PHILIPS PHB2N50

Philips Semiconductors
Product specification
PowerMOS transistor
GENERAL DESCRIPTION
N-channel enhancement mode
field-effect power transistor in a
plastic envelope suitable for surface
mounting featuring high avalanche
energy capability, stable off-state
characteristics, fast switching and
high thermal cycling performance
with low thermal resistance. Intended
for use in Switched Mode Power
Supplies (SMPS), motor control
circuits and general purpose
switching applications.
PINNING - SOT404
PIN
PHB2N50
QUICK REFERENCE DATA
SYMBOL
PARAMETER
VDS
ID
Ptot
RDS(ON)
Drain-source voltage
Drain current (DC)
Total power dissipation
Drain-source on-state resistance
PIN CONFIGURATION
MAX.
UNIT
500
2
50
5
V
A
W
Ω
SYMBOL
DESCRIPTION
d
mb
1
gate
2
drain
3
source
mb
g
2
drain
1
3
s
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
ID
Continuous drain current
IDM
PD
∆PD/∆Tmb
VGS
EAS
Pulsed drain current
Total dissipation
Linear derating factor
Gate-source voltage
Single pulse avalanche
energy
Peak avalanche current
Tmb = 25 ˚C; VGS = 10 V
Tmb = 100 ˚C; VGS = 10 V
Tmb = 25 ˚C
Tmb = 25 ˚C
Tmb > 25 ˚C
IAS
Tj, Tstg
Operating junction and
storage temperature range
MIN.
MAX.
UNIT
-
2
1.3
8
50
0.4
± 30
100
A
A
A
W
W/K
V
mJ
-
2
A
- 55
150
˚C
VDD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω;
VGS = 10 V
VDD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω;
VGS = 10 V
THERMAL RESISTANCES
SYMBOL
PARAMETER
Rth j-mb
Thermal resistance junction to
mounting base
Thermal resistance junction to
ambient
Rth j-a
June 1997
CONDITIONS
pcb mounted, minimum
footprint
1
TYP.
MAX.
UNIT
-
2.5
K/W
50
-
K/W
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
PHB2N50
ELECTRICAL CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V(BR)DSS
VGS = 0 V; ID = 0.25 mA
500
-
-
V
∆V(BR)DSS /
∆Tj
RDS(ON)
VGS(TO)
gfs
IDSS
Drain-source breakdown
voltage
Drain-source breakdown
voltage temperature coefficient
Drain-source on resistance
Gate threshold voltage
Forward transconductance
Drain-source leakage current
VDS = VGS; ID = 0.25 mA
-
0.6
-
V/K
IGSS
Gate-source leakage current
2.0
0.5
-
3.1
3.0
1.3
1
30
10
5
4.0
25
250
200
Ω
V
S
µA
µA
nA
Qg(tot)
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain (Miller) charge
ID = 2 A; VDD = 400 V; VGS = 10 V
-
20
2
12
25
3
15
nC
nC
nC
td(on)
tr
td(off)
tf
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
VDD = 250 V; ID = 2 A;
RG = 24 Ω; RD = 120 Ω
-
10
20
60
20
-
ns
ns
ns
ns
Ld
Ld
Internal drain inductance
Internal drain inductance
-
3.5
4.5
-
nH
nH
Ls
Internal source inductance
Measured from tab to centre of die
Measured from drain lead solder
point to centre of die
Measured from source lead solder
point to source bond pad
-
7.5
-
nH
Ciss
Coss
Crss
Input capacitance
Output capacitance
Feedback capacitance
VGS = 0 V; VDS = 25 V; f = 1 MHz
-
236
40
22
-
pF
pF
pF
MIN.
TYP.
MAX.
UNIT
VGS = 10 V; ID = 1 A
VDS = VGS; ID = 0.25 mA
VDS = 30 V; ID = 1 A
VDS = 500 V; VGS = 0 V
VDS = 400 V; VGS = 0 V; Tj = 125 ˚C
VGS = ±30 V; VDS = 0 V
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
IS
Tmb = 25˚C
-
-
2
A
Tmb = 25˚C
-
-
8
A
VSD
Continuous source current
(body diode)
Pulsed source current (body
diode)
Diode forward voltage
IS = 2 A; VGS = 0 V
-
-
1.2
V
trr
Qrr
Reverse recovery time
Reverse recovery charge
IS = 2 A; VGS = 0 V; dI/dt = 100 A/µs
-
300
2.1
-
ns
µC
ISM
June 1997
2
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
Normalised Power Derating
PD%
120
PHB2N50
1E+01
Zth j-mb / (K/W)
110
D=
100
90
80
0.5
1E+00
70
0.2
60
50
0.1
0.05
40
1E-01
30
0.02
20
10
PD
tp
D=
tp
T
0
0
0
20
40
60
80
100
Tmb / C
120
140
Fig.1. Normalised power dissipation.
PD% = 100⋅PD/PD 25 ˚C = f(Tmb)
1E-05
1E-03
t/s
1E-01
1E+01
Fig.4. Transient thermal impedance.
Zth j-mb = f(t); parameter D = tp/T
Normalised Current Derating
ID%
120
t
T
1E-02
1E-07
6
PHP2N50
ID, Drain current (Amps)
Tj = 25 C
110
100
90
5
20 V
80
4
10 V
70
60
50
3
40
2
7V
6.5 V
6V
30
20
10
1
0
0
5.5 V
VGS = 5 V
0
20
40
60
80
Tmb / C
100
120
140
0
5
Fig.2. Normalised continuous drain current.
