PC901V0NSZXF Series
PC901V0NSZXF
Series
Digital Output, Normal ON
Operation DIP 6 pin ∗OPIC
Photocoupler
■ Description
■ Agency approvals/Compliance
PC901V0NSZXF Series contains an IRED optically
coupled to an OPIC chip.
It is packaged in a 6 pin DIP.
Input-output isolation voltage(rms) is 5.0kV.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC901V)
2. Approved by VDE, DIN EN60747-5-2 (∗) (as an
option), file No. 40008189 (as model No. PC901V)
3. Package resin : UL flammability grade (94V-0)
■ Features
(∗)
1. 6 pin DIP package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. Normal ON operation, open collector output
4. TTL and LSTTL compatible output
5. Operating supply voltage (VCC=3 to 15 V)
6. Isolation voltage (Viso(rms) : 5.0 kV)
7. Lead-free and RoHS directive compliant
DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Applications
1. Programmable controllers
2. PC peripherals
3. Electronic musical instruments
∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A05402EN
Date Jun. 30. 2005
© SHARP Corporation
PC901V0NSZXF Series
■ Internal Connection Diagram
6
5
4
1
2
Voltage
regulator
3
Amp
4
5
1
2
6
3
Anode
Cathode
NC
VO
GND
VCC
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC901V0NSZXF]
2. Through-Hole (VDE option) [ex. PC901V0YSZXF]
1.2±0.3
1.2±0.3
±0.2
±0.2
0.6
4
Anode
mark
1
2
3
5
PC901V
4
Anode
mark
Date code
1
7.12
7.62±0.3
3
Date code
2.9±0.5
3.25
Epoxy resin
0.5±0.1
θ
7.62±0.3
VDE Identification mark
±0.5
0.5TYP. 3.5±0.5
2.9±0.5
2
7.12±0.5
±0.5
2.54±0.25
4
2.54±0.25
θ
3.25
PC901V
6
±0.5
5
0.5TYP. 3.5±0.5
6
6.5±0.5
SHARP
mark
"S"
SHARP
mark
"S"
6.5±0.5
0.6
Epoxy resin
0.5±0.1
θ
θ
θ : 0 to 13˚
θ : 0 to 13˚
Product mass : approx. 0.36g
Product mass : approx. 0.36g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A05402EN
2
PC901V0NSZXF Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
repeats in a 20 year cycle
Country of origin
Japan
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A05402EN
3
PC901V0NSZXF Series
■ Absolute Maximum Ratings
Parameter
Symbol
Forward current
IF
*1
Peak forward current
IFM
Input
Reverse voltage
VR
Power dissipation
P
VCC
Supply voltage
High level output voltage
VOH
Output
Low level output current
IOL
Power dissipation
PO
Ptot
Total power dissipation
Operating temperature
Storage temperature
*2
Isolation voltage
*3
Soldering temperature
Topr
Tstg
Viso (rms)
Tsol
(Ta=25°C)
Rating
50
1
6
70
16
16
50
150
170
−25 to +85
−40 to +125
5.0
260
Unit
mA
A
V
mW
V
V
mA
mW
mW
°C
°C
kV
°C
*1 Pulse width≤100µs, Duty ratio :0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
■ Electro-optical Characteristics
Parameter
Input
Output
*4
Symbol
Forward voltage
VF
Reverse current
Terminal capacitance
Operating supply voltage
Low level output voltage
High level output current
Low level supply current
High level supply current
IR
Ct
VCC
VOL
IOH
ICCL
ICCH
"Low→High" input threshold
current
IFLH
*5
"High→Low" input threshold
IFHL
current
*6
Hysteresis
IFHL/IFLH
Isolation voltage
RISO
"Low→High" propagation delay time
tPLH
tPHL
Response "High→Low" propagation delay time
time
Rise time
tr
Transfer
Fall time
tf
characInstantaneous common
teristics
mode rejection voltage
CMH
"Output : High level"
Instantaneous common
mode rejection voltage
"Output : Low level"
CML
(unless otherwise specified Ta=0 to +70˚C)
Conditions
TYP. MAX.
Unit
MIN.
IF=4mA
−
1.1
1.4
V
1.0
−
IF=0.3mA
0.7
10
−
Ta=25˚C, VR=4V
−
µA
250
Ta=25˚C, V=0, f=1kHz
pF
−
30
3
−
15
V
−
−
0.2
0.4
V
IOL=16mA, VCC=5V, IF=0
−
−
100
µA
VO=VCC=15V, IF=4mA
5.0
−
mA
2.5
VCC=5V, IF=0
VCC=5V, IF=4mA
5.5
−
mA
2.7
Ta=25˚C, VCC=5V, RL=280Ω
−
1.1
2.0
mA
−
4.0
−
VCC=5V, RL=280Ω
0.4
0.8
−
Ta=25˚C, VCC=5V, RL=280Ω
mA
VCC=5V, RL=280Ω
0.3
−
−
−
VCC=5V, RL=280Ω
0.9
0.5
0.7
10
11
−
5×10
Ω
Ta=25˚C, DC500V, 40 to 60%RH
1×10
−
1
3
Ta=25˚C
−
2
6
VCC=5V, IF=4mA
µs
0.5
−
0.1
RL=280Ω
0.5
−
0.05
VCM=600V(peak), VO(MIN.)=2V
IF=4mA, RL=280Ω, Ta=25˚C
−
−2 000
−
V/µs
VCM=600V(peak), VO(MAX.)=0.8V
IF=0, RL=280Ω, Ta=25˚C
−
2 000
−
V/µs
*4 IFLH represents forward current when output goes from low to high.
