ETC 74HC1G14GW/T1

INTEGRATED CIRCUITS
DATA SHEET
74HC1G14; 74HCT1G14
Inverting Schmitt-trigger
Product specification
File under Integrated Circuits, IC06
1998 Aug 05
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
FEATURES
• Wide operating voltage range:
2.0 to 6.0 V
• Symmetrical output impedance
• High noise immunity
• Low power dissipation
• Balanced propagation delays
74HC1G14; 74HCT1G14
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C; tr = tf = 6.0 ns.
TYP.
SYMBOL
15
ns
CI
input
capacitance
1.5
1.5
pF
CPD
power
dissipation
capacitance
20
22
pF
notes 1 and 2
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
DESCRIPTION
The 74HC1G/HCT1G14 is a
high-speed Si-gate CMOS device.
The 74HC1G/HCT1G14 provides the
inverting buffer function with
Schmitt-trigger action. These devices
are capable of transforming slowly
changing input signals into sharply
defined, jitter-free output signals.
The standard output currents are 1⁄2
compared to the 74HC/HCT14.
FUNCTION TABLE
See note 1.
INPUT
inA
OUTPUT
outY
L
H
H
L
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
∑ (CL × VCC2 × fo) = sum of outputs.
2. For HC1G the condition is VI = GND to VCC.
For HCT1G the condition is VI = GND to VCC − 1.5 V.
PINNING
PIN
SYMBOL
DESCRIPTION
1
n.c.
not connected
2
inA
data input
3
GND
ground (0 V)
4
outY
data output
5
VCC
DC supply voltage
Note
1. H = HIGH voltage level;
L = LOW voltage level.
1998 Aug 05
HCT1G
10
– Astable multivibrators
• Output capability: standard.
UNIT
HC1G
propagation
CL = 15 pF
delay inA to outY VCC = 5 V
– Wave and pulse shapers
– Monostable multivibrators
CONDITIONS
tPHL/tPLH
• Very small 5 pins package
• Applications
PARAMETER
2
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
ORDERING AND PACKAGE INFORMATION
PACKAGES
OUTSIDE NORTH
AMERICA
TEMPERATURE
RANGE
74HC1G14GW
−40 to +125 °C
74HCT1G14GW
PINS
PACKAGE
MATERIAL
CODE
MARKING
5
SC-88A
plastic
SOT353
HF
5
SC-88A
plastic
SOT353
TF
handbook, halfpage
n.c 1
inA 2
GND
5 VCC
handbook, halfpage
2
14
3
4
outY
inA
outY
4
MNA023
MNA022
Fig.1 Pin configuration.
Fig.2 Logic symbol.
handbook, halfpage
2
handbook, halfpage
inA
4
outY
MNA025
MNA024
Fig.3 IEC logic symbol.
1998 Aug 05
Fig.4 Logic diagram.
3
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
RECOMMENDED OPERATING CONDITIONS
74HC1G
SYMBOL
74HCT1G
PARAMETER
UNIT
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
VCC
DC supply voltage
2.0
5.0
6.0
4.5
5.0
5.5
V
VI
input voltage
0
−
VCC
0
−
VCC
V
VO
output voltage
0
−
VCC
0
−
VCC
V
Tamb
operating ambient
temperature range
−40
+25
+125
−40
+25
+125
°C
CONDITIONS
see DC and AC
characteristics per device
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCC
DC supply voltage
−0.5
+7.0
V
±IIK
DC input diode current
VI < −0.5 or VI > VCC + 0.5 V; note 1
−
20
mA
±IOK
DC output diode current
VO < −0.5 or VO > VCC + 0.5 V; note 1
−
20
mA
±IO
DC output source or sink
current standard outputs
−0.5 V < VO < VCC + 0.5 V; note 1
−
12.5
mA
±ICC
DC VCC or GND current for
types with standard outputs
note 1
−
25
mA
Tstg
storage temperature range
−65
+150
°C
PD
power dissipation per package
−
200
mW
5 pins plastic SC-88A
for temperature range: −40 to +125 °C
above +55 °C derate linearly with
2.5 mW/K
Note
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 Aug 05
4
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
DC CHARACTERISTICS FOR THE 74HC1G
Over recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Tamb (°C)
SYMBOL
−40 to +85
PARAMETER
MIN.
VOH
VOH
VOL
HIGH-level output
voltage; all outputs
HIGH-level output
voltage; standard
outputs
LOW-level output
voltage; all outputs
TEST CONDITIONS
TYP.(1)
−40 to +125
MAX.
MIN.
UNIT
VCC (V)
MAX.
