PIC10F220/222 Data Sheet High-Performance Microcontrollers with 8-bit A/D © 2007 Microchip Technology Inc. DS41270E Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS41270E-page ii © 2007 Microchip Technology Inc. PIC10F220/222 6-Pin, 8-Bit Flash Microcontrollers Device Included In This Data Sheet: Low-Power Features/CMOS Technology: • PIC10F220 • PIC10F222 • Operating Current: - < 175 μA @ 2V, 4 MHz • Standby Current: - 100 nA @ 2V, typical • Low-Power, High-Speed Flash Technology: - 100,000 Flash endurance - > 40-year retention • Fully Static Design • Wide Operating Voltage Range: 2.0V to 5.5V • Wide Temperature Range: - Industrial: -40°C to +85°C - Extended: -40°C to +125°C High-Performance RISC CPU: • Only 33 Single-Word Instructions to Learn • All Single-Cycle Instructions Except for Program Branches which are Two-Cycle • 12-bit Wide Instructions • 2-Level Deep Hardware Stack • Direct, Indirect and Relative Addressing modes for Data and Instructions • 8-bit Wide Data Path • 8 Special Function Hardware Registers • Operating Speed: - 500 ns instruction cycle with 8 MHz internal clock - 1 μs instruction cycle with 4 MHz internal clock Peripheral Features: • 4 I/O Pins: - 3 I/O pins with individual direction control - 1 input only pin - High current sink/source for direct LED drive - Wake-on-change - Weak pull-ups • 8-bit Real-Time Clock/Counter (TMR0) with 8-bit Programmable Prescaler • Analog-to-Digital (A/D) Converter: - 8-bit resolution - 2 external input channels - 1 internal input channel dedicated Special Microcontroller Features: • 4 or 8 MHz Precision Internal Oscillator: - Factory calibrated to ±1% • In-Circuit Serial Programming™ (ICSP™) • In-Circuit Debugging (ICD) Support • Power-On Reset (POR) • Short Device Reset Timer, DRT (1.125 ms typical) • Watchdog Timer (WDT) with Dedicated On-Chip RC Oscillator for Reliable Operation • Programmable Code Protection • Multiplexed MCLR Input Pin • Internal Weak Pull-Ups on I/O Pins • Power-Saving Sleep mode • Wake-up from Sleep on Pin Change Program Memory Data Memory Flash (words) SRAM (bytes) PIC10F220 256 PIC10F222 512 I/O Timers 8-bit 8-Bit A/D (ch) 16 4 1 2 23 4 1 2 Device © 2007 Microchip Technology Inc. DS41270E-page 1 PIC10F220/222 1 VSS 2 GP1/AN1/ICSPCLK 3 PIC10F220/222 GP0/AN0/ICSPDAT 6 GP3/MCLR/VPP 5 VDD 4 GP2/T0CKI/FOSC4 PIC10F220/222 6-Lead SOT-23 Pin Diagram 8 GP3/MCLR/VPP 7 VSS 6 N/C 5 GP0/AN0/ICSPDAT 8 GP3/MCLR/VPP 7 VSS 6 N/C 5 GP0/AN0/ICSPDAT 8-Lead DIP Pin Diagram N/C 1 VDD 2 GP2/T0CKI/FOSC4 3 GP1/AN1/ICSPCLK 4 DS41270E-page 2 N/C 1 VDD 2 GP2/T0CKI/FOSC4 3 GP1/AN1/ICSPCLK 4 PIC10F220/222 8-Lead DFN Pin Diagram © 2007 Microchip Technology Inc. PIC10F220/222 Table of Contents 1.0 General Description...................................................................................................................................................................... 5 2.0 Device Varieties .......................................................................................................................................................................... 7 3.0 Architectural Overview ................................................................................................................................................................. 9 4.0 Memory Organization ................................................................................................................................................................. 13 5.0 I/O Port ....................................................................................................................................................................................... 21 6.0 TMR0 Module and TMR0 Register............................................................................................................................................. 25 7.0 Analog-to-Digital (A/D) converter ............................................................................................................................................... 29 8.0 Special Features Of The CPU.................................................................................................................................................... 33 9.0 Instruction Set Summary ............................................................................................................................................................ 43 10.0 Electrical Characteristics ............................................................................................................................................................ 51 11.0 Development Support................................................................................................................................................................. 61 12.0 DC and AC Characteristics Graphs and Charts ......................................................................................................................... 69 13.0 Packaging Information................................................................................................................................................................ 73 Index .................................................................................................................................................................................................... 79 The Microchip Web Site ....................................................................................................................................................................... 81 Customer Change Notification Service ................................................................................................................................................ 81 Customer Support ................................................................................................................................................................................ 81 Reader Response ................................................................................................................................................................................ 82 Product Identification System .............................................................................................................................................................. 83 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) • The Microchip Corporate Literature Center; U.S. FAX: (480) 792-7277 When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include _literature number) you are using. Customer Notification System Register on our web site at www.microchip.com/cn to receive the most current information on all of our products. © 2007 Microchip Technology Inc. DS41270E-page 3 PIC10F220/222 NOTES: DS41270E-page 4 © 2007 Microchip Technology Inc. PIC10F220/222 1.0 GENERAL DESCRIPTION The PIC10F220/222 devices from Microchip Technology are low-cost, high-performance, 8-bit, fullystatic Flash-based CMOS microcontrollers. They employ a RISC architecture with only 33 single-word/ single-cycle instructions. All instructions are singlecycle (1 μs) except for program branches, which take two cycles. The PIC10F220/222 devices deliver performance in an order of magnitude higher than their competitors in the same price category. The 12-bit wide instructions are highly symmetrical, resulting in a typical 2:1 code compression over other 8-bit microcontrollers in its class. The easy-to-use and easy to remember instruction set reduces development time significantly. 1.1 Applications The PIC10F220/222 devices fit in applications ranging from personal care appliances and security systems to low-power remote transmitters/receivers. The Flash technology makes customizing application programs (transmitter codes, appliance settings, receiver frequencies, etc.) extremely fast and convenient. The small footprint packages, for through hole or surface mounting, make these microcontrollers well suited for applications with space limitations. Low-cost, lowpower, high-performance, ease-of-use and I/O flexibility make the PIC10F220/222 devices very versatile, even in areas where no microcontroller use has been considered before (e.g., timer functions, logic and PLDs in larger systems and coprocessor applications). The PIC10F220/222 products are equipped with special features that reduce system cost and power requirements. The Power-on Reset (POR) and Device Reset Timer (DRT) eliminates the need for the external Reset circuitry. INTOSC Internal Oscillator mode is provided, thereby, preserving the limited number of I/O available. Power-Saving Sleep mode, Watchdog Timer and code protection features improve system cost, power and reliability. The PIC10F220/222 devices are available in costeffective Flash, which is suitable for production in any volume. The customer can take full advantage of Microchip’s price leadership in Flash programmable microcontrollers while benefiting from the Flash programmable flexibility. The PIC10F220/222 products are supported by a fullfeatured macro assembler, a software simulator, an incircuit debugger, a ‘C’ compiler, a low-cost development programmer and a full featured programmer. All the tools are supported on IBM® PC and compatible machines. TABLE 1-1: PIC10F220/222 DEVICES(1), (2) PIC10F220 PIC10F222 Clock Maximum Frequency of Operation (MHz) 8 8 Memory Flash Program Memory 256 512 Data Memory (bytes) 16 23 TMR0 TMR0 Yes Yes Analog inputs 2 2 I/O Pins 3 3 Peripherals Timer Module(s) Wake-up from Sleep on pin change Features Input Only Pins 1 1 Internal Pull-ups Yes Yes In-Circuit Serial Programming™ Yes Yes Number of instructions 33 33 6-pin SOT-23, 8-pin DIP, DFN 6-pin SOT-23, 8-pin DIP, DFN Packages Note 1: 2: The PIC10F220/222 devices have Power-on Reset, selectable Watchdog Timer, selectable code-protect, high I/O current capability and precision internal oscillator. The PIC10F220/222 devices use serial programming with data pin GP0 and clock pin GP1. © 2007 Microchip Technology Inc. DS41270E-page 5 PIC10F220/222 NOTES: DS41270E-page 6 © 2007 Microchip Technology Inc. PIC10F220/222 2.0 DEVICE VARIETIES A variety of packaging options are available. Depending on application and production requirements, the proper device option can be selected using the information in this section. When placing orders, please use the PIC10F220/222 Product Identification System at the back of this data sheet to specify the correct part number. 2.1 Quick Turn Programming (QTP) Devices Microchip offers a QTP programming service for factory production orders. This service is made available for users who choose not to program medium-to-high quantity units and whose code patterns have stabilized. The devices are identical to the Flash devices but with all Flash locations and fuse options already programmed by the factory. Certain code and prototype verification procedures do apply before production shipments are available. Please contact your local Microchip Technology sales office for more details. 2.2 Serialized Quick Turn ProgrammingSM (SQTPSM) Devices Microchip offers a unique programming service, where a few user-defined locations in each device are programmed with different serial numbers. The serial numbers may be random, pseudo-random or sequential. Serial programming allows each device to have a unique number, which can serve as an entry-code, password or ID number. © 2007 Microchip Technology Inc. DS41270E-page 7 PIC10F220/222 NOTES: DS41270E-page 8 © 2007 Microchip Technology Inc. PIC10F220/222 3.0 ARCHITECTURAL OVERVIEW The high performance of the PIC10F220/222 devices can be attributed to a number of architectural features commonly found in RISC microprocessors. To begin with, the PIC10F220/222 devices use a Harvard architecture in which program and data are accessed on separate buses. This improves bandwidth over traditional von Neumann architectures where program and data are fetched on the same bus. Separating program and data memory further allows instructions to be sized differently than the 8-bit wide data word. Instruction opcodes are 12 bits wide, making it possible to have all single-word instructions. A 12-bit wide program memory access bus fetches a 12-bit instruction in a single cycle. A two-stage pipeline overlaps fetch and execution of instructions. Consequently, all instructions (33) execute in a single cycle (1 μs @ 4 MHz or 500 ns @ 8 MHz) except for program branches. The table below lists program memory (Flash) and data memory (RAM) for the PIC10F220/222 devices. Memory Device PIC10F220 PIC10F222 Program Data 256 x 12 512 x 12 16 x 8 23 x 8 The PIC10F220/222 devices contain an 8-bit ALU and working register. The ALU is a general purpose arithmetic unit. It performs arithmetic and Boolean functions between data in the working register and any register file. The ALU is 8-bits wide and capable of addition, subtraction, shift and logical operations. Unless otherwise mentioned, arithmetic operations are two’s complement in nature. In two-operand instructions, one operand is typically the W (working) register. The other operand is either a file register or an immediate constant. In single operand instructions, the operand is either the W register or a file register. The W register is an 8-bit working register used for ALU operations. It is not an addressable register. Depending on the instruction executed, the ALU may affect the values of the Carry (C), Digit Carry (DC) and Zero (Z) bits in the STATUS register. The C and DC bits operate as a borrow and digit borrow out bit, respectively, in subtraction. See the SUBWF and ADDWF instructions for examples. A simplified block diagram is shown in Figure 3-1 with the corresponding device pins described in Table 3-1. The PIC10F220/222 devices can directly or indirectly address its register files and data memory. All Special Function Registers (SFR), including the PC, are mapped in the data memory. The PIC10F220/222 devices have a highly orthogonal (symmetrical) instruction set that makes it possible to carry out any operation, on any register, using any addressing mode. This symmetrical nature and lack of “special optimal situations” make programming with the PIC10F220/222 devices simple, yet efficient. In addition, the learning curve is reduced significantly. © 2007 Microchip Technology Inc. DS41270E-page 9 PIC10F220/222 FIGURE 3-1: BLOCK DIAGRAM 9-10 512 x 12 or 256 x 12 GPIO GP0/AN0/ICSPDAT GP1/AN1/ICSPCLK GP2/T0CKI/FOSC4 GP3/MCLR/VPP RAM Program Memory 23 or 16 bytes STACK1 STACK2 Program Bus 8 Data Bus Program Counter Flash File Registers 12 RAM Addr 9 Addr MUX Instruction Reg Direct Addr 5 5-7 Indirect Addr FSR Reg STATUS Reg 8 3 MUX Device Reset Timer Instruction Decode & Control Power-on Reset Timing Generation Watchdog Timer Internal RC Clock ALU AN0 8 ADC W Reg AN1 Timer0 Absolute Voltage Reference MCLR VDD, VSS TABLE 3-1: PINOUT DESCRIPTION Name GP0/AN0/ICSPDAT GP1/AN1/ICSPCLK Function Input Type Output Type GP0 TTL CMOS AN0 AN — Description Bidirectional I/O pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. Analog Input ICSPDAT ST CMOS In-Circuit programming data GP1 TTL CMOS Bidirectional I/O pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. AN1 AN — Analog Input ICSPCLK ST — In-Circuit programming clock GP2 TTL CMOS Bidirectional I/O pin T0CKI ST — Clock input to TMR0 FOSC4 — CMOS GP3 TTL — Input pin. Can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. MCLR ST — Master Clear (Reset). When configured as MCLR, this pin is an active-low Reset to the device. Voltage on MCLR/VPP must not exceed VDD during normal device operation or the device will enter Programming mode. VPP HV — Programming voltage input VDD VDD P — Positive supply for logic and I/O pins VSS VSS P — Ground reference for logic and I/O pins GP2/T0CKI/FOSC4 GP3/MCLR/VPP Legend: Oscillator/4 output I = Input, O = Output, I/O = Input/Output, P = Power, — = Not used, TTL = TTL input, ST = Schmitt Trigger input, AN = Analog Input DS41270E-page 10 © 2007 Microchip Technology Inc. PIC10F220/222 3.1 Clocking Scheme/Instruction Cycle 3.2 Instruction Flow/Pipelining An instruction cycle consists of four Q cycles (Q1, Q2, Q3 and Q4). The instruction fetch and execute are pipelined such that fetch takes one instruction cycle, while decode and execute takes another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the PC to change (e.g., GOTO) then two cycles are required to complete the instruction (Example 3-1). The clock is internally divided by four to generate four non-overlapping quadrature clocks, namely Q1, Q2, Q3 and Q4. Internally, the PC is incremented every Q1, and the instruction is fetched from program memory and latched into the Instruction Register (IR) in Q4. It is decoded and executed during Q1 through Q4. The clocks and instruction execution flow is shown in Figure 3-2 and Example 3-1. A fetch cycle begins with the PC incrementing in Q1. In the execution cycle, the fetched instruction is latched into the Instruction Register in cycle Q1. This instruction is then decoded and executed during the Q2, Q3 and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write). FIGURE 3-2: CLOCK/INSTRUCTION CYCLE Q2 Q1 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Q1 Q2 Internal phase clock Q3 Q4 PC PC PC + 1 Fetch INST (PC) Execute INST (PC - 1) EXAMPLE 3-1: PC + 2 Fetch INST (PC + 1) Execute INST (PC) Fetch INST (PC + 2) Execute INST (PC + 1) INSTRUCTION PIPELINE FLOW 1. MOVLW 03H 2. MOVWF GPIO 3. CALL SUB_1 4. BSF GPIO, BIT1 Fetch 1 Execute 1 Fetch 2 Execute 2 Fetch 3 Execute 3 Fetch 4 Flush Fetch SUB_1 Execute SUB_1 All instructions are single cycle, except for any program branches. These take two cycles, since the fetch instruction is “flushed” from the pipeline, while the new instruction is being fetched and then executed. © 2007 Microchip Technology Inc. DS41270E-page 11 PIC10F220/222 NOTES: DS41270E-page 12 © 2007 Microchip Technology Inc. PIC10F220/222 MEMORY ORGANIZATION The PIC10F220/222 memories are organized into program memory and data memory. Data memory banks are accessed using the File Select Register (FSR). 4.1 Program Memory Organization for the PIC10F220 The PIC10F220 devices have a 9-bit Program Counter (PC) capable of addressing a 512 x 12 program memory space. Only the first 256 x 12 (0000h-00FFh) for the PIC10F220 are physically implemented (see Figure 4-1). Accessing a location above these boundaries will cause a wrap-around within the first 256 x 12 space (PIC10F220). The effective Reset vector is at 0000h, (see Figure 4-1). Location 00FFh (PIC10F220) contains the internal clock oscillator calibration value. This value should never be overwritten. FIGURE 4-1: 4.2 Program Memory Organization for the PIC10F222 The PIC10F222 devices have a 10-bit Program Counter (PC) capable of addressing a 1024 x 12 program memory space. Only the first 512 x 12 (0000h-01FFh) for the MemHigh are physically implemented (see Figure 4-2). Accessing a location above these boundaries will cause a wrap-around within the first 512 x 12 space (PIC10F222). The effective Reset vector is at 0000h, (see Figure 4-2). Location 01FFh (PIC10F222) contains the internal clock oscillator calibration value. This value should never be overwritten. FIGURE 4-2: <9:0> PC<8:0> 10 CALL, RETLW Stack Level 1 Stack Level 2 PROGRAM MEMORY MAP AND STACK FOR THE PIC10F220 Reset Vector(1) <8:0> PC<7:0> PROGRAM MEMORY MAP AND STACK FOR THE PIC10F222 0000h 9 CALL, RETLW On-chip Program Memory Stack Level 1 Stack Level 2 Reset Vector(1) 0000h User Memory Space 4.0 User Memory Space On-chip Program Memory 512 Words 01FFh 0200h 02FFh 256 Word 00FFh 0100h Note 1: Address 0000h becomes the effective Reset vector. Location 01FFh contains the MOVLW XX internal oscillator calibration value. 01FFh Note 1: Address 0000h becomes the effective Reset vector. Location 00FFh contains the MOVLW XX internal oscillator calibration value. © 2007 Microchip Technology Inc. DS41270E-page 13 PIC10F220/222 4.3 Data Memory Organization FIGURE 4-4: Data memory is composed of registers or bytes of RAM. Therefore, data memory for a device is specified by its register file. The register file is divided into two functional groups: Special Function Registers (SFR) and General Purpose Registers (GPR). PIC10F222 REGISTER FILE MAP File Address 00h INDF(1) 01h TMR0 02h PCL 03h STATUS 04h FSR 05h OSCCAL 06h GPIO The General Purpose Registers are used for data and control information under command of the instructions. 07h ADCON0 08h ADRES For the PIC10F220, the register file is composed of 9 Special Function Registers and 16 General Purpose Registers (Figure 4-3, Figure 4-4). 09h The Special Function Registers include the TMR0 register, the Program Counter (PCL), the STATUS register, the I/O register (GPIO) and the File Select Register (FSR). In addition, Special Function Registers are used to control the I/O port configuration and prescaler options. General Purpose Registers For the PIC10F222, the register file is composed of 9 Special Function Registers and 23 General Purpose Registers (Figure 4-4). 1Fh 4.3.1 GENERAL PURPOSE REGISTER FILE The General Purpose Register file is accessed, either directly or indirectly, through the File Select Register (FSR). See Section 4.9 “Indirect Data Addressing; INDF and FSR Registers”. FIGURE 4-3: PIC10F220 REGISTER FILE MAP File Address 00h INDF (1) 01h TMR0 02h PCL 03h STATUS 04h FSR 05h OSCCAL 06h GPIO 07h ADCON0 08h 09h ADRES Note 1: 4.3.2 Not a physical register. See Section 4.9 “Indirect Data Addressing; INDF and FSR Registers”. SPECIAL FUNCTION REGISTERS The Special Function Registers (SFRs) are registers used by the CPU and peripheral functions to control the operation of the device (Table 4-1). The Special Function Registers can be classified into two sets. The Special Function Registers associated with the “core” functions are described in this section. Those related to the operation of the peripheral features are described in the section for each peripheral feature. Unimplemented(2) 0Fh 10h General Purpose Registers 1Fh Note 1: 2: Not a physical register. See Section 4.9 “Indirect Data Addressing; INDF and FSR Registers”. Unimplemented, read as 00h. DS41270E-page 14 © 2007 Microchip Technology Inc. PIC10F220/222 TABLE 4-1: Address SPECIAL FUNCTION REGISTER (SFR) SUMMARY Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Power-On Reset(2) Page # 20 00h INDF Uses contents of FSR to address data memory (not a physical register) xxxx xxxx 01h TMR0 8-Bit Real-Time Clock/Counter xxxx xxxx 25 02h PCL(1) Low Order 8 Bits of PC 1111 1111 19 03h STATUS GPWUF 0--1 1xxx(3) 15 04h FSR Indirect Data Memory Address Pointer 111x xxxx 20 05h OSCCAL 1111 1110 18 06h GPIO 07h ADCON0 08h ADRES N/A TRISGPIO N/A OPTION Legend: Note 1: 2: 3: 4.4 — CAL6 — TO PD CAL2 Z DC CAL1 CAL0 C CAL5 CAL4 CAL3 FOSC4 — — — — GP3 GP2 GP1 GP0 ---- xxxx 21 ANS1 ANS0 — — CHS1 CHS0 GO/DONE ADON 11-- 1100 30 Result of Analog-to-Digital Conversion — — — — GPWU GPPU T0CS T0SE I/O Control Register PSA PS2 PS1 PS0 xxxx xxxx 31 ---- 1111 23 1111 1111 17 – = unimplemented, read as ‘0’, x = unknown, u = unchanged, q = value depends on condition. The upper byte of the Program Counter is not directly accessible. See Section 4.7 “Program Counter” for an explanation of how to access these bits. Other (non Power-up) Resets include external Reset through MCLR, Watchdog Timer and wake-up on pin change Reset. See Table 8-1 for other Reset specific values. STATUS Register This register contains the arithmetic status of the ALU, the Reset status and the page preselect bit. The STATUS register can be the destination for any instruction, as with any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). Therefore, it is recommended that only BCF, BSF and MOVWF instructions be used to alter the STATUS register. These instructions do not affect the Z, DC or C bits from the STATUS register. For other instructions, which do affect Status bits, see Instruction Set Summary. © 2007 Microchip Technology Inc. DS41270E-page 15 PIC10F220/222 REGISTER 4-1: STATUS REGISTER (ADDRESS: 03h) R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x GPWUF — — TO PD Z DC C bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 GPWUF: GPIO Reset bit 1 = Reset due to wake-up from Sleep on pin change 0 = After power-up or other Reset bit 6 Reserved: Do not use. Use of this bit may affect upward compatibility with future products. bit 5 Reserved: Do not use. Use of this bit may affect upward compatibility with future products. bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit carry/borrow bit (for ADDWF and SUBWF instructions) ADDWF: 1 = A carry to the 4th low-order bit of the result occurred 0 = A carry to the 4th low-order bit of the result did not occur SUBWF: 1 = A borrow from the 4th low-order bit of the result did not occur 0 = A borrow from the 4th low-order bit of the result occurred bit 0 C: Carry/borrow bit (for ADDWF, SUBWF and RRF, RLF instructions) ADDWF: SUBWF: RRF or RLF: 1 = A carry occurred 1 = A borrow did not occur Load bit with LSb or MSb, respectively 0 = A carry did not occur 0 = A borrow occurred DS41270E-page 16 © 2007 Microchip Technology Inc. PIC10F220/222 4.5 OPTION Register The OPTION register is a 8-bit wide, write-only register, which contains various control bits to configure the Timer0/WDT prescaler and Timer0. The OPTION register is not memory mapped and is therefore only addressable by executing the OPTION instruction, the contents of the W register will be transferred to the OPTION register. A Reset sets the OPTION<7:0> bits. REGISTER 4-2: Note: If TRIS bit is set to ‘0’, the wake-up on change and pull-up functions are disabled for that pin (i.e., note that TRIS overrides Option control of GPPU and GPWU). Note: If the T0CS bit is set to ‘1’, it will override the TRIS function on the T0CKI pin. OPTION REGISTER W-1 W-1 W-1 W-1 W-1 W-1 W-1 W-1 GPWU GPPU T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 GPWU: Enable Wake-up On Pin Change bit (GP0, GP1, GP3) 1 = Disabled 0 = Enabled bit 6 GPPU: Enable Weak Pull-ups bit (GP0, GP1, GP3) 1 = Disabled 0 = Enabled bit 5 T0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin (overrides TRIS on the T0CKI pin) 0 = Transition on internal instruction cycle clock, FOSC/4 bit 4 T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on the T0CKI pin 0 = Increment on low-to-high transition on the T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler assigned to the WDT 0 = Prescaler assigned to Timer0 bit 2-0 PS<2:0>: Prescaler Rate Select bits Bit Value 000 001 010 011 100 101 110 111 © 2007 Microchip Technology Inc. x = Bit is unknown Timer0 Rate WDT Rate 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 DS41270E-page 17 PIC10F220/222 4.6 OSCCAL Register The Oscillator Calibration (OSCCAL) register is used to calibrate the internal precision 4/8 MHz oscillator. It contains seven bits for calibration. Note: Erasing the device will also erase the preprogrammed internal calibration value for the internal oscillator. The calibration value must be read prior to erasing the part so it can be reprogrammed correctly later. After you move in the calibration constant, do not change the value. See Section 8.2.2 “Internal 4/8 MHz Oscillator”. REGISTER 4-3: OSCCAL – OSCILLATOR CALIBRATION REGISTER (ADDRESS: 05h) R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 FOSC4 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-1 CAL<6:0>: Oscillator Calibration bits 0111111 = Maximum frequency • • • 0000001 0000000 = Center frequency 1111111 • • • 1000000 = Minimum frequency bit 0 FOSC4: INTOSC/4 Output Enable bit(1) 1 = INTOSC/4 output onto GP2 0 = GP2/T0CKI applied to GP2 Note 1: x = Bit is unknown Overrides GP2/T0CKI control registers when enabled. DS41270E-page 18 © 2007 Microchip Technology Inc. PIC10F220/222 4.7 4.7.1 Program Counter As a program instruction is executed, the Program Counter (PC) will contain the address of the next program instruction to be executed. The PC value is increased by one every instruction cycle, unless an instruction changes the PC. For a GOTO instruction, bits 8:0 of the PC are provided by the GOTO instruction word. The PC Latch (PCL) is mapped to PC<7:0>. For a CALL instruction or any instruction where the PCL is the destination, bits 7:0 of the PC again are provided by the instruction word. However, PC<8> does not come from the instruction word, but is always cleared (Figure 4-5). Instructions where the PCL is the destination or Modify PCL instructions, include MOVWF PC, ADDWF PC and BSF PC, 5. Note: Because PC<8> is cleared in the CALL instruction or any Modify PCL instruction, all subroutine calls or computed jumps are limited to the first 256 locations of any program memory page (512 words long). FIGURE 4-5: LOADING OF PC BRANCH INSTRUCTIONS GOTO Instruction 8 7 PC 0 PCL EFFECTS OF RESET The PC is set upon a Reset, which means that the PC addresses the last location in program memory (i.e., the oscillator calibration instruction). After executing MOVLW XX, the PC will roll over to location 0000h and begin executing user code. 4.8 Stack The PIC10F220 device has a 2-deep, 8-bit wide hardware PUSH/POP stack. The PIC10F222 device has a 2-deep, 9-bit wide hardware PUSH/POP stack. A CALL instruction will PUSH the current value of stack 1 into stack 2 and then PUSH the current PC value, incremented by one, into stack level 1. If more than two sequential CALL’s are executed, only the most recent two return addresses are stored. A RETLW instruction will POP the contents of stack level 1 into the PC and then copy stack level 2 contents into level 1. If more than two sequential RETLW’s are executed, the stack will be filled with the address previously stored in level 2. Note 1: The W register will be loaded with the literal value specified in the instruction. This is particularly useful for the implementation of data look-up tables within the program memory. 2: There are no Status bits to indicate stack overflows or stack underflow conditions. 3: There are no instructions mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL and RETLW instructions. Instruction Word CALL or Modify PCL Instruction 8 7 PC 0 PCL Instruction Word Reset to ‘0’ © 2007 Microchip Technology Inc. DS41270E-page 19 PIC10F220/222 4.9 EXAMPLE 4-1: Indirect Data Addressing; INDF and FSR Registers The INDF register is not a physical register. Addressing INDF actually addresses the register whose address is contained in the FSR register (FSR is a pointer). This is indirect addressing. 