55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-SOT23-Y Features Description !SOT-23 The Super Bright Yellow source color devices are !LOW PACKAGE SURFACE MOUNT LED LAMP. made with DH InGaAlP on GaAs substrate Light Emitting POWER CONSUMPTION. !LONG Diode. LIFE - SOLID STATE RELIABILITY. !PACKAGE: 2000PCS / REEL. SOT-23 SURFACE MOUNT LED LAMP Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. REV NO: V.1 DATE:DEC/28/2002 PAGE: 1 OF 4 Selection Guide P Pa a art rt N No. No o.. SUPER BRIGHT YELLOW (InGaAlP) GHB-SOT23-Y IIv v ((mcd) (mcd m c dd) @ 20 mA Lens Typ L e ens nss T Tyy p e D iic ce WATER CLEAR V Viewin Viiiewing ew i n g Angle in. Miin n. T Typ Tyyyp pp.. 2 1 1///2 2 50 100 140° Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C S Sy yymbo ymbol mb o l P Pa a aramete r a m e t er De evic ev ic e peak Peak Wavelength Super Bright Yellow D D ominate Wavelength 1/2 TTyyyp pp.. Ma ax xx.. Un nit its T Test e est ss t C Cond o n d iition t io nss 590 nm IF =20mA Super Bright Yellow 588 nm IF =20mA Spectral Line Half-width Super Bright Yellow 28 nm IF =20mA C C apacitance Super Bright Yellow 25 pF V F =0V;f=1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V IF =20mA IR Reverse Current Super Bright Yellow 10 uA VR = 5V Absolute Maximum Ratings at TA=25 C Y Yello w h t Ye B Br ig S Su u up uper pe err Br Bright Bri gh Yellow Yello n its U Unit nit Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating/Storage Temperature -40 C To +85 C P Paramet Pa a arameter r am e t er Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. REV NO: V.1 DATE:DEC/28/2002 PAGE: 2 OF 4 REV NO: V.1 DATE:DEC/28/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.1 DATE:DEC/28/2002 PAGE: 4 OF 4