55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-GW20-Y Features Description ?SUBMINIATURE PACKAGE. The Super Bright Yellow source color devices are made ?WIDE VIEWING ANGLE. ?LONG LIFE - SOLID STATE RELIABILITY. SUBMINIATURE SOLID STATE LAMP ?LOW PACKAGE PROFILE. ?PACKAGE : with DH InGaAlP on GaAs substrate Light Emitting Diode. 1000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. REV NO: V.2 DATE: NOV/13/2002 PAGE: 1 OF 4 Selection Guide P Pa a art rt N No. No o.. S UPER BRIGHTYELLOW (InGaAIP) GHB-GW20-Y m c dd) v ((mcd) IIv (mc @ 20 mA Lens Typ L e ens nss T Tyy p e Diic ce WATER CLEAR ng ew iin V Viewin Viiiew Angle Miin n. in. T Typ Tyyyp pp.. 110 7 00 20° Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C its Un nit t io nss o n d iition T Test e est ss t C Cond 590 nm I F =20mA Super Bright Yellow 588 nm I F =20mA Spectral Line Half-width Super Bright Yellow 28 nm I F =20mA C Capacitance Super Bright Yellow 25 pF V F =0V;f =1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V I F =20mA IR Reverse Current Super Bright Yellow 10 uA V R = 5V S Sy yymbo ymbol mb o l P Pa a aramete r a m e t er peak Peak Wavelength Super Bright Yellow D Dominate Wavelength 1/2 ev ic e De evic TTyyyp pp.. xx.. ax Ma Absolute Maximum Ratings at TA=25 C Y Yello w g h t Ye B Br Br igh S Su up u uper pe err Bri Brigh Yellow Yello n its U Unit nit Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating/Storage Temperature -40 C To +85 C P Paramet Pa a arameter r am e t er Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. REV NO: V.2 DATE: NOV/13/2002 PAGE: 2 OF 4 REV NO: V.2 DATE: NOV/13/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE: NOV/13/2002 PAGE: 4 OF 4