55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-0805-DR Features Description !2.0mmx1.25mm SMT !LOW LED,1.1mm THICKNESS. The Super Bright Red source color devices are POWER CONSUMPTION. !WIDE !IDEAL made with Gallium Aluminum Arsenide Red Light VIEWING ANGLE. Emitting Diode. FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2.0x1.25mm SMD CHIP LED LAMP 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.3 DATE: DEC/10/2002 PAGE: 1 OF 4 Selection Guide o.. P Pa a art rt N No. No ce D iic SUPER BRIGHT RED( GaAlAs) GHB-0805-DR m c dd) v ((mcd IIv (mcd) @ 20 mA L Lens e ens nss T Typ Tyy p e WATER CLEAR ew i n g V Viewin Viiiewing Angle in. Miin n. T Typ Tyyyp pp.. 36 100 120° Note: 1 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C S Sy yymbo ymbol mb o l P Pa a aramete r a m e t er De evic ev ic e peak Peak Wavelength Super Bright Red D D ominate Wavelength 1/2 TTyyyp pp.. Ma ax xx.. Un nit its T Test e est ss t C Cond o n d iition t io nss 660 nm I F =20mA Super Bright Red 640 nm I F =20mA Spectral Line Half-width Super Bright Red 20 nm I F =20mA C C apacitance Super Bright Red 45 pF VF=0V;f=1MHz VF Forward Voltage Super Bright Red 1.85 2.5 V I F =20mA IR Reverse Current Super Bright Red 10 uA VR = 5V Absolute Maximum Ratings at TA=25 C P Paramete Pa a arameter r a m e t er S Su u uper uper p er Br Bright Bright Red Re B Br ig h t R ed U Unit nit n its Power dissipation 100 mW DC Forward Current 30 mA Peak Forward Current [1] 155 mA Reverse Voltage 5 V Operating/Storage Temperature -40 C To +85 C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. REV NO: V.3 DATE: DEC/10/2002 PAGE: 2 OF 4 REV NO: V.3 DATE: DEC/10/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.3 DATE: DEC/10/2002 PAGE: 4 OF 4