PHILIPS 74HCT253

74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
Rev. 03 — 22 April 2010
Product data sheet
1. General description
The 74HC253; 74HCT253 are high-speed Si-gate CMOS devices and are pin compatible
with Low-power Schottky TTL (LSTTL).
The 74HC253; 74HCT253 provides a dual 4-input multiplexer with 3-state outputs which
selects 2 bits of data from up to four sources selected by common data select inputs (S0,
S1). The two 4-input multiplexer circuits have individual active LOW output enable inputs
(1OE, 2OE).
The 74HC253 and 74HCT253 are the logic implementation of a 2-pole, 4-position switch,
where the position of the switch is determined by the logic levels applied to S0 and S1.
The outputs are forced to a high-impedance OFF-state when nOE is HIGH.
The logic equations for the outputs are:
1Y = 1OE • ( 1I0 • S1 • S0 + 1I1 • S1 • S0 + 1I2 • S1 • S0 + 1I3 • S1 • S0 )
2Y = 2OE • ( 2I0 • S1 • S0 + 2I1 • S1 • S0 + 2I2 • S1 • S0 + 2I3 • S1 • S0 )
2. Features and benefits
„
„
„
„
„
„
Non-inverting data path
3-state outputs interface directly with system bus
Complies with JEDEC standard no. 7A
Common select inputs
Separate output enable inputs
Input levels:
‹ For 74HC253: CMOS level
‹ For 74HCT253: TTL level
„ ESD protection:
‹ HBM JESD22-A114F exceeds 2000 V
‹ MM JESD22-A115-A exceeds 200 V
„ Multiple package options
„ Specified from −40 °C to +85 °C and from −40 °C to +125 °C
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
3. Applications
„ Data selectors
„ Data multiplexers
4. Ordering information
Table 1.
Ordering information
Type number
74HC253N
Package
Temperature range
Name
Description
Version
−40 °C to +125 °C
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
−40 °C to +125 °C
SO16
plastic small outline package; 16 leads; body width
3.9 mm
SOT109-1
−40 °C to +125 °C
SSOP16
plastic shrink small outline package; 16 leads;
body width 5.3 mm
SOT338-1
74HCT253N
74HC253D
74HCT253D
74HC253DB
74HCT253DB
5. Functional diagram
1
6
5
4
3
6
5
4
3
10
11
12
14
13
2
1I0 1I1 1I2 1I3 2I0 2I1 2I2 2I3
S0
10
2
S1
11
1
1OE
12
14
15
Fig 1.
2OE
Logic symbol
74HC_HCT253_3
Product data sheet
13
1Y
2Y
7
9
1OE
1I0
1I1
1I2
1Y
MUX
7
1I3
S0
S1
2I0
2I1
2I2
2Y
MUX
9
2I3
2OE
15
001aal850
Fig 2.
001aal851
Functional diagram
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
2 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
1OE
1I3
1I2
1I1
1I0
S0
S1
2I3
2I2
1Y
Fig 3.
2I1
2Y
2I0
2OE
001aal852
Logic diagram
6. Pinning information
6.1 Pinning
74HC253
74HCT253
1OE
1
16 VCC
S1
2
15 2OE
1I3
3
14 S0
1I2
1I1
1I0
5
6
7
GND
8
1OE
1
16 VCC
S1
2
15 2OE
1l3
3
14 S0
12 2I2
1l2
4
13 2l3
11 2I1
1l1
5
12 2l2
1l0
6
11 2l1
1Y
7
10 2l0
GND
8
13 2I3
4
1Y
74HC253
74HCT253
10 2I0
9
2Y
Pin configuration DIP16, SO16
74HC_HCT253_3
Product data sheet
2Y
001aal854
001aal853
Fig 4.
9
Fig 5.
Pin configuration SSOP16
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
3 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
1OE, 2OE
1, 15
output enable inputs (active LOW)
S0, S1
14, 2
data select inputs
1I0, 1I1, 1I2, 1I3
6, 5, 4, 3
data inputs source 1
1Y
7
multiplexer output source 1
GND
8
ground (0 V)
2Y
9
multiplexer output source 2
2I0, 2I1, 2I2, 2I3
10, 11, 12, 13
data inputs source 2
VCC
16
supply voltage
7. Functional description
Table 3.