ID% = 100⋅ID/ID 25 ˚C = f(Tmb); conditions: VGS ≥ 10 V
10
)=
tp =
10 us
VD
N
S(O
30
PHP2N50
Drain-Source on resistance, RDS(ON) (Ohms)
5V 5.5 V 6 V
6.5 V
10
D
S/I
Tmb = 25 C
25
Fig.5. Typical output characteristics.
ID = f(VDS); parameter VGS
PHP2N50
Drain current, ID (Amps)
10
15
20
VDS, Drain-Source voltage (Volts)
Tj = 25 C
8
RD
7V
100us
1
6
1 ms
DC
0.1
10 V
10 ms
VGS = 20 V
4
100ms
2
0.01
10
100
Drain-source voltage, VDS (Volts)
0
1000
Fig.3. Safe operating area. Tmb = 25 ˚C
ID & IDM = f(VDS); IDM single pulse; parameter tp
June 1997
0
1
2
3
Drain current, ID (Amps)
4
5
Fig.6. Typical on-state resistance.
RDS(ON) = f(ID); parameter VGS
3
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
6
PHB2N50
VGS(TO) / V
PHP2N50
Drain current, ID (A)
VDD = 30 V
max.
4
5
Tj = 25 C
typ.
3
4
150 C
3
min.
2
2
1
1
0
0
0
2
4
6
Gate-source voltage, VGS (V)
8
-60
10
Transconductance, gfs (S)
-20
0
20
40
60
Tj / C
80
100
120
140
Fig.10. Gate threshold voltage.
VGS(TO) = f(Tj); conditions: ID = 0.25 mA; VDS = VGS
Fig.7. Typical transfer characteristics.
ID = f(VGS); parameter Tj
2.5
-40
PHP2N50
1E-01
SUB-THRESHOLD CONDUCTION
ID / A
VDD = 30 V
1E-02
2
Tj = 25 C
150 C
1
typ
98 %
1E-04
1E-05
0.5
0
2%
1E-03
1.5
1E-06
0
1
2
3
4
Drain current, ID (A)
5
0
6
Fig.8. Typical transconductance.
gfs = f(ID); parameter Tj
2
VGS / V
3
4
Fig.11. Sub-threshold drain current.
ID = f(VGS); conditions: Tj = 25 ˚C; VDS = VGS
Normalised RDS(ON) = f(Tj)
a
1
1000
PHP2N50
Capacitances, Ciss, Coss, Crss (pF)
2
Ciss
100
Coss
1
10
0
-60
-40
-20
0
20
40 60
Tj / C
80
1
100 120 140
Fig.9. Normalised drain-source on-state resistance.
a = RDS(ON)/RDS(ON)25 ˚C = f(Tj); ID = 1 A; VGS = 10 V
June 1997
Crss
1
10
100
Drain-source voltage, VDS (V)
1000
Fig.12. Typical capacitances, Ciss, Coss, Crss.
C = f(VDS); conditions: VGS = 0 V; f = 1 MHz
4
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
20
PHB2N50
Gate-Source voltage, VGS (Volts)
ID = 2 A
PHP2N50
10
200 V
15
PHP2N50
Source-drain diode current, IF(A)
VGS = 0 V
300 V
8
VDD = 400 V
Tj = 25 C
150 C
6
10
4
5
2
0
0
10
20
Gate charge, Qg (nC)
30
0
40
Switching times, td(on), tr, td(off), tf (ns)
0.5
1
Source-Drain voltage, VSDS (V)
1.5
Fig.16. Source-Drain diode characteristic.
IF = f(VSDS); parameter Tj
Fig.13. Typical turn-on gate-charge characteristics.
VGS = f(QG); parameter VDS
1000
0
PHP2N50
120
VDD = 250V
RD = 120 Ohms
Tj = 25 C
EAS, Normalised unclamped inductive energy (%)
110
100
90
100
80
td(off)
70
60
50
tr
tf
10
40
30
td(on)
20
10
1
0
20
40
60
Gate resistance, RG (Ohms)
80
0
100
20
Fig.14. Typical switching times.
td(on), tr, td(off), tf = f(RG)
1.15
40
60
80
100
Starting Tj ( C)
120
140
Fig.17. Normalised unclamped inductive energy.
EAS% = f(Tj)
Normalised Drain-source breakdown voltage
V(BR)DSS @ Tj
+
V(BR)DSS @ 25 C
1.1
VDD
L
1.05
VDS
-
VGS
1
-ID/100
0
0.95
0.9
0.85
-100
RGS
-50
0
50
Tj, Junction temperature (C)
100
R 01
shunt
150
Fig.18. Unclamped inductive test circuit.
EAS = 0.5 ⋅ LID2 ⋅ V(BR)DSS /(V(BR)DSS − VDD )
Fig.15. Normalised drain-source breakdown voltage.
V(BR)DSS/V(BR)DSS 25 ˚C = f(Tj)
June 1997
T.U.T.
5
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
PHB2N50
MECHANICAL DATA
Dimensions in mm
4.5 max
1.4 max
10.3 max
Net Mass: 1.4 g
11 max
15.4
2.5
0.85 max
(x2)
0.5
2.54 (x2)
Fig.19. SOT404 : centre pin connected to mounting base.
MOUNTING INSTRUCTIONS
Dimensions in mm
11.5
9.0
17.5
2.0
3.8
5.08
Fig.20. SOT404 : soldering pattern for surface mounting.
Notes
1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent
damage to MOS gate oxide.
2. Epoxy meets UL94 V0 at 1/8".
June 1997
6
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
PHB2N50
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
June 1997
7
Rev 1.000