*5 IFHL represents forward current when output goes from high to low.
*6 Hysteresis stands for IFHL/IFLH.
Sheet No.: D2-A05402EN
4
PC901V0NSZXF Series
■ Model Line-up
Lead Form
Package
DIN EN60747-5-2
Model No.
Through-Hole
Sleeve
50 pcs/sleeve
−−−−−−
Approved
PC901V0NSZXF PC901V0YSZXF
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A05402EN
5
PC901V0NSZXF Series
Fig.1 Test Circuit for Response Time
Voltage
regulator
5V
280Ω
tr=tf=0.01µs
ZO=50Ω
50%
VIN
Amp
VIN
tPLH
VO
90%
1.5V
VO
VOH
10%
VOL
tf
tr
0.1µF
47Ω
tPHL
Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage
Switch for
IRED
Voltage regulator
600V
IF
VCM
5V
280Ω
VO
A
B
Amp.
+
0.1µF
Swich for IRED at A (IF=0)
−
VCM
VO(MIN.)=2V
VO(MAX.)=0.8V
VOL
GND
Swich for IRED at B (IF=4mA)
Fig.4 Power Dissipation vs. Ambient
Temperature
60
200
50
170
Power dissipation PO, Ptot (mW)
Forward current IF (mA)
Fig.3 Forward Current vs. Ambient
Temperature
40
30
20
10
0
−25
0
25
50
75 85
Ambient temperature Ta (˚C)
PO
150
100
50
0
−25
100
Ptot
0
25
50
75 85
100
Ambient temperature Ta (˚C)
Sheet No.: D2-A05402EN
6
PC901V0NSZXF Series
Fig.5 Forward Current vs. Forward Voltage
Fig.6 Relative Input Threshold Current vs.
Supply Voltage
1.4
Relative input threshold current IFLH, IFHL
Forward current IF (mA)
Ta=75˚C
50˚C
25˚C
0˚C
−25˚C
100
10
1
Ta=25˚C
IFLH=1 at VCC=5V
1.2
IFLH
1
IFHL
0.8
0.6
0.4
0.2
0
0.5
1
1.5
2
2.5
0
3
5
Forward voltage VF (V)
20
Fig.8 Low Level Output Voltage vs. Low
Level Output Current
1
1.6
VCC=5V
IF=0
Ta=25˚C
VCC=5V
1.4
1.2
Low level output voltage VOL (V)
Relative input threshold current IFLH, IFHL
15
Supply voltage VCC (V)
Fig.7 Relative Input Threshold Current vs.
Ambient Temperature
IFLH
1
0.8
IFHL
0.6
0.4
0.1
0.2
0
−25
IFLH=1 at Ta=25˚C
0
25
50
75
0.01
1
100
Fig.9 Low Level Output Voltage vs. Ambient
Temperature
100
Fig.10 High Level Output Current vs.
Forward Current
0.5
10
VCC=5V
VCC=5V
High level output current IOH(µA)
IOL=30mA
0.4
0.3
16mA
0.2
5mA
0.1
0
−25
10
Low level output current IOL (mA)
Ambient temperature Ta (˚C)
Low level output voltage VOL(V)
10
Ta=25˚C
1
0.1
0
25
50
75
100
0
Ambient temperature Ta(˚C)
10
20
30
40
50
60
Forward current IF(mA)
Sheet No.: D2-A05402EN
7
PC901V0NSZXF Series
Fig.11 High Level Output Current vs.
Ambient Temperature
Fig.12 Supply Current vs. Supply Voltage
9
8
IF=4mA
ICCH
ICCL
7
1
Supply current ICC(mA)
High level output current IOH(µA)
VCC=VO=15V
0.1
ICCH
ICCL
6
5
4
ICCH
ICCL
3
Ta=
2 −25˚C{
25˚C{
1 85˚C{
0
−25
0
25
50
75
0
100
Fig.13 Propagation Delay Time vs.
Forward Current
8
10
12
14
16
18
Fig.14 Rise Time, Fall Time vs. Load
Resistance
VCC=5V
IF=4mA
Ta=25˚C
tPHL
0.5
Rise time, fall time tr, tf(µs)
Propagation delay time tPHL, tPLH (µs)
6
0.6
VCC=5V
RL=280Ω
Ta=25˚C
5
4
Supply voltage VCC(V)
Ambient temperature Ta(˚C)
6
2
4
3
2
1
0.4
0.3
0.2
tr
0.1
tf
tPLH
0
0
0
10
20
30
40
50
60
0.1
Forward current IF(mA)
1
10
Load resistance RL(kΩ)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A05402EN
8
PC901V0NSZXF Series
■ Design Considerations
● Notes about static electricity
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute
design.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through IRED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of IRED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
Please decide the input current which become 2 times of MAX. IFLH.
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A05402EN
9
PC901V0NSZXF Series
■ Manufacturing Guidelines
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A05402EN
10
PC901V0NSZXF Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A05402EN
11
PC901V0NSZXF Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
±2
5.8
10.8
520
6.7
(Unit : mm)
Sheet No.: D2-A05402EN
12
PC901V0NSZXF Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
· If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
[E226]
Sheet No.: D2-A05402EN
13