Function table[1]
select Inputs
data inputs
output enable
output
S0
S1
nI0
nI1
nI2
nI3
nOE
nY
X
X
X
X
X
X
H
Z
L
L
L
X
X
X
L
L
L
L
H
X
X
X
L
H
H
L
X
L
X
X
L
L
H
L
X
H
X
X
L
H
L
H
X
X
L
X
L
L
L
H
X
X
H
X
L
H
H
H
X
X
X
L
L
L
H
H
X
X
X
H
L
H
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
IIK
input clamping current
VI < −0.5 V or VI > VCC + 0.5 V
IOK
output clamping current
VO < −0.5 V or VO > VCC + 0.5 V
IO
output current
−0.5 V < VO < VCC + 0.5 V
-
±35
mA
ICC
supply current
-
70
mA
IGND
ground current
−70
-
mA
Tstg
storage temperature
−65
+150
°C
74HC_HCT253_3
Product data sheet
Conditions
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
Min
Max
Unit
−0.5
+7.0
V
[1]
-
±20
mA
[1]
-
±50
mA
© NXP B.V. 2010. All rights reserved.
4 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
Table 4.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Ptot
total power dissipation
Tamb = −40 °C to +125 °C
[1]
Min
Max
Unit
DIP16 package
[2]
-
750
mW
SO16 package
[3]
-
500
mW
SSOP16 package
[4]
-
500
mW
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
Ptot derates linearly with 12 mW/K above 70 °C.
[3]
Ptot derates linearly with 8 mW/K above 70 °C.
[4]
Ptot derates linearly with 5.5 mW/K above 60 °C.
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter
Conditions
VCC
supply voltage
VI
input voltage
VO
output voltage
Tamb
ambient temperature
Δt/ΔV
input transition rise and fall rate
74HC253
74HCT253
Unit
Min
Typ
Max
Min
Typ
Max
2.0
5.0
6.0
4.5
5.0
5.5
V
0
-
VCC
0
-
VCC
V
0
-
VCC
0
-
VCC
V
−40
-
+125
−40
-
+125
°C
VCC = 2.0 V
-
-
625
-
-
-
ns/V
VCC = 4.5 V
-
1.67
139
-
1.67
139
ns/V
VCC = 6.0 V
-
-
83
-
-
-
ns/V
10. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 °C
Conditions
Min
Typ
−40 °C to +85 °C −40 °C to +125 °C Unit
Max
Min
Max
Min
Max
74HC253
VIH
VIL
HIGH-level
input voltage
LOW-level
input voltage
74HC_HCT253_3
Product data sheet
VCC = 2.0 V
1.5
1.2
-
1.5
-
1.5
-
V
VCC = 4.5 V
3.15
2.4
-
3.15
-
3.15
-
V
VCC = 6.0 V
4.2
3.2
-
4.2
-
4.2
-
V
VCC = 2.0 V
-
0.8
0.5
-
0.5
-
0.5
V
VCC = 4.5 V
-
2.1
1.35
-
1.35
-
1.35
V
VCC = 6.0 V
-
2.8
1.8
-
1.8
-
1.8
V
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
5 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VOH
VOL
HIGH-level
output voltage
LOW-level
output voltage
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
IO = −20 μA; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = −20 μA; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = −20 μA; VCC = 6.0 V
5.9
6.0
-
5.9
-
5.9
-
V
IO = −6.0 mA; VCC = 4.5 V
3.98
4.32
-
3.84
-
3.7
-
V
IO = −7.8 mA; VCC = 6.0 V
5.48
5.81
-
5.34
-
5.2
-
V
IO = 20 μA; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 20 μA; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 20 μA; VCC = 6.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 6.0 mA; VCC = 4.5 V
-
0.15
0.26
-
0.33
-
0.4
V
IO = 7.8 mA; VCC = 6.0 V
-
0.16
0.26
-
0.33
-
0.4
V
VI = VIH or VIL
VI = VIH or VIL
II
input leakage
current
VI = VCC or GND;
VCC = 6.0 V
-
-
±0.1
-
±1.0
-
±1.0
μA
IOZ
OFF-state
output current
