–4600).
MOTOROLA ANALOG IC DEVICE DATA
11
MC75172B MC75174B
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
16 PL
0.25 (0.010)
M
T A
M
DW SUFFIX
PLASTIC PACKAGE
CASE 751D–04
(SO–20L)
ISSUE E
–A–
20
11
–B–
10X
M
B
M
10
J
20X
D
0.010 (0.25)
M
T A
B
S
S
F
R
C
–T–
18X
G
SEATING
PLANE
K
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
P
0.010 (0.25)
1
M
J
DIM
A
B
C
D
F
G
H
J
K
L
M
S
X 45 _
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
12.65
12.95
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.499
0.510
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
M
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12
◊
*MC75172B/D*
MOTOROLA ANALOG IC DEVICE
DATA
MC75172B/D