VISHAY RG4A

RG4A to RG4J
VISHAY
Vishay Semiconductors
Fast Sinterglass Diode
\
Features
• High temperature metallurgically bonded construction
• Cavity-free glass passivated junction
• Fast switching for high efficiency
• 3.0 ampere operation at Tamb = 50 °C with no thermal runaway
• Hermetically sealed package
17133
Mechanical Data
Case: Sintered glass case, G4
Terminals: Solder plated axial leads, solderable per
MIL-STD-750, Method 2026
Mounting Position: Any
Weight: 1040 mg
Parts Table
Part
Type differentiation
Package
RG4A
VRRM = 50 V
G4
RG4B
VRRM = 100 V
G4
RG4D
VRRM = 200 V
G4
RG4G
VRRM = 400 V
G4
RG4J
VRRM = 600 V
G4
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
Parameter
Reverse voltage = Repetitive peak reverse
voltage
Part
Symbol
Value
Unit
see electrical characteristics
Test condition
RG4A
VR =
VRRM
50
V
see electrical characteristics
RG4B
VR =
VRRM
100
V
see electrical characteristics
RG4D
VR =
VRRM
200
V
see electrical characteristics
RG4J
VR =
VRRM
400
V
see electrical characteristics
RG1J
VR =
VRRM
600
V
Maximum average forward rectified current
0.375 " (9.5 mm) lead length at Tamb = 55 °C
IF(AV)
3.0
A
Peak forward surge current
8.3 ms single half sine-wave superimposed
on rated load (JEDEC Method)
IFSM
100
A
Maximum average reverse current
at rated peak reverse voltage Tamb = 25 °C
IR(AV)
2.0
µA
at rated peak reverse voltage Tamb = 100 °C
IR(AV)
100
µA
TJ,
TSTG
- 55 to +
175
°C
Operating junction and storage temperature
range
Document Number 86076
Rev. 2, 28-Jan-03
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RG4A to RG4J
VISHAY
Vishay Semiconductors
Maximum Thermal Resistance
Tamb = 25 °C, unless otherwise specified
Parameter
Typical thermal resistance 1)
1)
Symbol
Value
Unit
RθJA
22
K/W
Thermal resistance from junction to ambient at 0.375 " (9.5 mm) lead length, with both leads attached to heat sink
Electrical Characteristics
Tamb = 25 °C, unless otherwise specified
Parameter
Test condition
Maximum instantaneous forward
voltage
IF = 3.0 A
Maximum reverse current
VR = VRRM
Maximum reverse recovery time
IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A
Typical junction capacitance
Part
Symbol
Typ.
VF
Max
Unit
1.3
V
IR
5.0
µA
RG4A
trr
150
ns
IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A
RG4B
trr
150
ns
IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A
RG4D
trr
150
ns
IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A
RG4G
trr
150
ns
IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A
RG4J
VR = 4.0 V, f = 1 MHz
trr
250
CJ
ns
50
pF
4.0
200
TA = 55°C
8.3ms Single Half Sine-Wave
(JEDEC Method)
Resistive or Inductive Load
Peak Forward Surge Current (A)
Average Forward Rectified Current (A)
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
3.0
2.0
1.0
100
0.375" (9.5mm) Lead Length
0
10
0
grg4a_01
25
50
75
100
125
150
Ambient Temperature (°C)
Figure 1. Forward Current Derating Curve
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2
175
1
grg4a_02
100
10
Number of Cycles at 60 HZ
Figure 2. Maximum Non-Repetitive Peak Forward Surge Current
Document Number 86076
Rev. 2, 28-Jan-03
RG4A to RG4J
VISHAY
Vishay Semiconductors
20
Instantaneous Forward Current (A)
10
1
TJ = 25°C
Pulse Width = 300µs
1% Duty Cycle
0.1
0.01
0.4
0.6
1.0
0.8
1.4
1.2
1.6
Instantaneous Forward Voltage (V)
grg4a_03
Figure 3. Typical Instantaneous Forward Characteristics
Instantaneous Reverse Current (µA)
10
TJ = 125°C
1
TJ = 75°C
0.1
TJ = 25°C
0.01
20
0
40
60
80
100
Percent of Rated Peak Reverse Voltage (V)
grg4a_04
Figure 4. Typical Reverse Characteristics
Junction Capacitance (pF)
100
TJ = 25°C
f = 1.0 MHZ
Vsig, 50mVp-p
50
10
10
1
100
Reverse Voltage (V)
grg4a_05
Figure 5. Typical Junction Capacitance
Document Number 86076
Rev. 2, 28-Jan-03
www.vishay.com
3
RG4A to RG4J
VISHAY
Vishay Semiconductors
Package Dimensions in Inches (mm)
0.180 (4.6)
1.0 (25.4)
MIN.
0.115 (2.9)
DIA.
0.300 (7.6)
MAX.
0.042 (1.07)
0.038 (0.962)
DIA.
1.0 (25.4)
MIN.
17032
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Document Number 86076
Rev. 2, 28-Jan-03
RG4A to RG4J
VISHAY
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and
operatingsystems with respect to their impact on the health and safety of our employees and the public, as
well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the
use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
Document Number 86076
Rev. 2, 28-Jan-03
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