OTHER
1.9
2.0
−
1.9
−
V
2.0
4.4
4.5
−
4.4
−
V
4.5
5.9
6.0
−
5.9
−
V
6.0
4.13
4.32
−
3.7
−
V
4.5
VI = VIH or VIL;
−IO = 2.0 mA
5.63
5.81
−
5.2
−
V
6.0
VI = VIH or VIL;
−IO = 2.6 mA
−
0
0.1
−
0.1
V
2.0
VI = VIH or VIL;
IO = 20 µA
−
0
0.1
−
0.1
V
4.5
−
0
0.1
−
0.1
V
6.0
VI = VIH or VIL;
−IO = 20 µA
LOW-level output
voltage; standard
outputs
−
0.15
0.33
−
0.4
V
4.5
VI = VIH or VIL;
IO = 2.0 mA
−
0.16
0.33
−
0.4
V
6.0
VI = VIH or VIL;
IO = 2.6 mA
II
input leakage current
−
−
1.0
−
1.0
µA
6.0
VI = VCC or GND
ICC
quiescent supply
current
−
−
10
−
20
µA
6.0
VI = VCC or GND;
IO = 0
VOL
Note
1. All typical values are measured at Tamb = 25 °C.
DC CHARACTERISTICS FOR THE 74HC1G14
Voltages are referenced to GND (ground = 0 V).
Tamb (°C)
SYMBOL
VT+
VT−
VH
−40 to +85
PARAMETER
positive-going threshold
negative-going threshold
hysteresis (VT+ − VT−)
−40 to +125
UNIT
VCC (V)
MIN.
TYP.(1)
0.7
1.09
1.5
0.7
1.5
V
2.0
1.7
2.36
3.15
1.7
3.15
V
4.5
2.1
3.12
4.2
2.1
4.2
V
6.0
0.3
0.60
0.9
0.3
0.9
V
2.0
0.9
1.53
2.0
0.9
2.0
V
4.5
MAX.
MIN.
MAX.
1.2
2.08
2.6
1.2
2.6
V
6.0
0.2
0.48
1.0
0.2
1.0
V
2.0
0.4
0.83
1.4
0.4
1.4
V
4.5
0.6
1.04
1.6
0.6
1.6
V
6.0
Note
1. All typical values are measured at Tamb = 25 °C.
1998 Aug 05
TEST CONDITIONS
5
WAVEFORMS
see Figs 5 and 6
see Figs 5 and 6
see Figs 5 and 6
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
DC CHARACTERISTICS FOR THE 74HCT1G
Over recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Tamb (°C)
SYMBOL
TEST CONDITIONS
−40 to +85
PARAMETER
TYP.(1)
MIN.
−40 to +125
MAX.
MIN.
UNIT
VCC (V)
MAX.
OTHER
VOH
HIGH-level output
voltage; all outputs
4.4
4.5
−
4.4
−
V
4.5
VI = VIH or VIL;
−IO = 20 µA
VOH
HIGH-level output
voltage; standard
outputs
4.13
4.32
−
3.7
−
V
4.5
VI = VIH or VIL;
−IO = 2.0 mA
VOL
LOW-level output
voltage; all outputs
−
0
0.1
−
0.1
V
4.5
VI = VIH or VIL;
IO = 20 µA
VOL
LOW-level output
voltage; standard
outputs
−
0.15
0.33
−
0.4
V
4.5
VI = VIH or VIL;
IO = 2.0 mA
II
input leakage current −
−
1.0
−
1.0
µA
5.5
VI = VCC or GND
ICC
quiescent supply
current
−
−
10.0
−
20.0
µA
5.5
VI = VCC or GND;
IO = 0
∆ICC
additional supply
current per input
−
−
500
−
850
µA
4.5 to 5.5
VI = VCC − 2.1 V;
IO = 0
Note
1. All typical values are measured at Tamb = 25 °C.
DC CHARACTERISTICS FOR THE 74HCT1G14
Voltages are referenced to GND (ground = 0 V).
Tamb (°C)
SYMBOL
−40 to +85
PARAMETER
MIN.
VT+
positive-going threshold
TYP.(1)
TEST CONDITIONS
−40 to +125
MAX.
MIN.
UNIT
VCC (V)
MAX.
1.2
1.55
1.9
1.2
1.9
V
4.5
1.4
1.80
2.1
1.4
2.1
V
5.5
0.76
1.2
0.5
1.2
V
4.5
VT−
negative-going threshold
0.5
0.6
0.90
1.4
0.6
1.4
V
5.5
VH
hysteresis (VT+ − VT−)
0.4
0.80
−
0.4
−
V
4.5
0.4
0.90
−
0.4
−
V
5.5
Note
1. All typical values are measured at Tamb = 25 °C.
1998 Aug 05
6
WAVEFORMS
see Figs 5 and 6
see Figs 5 and 6
see Figs 5 and 6
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
AC CHARACTERISTICS FOR 74HC1G14
GND = 0 V; tr = tf = 6.0 ns; CL = 50 pF.
Tamb (°C)
SYMBOL
−40 to +85
PARAMETER
MIN. TYP.(1)
tPHL/tPLH
propagation delay
inA to outY
TEST CONDITIONS
−40 to +125
MAX.
MIN.
UNIT
VCC (V)
MAX.
−
25
155
−
190
ns
2.0
−
12
31
−
38
ns
4.5
−
11
26
−
32
ns
6.0
WAVEFORMS
see Figs 12 and 13
Note
1. All typical values are measured at Tamb = 25 °C.
AC CHARACTERISTICS FOR 74HCT1G14
GND = 0 V; tr = tf = 6.0 ns; CL = 50 pF.
