H 400 V/10 Ohm, General Purpose, 1 Form A, Solid State Relay Technical Data HSSR-8400 Features Description • Compact Solid-State Bidirectional Switch • Normally-Off Single-Pole Relay Function (1 Form-A) • 400 V Output Withstand Voltage in Both Polarities at 25°C • 150/300 mA Current Ratings (See Schematic for Connection A & B) • Low Input Current; CMOS Compatibility • Very Low On-Resistance: 6 Ω Typical at 25°C • ac/dc Signal & Power Switching • Input-to-Output Momentary Withstand Insulation Voltage: 2500 Vac, 1 Minute • 16-kV ESD Immunity: MILSTD-883, Method 3015 • CSA Approved • UL 508 Recognized The HSSR-8400 consists of a high-voltage circuit, optically coupled with a Light-Emitting Diode (LED). This device is a solid-state replacement for singlepole, normally-open (1 Form A) electromechanical relays used for general purpose switching of signals and low-power ac/dc loads. The relay turns on (contact closes) with a minimum input current, IF , of 5 mA through the input LED. The relay turns off (contact opens) with an input voltage, VF , of 0.8 V or less. The detector contains a high speed photosensitive FET driver circuit and two high voltage MOSFETs. Applications • Modems • Telecommunication Switching Equipment • Telecommunication Test Instruments • Reed Relay Replacement • 110/220 Vac Load Driver • Industrial Relay Coil Driver This relay’s logic-level input con– trol and very low typical output on-resistance of 6 Ω make it suitable for switching of audio frequency signals in telecom applications. Connection A, as shown in the schematic, allows the relay to switch either ac or dc loads. In this configuration, the 150 mA output current rating allows it to switch small loads that are driven from 110 Vac and 220 Vac power lines. Connection B, with the polarity and pin configuration as indicated in the schematic, allows the relay to switch dc loads only. The advantage of Connection B is that the on-resistance is significantly reduced and the output current capability increases by a factor of two. The electrical and switching characteristics of the HSSR-8400 are specified from -40°C to +85°C. Functional Diagram TRUTH TABLE (POSITIVE LOGIC) LED ON OFF OUTPUT L H CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 5965-3573E 1-465 Selection Guide 6-Pin DIP (300 Mil) Single Channel Package HSSR-8400 HSSR-8060[1] 4-Pin DIP (300 Mil) Dual Channel Package HSSR-8200[1] Maximum Maximum ON Speed Resistance t(ON) R(ON) Ω msec 25°C 25°C 0.95 10 1.4 0.7 1.5 200 6 1 Maximum Output Voltage VO(off) V 25°C 400 60 200 90 Maximum Output Current Io(ON) mA 25°C 150 750 40 800 Minimum Input Current mA 5 5 1 5 Hermetic 8-Pin Single Channel Packages HSSR-7110[1] Note: 1. Technical data are on separate HP publication. Ordering Information: Specify part number followed by Option Number (if desired). HSSR-8400#XXX 300 = Gull Wing Surface Mount Lead Option 500 = Tape/Reel Package Option (1 Kmin.) Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for information. Schematic 6 + 1 VF IF SWITCH DRIVER 5 – 2 4 1-466 Outline Drawing 6-Pin DIP Package 7.36 (0.290) 7.88 (0.310) 9.40 (0.370) 9.90 (0.390) 6 5 4 PIN ONE DOT 1 2 0.20 (0.008) 0.33 (0.013) DATE CODE HP RXXXX YYWW TYPE NUMBER RU UL RECOGNITION 5° TYP. 3 6.10 (0.240) 6.60 (0.260) 1.78 (0.070) MAX. 4.70 (0.185) MAX. 0.51 (0.020) MIN. 2.92 (0.115) MIN. 2.16 (0.085) 2.54 (0.100) 0.45 (0.018) 0.65 (0.025) 2.28 (0.090) 2.80 (0.110) DIMENSIONS IN MILLIMETERS AND (INCHES). 