4.9.1 NEXT MOVLW MOVWF CLRF 0x10 FSR INDF INCF BTFSC GOTO CONTINUE : : INDIRECT ADDRESSING • • • • Register file 09 contains the value 10h Register file 0A contains the value 0Ah Load the value 09 into the FSR register A read of the INDF register will return the value of 10h • Increment the value of the FSR register by one (FSR = 0A) • A read of the INDR register now will return the value of 0Ah. HOW TO CLEAR RAM USING INDIRECT ADDRESSING FSR,F FSR,4 NEXT ;initialize pointer ;to RAM ;clear INDF ;register ;inc pointer ;all done? ;NO, clear next ;YES, continue The FSR is a 5-bit wide register. It is used in conjunction with the INDF register to indirectly address the data memory area. Reading INDF itself indirectly (FSR = 0) will produce 00h. Writing to the INDF register indirectly results in a no-operation (although Status bits may be affected). The FSR<4:0> bits are used to select data memory addresses 00h to 1Fh. Note: Do not use banking. FSR <7:5> are unimplemented and read as ‘1’s. A simple program to clear RAM locations 10h-1Fh using Indirect addressing is shown in Example 4-1. FIGURE 4-6: DIRECT/INDIRECT ADDRESSING Direct Addressing 4 (opcode) Indirect Addressing 0 4 Location Select (FSR) 0 Location Select 00h Data Memory(1) 0Fh 10h 1Fh Bank 0 Note 1: For register map detail, see Section 4.3 “Data Memory Organization”. DS41270E-page 20 © 2007 Microchip Technology Inc. PIC10F220/222 5.0 I/O PORT The TRIS registers are “write-only” and are set (output drivers disabled) upon Reset. As with any other register, the I/O register(s) can be written and read under program control. However, read instructions (e.g., MOVF GPIO, W) always read the I/O pins independent of the pin’s Input/Output modes. On Reset, all I/O ports are defined as input (inputs are at high-impedance) since the I/O control registers are all set. 5.1 5.3 The equivalent circuit for an I/O port pin is shown in Figure 5-1. All port pins, except GP3, which is input only, may be used for both input and output operations. For input operations, these ports are non-latching. Any input must be present until read by an input instruction (e.g., MOVF GPIO, W). The outputs are latched and remain unchanged until the output latch is rewritten. To use a port pin as output, the corresponding direction control bit in TRIS must be cleared (= 0). For use as an input, the corresponding TRIS bit must be set. Any I/O pin (except GP3) can be programmed individually as input or output. GPIO GPIO is an 8-bit I/O register. Only the low-order 4 bits are used (GP<3:0>). Bits 7 through 4 are unimplemented and read as ‘0’s. Please note that GP3 is an input only pin. Pins GP0, GP1 and GP3 can be configured with weak pull-ups and also for wake-up on change. The wake-up on change and weak pull-up functions are not individually pin selectable. If GP3/ MCLR is configured as MCLR, a weak pull-up can be enabled via the Configuration Word. Configuring GP3 as MCLR disables the wake-up on change function for this pin. 5.2 FIGURE 5-1: Data Bus The Output Driver Control register is loaded with the contents of the W register by executing the TRIS f instruction. A ‘1’ from a TRIS register bit puts the corresponding output driver in a High-Impedance mode. A ‘0’ puts the contents of the output data latch on the selected pins, enabling the output buffer. The exceptions are GP3, which is input only, and the GP2/T0CKI/ FOSC4 pin, which may be controlled by various registers. See Table 5-1. EQUIVALENT CIRCUIT FOR A SINGLE I/O PIN Q Data Latch CK Q VDD VDD P (1) N W Reg D TRIS ‘f’ Q TRIS Latch CK Q Reset A read of the ports reads the pins, not the output data latches. That is, if an output driver on a pin is enabled and driven high, but the external system is holding it low, a read of the port will indicate that the pin is low. TABLE 5-1: D WR Port TRIS Registers Note: I/O Interfacing I/O pin VSS VSS (2) RD Port Note 1: 2: I/O pins have protection diodes to VDD and VSS. See Table 3-1 for buffer type. ORDER OF PRECEDENCE FOR PIN FUNCTIONS Priority GP0 GP1 GP2 GP3 1 2 3 AN0 TRIS GPIO — AN1 TRIS GPIO — FOSC4 T0CKI TRIS GPIO MCLR — — TABLE 5-2: REQUIREMENTS TO MAKE PINS AVAILABLE IN DIGITAL MODE GP0 GP1 GP2 GP3 FOSC4 Bit — — 0 — T0CS — — 0 — ANS1 — 0 — — ANS0 0 — — — MCLRE — — — 0 Legend: — = Condition of bit will have no effect on the setting of the pin to Digital mode. © 2007 Microchip Technology Inc. DS41270E-page 21 PIC10F220/222 FIGURE 5-2: BLOCK DIAGRAM OF GP0 AND GP1 FIGURE 5-3: I/O Pin(1) Data Bus D GPPU D Q WR Port CK W Reg I/O Pin FOSC4 OSCCAL<0> D Q TRIS Latch (1) TRIS ‘f’ Q Q CK W Reg Data Latch Q Data Latch WR Port Data Bus BLOCK DIAGRAM OF GP2 Q CK Reset D Q T0CS TRIS Latch TRIS ‘f’ CK Q RD Port Reset T0CKI Analog Enable Note 1: I/O pins have protection diodes to VDD and VSS. RD Port FIGURE 5-4: Q D CK Mis-Match BLOCK DIAGRAM OF GP3 GPPU MCLRE Reset I/O Pin(1) ADC Note 1: I/O pins have protection diodes to VDD and VSS. Data Bus RD Port Q D CK Mis-match Note 1: DS41270E-page 22 GP3/MCLR pin has a protection diode to VSS only. © 2007 Microchip Technology Inc. PIC10F220/222 TABLE 5-3: Address N/A SUMMARY OF PORT REGISTERS Name TRISGPIO Bit 7 Bit 6 Bit 5 Bit 4 — — — — Bit 3 Bit 2 Bit 1 Bit 0 I/O Control Registers Value on Power-On Reset Value on All Other Resets ---- 1111 ---- 1111 N/A OPTION GPWU GPPU T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 03h STATUS GPWUF — — TO PD Z DC C 0001 1xxx q00q quuu(1) — — — — GP3 GP2 GP1 GP0 ---- xxxx ---- uuuu 06h GPIO Legend: Shaded cells not used by PORT registers, read as ‘0’, – = unimplemented, read as ‘0’, x = unknown, u = unchanged, q = depends on condition. If Reset was due to wake-up on pin change, then bit 7 = 1. All other Resets will cause bit 7 = 0. Note 1: 5.4 EXAMPLE 5-1: I/O Programming Considerations 5.4.1 BIDIRECTIONAL I/O PORTS ;Initial GPIO Settings ;GPIO<3:2> Inputs ;GPIO<1:0> Outputs ; ; GPIO latch GPIO pins ; ------------------BCF GPIO, 1 ;---- pp01 ---- pp11 BCF GPIO, 0 ;---- pp10 ---- pp11 MOVLW 007h; TRIS GPIO ;---- pp10 ---- pp11 ; Note: The user may have expected the pin values to be ---- pp00. The second BCF caused GP1 to be latched as the pin value (High). Some instructions operate internally as read followed by write operations. The BCF and BSF instructions, for example, read the entire port into the CPU, execute the bit operation and re-write the result. Caution must be used when these instructions are applied to a port where one or more pins are used as input/outputs. For example, a BSF operation on bit 2 of GPIO will cause all eight bits of GPIO to be read into the CPU, bit 2 to be set and the GPIO value to be written to the output latches. If another bit of GPIO is used as a bidirectional I/O pin (say bit 0) and it is defined as an input at this time, the input signal present on the pin itself would be read into the CPU and rewritten to the data latch of this particular pin, overwriting the previous content. As long as the pin stays in the Input mode, no problem occurs. However, if bit 0 is switched into Output mode later on, the content of the data latch may now be unknown. 5.4.2 A pin actively outputting a high or a low should not be driven from external devices at the same time in order to change the level on this pin (“wired-or”, “wired-and”). The resulting high output currents may damage the chip. SUCCESSIVE I/O OPERATION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC Instruction Fetched SUCCESSIVE OPERATIONS ON I/O PORTS The actual write to an I/O port happens at the end of an instruction cycle, whereas for reading, the data must be valid at the beginning of the instruction cycle (Figure 5-5). Therefore, care must be exercised if a write followed by a read operation is carried out on the same I/O port. The sequence of instructions should allow the pin voltage to stabilize (load dependent) before the next instruction causes that file to be read into the CPU. Otherwise, the previous state of that pin may be read into the CPU rather than the new state. When in doubt, it is better to separate these instructions with a NOP or another instruction not accessing this I/O port. Example 5-1 shows the effect of two sequential Read-Modify-Write instructions (e.g., BCF, BSF, etc.) on an I/O port. FIGURE 5-5: I/O PORT READ-MODIFYWRITE INSTRUCTIONS MOVWF GPIO PC + 1 MOVF GPIO, W Q1 Q2 Q3 Q4 PC + 2 PC + 3 This example shows a write to GPIO followed by a read from GPIO. NOP NOP Data setup time = (0.25 TCY – TPD) where: TCY = instruction cycle GP<2:0> TPD = propagation delay Port pin written here Instruction Executed MOVWF GPIO (Write to GPIO) © 2007 Microchip Technology Inc. Port pin sampled here MOVF GPIO,W (Read GPIO) Therefore, at higher clock frequencies, a write followed by a read may be problematic. NOP DS41270E-page 23 PIC10F220/222 NOTES: DS41270E-page 24 © 2007 Microchip Technology Inc. PIC10F220/222 6.0 TMR0 MODULE AND TMR0 REGISTER Counter mode is selected by setting the T0CS bit (OPTION<5>). In this mode, Timer0 will increment either on every rising or falling edge of pin T0CKI. The T0SE bit (OPTION<4>) determines the source edge. Clearing the T0SE bit selects the rising edge. Restrictions on the external clock input are discussed in detail in Section 6.1 “Using Timer0 With An External Clock”. The Timer0 module has the following features: • • • • 8-bit timer/counter register, TMR0 Readable and writable 8-bit software programmable prescaler Internal or external clock select: - Edge select for external clock Figure 6-1 is a simplified block diagram of the Timer0 module. Timer mode is selected by clearing the T0CS bit (OPTION<5>). In Timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If TMR0 register is written, the increment is inhibited for the following two cycles (Figure 6-2 and Figure 6-3). The user can work around this by writing an adjusted value to the TMR0 register. FIGURE 6-1: The prescaler may be used by either the Timer0 module or the Watchdog Timer, but not both. The prescaler assignment is controlled in software by the control bit PSA (OPTION<3>). Clearing the PSA bit will assign the prescaler to Timer0. The prescaler is not readable or writable. When the prescaler is assigned to the Timer0 module, prescale values of 1:2, 1:4, 1:256 are selectable. Section 6.2 “Prescaler” details the operation of the prescaler. A summary of registers associated with the Timer0 module is found in Table 6-1. TIMER0 BLOCK DIAGRAM Data Bus GP2/T0CKI Pin FOSC/4 0 PSOUT 1 1 Programmable Prescaler(2) 0 T0SE 8 Sync with Internal Clocks TMR0 Reg PSOUT (2 TCY delay) Sync 3 T0CS(1) Note 1: 2: The prescaler is shared with the Watchdog Timer (Figure 6-5). TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC-1 Instruction Fetch Timer0 PSA(1) Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register. FIGURE 6-2: PC (Program Counter) PS2, PS1, PS0(1) PC MOVWF TMR0 T0 T0 + 1 Instruction Executed © 2007 Microchip Technology Inc. PC + 1 PC + 2 PC + 3 PC + 4 PC + 5 PC + 6 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W T0 + 2 Write TMR0 executed NT0 + 1 NT0 Read TMR0 reads NT0 Read TMR0 reads NT0 Read TMR0 reads NT0 NT0 + 2 Read TMR0 Read TMR0 reads NT0 + 1 reads NT0 + 2 DS41270E-page 25 PIC10F220/222 FIGURE 6-3: PC (Program Counter) TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC-1 Instruction Fetch PC MOVWF TMR0 T0 Timer0 PC + 2 PC + 4 PC + 5 NT0 Write TMR0 executed TABLE 6-1: PC + 3 T0 + 1 Instruction Executed Address PC + 1 Read TMR0 reads NT0 NT0 + 1 Read TMR0 reads NT0 Read TMR0 Read TMR0 reads NT0 + 1 reads NT0 + 2 Read TMR0 reads NT0 REGISTERS ASSOCIATED WITH TIMER0 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Power-On Reset Value on All Other Resets xxxx xxxx uuuu uuuu PS2 PS1 PS0 1111 1111 1111 1111 ---- 1111 01h TMR0 Timer0 – 8-Bit Real-Time Clock/Counter N/A OPTION GPWU GPPU T0CS T0SE N/A TRISGPIO(1) — — — — Legend: Shaded cells not used by Timer0, – = unimplemented, x = unknown, u = unchanged. Note 1: 6.1 PC + 6 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W PSA I/O Control Register ---- 1111 The TRIS of the T0CKI pin is overridden when T0CS = 1 Using Timer0 With An External Clock When an external clock input is used for Timer0, it must meet certain requirements. The external clock requirement is due to internal phase clock (TOSC) synchronization. Also, there is a delay in the actual incrementing of Timer0 after synchronization. 6.1.1 EXTERNAL CLOCK SYNCHRONIZATION When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI with the internal phase clocks is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks (Figure 6-4). Therefore, it is necessary for T0CKI to be high for at least 2TOSC (and a small RC delay of 2Tt0H) and low for at least 2TOSC (and a small RC delay of 2Tt0H). Refer to the electrical specification of the desired device. When a prescaler is used, the external clock input is divided by the asynchronous ripple counter-type prescaler, so that the prescaler output is symmetrical. For the external clock to meet the sampling requirement, the ripple counter must be taken into account. Therefore, it is necessary for T0CKI to have a period of at least 4TOSC (and a small RC delay of 4Tt0H) divided by the prescaler value. The only requirement on T0CKI high and low time is that they do not violate the minimum pulse width requirement of Tt0H. Refer to parameters 40, 41 and 42 in the electrical specification of the desired device. DS41270E-page 26 © 2007 Microchip Technology Inc. PIC10F220/222 6.1.2 TIMER0 INCREMENT DELAY Since the prescaler output is synchronized with the internal clocks, there is a small delay from the time the external clock edge occurs to the time the Timer0 module is actually incremented. Figure 6-4 shows the delay from the external clock edge to the timer incrementing. FIGURE 6-4: TIMER0 TIMING WITH EXTERNAL CLOCK External Clock Input or Prescaler Output(2) External Clock/Prescaler Output After Sampling Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Small pulse misses sampling (1) (3) Increment Timer0 (Q4) Timer0 T0 T0 + 1 T0 + 2 Note 1: Delay from clock input change to Timer0 increment is 3TOSC to 7TOSC. (Duration of Q = TOSC). Therefore, the error in measuring the interval between two edges on Timer0 input = ±4TOSC max. 2: External clock if no prescaler selected; prescaler output otherwise. 3: The arrows indicate the points in time where sampling occurs. 6.2 Prescaler An 8-bit counter is available as a prescaler for the Timer0 module or as a postscaler for the Watchdog Timer (WDT), respectively (see Section 8.6 “Watchdog Timer (WDT)”). For simplicity, this counter is being referred to as “prescaler” throughout this data sheet. Note: The prescaler may be used by either the Timer0 module or the WDT, but not both. Thus, a prescaler assignment for the Timer0 module means that there is no prescaler for the WDT and vice-versa. The PSA and PS<2:0> bits (OPTION<3:0>) determine prescaler assignment and prescale ratio. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF 1, MOVWF 1, BSF 1,x, etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT. The prescaler is neither readable nor writable. On a Reset, the prescaler contains all ‘0’s. © 2007 Microchip Technology Inc. DS41270E-page 27 PIC10F220/222 6.2.1 SWITCHING PRESCALER ASSIGNMENT To change prescaler from the WDT to the Timer0 module, use the sequence shown in Example 6-2. This sequence must be used even if the WDT is disabled. A CLRWDT instruction should be executed before switching the prescaler. The prescaler assignment is fully under software control (i.e., it can be changed “on-the-fly” during program execution). To avoid an unintended device Reset, the following instruction sequence (Example 6-1) must be executed when changing the prescaler assignment from Timer0 to the WDT. EXAMPLE 6-2: CHANGING PRESCALER (WDT→TIMER0) CLRWDT EXAMPLE 6-1: CHANGING PRESCALER (TIMER0 → WDT) MOVLW CLRWDT ;Clear WDT CLRF TMR0 ;Clear TMR0 & Prescaler MOVLW ‘00xx1111’b ;These 3 lines (5, 6, 7) OPTION ;are required only if ;desired CLRWDT ;PS<2:0> are 000 or 001 MOVLW ‘00xx1xxx’b ;Set Postscaler to OPTION ;desired WDT rate FIGURE 6-5: ‘xxxx0xxx’ ;Clear WDT and ;prescaler ;Select TMR0, new ;prescale value and ;clock source OPTION BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER TCY (= FOSC/4) Data Bus 0 GP2/T0CKI(2) Pin 1 8 M U X 1 M U X 0 T0SE(1) T0CS(1) 0 Watchdog Timer 1 M U X Sync 2 Cycles TMR0 Reg PSA(1) 8-bit Prescaler 8 8-to-1 MUX PS<2:0>(1) PSA(1) WDT Enable bit 1 0 MUX PSA(1) WDT Time-Out Note 1: 2: T0CS, T0SE, PSA, PS<2:0> are bits in the OPTION register. T0CKI is shared with pin GP2 on the PIC10F220/222. DS41270E-page 28 © 2007 Microchip Technology Inc. PIC10F220/222 7.0 ANALOG-TO-DIGITAL (A/D) CONVERTER Note: The A/D Converter module consumes power when the ADON bit is set even when no channels are selected as analog inputs. For low-power applications, it is recommended that the ADON bit be cleared when the A/D Converter is not in use. The A/D converter allows conversion of an analog signal into an 8-bit digital signal. 7.1 Clock Divisors The A/D Converter has a single clock source setting, INTOSC/4. The A/D Converter requires 13 TAD periods to complete a conversion. The divisor values do not affect the number of TAD periods required to perform a conversion. The divisor values determine the length of the TAD period. Note: 7.2 7.5 The GO/DONE bit is used to determine the status of a conversion, to start a conversion and to manually halt a conversion in process. Setting the GO/DONE bit starts a conversion. When the conversion is complete, the A/ D Converter module clears the GO/DONE bit. A conversion can be terminated by manually clearing the GO/DONE bit while a conversion is in process. Manual termination of a conversion may result in a partially converted result in ADRES. Due to the fixed clock divisor, a conversion will complete in 13 CPU instruction cycles. Voltage Reference Due to the nature of the design, there is no external voltage reference allowed for the A/D Converter. The A/D Converter reference voltage will always be VDD. 7.3 The GO/DONE bit is cleared when the device enters Sleep, stopping the current conversion. The A/D Converter does not have a dedicated oscillator, it runs off of the system clock. Analog Mode Selection The GO/DONE bit cannot be set when ADON is clear. The ANS<1:0> bits are used to configure pins for analog input. Upon any Reset ANS<1:0> defaults to 11. This configures pins AN0 and AN1 as analog inputs. Pins configured as analog inputs are not available for digital output. Users should not change the ANS bits while a conversion is in process. ANS bits are active regardless of the condition of ADON. 7.4 7.6 The CHS bits are used to select the analog channel to be sampled by the A/D Converter. The CHS bits should not be changed during a conversion. To acquire an analog signal, the CHS selection must match one of the pin(s) selected by the ANS bits. The Internal Absolute Voltage Reference can be selected regardless of the condition of the ANS bits. All channel selection information will be lost when the device enters Sleep. Prior to Sleep Sleep This A/D Converter does not have a dedicated A/D Converter clock and therefore no conversion in Sleep is possible. If a conversion is underway and a Sleep command is executed, the GO/DONE and ADON bit will be cleared. This will stop any conversion in process and power-down the A/D Converter module to conserve power. Due to the nature of the conversion process, the ADRES may contain a partial conversion. At least 1 bit must have been converted prior to Sleep to have partial conversion data in ADRES. The CHS bits are reset to their default condition and CHS<1:0> = 11. A/D Converter Channel Selection TABLE 7-1: The GO/DONE bit For accurate conversions, TAD must meet the following: • 500 ns < TAD < 50 μs • TAD = 1/(FOSC/divisor) EFFECTS OF SLEEP AND WAKE ON ADCON0 ANS1 ANS0 CHS1 CHS0 GO/DONE ADON x x x x 0 0 Prior to Sleep x x x x 1 1 Entering Sleep Unchanged Unchanged 1 1 0 0 1 1 1 1 0 0 Wake © 2007 Microchip Technology Inc. DS41270E-page 29 PIC10F220/222 7.7 Analog Conversion Result Register 7.8 The ADRES register contains the results of the last conversion. These results are present during the sampling period of the next analog conversion process. After the sampling period is over, ADRES is cleared (= 0). A ‘leading one’ is then right shifted into the ADRES to serve as an internal conversion complete bit. As each bit weight, starting with the MSb, is converted, the leading one is shifted right and the converted bit is stuffed into ADRES. After a total of 9 right shifts of the ‘leading one’ have taken place, the conversion is complete; the ‘leading one’ has been shifted out and the GO/DONE bit is cleared. The function of the Internal Absolute Voltage Reference is to provide a constant voltage for conversion across the devices VDD supply range. The A/D Converter is ratiometric with the conversion reference voltage being VDD. Converting a constant voltage of 0.6V (typical) will result in a result based on the voltage applied to VDD of the device. The result of conversion of this reference across the VDD range can be approximated by: Conversion Result = 0.6V/(VDD/256) Note: If the GO/DONE bit is cleared in software during a conversion, the conversion stops. The data in ADRES is the partial conversion result. This data is valid for the bit weights that have been converted. The position of the ‘leading one’ determines the number of bits that have been converted. The bits that were not converted before the GO/DONE was cleared are unrecoverable. REGISTER 7-1: Internal Absolute Voltage Reference The actual value of the Absolute Voltage Reference varies with temperature and part-to-part variation. The conversion is also susceptible to analog noise on the VDD pin and noise generated by the sinking or sourcing of current on the I/O pins. ADCON0: A/D CONVERTER 0 REGISTER R/W-1 R/W-1 U-0 U-0 R/W-1 R/W-1 R/W-0 R/W-0 ANS1 ANS0 — — CHS1 CHS0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ANS1: ADC Analog Input Pin Select bit 1 = GP1/AN1 configured for analog input 0 = GP1/AN1 configured as digital I/O bit 6 ANS0: ADC Analog Input Pin Select bit(1), (2) 1 = GP0/AN0 configured as an analog input 0 = GP0/AN0 configured as digital I/O bit 5-4 Unimplemented: Read as ‘0’ bit 3-2 CHS<1:0>: ADC Channel Select bits(3) 00 = Channel 00 (GP0/AN0) 01 = Channel 01 (GP1/AN1) 1X = 0.6V absolute Voltage reference bit 1 GO/DONE: ADC Conversion Status bit(4) 1 = ADC conversion in progress. Setting this bit starts an ADC conversion cycle. This bit is automatically cleared by hardware when the ADC is done converting. 0 = ADC conversion completed/not in progress. Manually clearing this bit while a conversion is in process terminates the current conversion. bit 0 ADON: ADC Enable bit 1 = ADC module is operating 0 = ADC module is shut-off and consumes no power Note 1: 2: 3: 4: When the ANS bits are set, the channel(s) selected are automatically forced into analog mode regardless of the pin function previously defined. The ANS<1:0> bits are active regardless of the condition of ADON CHS<1:0> bits default to 11 after any Reset. If the ADON bit is clear, the GO/DONE bit cannot be set. DS41270E-page 30 © 2007 Microchip Technology Inc. PIC10F220/222 REGISTER 7-2: ADRES: ANALOG CONVERSION RESULT REGISTER R-X R-X R-X R-X R-X R-X R-X R-X ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown ADRES<7:0> © 2007 Microchip Technology Inc. DS41270E-page 31 PIC10F220/222 7.9 A/D Acquisition Requirements After the analog input channel is selected (or changed), an A/D acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 7-1 may be used. This equation assumes that 1/2 LSb error is used (256 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 7-1. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), see Figure 7-1. The maximum recommended impedance for analog sources is 10 kΩ. As the source impedance is decreased, the acquisition time may be decreased. EQUATION 7-1: ACQUISITION TIME EXAMPLE Assumptions: Temperature = 50°C and external impedance of 10 kΩ 5.0V VDD Tacq = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = TAMP + TC + TCOFF = 2 μs + TC + [(Temperature - 25°C)(0.05 μs/°C)] Solving for Tc: = CHOLD (RIC + RSS + RS) In(1/512) Tc = -25pF (l kΩ + 7 kΩ + 10 kΩ ) In(0.00196) = 2.81 μs Therefore: = 2 μs + 2.81 μs + [(50°C-25°C)(0.0 5μs/°C)] Tacq = 6.06 μs Note 1: The charge holding capacitor (CHOLD) is not discharged after each conversion. 2: The maximum recommended impedance for analog sources is 10 kΩ. This is required to meet the pin leakage specification. FIGURE 7-1: ANALOG INPUT MODULE VDD Rs VA ANx CPIN 5 pF VT = 0.6V VT = 0.6V RIC ≤ 1k Sampling Switch SS Rss I LEAKAGE ± 500 nA CHOLD = 25 pF VSS/VREF- Legend: CPIN VT ILEAKAGE RIC SS CHOLD DS41270E-page 32 = Input Capacitance = Threshold Voltage = Leakage current at the pin due to various junctions = Interconnect Resistance = Sampling Switch = Sample/Hold Capacitance 6V 5V VDD 4V 3V 2V RSS 5 6 7 8 9 10 11 Sampling Switch (kΩ) © 2007 Microchip Technology Inc. PIC10F220/222 8.0 SPECIAL FEATURES OF THE CPU What sets a microcontroller apart from other processors are special circuits that deal with the needs of realtime applications. The PIC10F220/222 microcontrollers have a host of such features intended to maximize system reliability, minimize cost through elimination of external components, provide power-saving operating modes and offer code protection. These features are: • Reset: - Power-on Reset (POR) - Device Reset Timer (DRT) - Watchdog Timer (WDT) - Wake-up from Sleep on pin change • Sleep • Code Protection • ID Locations • In-Circuit Serial Programming™ • Clock Out REGISTER 8-1: — — The PIC10F220/222 devices have a Watchdog Timer, which can be shut off only through Configuration bit WDTE. It runs off of its own RC oscillator for added reliability. When using DRT, there is an 1.125 ms (typical) delay only on VDD power-up. With this timer on-chip, most applications need no external Reset circuitry. The Sleep mode is designed to offer a very low current Power-Down mode. The user can wake-up from Sleep through a change on input pins or through a Watchdog Timer time-out. 8.1 Configuration Bits The PIC10F220/222 Configuration Words consist of 12 bits. Configuration bits can be programmed to select various device configurations. One bit is the Watchdog Timer enable bit, one bit is the MCLR enable bit and one bit is for code protection (see Register 8-1). CONFIG: CONFIGURATION WORD(1) — — — — — MCLRE CP WDTE MCPU bit 11 IOSCFS bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 11-5 Unimplemented: Read as ‘0’ bit 4 MCLRE: GP3/MCLR Pin Function Select bit 1 = GP3/MCLR pin function is MCLR 0 = GP3/MCLR pin function is digital I/O, MCLR internally tied to VDD bit 3 CP: Code Protection bit 1 = Code protection off 0 = Code protection on bit 2 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 1 MCPU: Master Clear Pull-up Enable bit(2) 1 = Pull-up disabled 0 = Pull-up enabled bit 0 IOSCFS: Internal Oscillator Frequency Select bit 1 = 8 MHz 0 = 4 MHz Note 1: Refer to the “PIC10F220/222 Memory Programming Specification” (DS41266), to determine how to access the Configuration Word. The Configuration Word is not user addressable during device operation. MCLRE must be a ‘1’ to enable this selection. 2: © 2007 Microchip Technology Inc. DS41270E-page 33 PIC10F220/222 8.2 Oscillator Configurations 8.2.1 OSCILLATOR TYPES The PIC10F220/222 devices are offered with internal oscillator mode only. • INTOSC: Internal 4/8 MHz Oscillator 8.2.2 INTERNAL 4/8 MHz OSCILLATOR The internal oscillator provides a 4/8 MHz (nominal) system clock (see Section 10.0 “Electrical Characteristics” for information on variation over voltage and temperature). In addition, a calibration instruction is programmed into the last address of memory, which contains the calibration value for the internal oscillator. This location is always uncode protected, regardless of the code-protect settings. This value is programmed as a MOVLW XX instruction where XX is the calibration value and is placed at the Reset vector. This will load the W register with the calibration value upon Reset and the PC will then roll over to the users program at address 0x000. The user then has the option of writing the value to the OSCCAL Register (05h) or ignoring it. 8.3 Reset The device differentiates between various kinds of Reset: • • • • • • Power-on Reset (POR) MCLR Reset during normal operation MCLR Reset during Sleep WDT Time-out Reset during normal operation WDT Time-out Reset during Sleep Wake-up from Sleep on pin change Some registers are not reset in any way, they are unknown on POR and unchanged in any other Reset. Most other registers are reset to “Reset state” on Power-on Reset (POR), MCLR, WDT or Wake-up on pin change Reset during normal operation. They are not affected by a WDT Reset during Sleep or MCLR Reset during Sleep, since these Resets are viewed as resumption of normal operation. The exceptions to this are TO, PD and GPWUF bits. They are set or cleared differently in different Reset situations. These bits are used in software to determine the nature of Reset. See Table 8-1 for a full description of Reset states of all registers. OSCCAL, when written to with the calibration value, will “trim” the internal oscillator to remove process variation from the oscillator frequency. Note: Erasing the device will also erase the preprogrammed internal calibration value for the internal oscillator. The calibration value must be read prior to erasing the part so it can be reprogrammed correctly later. TABLE 8-1: Register RESET CONDITIONS FOR REGISTERS – PIC10F220/222 Address Power-on Reset MCLR Reset, WDT Time-out, Wake-up On Pin Change, — qqqq qqqu(1) qqqq qqqu(1) INDF 00h xxxx xxxx uuuu uuuu TMR0 01h xxxx xxxx uuuu uuuu PC 02h 1111 1111 1111 1111 STATUS 03h 0--1 1xxx q00q quuu FSR 04h 111x xxxx 111u uuuu OSCCAL 05h 1111 1110 uuuu uuuu GPIO 06h ---- xxxx ---- uuuu ADCON0 07h 11-- 1100 11-- 1100 ADRES 08h xxxx xxxx uuuu uuuu OPTION — 1111 1111 1111 1111 TRIS — ---- 1111 ---- 1111 W Legend: Note 1: u = unchanged, x = unknown, – = unimplemented bit, read as ‘0’, q = value depends on condition. Bits <7:2> of W register contain oscillator calibration values due to MOVLW XX instruction at top of memory. DS41270E-page 34 © 2007 Microchip Technology Inc. PIC10F220/222 TABLE 8-2: RESET CONDITION FOR SPECIAL REGISTERS STATUS Addr: 03h PCL Addr: 02h Power-on Reset 0--1 1xxx 1111 1111 MCLR Reset during normal operation 0--u uuuu 1111 1111 MCLR Reset during Sleep 0--1 0uuu 1111 1111 WDT Reset during Sleep 0--0 0uuu 1111 1111 WDT Reset normal operation 0--0 uuuu 1111 1111 Wake-up from Sleep on pin change 1--1 0uuu 1111 1111 Legend: u = unchanged, x = unknown, – = unimplemented bit, read as ‘0’. 