VI = VIH or VIL;
VO = VCC or GND;
VCC = 6.0 V
-
-
±0.5
-
±5.0
-
±10.0
μA
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
8.0
-
80
-
160
μA
CI
input
capacitance
-
3.5
-
pF
74HCT253
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
2.0
1.6
-
2.0
-
2.0
-
V
VIL
LOW-level
input voltage
VCC = 4.5 V to 5.5 V
-
1.2
0.8
-
0.8
-
0.8
V
VOH
HIGH-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = −20 μA
4.4
4.5
-
4.4
-
4.4
-
V
IO = −6 mA
3.98
4.32
-
3.84
-
3.7
-
V
IO = 20 μA
-
0
0.1
-
0.1
-
0.1
V
IO = 6.0 mA
-
0.15
0.26
-
0.33
-
0.4
V
VOL
LOW-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
II
input leakage
current
VI = VCC or GND;
VCC = 5.5 V
-
-
±0.1
-
±1.0
-
±1.0
μA
IOZ
OFF-state
output current
VI = VIH or VIL; VCC = 5.5 V;
VO = VCC or GND per input
pin; other inputs at VCC or
GND; IO = 0 A
-
-
±0.5
-
±5.0
-
±10
μA
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
8.0
-
80
-
160
μA
74HC_HCT253_3
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
6 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
ΔICC
CI
additional
supply current
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
per input pin; 1In, 2In
inputs
-
40
144
-
180
-
196
μA
per input pin; nOE input
-
110
396
-
495
-
539
μA
per input pin; Sn input
-
110
396
-
495
-
539
μA
-
3.5
-
VI = VCC − 2.1 V;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V;
IO = 0 A
input
capacitance
pF
11. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8.
Symbol Parameter
25 °C
Conditions
−40 °C to
+85 °C
−40 °C to Unit
+125 °C
Typ
Max
Max
Max
VCC = 2.0 V
55
175
220
265
ns
VCC = 4.5 V
20
35
44
53
ns
VCC = 5.0 V; CL = 15 pF
17
-
-
-
ns
VCC = 6.0 V
16
30
37
45
ns
74HC253
tpd
propagation delay
1ln to 1Y or 2ln to 2Y;
see Figure 6
[1]
Sn to nY; see Figure 6
VCC = 2.0 V
58
175
220
265
ns
VCC = 4.5 V
21
35
44
53
ns
VCC = 5.0 V; CL = 15 pF
18
-
-
-
ns
17
30
37
45
ns
VCC = 2.0 V
30
100
125
150
ns
VCC = 4.5 V
11
20
25
30
ns
9
17
21
26
ns
VCC = 2.0 V
41
150
190
225
ns
VCC = 4.5 V
15
30
38
45
ns
VCC = 6.0 V
12
26
33
38
ns
VCC = 6.0 V
ten
enable time
nOE to nY; see Figure 7
[2]
VCC = 6.0 V
tdis
disable time
74HC_HCT253_3
Product data sheet
nOE to nY; see Figure 7
[3]
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
7 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8.
Symbol Parameter
tt
transition time
25 °C
Conditions
power dissipation
capacitance
−40 °C to Unit
+125 °C
Typ
Max
Max
Max
VCC = 2.0 V
14
60
75
90
ns
VCC = 4.5 V
5
12
15
18
ns
4
10
13
15
ns
55
-
VCC = 4.5 V
20
38
48
VCC = 5.0 V; CL = 15 pF
17
-
-
VCC = 4.5 V
22
40
50
VCC = 5.0 V; CL = 15 pF
19
-
14
30
38
45
ns
13
30
38
45
ns
5
12
15
18
ns
55
-
[4]
see Figure 6
VCC = 6.0 V
CPD
−40 °C to
+85 °C
per multiplexer;
VI = GND to VCC
[5]
1ln to 1Y or 2ln to 2Y;
see Figure 6
[1]
pF
74HCT253
propagation delay
tpd
57
ns
ns
Sn to nY; see Figure 6
ten
enable time
nOE to nY; VCC = 4.5 V; see
Figure 7
[2]
tdis
disable time
nOE to nY; VCC = 4.5 V;
see Figure 7
[3]
tt
transition time
VCC = 4.5 V; see Figure 6
power dissipation
capacitance
CPD
[1]
tpd is the same as tPHL, tPLH.