1-467 6-Pin Device Outline Drawing Option #300 (Gull Wing Surface Mount) 9.65 ± 0.25 (0.380 ± 0.010) PAD LOCATION (FOR REFERENCE ONLY) 4.826 (0.190) TYP. TYPE NUMBER HP RXXXX 6.35 ± 0.25 (0.250 ± 0.010) DATE CODE 9.398 (0.370) 9.906 (0.390) YYWW 0.381 (0.015) 0.635 (0.025) 1.194 (0.047) 1.778 (0.070) 9.65 ± 0.25 (0.380 ± 0.010) 1.78 (0.070) MAX. 7.62 ± 0.25 (0.300 ± 0.010) 0.635 ± 0.130 (0.025 ± 0.005) 0.20 (0.008) 0.33 (0.013) 4.19 MAX. (0.165) 0.635 ± 0.25 (0.025 ± 0.010) 2.54 (0.100) TYP. 2.29 (0.090) 12° NOM. [3] [5] DIMENSIONS IN mm (INCHES) TOLERANCES: xx.xx = 0.01 xx.xxx = 0.001 (unless otherwise specified) LEAD COPLANARITY MAXIMUM: 0.102 (0.004) HSSR-8400 Outline – Option 300 TEMPERATURE – °C Thermal Profile (Option #300) 260 240 220 200 180 160 140 120 100 80 60 40 20 0 ∆T = 145°C, 1°C/SEC ∆T = 115°C, 0.3°C/SEC ∆T = 100°C, 1.5°C/SEC 0 1 2 3 4 5 6 7 8 9 TIME – MINUTES Figure 1. Maximum Solder Reflow Thermal Profile. (Note: Use of non-chlorine activated fluxes is recommended.) 1-468 10 11 12 Regulatory Information UL Recognized under UL 508, Component Recognition Program, Industrial Control Switches, File E142465. The HSSR-8400 has been approved by the following organizations: CSA Approved under CAN/CSA-C22.2 No. 14-95, Industrial Control Equipment, File LR 87683. Insulation and Safety Related Specifications Parameter Symbol Value Units Conditions Min. External Air Gap (External Clearance) L(IO1) 7.0 mm Measured from input terminals to output terminals, shortest distance through air Min. External Tracking Path (External Creepage) L(IO2) 8.5 mm Measured from input terminals to output terminals, shortest distance path along body 0.5 mm Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity 200 volts DIN IEC 112/VDE 0303 PART 1 Min. Internal Plastic Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) Isolation Group CTI IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 – surface mount classification is Class A in accordance with CECC 00802. Absolute Maximum Ratings Thermal Resistance Storage Temperature ................................................... -55°C to+125°C Operating Temperature - TA .......................................... -40°C to +85°C Case Temperature - TC .......................................................... +105°C[1] Lead Solder Temperature .... 260°C for 10 S (1.6 mm below seating plane) Average Input Current - IF ............................................................ 20 mA Repetitive Peak Input Current - IF ............................................... 40 mA (Pulse Width ≤ 1 ms; duty cycle ≤ 50%) Transient Peak Input Current - IF ............................................... 100 mA (Pulse Width ≤ 200 µs; duty cycle ≤ 1%) Reverse Input Voltage - VR ................................................................ 3 V Input Power Dissipation .............................................................. 40 mW Output Voltage (TA = 25°C) Connection A - VO ..................................................... - 400 to +400 V Connection B - VO ........................................................... 0 to +400 V Average Output Current - Figure 3 (TA = 25°C, TC ≤ 70°C) Connection A - IO ..................................................................... 0.15 A Connection B - IO ....................................................................... 0.3 A Single Shot Peak Output Current (100 ms pulse width, TA = 25°C, IF = 10 mA) Connection A - IO ...................................................................... 1.0 A Connection B - IO ...................................................................... 2.0 A Output Power Dissipation ..................................................... 