8.3.1 MCLR ENABLE This Configuration bit, when unprogrammed (left in the ‘1’ state), enables the external MCLR function. When programmed, the MCLR function is tied to the internal VDD and the pin is assigned to be a I/O. See Figure 8-1. FIGURE 8-1: MCLR SELECT GPWU Weak Pull-up GP3/MCLR/VPP Internal MCLR MCLRE 8.4 Power-on Reset (POR) The PIC10F220/222 devices incorporate an on-chip Power-on Reset (POR) circuitry, which provides an internal chip Reset for most power-up situations. The on-chip POR circuit holds the chip in Reset until VDD has reached a high enough level for proper operation. To take advantage of the internal POR, program the GP3/MCLR/VPP pin as MCLR and tie through a resistor to VDD, or program the pin as GP3. An internal weak pull-up resistor is implemented using a transistor (refer to Table 10-1 for the pull-up resistor ranges). This will eliminate external RC components usually needed to create a Power-on Reset. When the devices start normal operation (exit the Reset condition), device operating parameters (voltage, frequency, temperature,...) must be met to ensure operation. If these conditions are not met, the devices must be held in Reset until the operating parameters are met. The Power-on Reset circuit and the Device Reset Timer (see Section 8.5 “Device Reset Timer (DRT)”) circuit are closely related. On power-up, the Reset latch is set and the DRT is reset. The DRT timer begins counting once it detects MCLR to be high. After the time-out period, which is typically 1.125 ms, it will reset the Reset latch and thus end the on-chip Reset signal. A power-up example where MCLR is held low is shown in Figure 8-3. VDD is allowed to rise and stabilize before bringing MCLR high. The chip will actually come out of Reset TDRT msec after MCLR goes high. In Figure 8-4, the on-chip Power-on Reset feature is being used (MCLR and VDD are tied together or the pin is programmed to be GP3). The VDD is stable before the Start-up timer times out and there is no problem in getting a proper Reset. However, Figure 8-5 depicts a problem situation where VDD rises too slowly. The time between when the DRT senses that MCLR is high and when MCLR and VDD actually reach their full value, is too long. In this situation, when the start-up timer times out, VDD has not reached the VDD (min) value and the chip may not function correctly. For such situations, we recommend that external RC circuits be used to achieve longer POR delay times (Figure 8-4). Note: When the devices start normal operation (exit the Reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure proper operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. For additional information on design considerations related to the use of PIC10F220/222 devices with their short device Reset timer, refer to Application Notes AN522, “Power-Up Considerations” (DS00522) and AN607, “Power-up Trouble Shooting” (DS00607). A simplified block diagram of the on-chip Power-on Reset circuit is shown in Figure 8-2. © 2007 Microchip Technology Inc. DS41270E-page 35 PIC10F220/222 FIGURE 8-2: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT VDD Power-up Detect POR (Power-on Reset) GP3/MCLR/VPP MCLR Reset MCLRE WDT Reset WDT Time-out Pin Change Sleep S Q R Q Start-up Timer 1.125 ms CHIP Reset Wake-up on pin Change Reset FIGURE 8-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR PULLED LOW) VDD MCLR Internal POR TDRT DRT Time-out Internal Reset FIGURE 8-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE TIME VDD MCLR Internal POR TDRT DRT Time-out Internal Reset DS41270E-page 36 © 2007 Microchip Technology Inc. PIC10F220/222 FIGURE 8-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): SLOW VDD RISE TIME V1 VDD MCLR Internal POR TDRT DRT Time-out Internal Reset Note: When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final value. In this example, the chip will reset properly if, and only if, V1 ≥ VDD min. © 2007 Microchip Technology Inc. DS41270E-page 37 PIC10F220/222 8.5 Device Reset Timer (DRT) On the PIC10F220/222 devices, the DRT runs any time the device is powered up. The DRT operates on an internal oscillator. The processor is kept in Reset as long as the DRT is active. The DRT delay allows VDD to rise above VDD min. and for the oscillator to stabilize. The on-chip DRT keeps the devices in a Reset condition for approximately 1.125 ms after MCLR has reached a logic high (VIH MCLR) level. Programming GP3/MCLR/VPP as MCLR and using an external RC network connected to the MCLR input is not required in most cases. This allows savings in cost-sensitive and/ or space restricted applications, as well as allowing the use of the GP3/MCLR/VPP pin as a general purpose input. The Device Reset Time delays will vary from chip-tochip due to VDD, temperature and process variation. See AC parameters for details. Reset sources are POR, MCLR, WDT time-out and wake-up on pin change. See Section 8.9.2 “Wake-up from Sleep”, Notes 1, 2 and 3. TABLE 8-3: WDT PERIOD The WDT has a nominal time-out period of 18 ms, (with no prescaler). If a longer time-out period is desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT (under software control) by writing to the OPTION register. Thus, a time-out period of a nominal 2.3 seconds can be realized. These periods vary with temperature, VDD and part-to-part process variations (see DC specs). Under worst-case conditions (VDD = Min., Temperature = Max., max. WDT prescaler), it may take several seconds before a WDT time-out occurs. 8.6.2 WDT PROGRAMMING CONSIDERATIONS The CLRWDT instruction clears the WDT and the postscaler, if assigned to the WDT, and prevents it from timing out and generating a device Reset. The SLEEP instruction resets the WDT and the postscaler, if assigned to the WDT. This gives the maximum Sleep time before a WDT wake-up Reset. DRT (DEVICE RESET TIMER PERIOD) POR Reset Subsequent Resets 1.125 ms (typical) 10 μs (typical) 8.6 8.6.1 Watchdog Timer (WDT) The Watchdog Timer (WDT) is a free running on-chip RC oscillator, which does not require any external components. This RC oscillator is separate from the internal 4/8 MHz oscillator. This means that the WDT will run even if the main processor clock has been stopped, for example, by execution of a SLEEP instruction. During normal operation or Sleep, a WDT Reset or wake-up Reset, generates a device Reset. The TO bit (STATUS<4>) will be cleared upon a Watchdog Timer Reset. The WDT can be permanently disabled by programming the configuration WDTE as a ‘0’ (see Section 8.1 “Configuration Bits”). Refer to the PIC10F220/222 Programming Specification to determine how to access the Configuration Word. DS41270E-page 38 © 2007 Microchip Technology Inc. PIC10F220/222 FIGURE 8-6: WATCHDOG TIMER BLOCK DIAGRAM From Timer0 Clock Source (Figure 6-5) 0 M U X 1 Watchdog Timer Postscaler 3 8-to-1 MUX PS<2:0> PSA WDT Enable Configuration Bit To Timer0 (Figure 6-4) 0 1 MUX PSA WDT Time-out Note 1: TABLE 8-4: Address N/A T0CS, T0SE, PSA, PS<2:0> are bits in the OPTION register. SUMMARY OF REGISTERS ASSOCIATED WITH THE WATCHDOG TIMER Name OPTION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 GPWU GPPU T0CS T0SE PSA PS2 PS1 PS0 Value on Power-On Reset Value on All Other Resets 1111 1111 1111 1111 Legend: Shaded boxes = Not used by Watchdog Timer, – = unimplemented, read as ‘0’, u = unchanged. 8.7 Time-out Sequence, Power-down and Wake-up from Sleep Status Bits (TO/PD/GPWUF/CWUF) The TO, PD and GPWUF bits in the STATUS register can be tested to determine if a Reset condition has been caused by a Power-up condition, a MCLR, Watchdog Timer (WDT) Reset or wake-up on pin change. TABLE 8-5: TO/PD/GPWUF STATUS AFTER RESET GPWUF TO PD Reset Caused By 0 0 0 WDT wake-up from Sleep 0 0 u WDT time-out (not from Sleep) 0 1 0 MCLR wake-up from Sleep 0 1 1 Power-up 0 u u MCLR not during Sleep 1 1 0 Wake-up from Sleep on pin change Legend: u = unchanged, x = unknown, – = unimplemented bit, read as ‘0’, q = value depends on condition. Note 1: The TO, PD and GPWUF bits maintain their status (u) until a Reset occurs. A low-pulse on the MCLR input does not change the TO, PD or GPWUF Status bits. © 2007 Microchip Technology Inc. DS41270E-page 39 PIC10F220/222 8.8 FIGURE 8-9: Reset on Brown-out A Brown-out is a condition where device power (VDD) dips below its minimum value, but not to zero, and then recovers. The device should be reset in the event of a Brown-out. BROWN-OUT PROTECTION CIRCUIT 3 VDD MCP809 VSS To reset PIC10F220/222 devices when a Brown-out occurs, external Brown-out protection circuits may be built, as shown in Figure 8-7 and Figure 8-8. Bypass Capacitor VDD VDD RST MCLR(2) PIC10F22X FIGURE 8-7: BROWN-OUT PROTECTION CIRCUIT 1 Note 1: VDD VDD 33k 10k Q1 MCLR(2) 2: PIC10F22X 8.9 40k(1) This Brown-out Protection circuit employs Microchip Technology’s MCP809 microcontroller supervisor. There are 7 different trip point selections to accommodate 5V to 3V systems. Pin must be configured as MCLR. Power-down Mode (Sleep) A device may be powered down (Sleep) and later powered up (wake-up from Sleep). Note 1: 2: This circuit will activate Reset when VDD goes below Vz + 0.7V (where Vz = Zener voltage). Pin must be configured as MCLR. FIGURE 8-8: BROWN-OUT PROTECTION CIRCUIT 2 VDD VDD R1 Q1 R2 Note 1: PIC10F22X 40k(1) SLEEP The Power-Down mode is entered by executing a SLEEP instruction. If enabled, the Watchdog Timer will be cleared but keeps running, the TO bit (STATUS<4>) is set, the PD bit (STATUS<3>) is cleared and the oscillator driver is turned off. The I/O ports maintain the status they had before the SLEEP instruction was executed (driving high, driving low or high-impedance). Note: A Reset generated by a WDT time-out does not drive the MCLR pin low. For lowest current consumption while powered down, the T0CKI input should be at VDD or VSS and the GP3/ MCLR/VPP pin must be at a logic high level if MCLR is enabled. This brown-out circuit is less expensive, although less accurate. Transistor Q1 turns off when VDD is below a certain level such that: R1 VDD • 2: MCLR(2) 8.9.1 = 0.7V R1 + R2 Pin must be configured as MCLR. DS41270E-page 40 © 2007 Microchip Technology Inc. PIC10F220/222 8.9.2 WAKE-UP FROM SLEEP The device can wake-up from Sleep through one of the following events: 1. 2. 3. An external Reset input on GP3/MCLR/VPP pin, when configured as MCLR. A Watchdog Timer Time-out Reset (if WDT was enabled). A change on input pin GP0, GP1 or GP3 when wake-up on change is enabled. These events cause a device Reset. The TO, PD GPWUF bits can be used to determine the cause of a device Reset. The TO bit is cleared if a WDT time-out occurred (and caused wake-up). The PD bit, which is set on power-up, is cleared when SLEEP is invoked. The GPWUF bit indicates a change in state while in Sleep at pins GP0, GP1 or GP3 (since the last file or bit operation on GP port). Caution: Right before entering Sleep, read the input pins. When in Sleep, wake up occurs when the values at the pins change from the state they were in at the last reading. If a wake-up on change occurs and the pins are not read before re-entering Sleep, a wake-up will occur immediately even if no pins change while in Sleep mode. Note: 8.10 In-Circuit Serial Programming™ The PIC10F220/222 microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware, or a custom firmware, to be programmed. The devices are placed into a Program/Verify mode by holding the GP1 and GP0 pins low while raising the MCLR (VPP) pin from VIL to VIHH (see programming specification). GP1 becomes the programming clock and GP0 becomes the programming data. Both GP1 and GP0 are Schmitt Trigger inputs in this mode. After Reset, a 6-bit command is then supplied to the device. Depending on the command, 16 bits of program data are then supplied to or from the device, depending if the command was a Load or a Read. For complete details of serial programming, please refer to the PIC10F220/222 Programming Specifications. A typical In-Circuit Serial Programming connection is shown in Figure 8-10. FIGURE 8-10: The WDT is cleared when the device wakes from Sleep, regardless of the wakeup source. Program Verification/Code Protection If the Code Protection bit has not been programmed, the on-chip program memory can be read out for verification purposes. The first 64 locations and the last location (Reset Vector) can be read, regardless of the code protection bit setting. 8.11 8.12 External Connector Signals TYPICAL IN-CIRCUIT SERIAL PROGRAMMING™ CONNECTION To Normal Connections PIC10F22X +5V VDD 0V VSS VPP MCLR/VPP CLK GP1 Data I/O GP0 ID Locations Four memory locations are designated as ID locations where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution, but are readable and writable during program/verify. VDD To Normal Connections Use only the lower 4 bits of the ID locations and always program the upper 8 bits as ‘1’s. © 2007 Microchip Technology Inc. DS41270E-page 41 PIC10F220/222 NOTES: DS41270E-page 42 © 2007 Microchip Technology Inc. PIC10F220/222 9.0 INSTRUCTION SET SUMMARY The PIC16 instruction set is highly orthogonal and is comprised of three basic categories. • Byte-oriented operations • Bit-oriented operations • Literal and control operations Each PIC16 instruction is a 12-bit word divided into an opcode, which specifies the instruction type, and one or more operands which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 9-1, while the various opcode fields are summarized in Table 9-1. For byte-oriented instructions, ‘f’ represents a file register designator and ‘d’ represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in the file register specified in the instruction. For bit-oriented instructions, ‘b’ represents a bit field designator which selects the number of the bit affected by the operation, while ‘f’ represents the number of the file in which the bit is located. For literal and control operations, ‘k’ represents an 8 or 9-bit constant or literal value. TABLE 9-1: Description Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1) The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0 (store result in W) d = 1 (store result in file register ‘f’) Default is d = 1 label TOS PC WDT TO GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 11 6 OPCODE 5 d 4 0 f (FILE #) d = 0 for destination W d = 1 for destination f f = 5-bit file register address Bit-oriented file register operations 11 OPCODE 8 7 5 4 b (BIT #) 0 f (FILE #) b = 3-bit address f = 5-bit file register address Literal and control operations (except GOTO) 11 8 7 OPCODE 0 k (literal) k = 8-bit immediate value Literal and control operations – GOTO instruction 11 9 8 OPCODE 0 k (literal) k = 9-bit immediate value Watchdog Timer counter Time-out bit Power-down bit [ ] Options ( ) Contents italics FIGURE 9-1: Top-of-Stack Destination, either the W register or the specified register file location ∈ where ‘h’ signifies a hexadecimal digit. Program Counter dest < > ‘0xhhh’ Label name PD → Figure 9-1 shows the three general formats that the instructions can have. All examples in the figure use the following format to represent a hexadecimal number: OPCODE FIELD DESCRIPTIONS Field f All instructions are executed within a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of an instruction. In this case, the execution takes two instruction cycles. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 μs. If a conditional test is true or the program counter is changed as a result of an instruction, the instruction execution time is 2 μs. Assigned to Register bit field In the set of User defined term (font is courier) © 2007 Microchip Technology Inc. DS41270E-page 43 PIC10F220/222 TABLE 9-2: INSTRUCTION SET SUMMARY Mnemonic, Operands ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF BCF BSF BTFSC BTFSS ANDLW CALL CLRWDT GOTO IORLW MOVLW OPTION RETLW SLEEP TRIS XORLW Note 1: 2: 3: 4: 12-Bit Opcode Description Cycles MSb LSb Status Notes Affected f, d f, d f – f, d f, d f, d f, d f, d f, d f, d f – f, d f, d f, d f, d f, d 0001 11df ffff C,DC,Z Add W and f 1 1,2,4 0001 01df ffff AND W with f 1 Z 2,4 0000 011f ffff Clear f 1 Z 4 0000 0100 0000 Clear W 1 Z 0010 01df ffff Complement f 1 Z 0000 11df ffff Decrement f 1 Z 2,4 0010 11df ffff Decrement f, Skip if 0 1(2) None 2,4 1 0010 10df ffff Increment f Z 2,4 1(2) 0011 11df ffff Increment f, Skip if 0 None 2,4 1 0001 00df ffff Inclusive OR W with f Z 2,4 1 0010 00df ffff Move f Z 2,4 1 0000 001f ffff Move W to f None 1,4 1 0000 0000 0000 No Operation None 1 0011 01df ffff Rotate left f through Carry C 2,4 1 0011 00df ffff Rotate right f through Carry C 2,4 1 0000 10df ffff C,DC,Z Subtract W from f 1,2,4 1 0011 10df ffff Swap f None 2,4 1 0001 10df ffff Exclusive OR W with f Z 2,4 BIT-ORIENTED FILE REGISTER OPERATIONS 0100 bbbf ffff None 2,4 1 Bit Clear f f, b 0101 bbbf ffff None 2,4 1 Bit Set f f, b 0110 bbbf ffff None Bit Test f, Skip if Clear 1(2) f, b 1(2) 0111 bbbf ffff None f, b Bit Test f, Skip if Set LITERAL AND CONTROL OPERATIONS k AND literal with W 1 1110 kkkk kkkk Z 1 k Call subroutine 2 1001 kkkk kkkk None k Clear Watchdog Timer 1 0000 0000 0100 TO, PD None k Unconditional branch 2 101k kkkk kkkk Z k Inclusive OR Literal with W 1 1101 kkkk kkkk None k Move Literal to W 1 1100 kkkk kkkk None – Load OPTION register 1 0000 0000 0010 None k Return, place Literal in W 2 1000 kkkk kkkk – Go into standby mode 1 0000 0000 0011 TO, PD None 3 f Load TRIS register 1 0000 0000 0fff Z k Exclusive OR Literal to W 1 1111 kkkk kkkk The 9th bit of the program counter will be forced to a ‘0’ by any instruction that writes to the PC except for GOTO. See Section 4.7 “Program Counter”. When an I/O register is modified as a function of itself (e.g., MOVF PORTB, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. The instruction TRIS f, where f = 6 causes the contents of the W register to be written to the tri-state latches of PORTB. A ‘1’ forces the pin to a high-impedance state and disables the output buffers. If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared (if assigned to TMR0). DS41270E-page 44 © 2007 Microchip Technology Inc. PIC10F220/222 9.1 Instruction Description ADDWF Add W and f BCF Bit Clear f Syntax: [ label ] ADDWF Syntax: [ label ] BCF Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: 0 ≤ f ≤ 31 0≤b≤7 Operation: (W) + (f) → (destination) Operation: 0 → (f<b>) Status Affected: C, DC, Z Status Affected: None Description: Description: Bit ‘b’ in register ‘f’ is cleared. BSF Bit Set f Syntax: [ label ] BSF Operands: 0 ≤ f ≤ 31 0≤b≤7 Status Affected: Z Operation: 1 → (f<b>) Description: The contents of the W register are AND’ed with the eight-bit literal ‘k’. The result is placed in the W register. Status Affected: None ANDWF AND W with f BTFSC Bit Test f, Skip if Clear Syntax: [ label ] ANDWF Syntax: [ label ] BTFSC f,b Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: 0 ≤ f ≤ 31 0≤b≤7 Operation: (W) AND (f) → (destination) Operation: skip if (f<b>) = 0 Status Affected: Z Status Affected: None Description: Description: If bit ‘b’ in register ‘f’ is ‘0’, then the next instruction is skipped. If bit ‘b’ is ‘0’, then the next instruction fetched during the current instruction execution is discarded, and a NOP is executed instead, making this a two-cycle instruction. ANDLW Syntax: f,d Add the contents of the W register and register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. AND literal with W [ label ] ANDLW k Operands: 0 ≤ k ≤ 255 Operation: (W).AND. (k) → (W) f,d The contents of the W register are AND’ed with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. © 2007 Microchip Technology Inc. f,b f,b Description: Bit ‘b’ in register ‘f’ is set. DS41270E-page 45 PIC10F220/222 BTFSS Bit Test f, Skip if Set CLRW Syntax: [ label ] BTFSS f,b Syntax: [ label ] CLRW 0 ≤ f ≤ 31 0≤b<7 Operands: None Operation: 00h → (W); 1→Z Operands: Clear W Operation: skip if (f<b>) = 1 Status Affected: None Status Affected: Z Description: If bit ‘b’ in register ‘f’ is ‘1’, then the next instruction is skipped. If bit ‘b’ is ‘1’, then the next instruction fetched during the current instruction execution, is discarded and a NOP is executed instead, making this a two-cycle instruction. Description: The W register is cleared. Zero bit (Z) is set. CALL Subroutine Call CLRWDT Clear Watchdog Timer Syntax: [ label ] CALL k Syntax: [ label ] CLRWDT k Operands: 0 ≤ k ≤ 255 Operands: None Operation: (PC) + 1→ Top of Stack; k → PC<7:0>; (Status<6:5>) → PC<10:9>; 0 → PC<8> Operation: 00h → WDT; 0 → WDT prescaler (if assigned); 1 → TO; 1 → PD Status Affected: None Status Affected: TO, PD Description: Subroutine call. First, return address (PC + 1) is pushed onto the stack. The eight-bit immediate address is loaded into PC bits <7:0>. The upper bits PC<10:9> are loaded from STATUS<6:5>, PC<8> is cleared. CALL is a twocycle instruction. Description: The CLRWDT instruction resets the WDT. It also resets the prescaler, if the prescaler is assigned to the WDT and not Timer0. Status bits TO and PD are set. CLRF Clear f COMF Complement f Syntax: [ label ] CLRF Syntax: [ label ] COMF Operands: 0 ≤ f ≤ 31 Operands: Operation: 00h → (f); 1→Z 0 ≤ f ≤ 31 d ∈ [0,1] Operation: (f) → (dest) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. Description: The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DS41270E-page 46 f f,d © 2007 Microchip Technology Inc. PIC10F220/222 DECF Decrement f INCF Syntax: [ label ] DECF f,d Syntax: [ label ] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operation: (f) – 1 → (dest) Operation: (f) + 1 → (dest) Status Affected: Z Status Affected: Z Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operation: (f) – 1 → d; Operation: (f) + 1 → (dest), skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead making it a two-cycle instruction. Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘0’, then the next instruction, which is already fetched, is discarded and a NOP is executed instead making it a twocycle instruction. GOTO Unconditional Branch IORLW Inclusive OR literal with W Syntax: [ label ] Syntax: [ label ] Operands: 0 ≤ k ≤ 511 Operands: 0 ≤ k ≤ 255 Operation: k → PC<8:0>; STATUS<6:5> → PC<10:9> Operation: (W) .OR. (k) → (W) Status Affected: Z Status Affected: None Description: Description: GOTO is an unconditional branch. The 9-bit immediate value is loaded into PC bits <8:0>. The upper bits of PC are loaded from STATUS<6:5>. GOTO is a twocycle instruction. The contents of the W register are OR’ed with the eight-bit literal ‘k’. The result is placed in the W register. skip if result = 0 GOTO k © 2007 Microchip Technology Inc. Increment f INCF f,d INCFSZ f,d IORLW k DS41270E-page 47 PIC10F220/222 IORWF Inclusive OR W with f MOVWF Syntax: [ label ] Syntax: [ label ] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: 0 ≤ f ≤ 31 Operation: (W).OR. (f) → (dest) (W) → (f) Operation: Status Affected: None Status Affected: Z Description: Description: Inclusive OR the W register with register ‘f’. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. Move data from the W register to register ‘f’. MOVF Move f NOP No Operation Syntax: [ label ] Syntax: [ label ] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: None Operation: No operation IORWF f,d MOVF f,d Move W to f MOVWF f NOP Operation: (f) → (dest) Status Affected: None Status Affected: Z Description: No operation. Description: The contents of register ‘f’ are moved to destination ‘d’. If ‘d’ is ‘0’, destination is the W register. If ‘d’ is ‘1’, the destination is file register ‘f’. ‘d’ = 1 is useful as a test of a file register, since status flag Z is affected. MOVLW Move Literal to W OPTION Load OPTION Register Syntax: [ label ] Syntax: [ label ] Operands: 0 ≤ k ≤ 255 Operands: None Operation: k → (W) Operation: (W) → OPTION Status Affected: None Status Affected: None Description: The content of the W register is loaded into the OPTION register. Description: DS41270E-page 48 MOVLW k The eight-bit literal ‘k’ is loaded into the W register. The “don’t cares” will assembled as ‘0’s. OPTION © 2007 Microchip Technology Inc. PIC10F220/222 RETLW Return with Literal in W SLEEP Enter SLEEP Mode Syntax: [ label ] Syntax: [label] Operands: 0 ≤ k ≤ 255 Operands: None Operation: k → (W); TOS → PC Operation: 00h → WDT; 0 → WDT prescaler; 1 → TO; 0 → PD RETLW k SLEEP Status Affected: None Description: The W register is loaded with the eight-bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. Status Affected: TO, PD, RBWUF Description: Time-out Status bit (TO) is set. The Power-down Status bit (PD) is cleared. RBWUF is unaffected. The WDT and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. See section on Sleep for more details. RLF Rotate Left f through Carry SUBWF Subtract W from f Syntax: [ label ] Syntax: [label] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operation: See description below Operation: (f) – (W) → (dest) Status Affected: C Status Affected: C, DC, Z Description: The contents of register ‘f’ are rotated one bit to the left through the Carry Flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Description: Subtract (2’s complement method) the W register from register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. RLF f,d SUBWF f,d register ‘f’ C RRF Rotate Right f through Carry SWAPF Swap Nibbles in f Syntax: [ label ] Syntax: [label] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operation: See description below Operation: Status Affected: C (f<3:0>) → (dest<7:4>); (f<7:4>) → (dest<3:0>) Description: The contents of register ‘f’ are rotated one bit to the right through the Carry Flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. Status Affected: None Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. RRF f,d C © 2007 Microchip Technology Inc. SWAPF f,d register ‘f’ DS41270E-page 49 PIC10F220/222 TRIS Load TRIS Register Syntax: [ label ] TRIS f Operands: f=6 Operation: (W) → TRIS register f Status Affected: None Description: TRIS register ‘f’ (f = 6 or 7) is loaded with the contents of the W register XORLW Exclusive OR literal with W Syntax: [label] Operands: 0 ≤ k ≤ 255 Operation: (W) .XOR. k → (W) Status Affected: Z Description: The contents of the W register are XOR’ed with the eight-bit literal ‘k’. The result is placed in the W register. XORLW k XORWF Exclusive OR W with f Syntax: [ label ] XORWF Operands: 0 ≤ f ≤ 31 d ∈ [0,1] Operation: (W) .XOR. (f) → (dest) Status Affected: Z Description: Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DS41270E-page 50 f,d © 2007 Microchip Technology Inc. PIC10F220/222 10.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) Ambient temperature under bias.............................................................................................................-40°C to +125°C Storage temperature ...............................................................................................................................-65°C to +150°C Voltage on VDD with respect to VSS ..................................................................................................................0 to +6.5V Voltage on MCLR with respect to VSS.............................................................................................................0 to +13.5V Voltage on all other pins with respect to VSS .................................................................................. -0.3V to (VDD + 0.3V) Total power dissipation(1) .....................................................................................................................................800 mW Max. current out of VSS pin .....................................................................................................................................80 mA Max. current into VDD pin ........................................................................................................................................80 mA Input clamp current, IIK (VI < 0 or VI > VDD)...................................................................................................................... ±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) .............................................................................................................. ±20 mA Max. output current sunk by any I/O pin .................................................................................................................25 mA Max. output current sourced by any I/O pin ............................................................................................................25 mA Max. output current sourced by I/O port .................................................................................................................75 mA Max. output current sunk by I/O port ......................................................................................................................75 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – ∑ IOH} + ∑ {(VDD – VOH) x IOH} .. + ∑(VOL x IOL) †NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. © 2007 Microchip Technology Inc. DS41270E-page 51 PIC10F220/222 VOLTAGE-FREQUENCY GRAPH, -40°C ≤ TA ≤ +125°C FIGURE 10-1: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 8 10 20 25 Frequency (MHz) DS41270E-page 52 © 2007 Microchip Technology Inc. PIC10F220/222 10.1 DC Characteristics: PIC10F220/222 (Industrial) Standard Operating Conditions (unless otherwise specified) Operating Temperature -40×C ≤ TA ≤ +85°C (industrial) DC CHARACTERISTICS Param No. Sym Characteristic Min Typ(1) Max Units Conditions D001 VDD Supply Voltage 2.0 5.5 V See Figure 10-1 D002 VDR RAM Data Retention Voltage(2) 1.5* — — V Device in Sleep mode D003 VPOR VDD Start Voltage to ensure Power-on Reset — Vss — V D004 SVDD VDD Rise Rate to ensure Power-on Reset 0.05* — — V/ms — — — — 175 0.625 250 0.800 275 1.1 400 1.5 — — 0.1 1 — — 1.0 7 IDD Supply Current(3) D010 IPD 2: 3: 4: 1.2 2.4 μA μA VDD = 2.0V VDD = 5.0V 3 16 μA μA VDD = 2.0V VDD = 5.0V μA WDT Current(4) D022 * Note 1: mA VDD = 2.0V, Fosc = 4 MHz VDD = 5.0V, Fosc = 4 MHz VDD = 2.0V, Fosc = 8 MHz VDD = 5.0V, Fosc = 8 MHz Power-down Current(4) D020 IWDT μA mA These parameters are characterized but not tested. Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance only and is not tested. This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, bus rate, internal code execution pattern and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: All I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in Sleep mode. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS. The peripheral current is the sum of the base IPD and the additional current consumed when the peripheral is enabled. © 2007 Microchip Technology Inc. DS41270E-page 53 PIC10F220/222 10.2 DC Characteristics: PIC10F220/222 (Extended) Standard Operating Conditions (unless otherwise specified) Operating Temperature -40×C £ TA £ +125×C (extended) DC CHARACTERISTICS Param No. Sym Characteristic Min Typ(1) Max Units Conditions D001 VDD Supply Voltage 2.0 5.5 V See Figure 10-1 D002 VDR RAM Data Retention Voltage(2) 1.5* — V Device in Sleep mode D003 VPOR VDD Start Voltage to ensure Power-on Reset V IDD D022 * Note 1: 2: 3: 4: — — — — — 175 0.625 250 0.800 275 1.1 400 1.5 — — 0.1 1 — — 1.0 7 μA mA VDD = 2.0V, Fosc = 4 MHz VDD = 5.0V, Fosc = 4 MHz VDD = 2.0V, Fosc = 8 MHz VDD = 5.0V, Fosc = 8 MHz 9 15 μA μA VDD = 2.0V VDD = 5.0V 18 22 μA μA VDD = 2.0V VDD = 5.0V mA μA Power-down Current(4) D020 IWDT Vss Supply Current(3) D010 IPD — WDT Current(4) These parameters are characterized but not tested. Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance only and is not tested. This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, bus rate, internal code execution pattern and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: All I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in Sleep mode. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS. The peripheral current is the sum of the base IPD and the additional current consumed when the peripheral is enabled. DS41270E-page 54 © 2007 Microchip Technology Inc. PIC10F220/222 10.3 DC Characteristics: PIC10F220/222 (Industrial, Extended) DC CHARACTERISTICS Param No. Sym VIL Characteristic Standard Operating Conditions (unless otherwise specified) Operating temperature -40°C ≤ TA ≤ +85°C (industrial) -40°C ≤ TA ≤ +125°C (extended) Operating voltage VDD range as described in DC specification Min Typ† Max Units Conditions Input Low Voltage I/O ports: D030 with TTL buffer D030A D031 with Schmitt Trigger buffer MCLR, T0CKI D032 VIH Vss — 0.8 V For all 4.5 ≤ VDD ≤ 5.5V Vss — 0.15 VDD V Otherwise Vss — 0.2 VDD V Vss — 0.2 VDD V 2.0 — VDD V 4.5 ≤ VDD ≤ 5.5V 0.25 VDD + 0.8 — VDD V Otherwise 0.8VDD — VDD V For entire VDD range 0.8VDD — VDD V 50 250 400 μA VDD = 5V, VPIN = VSS Input High Voltage I/O ports: D040 with TTL buffer D040A D041 with Schmitt Trigger buffer MCLR, T0CKI D042 D070 IPUR IIL GPIO weak pull-up current — Input Leakage Current(1) D060 I/O ports — ±0.1 ±1 μA Vss ≤ VPIN ≤ VDD, Pin at high-impedance D061 GP3/MCLR(2) — ±0.7 ±5 μA Vss ≤ VPIN ≤ VDD — — 0.6 V IOL = 8.5 mA, VDD = 4.5V, -40°C to +85°C — — 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40°C to +125°C VDD – 0.7 — — V IOH = -3.0 mA, VDD = 4.5V, -40°C to +85°C VDD – 0.7 — — V IOH = -2.5 mA, VDD = 4.5V, -40°C to +125°C — 50* pF Output Low Voltage D080 I/O ports D080A Output High Voltage I/O ports(2) D090 D090A Capacitive Loading Specs on Output Pins D101 All I/O pins † * Note 1: 2: — Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. These parameters are for design guidance only and are not tested. Negative current is defined as coming out of the pin. This specification applies when GP3/MCLR is configured as an input with pull-up disabled. The leakage current of the MCLR circuit is higher than the standard I/O logic. © 2007 Microchip Technology Inc. DS41270E-page 55 PIC10F220/222 TABLE 10-1: VDD (Volts) GP0/GP1 2.0 5.5 GP3 2.0 5.5 DS41270E-page 56 PULL-UP RESISTOR RANGES Temperature (°C) Min Typ Max Units -40 25 85 125 -40 25 85 125 73K 73K 82K 86K 15K 15K 19K 23K 105K 113K 123K 132k 21K 22K 26k 29K 186K 187K 190K 190K 33K 34K 35K 35K Ω Ω Ω Ω Ω Ω Ω Ω -40 25 85 125 -40 25 85 125 63K 77K 82K 86K 16K 16K 24K 26K 81K 93K 96k 100K 20k 21K 25k 27K 96K 116K 116K 119K 22K 23K 28K 29K Ω Ω Ω Ω Ω Ω Ω Ω © 2007 Microchip Technology Inc. PIC10F220/222 10.4 Timing Parameter Symbology and Load Conditions The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase subscripts (pp) and their meanings: pp 2 to mc MCLR ck CLKOUT osc Oscillator cy Cycle time os OSC1 drt Device Reset Timer t0 T0CKI io I/O port wdt Watchdog Timer Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (high-impedance) V Valid L Low Z High-impedance FIGURE 10-2: LOAD CONDITIONS Legend: CL pin CL = 50 pF for all pins VSS TABLE 10-2: CALIBRATED INTERNAL RC FREQUENCIES – PIC10F220/222 AC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40°C ≤ TA ≤ +85°C (industrial), -40°C ≤ TA ≤ +125°C (extended) Operating Voltage VDD range is described in Section 10.1 “DC Characteristics: PIC10F220/222 (Industrial)”. Param No. Freq. Min Tolerance F10 Sym FOSC Characteristic Internal Calibrated INTOSC Frequency(1, 2, 3) Typ† Max Units Conditions ± 1% 3.96 4.00 4.04 MHz VDD=3.5V @ 25°C ± 2% 3.92 4.00 4.08 MHz 2.5V ≤ VDD ≤ 5.5V 0°C ≤ TA ≤ +85°C (industrial) ± 5% 3.80 4.00 4.20 MHz 2.0V ≤ VDD ≤ 5.5V -40°C ≤ TA ≤ +85°C (industrial) -40°C ≤ TA ≤ +125°C (extended) † Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 μF and 0.01 μF values in parallel are recommended. 2: Under stable VDD conditions. 3: Frequency values in this table are doubled when the 8 MHz INTOSC option is selected. © 2007 Microchip Technology Inc. DS41270E-page 57 PIC10F220/222 FIGURE 10-3: RESET, WATCHDOG TIMER AND DEVICE RESET TIMER TIMING VDD MCLR 30 Internal POR 32 32 32 DRT Timeout(2) Internal Reset Watchdog Timer Reset 31 34 34 I/O pin(1) Note 1: 2: I/O pins must be taken out of High-impedance mode by enabling the output drivers in software. Runs on POR Reset only. TABLE 10-3: RESET, WATCHDOG TIMER AND DEVICE RESET TIMER – PIC10F220/222 Standard Operating Conditions (unless otherwise specified) Operating Temperature -40°C ≤ TA ≤ +85°C (industrial) -40°C ≤ TA ≤ +125°C (extended) Operating Voltage VDD range is described in Section 10.1 “DC Characteristics: PIC10F220/222 (Industrial)” AC CHARACTERISTICS Param No. Sym Characteristic Min Typ(1) Max Units Conditions 30 TMCL MCLR Pulse Width (low) 2* 5* — — — — μs μs VDD = 5V, -40°C to +85°C VDD = 5.0V 31 TWDT Watchdog Timer Time-out Period (no prescaler) 10 10 18 18 29 31 ms ms VDD = 5.0V (Industrial) VDD = 5.0V (Extended) 32 TDRT* Device Reset Timer Period (standard) 0.600 0.600 1.125 1.125 1.85 1.95 ms ms VDD = 5.0V (Industrial) VDD = 5.0V (Extended) 34 TIOZ I/O High-impedance from MCLR low — — 2* μs * Note 1: These parameters are characterized but not tested. Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. DS41270E-page 58 © 2007 Microchip Technology Inc. PIC10F220/222 FIGURE 10-4: TIMER0 CLOCK TIMINGS T0CKI 40 41 42 TABLE 10-4: TIMER0 CLOCK REQUIREMENTS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40°C ≤ TA ≤ +85°C (industrial) -40°C ≤ TA ≤ +125°C (extended) AC CHARACTERISTICS Param Sym No. Characteristic 40 Tt0H T0CKI High Pulse Width 41 Tt0L T0CKI Low Pulse Width 42 Tt0P T0CKI Period * Note 1: No Prescaler With Prescaler No Prescaler With Prescaler Min 0.5 TCY + 20* 10* 0.5 TCY + 20* 10* 20 or TCY + 40* N Typ(1) Max Units — — — — — — — — — — ns ns ns ns ns Conditions Whichever is greater. N = Prescale Value (1, 2, 4,..., 256) These parameters are characterized but not tested. Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. © 2007 Microchip Technology Inc. DS41270E-page 59 PIC10F220/222 TABLE 10-5: A/D CONVERTER CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C Param Sym No. Characteristic Min Typ† Max Units 8 bits bit Conditions A01 NR Resolution — — A03 EIL Integral Error — — ±1.5 LSb A04 EDL Differential Error — — -1 < EDL ≤ + 1.5 LSb A05 EFS Full-scale Range 2.0* — 5.5* V A06 EOFF Offset Error — — ±1.5 LSb A07 EGN Gain Error — — ±1.5 LSb A10 — Monotonicity — guaranteed(1) — — A25 VAIN Analog Input Voltage VSS — VDD V A30 ZAIN Recommended Impedence of Analog Voltage Source — — 10 kΩ A31* ΔIAD A/D Conversion Current(2) — 120 150 μA 2.0V — 200 250 μA 5.0V VSS ≤ VAIN ≤ VDD * These parameters are characterized but not tested. † Data in the “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only are not tested. Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 2: This is the additional current consumed by the A/D module when it is enabled; this current adds to base IDD. TABLE 10-6: A/D CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C Param No. Sym AD131 TCNV Characteristic Conversion Time (not including Acquisition Time) AD132* TACQ Acquisition Time(1) Min Typ† Max Units Conditions — 13 — TCY Set GO/DONE bit to new data in A/D Result register — 3.5 5 — μs μs VDD = 5V VDD = 2.5V * These parameters are characterized but not tested. † Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The Section 7.9 “A/D Acquisition Requirements” for information on how to compute minimum acquisition times based on operating conditions. DS41270E-page 60 © 2007 Microchip Technology Inc. PIC10F220/222 11.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. “Typical” represents the mean of the distribution at 25°C. “Maximum” or “minimum” represents (mean + 3σ) or (mean 3σ) respectively, where s is a standard deviation, over each temperature range. FIGURE 11-1: IDD vs. VDD OVER FOSC (4 MHZ) XT Mode 1,400 1,200 Typical: Statistical Mean @25°C Maximum: Mean (Worst Case Temp) + 3σ (-40°C to 125°C) Maximum 1,000 IDD (μA) 4 MHz 800 Typical 600 4 MHz 400 200 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) © 2007 Microchip Technology Inc. DS41270E-page 61 PIC10F220/222 FIGURE 11-2: IDD vs. VDD OVER FOSC (8 MHZ) Typical (Sleep Mode all Peripherals Disabled) 1,800 1,600 Typical: Statistical Mean @25°C Maximum: Mean (Worst Case Temp) + 3σ (-40°C to 125°C) Maximum 1,400 8 MHz IDD (μA) 1,200 1,000 Typical 800 8 MHz 600 400 200 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 11-3: TYPICAL IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED) Typical (Sleep Mode all Peripherals Disabled) 1.10 Typical: Statistical Mean @25°C 1.00 0.90 IPD (μA) 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41270E-page 62 © 2007 Microchip Technology Inc. PIC10F220/222 FIGURE 11-4: MAXIMUM IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED) Maximum (Sleep Mode all Peripherals Disabled) 18.0 16.0 Typical: Statistical Mean @25°C Maximum: Mean (Worst Case Temp) + 3σ (-40°C to 125°C) 14.0 Max. 125°C IPD (μA) 12.0 10.0 8.0 6.0 4.0 Max. 85°C 2.0 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) TYPICAL WDT IPD vs. VDD FIGURE 11-5: 9 8 Typical: Statistical Mean @25°C 7 IPD (μA) 6 5 4 3 2 1 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) © 2007 Microchip Technology Inc. DS41270E-page 63 PIC10F220/222 FIGURE 11-6: MAXIMUM WDT IPD vs. VDD OVER TEMPERATURE Maximum 25.0 Maximum: Mean (Worst Case Temp) + 3σ (-40°C to 125°C) 20.0 IPD (μA) Max. 125°C 15.0 10.0 Max. 85°C 5.0 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 11-7: WDT TIME-OUT vs. VDD OVER TEMPERATURE (NO PRESCALER) 50 Typical: Statistical Mean @25°C Maximum: Mean (Worst Case Temp) + 3σ (-40°C to 125°C) Max. 125°C 45 40 Max. 85°C 35 Time (ms) 30 Typical. 25°C 25 20 Min. -40°C 15 10 5 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41270E-page 64 © 2007 Microchip Technology Inc. PIC10F220/222 FIGURE 11-8: VOL vs. IOL OVER TEMPERATURE (VDD = 3.0V) (VDD = 3V, -40×C TO 125×C) 0.8 Typical: Statistical Mean @25°C Maximum: Mean (Worst Case Temp) + 3σ (-40°C to 125°C) 0.7 Max. 125°C 0.6 VOL (V) 0.5 Max. 85°C 0.4 Typical 25°C 0.3 0.2 Min. -40°C 0.1 0.0 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 IOL (mA) FIGURE 11-9: VOL vs. IOL OVER TEMPERATURE (VDD = 5.0V) 0.45 Typical: Statistical Mean @25°C Typical: Statistical @25×C+ 3σ Maximum: Mean (Worst Mean Case Temp) Maximum: Meas(-40×C + 3 to 125×C) (-40°C to 125°C) 0.40 Max. 125°C 0.35 Max. 85°C VOL (V) 0.30 0.25 Typ. 25°C 0.20 0.15 Min. -40°C 0.10 0.05 0.00 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 IOL (mA) © 2007 Microchip Technology Inc. DS41270E-page 65 PIC10F220/222 FIGURE 11-10: VOH vs. IOH OVER TEMPERATURE (VDD = 3.0V) 3.5 3.0 Max. -40°C Typ. 25°C 2.5 Min. 125°C VOH (V) 2.0 1.5 1.0 Typical: Statistical Mean @25°C Maximum: Mean (Worst Case Temp) + 3σ (-40°C to 125°C) 0.5 0.0 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 IOH (mA) FIGURE 11-11: (VDD = 5.0V) VOH vs. IOH OVER TEMPERATURE ( , ) 5.5 5.0 Max. -40°C Typ. 25°C VOH (V) 4.5 Min. 125°C 4.0 3.5 Typical: Statistical Mean @25°C Maximum: Mean (Worst Case Temp) + 3σ (-40°C to 125°C) 3.0 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5 -5.0 IOH (mA) DS41270E-page 66 © 2007 Microchip Technology Inc. PIC10F220/222 FIGURE 11-12: TTL INPUT THRESHOLD VIN vs. VDD (TTL Input, -40×C TO 125×C) 1.7 1.5 Typical: Statistical Mean @25°C Maximum: Mean (Worst Case Temp) + 3σ (-40°C to 125°C) Max. -40°C VIN (V) 1.3 Typ. 25°C 1.1 Min. 125°C 0.9 0.7 0.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 11-13: SCHMITT TRIGGER INPUT THRESHOLD VIN vs. VDD (ST Input, -40×C TO 125×C) 4.0 VIH Max. 125°C 3.5 Typical: Statistical Mean @25°C Maximum: Mean (Worst Case Temp) + 3σ (-40°C to 125°C) VIH Min. -40°C VIN (V) 3.0 2.5 2.0 VIL Max. -40°C 1.5 VIL Min. 125°C 1.0 0.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) © 2007 Microchip Technology Inc. DS41270E-page 67 PIC10F220/222 NOTES: DS41270E-page 68 © 2007 Microchip Technology Inc. PIC10F220/222 12.0 DEVELOPMENT SUPPORT The PIC® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C18 and MPLAB C30 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PICSTART® Plus Development Programmer - MPLAB PM3 Device Programmer - PICkit™ 2 Development Programmer • Low-Cost Demonstration and Development Boards and Evaluation Kits 12.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Visual device initializer for easy register initialization • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as HI-TECH Software C Compilers and IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PIC MCU emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (assembly or C) - Mixed assembly and C - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. © 2007 Microchip Technology Inc. DS41270E-page 69 PIC10F220/222 12.2 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 12.5 MPLAB ASM30 Assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire dsPIC30F instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility 12.6 12.3 MPLAB C18 and MPLAB C30 C Compilers The MPLAB C18 and MPLAB C30 Code Development Systems are complete ANSI C compilers for Microchip’s PIC18 and PIC24 families of microcontrollers and the dsPIC30 and dsPIC33 family of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 12.