http://www.luguang.cn Email: [email protected] 1. SCOPE This specification shall cover the characteristics of the ceramic resonator with the type ZTTCR4.19MG. 2. PART NO.: PART NUMBER CUSTOMER PART NO SPECIFICATION NO ZTTCR4.19MG 3. OUTLINE DRAWING AND DIMENSIONS: Appearance: No visible damage and dirt. Dimensions: 4.19 UINT：mm NOTES: 1.All dimensions are in millimeters. 2.*: EIAJ Monthly Code. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 1 http://www.luguang.cn Email: [email protected] 3.4 STRUCTURE 3 1 4 2 NO: 5 Components Materials Top and Bottom Electrodes 1 Outer Electrodes Ag+Ni(under plating)+Sn(over plating) Side Electrodes Ni+Cu+Ag(under plating)+Sn(over plating) 2 Ceramic Box Insulation Box 3 Cover Dielectric Material 4 Inner Electrodes Ag 5 Glue Epoxy Resin 6 Conductive Adhesive Ag+Epoxy Resin 7 Ceramic Element Piezoelectric Ceramics (PZT) SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 2 http://www.luguang.cn Email: [email protected] 4 RATING AND ELECTRICAL SPECIFICATIONS: 4.1 RATING Content Items Withstanding Voltage (V) Insulation Resistance Ri,（MΩ）min. Operating Temperature Range (℃) Storage Temperature Range (℃) 50 (DC，1min) 500（100V，1min） -25～+85 -55～+85 4.2 ELECTRICAL SPECIFICATIONS Oscillation Frequency Fosc（MHz） Frequency Accuracy （%） Resonant Impedance Ro（Ω）max. 4.19 ±0.5 40 Temperature Coefficient of Oscillation ±0.3 （Oscillation Frequency drift，-25℃～+85℃） Frequency （%） max. Loop Gain (dB) min Rating Voltage UR（V）max. Aging Rate （%）max. 10.0 6V DC 15V p-p ±0.2 （For Ten Years） 5 MEASUREMENT: 5.1 Measurement Conditions: Parts shall be measured under a condition ( Temp. ： 20±15 ℃ ,Humidity ： 65±20% R.H.) unless the standard condition(Temp. ： 25±3 ℃ ,Humidity ： 65±5% R.H.) is regulated to measure. 5.2 Test Circuit: IC: 1/6TC4069UBP×2 X: Ceramic Resonator SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 3 http://www.luguang.cn Email: [email protected] 6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS No Item Performance Requirements Condition of Test Humidity Keep the resonator at 40 ℃ ±2 ℃ and It shall fulfill 90-95% RH for 96h±4h. Then release the The specifications resonator into the room condition for 1h In Table 1. prior to the measurement. 6.2 Vibration Subject the resonator to vibration for 2h each in x、y and z axis with the amplitude It shall fulfill of 1.5mm, the frequency shall be varied The specifications uniformly between the limits of In Table 1. 10Hz—55Hz. 6.3 Mechanical Shock Drop the resonator randomly onto a wooden floor from the height of 100cm 3 times. 6.1 6.4 Soldering Test It shall fulfill The specifications In Table 1. Passed through the re-flow oven under the following condition and left at room temperature for 1h before measurement. It shall fulfill Temperature at the The specifications Time surface of the substrate In Table 1. Preheat 150℃±5℃ 60s±10s Peak 240℃±5℃ 10s±3s 6.5 Solder Ability Dipped in 230℃±5℃ solder bath for 3s±0.5s with rosin flux 25wt% ethanol solution. The terminals shall be at least 95% covered by solder. 6.6 High Temperature Exposure Subject the resonator to 85℃±5℃ for 96h±4h. Then release the resonator into the room conditions for 1h prior to the measurement. It shall fulfill The specifications In Table 1. 6.7 Low Temperature Exposure Subject the resonator to –25℃±5℃ for 96h±4h. Then release the resonator into the room conditions for 1h prior to the measurement. It shall fulfill The specifications In Table 1. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 4 http://www.luguang.cn Email: [email protected] 7. PHYSICAL AND ENVIRONMENAL CHARACTERISICS (Continued from the preceding page) No 6.8 Item Performance Requirements Condition of Test Temperature Cycling Subject the resonator to -40℃ for 30 min. followed by a high temperature of It shall fulfill 85℃ for 30 min. cycling shall be The specifications repeated 5 times with a transfer time of In Table 1. 15s. At the room temperature for 1h prior to the measurement. Mount a glass-epoxy board (Width=40mm,thickness=1.6mm), then bend it to 1mm displacement and keep It for 5s. (See the following Figure) PRESS 6.9 Board Bending PRESS HEAD Mechanical damage such as breaks shall not occur. D SUPPORT BAR TABLE 1 Item Specification Oscillation Frequency Change △Fosc/Fosc (%) max ±0.3 Resonant Impedance (Ω) max 40 7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING STANDARD CONDITIONS 7.1 Recommended land pattern SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 5 http://www.luguang.cn Email: [email protected] :Land Pattern 7.2 Recommended reflow soldering standard conditions Temperature(℃) within 10 sec ℃ Pre-heating within 80-120sec. within 20-40sec 8 PACKAGE To protect the products in storage and transportation ，it is necessary to pack them（outer and inner package）.On paper pack, the following requirements are requested. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 6 http://www.luguang.cn 8.1 Dimensions and Mark Email: [email protected] At the end of package, the warning (moisture proof, upward put) should be stick to it. Dimensions and Mark (see below) NO. Name Quantity 1 Package 1 2 Certificate of approval 1 3 Label 1 4 Tying 2 5 Adhesive tape 1.2m 6 Belt 2.9m 7 Inner Box 12 Notes 8.2 Section of package Package is made of corrugated paper with thickness of 0.8cm.Package has 12 inner boxes, each box has 5 reels (each reel for plastic bag). SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 7 http://www.luguang.cn 8.3 Quantity of package Email: [email protected] Per plastic reel 3000 pieces of piezoelectric ceramic part Per inner box 5 reels Per package 12 inner boxes（180000 pieces of piezoelectric ceramic part ） 8.4 Inner Packing Dimensions 1.UNIT: mm 1 Label 2 QC Label 3 Inner Box Pars shall be packaged in box with hold down tape upside. Part No., quantity and lot No. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 8 http://www.luguang.cn Email: [email protected] 8.5 Reel φ max 8.6 Packing Method Sketch Map Blank Pocket 20 Pitches Loaded Pocket Blank Pocket 20 Pitches Leader 200mm Max SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 9 http://www.luguang.cn 8.7 Test Condition Of Peeling Strength T op T ape Email: [email protected] S tre n g P e e lin g th 2 0 - 7 0 g 10° Max C a rrie r T a p e 9 EIAJ Monthly Code 2003 / 2005 / 2007 / 2009 MONTH JAN FEB MAR APR MAY JUN JUL AUG SEP OCT NOV DEC CODE A B C D E F G H J K L M 2004 / 2006 / 2008 / 2010 MONTH JAN FEB MAR APR MAY JUN JUL AUG SEP OCT NOV DEC CODE N P Q R S T U V W X Y Z 10 OTHER 10.1 Caution of use 10.1.1 Do not use this product with bend. Please don’t apply excess mechanical stress to the component and terminals at soldering. 10.1.2 The component may be damaged when an excess stress will be applied. 10.1.3 This specification mentions the quality of the component as a single unit. Please insure the component is thoroughly evaluated in your application circuit. 10.2 Notice 10.2.1 Please return one of this specification after your signature of acceptance. 10.2.2 When something gets doubtful with this specifications, we shall jointly work to get an agreement. SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 1 0