750 mW[2] Infrared and Vapor Phase Reflow Temperature (Option #300) ......................................... See Fig. 1, Thermal Profile Typical Output MOSFET Junction to Case – θJC = 55°C/W Demonstrated ESD Performance Human Body Model: MIL-STD883 Method 3015.7 - 16 kV Machine Model: EIAJ 1988.3.28 Version 2), Test Method 20, Condition C – 1200 V 1-469 Recommended Operating Conditions Parameter Input Current (ON) Input Voltage (OFF) Operating Temperature Output Voltage Connection A Connection B Output Current Connection A Connection B Symbol IF(ON) VF(OFF) TA Min. 5 0 -40 Max. 20 0.8 +85 Units mA Volt °C VO(OFF) -370 0 370 370 Volt IO(ON) -150 -300 150 300 mA DC Electrical Specifications For -40oC ≤ TA ≤ +85°C unless otherwise specified. All Typicals at TA = 25°C. Parameter Output Withstand Voltage Output OnResistance Connection Sym. Min. A |VO(OFF)| 400 1-470 Max. Units V 6 10 Ω 1.5 2.5 15 3.8 1.0 370 A R(ON) B Output Leakage Current Output OffCapacitance Output Offset Voltage Input Reverse Breakdown Voltage Input Forward Voltage Input Diode Temperature Coefficient Input Capacitance Typ. Test Conditions VF = 0.8 V, IO = 250 µA, TA = 25°C VF = 0.8 V, IO = 250 µA IF = 10 mA, IO = 150 mA (pulse duration ≤ 30 ms), TA = 25oC IF = 10 mA, IO = 150 mA (pulse duration ≤ 30 ms) VF = 0.8 V, VO = 400 V, TA = 25°C A B A IO(OFF) 6 x 10-4 A C(OFF) 60 pF A |VOS| 1 µV VF = 0.8 V, VO = 25 V, f = 1 MHz IF = 5 mA, IO = 0 mA V IR = 100 µA V IF = 10 mA, TA = 25°C VR 3 VF 1.3 1.6 1.85 µA ∆VF /∆TA -1.3 mV/ oC CIN 72 pF IF = 10 mA VF = 0 V, f = 1 MHz Fig. Notes 5 6,7 3 13 14 18 15 4 Switching Specifications For -40°C ≤ TA ≤ +85°C with Connection A, unless otherwise specified. All Typicals at TA = 25°C. Parameter Symbol Min. Typ. Max. Units Test Conditions Fig. Notes Turn On Time tON 0.5 0.95 ms IF = 10 mA, VDD = 400 V, 2,8, 7 IO = 150 mA, TA = 25°C 9,10, 20,21 1.2 ms IF = 10 mA, VDD = 370 V, IO = 150 mA Turn Off Time tOFF 0.013 0.1 ms IF = 10 mA, VDD = 400 V, 2,8, IO = 150 mA, TA = 25°C 11,12, 20,21 0.1 IF = 10 mA, VDD = 370 V, IO = 150 mA Output |dVO /dt| 1000 V/µs V(peak) = 100 V, RM ≥ 1 MΩ, 16 Transient CM = 1000 pF, TA = 25°C Rejection Input-Output |dVI-O /dt| 2500 V/µs VDD = 5 V, VI-O(peak) = 1000 V, 17 Transient RL = 1 kΩ, CL = 25 pF, Rejection TA = 25°C Package Characteristics For 0°C ≤ TA ≤ +70°C with Connection A, unless otherwise specified. All Typicals at TA = 25°C. Parameter Symbol Min. Typ. Max. Units Test Conditions Fig. Notes Input-Output VISO 2500 V rms RH ≤ 50%, t = 1 min, TA = 25°C 5,6 Momentary Withstand Voltage* Resistance RI-O 100 GΩ VI-O = 500 Vdc, t = 1 min, 5 Input-Output RH = 45% Capacitance CI-O 1.0 pF VI-O = 0 V, f = 1 MHz 5 Input-Output *The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification, or HP Application Note 1074, “Optocoupler Input-Output Endurance Voltage.” Notes: 1. The case temperature, TC, is measured at the center of the bottom of the package. 2. For derating, see Figure 4. The output power PO derating curve is obtained when the part is handling the maximum average output current IO as shown in Figure 3. 3. During the pulsed RON measurement (IO duration ≤ 30 ms), ambient (TA) and case temperature (TC) are equal. 4. VOS is a function of IF, and is defined between pins 4 and 6, with pin 4 as the reference. VOS must be measured in a stable ambient (free of temperature gradients). 5. Device considered a two terminal device: pins 1, 2, and 3 shorted together and pins 4, 5, and 6 shorted together. 6. This is a momentary withstand proof test. These parts are 100% tested in production at 3000 V rms, one second. 7. For a faster turn-on time, the optional peaking circuit shown in Figure 2 may be implemented. 1-471 Figure 2. Recommended Input Circuit. 0.30 IO – OUTPUT CURRENT – A CONNECTION A IF = 10 mA θCA = 40 °C/W θCA = 100 °C/W 0.20 0.15 0.10 SAFE OPERATING AREA 0 -40 -30 0 20 40 60 80 85 100 TA – AMBIENT TEMPERATURE –°C Figure 3A. Maximum Average Output Current Rating vs. Ambient Temperature. Figure 3B. Maximum Average Output Current Rating vs. Case Temperature. Figure 4. Output Power Derating vs. Case Temperature. Figure 5. Normalized Typical Output Withstand Voltage vs. Temperature. Figure 6. Normalized Typical Output Resistance vs. Temperature. Figure 7. Typical On State Output I-V Characteristics. 1-472 Figure 8. Switching Test Circuit for tON, tOFF. Figure 9. Typical Turn On Time vs. Temperature. Figure 10. Typical Turn On Time vs. Input Current. Figure 11. Typical Turn Off Time vs. Temperature. Figure 12. Typical Turn Off Time vs. Input Current. 