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. MPLAB ASM30 Assembler, Linker and Librarian MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C18 and MPLAB C30 C Compilers, and the MPASM and MPLAB ASM30 Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction DS41270E-page 70 © 2007 Microchip Technology Inc. PIC10F220/222 12.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator The MPLAB ICE 2000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 In-Circuit Emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The architecture of the MPLAB ICE 2000 In-Circuit Emulator allows expansion to support new PIC microcontrollers. The MPLAB ICE 2000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows® 32-bit operating system were chosen to best make these features available in a simple, unified application. 12.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC® Flash MCUs and dsPIC® Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The MPLAB REAL ICE probe is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with the popular MPLAB ICD 2 system (RJ11) or with the new high-speed, noise tolerant, LowVoltage Differential Signal (LVDS) interconnection (CAT5). 12.9 MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PIC MCUs and can be used to develop for these and other PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers costeffective, in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single stepping and watching variables, and CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices. 12.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an SD/MMC card for file storage and secure data applications. MPLAB REAL ICE is field upgradeable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added, such as software breakpoints and assembly code trace. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, real-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. © 2007 Microchip Technology Inc. DS41270E-page 71 PIC10F220/222 12.11 PICSTART Plus Development Programmer 12.13 Demonstration, Development and Evaluation Boards The PICSTART Plus Development Programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus Development Programmer supports most PIC devices in DIP packages up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus Development Programmer is CE compliant. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. 12.12 PICkit 2 Development Programmer The PICkit™ 2 Development Programmer is a low-cost programmer and selected Flash device debugger with an easy-to-use interface for programming many of Microchip’s baseline, mid-range and PIC18F families of Flash memory microcontrollers. The PICkit 2 Starter Kit includes a prototyping development board, twelve sequential lessons, software and HI-TECH’s PICC™ Lite C compiler, and is designed to help get up to speed quickly using PIC® microcontrollers. The kit provides everything needed to program, evaluate and develop applications using Microchip’s powerful, mid-range Flash memory family of microcontrollers. DS41270E-page 72 The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. © 2007 Microchip Technology Inc. PIC10F220/222 13.0 PACKAGING INFORMATION 13.1 Package Marking Information 6-Lead SOT-23* XXNN 8-Lead PDIP XXXXXXXX XXXXXNNN YYWW 8-Lead DFN* XXX YWW NN Legend: XX...X Y YY WW NNN e3 * Note: Example 20JR Example PIC10F220 I/P e3 07Q 0520 Example BJ0 625 3Q Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2007 Microchip Technology Inc. DS41270E-page 73 PIC10F220/222 TABLE 13-1: 8-LEAD 2x3 DFN (MC) TOP MARKING Part Number Marking TABLE 13-2: 6-LEAD SOT-23 (OT) PACKAGE TOP MARKING Part Number Marking PIC10F220-I/MC BJ0 PIC10F220-I/OT 20NN PIC10F220-E/MC BK0 PIC10F220-E/OT A0NN PIC10F222-I/MC BL0 PIC10F222-I/OT 22NN PIC10F222-E/MC BM0 PIC10F222-E/OT Note: DS41270E-page 74 A2NN NN represents traceability code. the alphanumeric © 2007 Microchip Technology Inc. PIC10F220/222 6-Lead Plastic Small Outline Transistor (OT) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging b 4 N E E1 PIN 1 ID BY LASER MARK 1 2 3 e e1 D A A2 c φ L A1 L1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 6 Pitch e 0.95 BSC Outside Lead Pitch e1 1.90 BSC Overall Height A 0.90 – Molded Package Thickness A2 0.89 – 1.45 1.30 Standoff A1 0.00 – 0.15 Overall Width E 2.20 – 3.20 Molded Package Width E1 1.30 – 1.80 Overall Length D 2.70 – 3.10 Foot Length L 0.10 – 0.60 Footprint L1 0.35 – 0.80 Foot Angle φ 0° – 30° Lead Thickness c 0.08 – 0.26 Lead Width b 0.20 – 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-028B © 2007 Microchip Technology Inc. DS41270E-page 75 PIC10F220/222 8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b Units Dimension Limits Number of Pins INCHES MIN N NOM MAX 8 Pitch e Top to Seating Plane A – – .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 – – Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 b1 .040 .060 .070 b .014 .018 .022 eB – – Upper Lead Width Lower Lead Width Overall Row Spacing § .100 BSC .430 Notes: 1. Pin 1 visual index feature may vary, but must be located with the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-018B DS41270E-page 76 © 2007 Microchip Technology Inc. PIC10F220/222 8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D e b N N L K E2 E EXPOSED PAD NOTE 1 2 1 2 NOTE 1 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 8 Pitch e Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Length D 2.00 BSC Overall Width E Exposed Pad Length D2 1.30 – Exposed Pad Width E2 1.50 – 1.90 b 0.18 0.25 0.30 Contact Length L 0.30 0.40 0.50 Contact-to-Exposed Pad K 0.20 – – Contact Width 0.50 BSC 3.00 BSC 1.75 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-123B © 2007 Microchip Technology Inc. DS41270E-page 77 PIC10F220/222 APPENDIX A: REVISION HISTORY Revision A Original release of document. Revision B (03/2006) Table 3-1, GP1; Section 4.7, Program Counter; Table 52; Figure 8-5; Section 9.1, ANDWF, SLEEP, SUBWF, SWAPF, XORLW. Revision C (08/2006) Added 8-Lead DFN pinout diagram, updated Table 1-1 with DFN package, updated Table 10-3 in Section 10.0, added 8-Lead DFN package marking information to section 13.0, updated the Product Identification System section to include DFN package identification. Added note to package drawings. Revision D (02/2007) Replaced Dev. Tool Section; Replaced Package Drawings. Revision E (06/2007) Updated and added Characterization Data; Revised Operating Current; Revised Section 8.4 and Note; Revised Section 10.0, Total Power Dissipation, 10.1, 10.2, 10.3 DC Characteristics; Revised Tables 10-2, 10-3, 10-5, 10-6; Section 11.0; Revised Product ID System. DS41270E-page 78 © 2007 Microchip Technology Inc. PIC10F220/222 INDEX A M A/D Specifications.............................................................. 60 ADC Internal Sampling Switch (RSS) IMPEDANCE ................ 32 Source Impedance...................................................... 32 ALU ....................................................................................... 9 Assembler MPASM Assembler..................................................... 62 B Block Diagram On-Chip Reset Circuit ................................................. 36 Timer0......................................................................... 25 TMR0/WDT Prescaler................................................. 28 Watchdog Timer.......................................................... 39 Block Diagrams Analog Input Model ..................................................... 32 Brown-Out Protection Circuit .............................................. 40 C C Compilers MPLAB C18 ................................................................ 62 MPLAB C30 ................................................................ 62 Carry ..................................................................................... 9 Clocking Scheme ................................................................ 11 Code Protection ............................................................ 33, 41 Configuration Bits................................................................ 33 Customer Change Notification Service ............................... 75 Customer Notification Service............................................. 75 Customer Support ............................................................... 75 D DC and AC Characteristics ................................................. 65 Development Support ......................................................... 61 Digit Carry ............................................................................. 9 E Errata .................................................................................... 3 F Family of Devices PIC10F22X ................................................................... 5 FSR ..................................................................................... 20 G GPIO ................................................................................... 21 I I/O Interfacing ..................................................................... 21 I/O Ports .............................................................................. 21 I/O Programming Considerations........................................ 23 ID Locations .................................................................. 33, 41 INDF.................................................................................... 20 Indirect Data Addressing..................................................... 20 Instruction Cycle ................................................................. 11 Instruction Flow/Pipelining .................................................. 11 Instruction Set Summary..................................................... 44 Internal Sampling Switch (RSS) IMPEDANCE ........................ 32 Internet Address.................................................................. 75 L Loading of PC ..................................................................... 19 © 2007 Microchip Technology Inc. Memory Organization ......................................................... 13 Data Memory .............................................................. 14 Program Memory (PIC10F220) .................................. 13 Program Memory (PIC10F222) .................................. 13 Microchip Internet Web Site................................................ 75 MPLAB ASM30 Assembler, Linker, Librarian ..................... 62 MPLAB ICD 2 In-Circuit Debugger ..................................... 63 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator...................................................... 63 MPLAB Integrated Development Environment Software.... 61 MPLAB PM3 Device Programmer ...................................... 63 MPLAB REAL ICE In-Circuit Emulator System .................. 63 MPLINK Object Linker/MPLIB Object Librarian .................. 62 O OPTION Register................................................................ 17 OSCCAL Register............................................................... 18 Oscillator Configurations..................................................... 34 Oscillator Types HS............................................................................... 34 LP ............................................................................... 34 P PIC10F220/222 Device Varieties.......................................... 7 PICSTART Plus Development Programmer....................... 64 POR Device Reset Timer (DRT) ................................... 33, 38 PD............................................................................... 39 Power-on Reset (POR)............................................... 33 TO............................................................................... 39 Power-down Mode.............................................................. 40 Prescaler ............................................................................ 27 Program Counter ................................................................ 19 Q Q cycles .............................................................................. 11 R Reader Response............................................................... 76 Read-Modify-Write.............................................................. 23 Register File Map PIC10F220 ................................................................. 14 PIC10F222 ................................................................. 14 Registers Special Function ......................................................... 14 Reset .................................................................................. 33 Reset on Brown-Out ........................................................... 40 S Sleep ............................................................................ 33, 40 Software Simulator (MPLAB SIM) ...................................... 62 Special Features of the CPU .............................................. 33 Special Function Registers ................................................. 14 Stack................................................................................... 19 STATUS Register ..................................................... 9, 15, 29 T Timer0 Timer0 ........................................................................ 25 Timer0 (TMR0) Module .............................................. 25 TMR0 with External Clock .......................................... 26 Timing Parameter Symbology and Load Conditions .......... 57 TRIS Registers ................................................................... 21 DS41270E-page 79 PIC10F220/222 W Wake-up from Sleep ........................................................... 41 Watchdog Timer (WDT) ................................................ 33, 38 Period.......................................................................... 38 Programming Considerations ..................................... 38 WWW Address.................................................................... 75 WWW, On-Line Support........................................................ 3 Z Zero bit .................................................................................. 9 DS41270E-page 80 © 2007 Microchip Technology Inc. PIC10F220/222 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2007 Microchip Technology Inc. DS41270E-page 81 PIC10F220/222 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: PIC10F220/222 Y N Literature Number: DS41270E Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS41270E-page 82 © 2007 Microchip Technology Inc. PIC10F220/222 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Device Temperature Range Package Pattern Examples: a) b) Device: PIC10F220 PIC10F222 PIC10F220T (Tape & Reel) PIC10F222T (Tape & Reel) Temperature Range: I E = -40°C to +85°C = -40°C to +125°C Package: P OT MC = = = Pattern: Special Requirements c) PIC10F220-I/P = Industrial temp., PDIP package (Pb-free) PIC10F222T-E/OT = Extended temp., SOT-23 package (Pb-free), Tape and Reel PIC10F222-E/MC = Extended temp., DFN package (Pb-free) (Industrial) (Extended) 300 mil PDIP (Pb-free) SOT-23, 6-LD (Pb-free) DFN, 8-LD 2x3 (Pb-free) © 2007 Microchip Technology Inc. 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