[2]
ten is the same as tPZH, tPZL.
[3]
tdis is the same as tPHZ, tPLZ.
[4]
tt is the same as tTHL, tTLH.
[5]
per multiplexer;
VI = GND to VCC
[5]
60
ns
ns
pF
CPD is used to determine the dynamic power dissipation (PD in μW).
PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
∑(CL × VCC2 × fo) = sum of outputs.
74HC_HCT253_3
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
8 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
12. Waveforms
VI
VM
Sn, 1In, 2ln input
VM
GND
tPHL
tPLH
VOH
90 %
VM
nY output
VM
10 %
VOL
tTHL
tTLH
001aal855
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6.
Propagation delays input (Sn, 1In, 2In) to output (nY) and output (nY) transition times
tr
VI
nOE input
tf
90 %
VM
GND 10 %
tPLZ
output
LOW-to-OFF
OFF-to-LOW
tPZL
VCC
VM
10 %
VOL
tPHZ
VOH
tPZH
90 %
output
HIGH-to-OFF
OFF-to-HIGH
VM
GND
outputs
enabled
outputs
disabled
outputs
enabled
001aal856
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7.
3-state output enable and disable times
Table 8.
Measurement points
Type
Input
Output
VM
VM
74HC253
0.5VCC
0.5VCC
74HCT253
1.3 V
1.3 V
74HC_HCT253_3
Product data sheet
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Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
9 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VCC
VCC
VI
G
VO
RL
S1
open
DUT
RT
CL
001aad983
Measurement points are given in Table 8 and test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistor.
Fig 8.
Test circuit for switching times
Table 9.
Type
Test data
Input
Load
Switch position
VI
tr, tf
CL
RL
tPHL, tPLH
tPZH, tPHZ
tPZL, tPLZ
74HC253
VCC
6 ns
50 pF
1 kΩ
open
GND
VCC
74HCT253
3V
6 ns
50 pF
1 kΩ
open
GND
VCC
74HC_HCT253_3
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
10 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
13. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
b2
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches
0.17
0.02
0.13
0.068
0.051
0.021
0.015
0.049
0.033
0.014
0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
95-01-14
03-02-13
SOT38-4
Fig 9.
EUROPEAN
PROJECTION
Package outline SOT38-4 (DIP16)
74HC_HCT253_3
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
11 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 10. Package outline SOT109-1 (SO16)
74HC_HCT253_3
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
12 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
D
SOT338-1
E
A
X
c
y
HE
v M A
Z
9
16
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
8
1
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
1.00
0.55
8
o
0
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT338-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-150
Fig 11. Package outline SOT338-1 (SSOP16)
74HC_HCT253_3
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
13 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
14. Abbreviations
Table 10.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
15. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74HC_HCT253_3
20100422
Product data sheet
-
74HC_HCT253_CNV_2
Modifications:
74HC_HCT253_CNV_2
74HC_HCT253_3
Product data sheet
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
Legal texts have been adapted to the new company name where appropriate.
970828
Product specification
-
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
-
© NXP B.V. 2010. All rights reserved.
14 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. The product is not designed, authorized or warranted to be
74HC_HCT253_3
Product data sheet
suitable for use in medical, military, aircraft, space or life support equipment,
nor in applications where failure or malfunction of an NXP Semiconductors
product can reasonably be expected to result in personal injury, death or
severe property or environmental damage. NXP Semiconductors accepts no
liability for inclusion and/or use of NXP Semiconductors products in such
equipment or applications and therefore such inclusion and/or use is at the
customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
15 of 17
74HC253; 74HCT253
NXP Semiconductors
Dual 4-input multiplexer; 3-state
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74HC_HCT253_3
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 22 April 2010
© NXP B.V. 2010. All rights reserved.
16 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 22 April 2010
Document identifier: 74HC_HCT253_3