1-473 CONNECTION A VF(OFF) = 0.8 V VO(OFF) = 370 V Figure 13. Typical Output Leakage vs. Temperature. Figure 14. Typical Output Capacitance vs. Output Voltage. Figure 16. Output Transient Rejection Test Circuit. 1-474 Figure 15. Typical Input Forward Current vs. Input Forward Voltage. Figure 17. Input-Output Transient Rejection Test Circuit. Tjo T11 T12 Tjd TC TA θCA = = = = = LED JUNCTION TEMPERATURE FET 1 JUNCTION TEMPERATURE FET 2 JUNCTION TEMPERATURE FET DRIVER JUNCTION TEMPERATURE CASE TEMPERATURE ( MEASURED AT CENTER OF PACKAGE BOTTOM) = AMBIENT TEMPERATURE (MEASURED 15 cm AWAY FROM THE PACKAGE) = CASE-TO-AMBIENT THERMAL RESISTANCE ALL THERMAL RESISTANCE VALUES ARE IN °C/W. Figure 18. Voltage Offset Test Setup. Figure 19. Thermal Model. 1-475 Figure 20. Turn On Time Variation with High Temperature Operating Life. Figure 21. Turn On Time Variation with Temperature Cycling. 1-476 Applications Information Thermal Model The steady state thermal model for the HSSR-8400 is shown in Figure 19. The thermal resistance values given in this model can be used to calculate the temperatures at each node for a given operating condition. The thermal resistances between the LED and other internal nodes are very large in comparison with the other terms and are omitted for simplicity. The components do, however, interact indirectly through θCA, the case-to-ambient thermal resistance. All heat generated flows through θCA, which raises the case temperature TC accordingly. The value of θCA depends on the conditions of the board design and is, therefore, determined by the designer. The typical value for each output MOSFET junction-to-case thermal resistance is specified as 55°C/W. This is the thermal resistance from one MOSFET junction to the case when power is dissipated equally in the MOSFETs. The power dissipation in the FET Driver is negligible in comparison to the MOSFETs. On-Resistance and Derating Curves The output on-resistance, RON, specified in this data sheet, is the resistance measured across the output contact when a pulsed current signal (IO = 150 mA) is applied to the output pins. The use of a pulsed signal (≤ 30 ms) implies that each junction temperature is equal to the ambient and case temperatures. The steadystate resistance, RSS, on the other hand, is the value of the resistance measured across the output contact when a DC current signal is applied to the output pins for a duration sufficient to reach thermal equilibrium. RSS includes the effects of the temperature rise of each element in the thermal model. Derating curves are shown in Figures 3 and 4. Figure 3 specifies the maximum average output current allowable for a given ambient or case temperature. Figure 4 specifies the output power dissipation allowable for a given case temperature. Above a case temperature of 93°C, the maximum allowable output current and power dissipation are related by the expression RSS = PO(max)/(IO(max))2 from which RSS can be calculated. Staying within the safe area assures that the steady state junction temperatures remain less than 125°C. As an example, for a case temperature of 100°C, Figure 4 shows that the output power dissipation should be limited to less than 0.5 watts. A check with Figure 3B shows that the output current should be limited to less than 150 mA. This yields an RSS of 22 Ω. Turn On Time Variation For applications which are sensitive to turn on time, the designer should refer to Figures 20 and 21. These figures show that although there is very little variation in tON within most of the population, a portion of the distribution will vary with use. The optional peaking circuit shown in Figure 2 can be used to reduce the total turn on time and, consequently, any associated variation. 1-477