Tamb (°C)
SYMBOL
−40 to +85
PARAMETER
MIN.
tPHL/tPLH
propagation delay
inA to outY
−
TYP.(1)
17
−40 to +125
MAX.
MIN.
−
43
Note
1. All typical values are measured at Tamb = 25 °C.
1998 Aug 05
TEST CONDITIONS
7
UNIT
VCC(V)
MAX.
51
ns
4.5
WAFEFORMS
see Figs 12 and 13
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
TRANSFER CHARACTERISTIC WAVEFORMS
handbook, halfpage
handbook, halfpage
VO
VI
VT+
VH
VT−
VO
MNA027
VH
VT+
VT−
MNA026
Fig.6
The definitions of VT+, VT− and VH; where
VT+ and VT− are between limits of 20% and
70%.
Fig.5 Transfer characteristic.
MNA028
100
MNA029
1.0
handbook, halfpage
handbook, halfpage
ICC
(mA)
ICC
(µA)
0.8
0.6
50
0.4
0.2
0
0
1.0
0
Fig.7
VI (V)
2.0
0
Typical HC1G14 transfer characteristics;
VCC = 2.0 V.
1998 Aug 05
Fig.8
8
2.5
VI (V)
5.0
Typical HC1G14 transfer characteristics;
VCC = 4.5 V.
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
MNA030
1.6
MNA031
2.0
handbook, halfpage
handbook, halfpage
ICC
(mA)
ICC
(mA)
1.0
0.8
0
0
0
Fig.9
3.0
VI (V)
2.5
0
6.0
Typical HC1G14 transfer characteristics;
VCC = 6.0 V.
VI (V)
5.0
Fig.10 Typical HCT1G14 transfer characteristics;
VCC = 4.5 V.
MNA032
3.0
handbook, halfpage
ICC
(mA)
handbook, halfpage
inA INPUT
VM(1)
2.0
tPHL
outY OUTPUT
tPLH
VM(1)
1.0
MNA033
0
0
3.0
VI (V)
6.0
(1) HC1G: VM = 50%; VI = GND to VCC.
HCT1G: VM = 1.3 V; VI = GND to 3.0 V.
Fig.11 Typical HCT1G14 transfer characteristics;
VCC = 5.5 V.
1998 Aug 05
Fig.12 The input (inA) to output (outY) propagation
delays.
9
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
VCC
handbook, halfpage
PULSE
GENERATOR
VI
VO
D.U.T.
RT
CL
50 pF
MNA034
Definitions for test circuit:
CL = load capacitance including jig and probe capacitance (See “AC characteristics for 74HC1G14”
and “AC characteristics for 74HCT1G14” for values).
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.13 Load circuitry for switching times.
1998 Aug 05
10
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
APPLICATION INFORMATION
The slow input rise and fall times cause additional power
dissipation, this can be calculated using the following
formula:
MNA036
200
handbook, halfpage
average
ICC
(µA)
150
Pad = fi × (tr × ICCa + tf × ICCa) × VCC
Where:
Pad = additional power dissipation (µW)
positive-going
edge
fi = input frequency (MHz)
tr = input rise time (ns); 10% to 90%
100
tf = input fall time (ns); 90% to 10%
ICCa = average additional supply current (µA).
50
Average ICCa differs with positive or negative input
transitions, as shown in Fig.14 and Fig.15.
negative-going
edge
HC1G/HCT1G14 used in relaxation oscillator circuit,
see Fig.14 and Fig.16.
0
0
2.0
4.0
VCC (V)
6.0
Note to the application information:
1. All values given are typical unless otherwise specified.
Fig.14 Average ICC for HC1G Schmitt-trigger
devices; linear change of VI between
0.1VCC to 0.9VCC.
MNA058
200
average
ICC
(µA)
handbook, halfpage
R
handbook, halfpage
150
positive-going
edge
100
C
MNA035
negative-going
edge
50
1
1
For HC1G: f = --- ≈ ----------------------T 0.8 × RC
0
0
2
4
VCC (V)
6
1
1
For HCT1G: f = --- ≈ --------------------------T 0.67 × RC
Fig.15 Average ICC for HCT1G Schmitt-trigger
devices; linear change of VI between
0.1VCC to 0.9VCC.
1998 Aug 05
Fig.16 Relaxation oscillator using the
HC1G/HCT1G14.
11
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
PACKAGE OUTLINE
Plastic surface mounted package; 5 leads
SOT353
D
E
B
y
X
A
HE
5
v M A
4
Q
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E (2)
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
SOT353
1998 Aug 05
REFERENCES
IEC
JEDEC
EIAJ
SC-88A
12
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
SOLDERING
Wave soldering
Introduction
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1998 Aug 05
13
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Aug 05
14
Philips Semiconductors
Product specification
Inverting Schmitt-trigger
74HC1G14; 74HCT1G14
NOTES
1998 Aug 05
15
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Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245106/00/01/pp16
Date of release: 1998 Aug 05
Document order number:
9397 750 03652