VISHAY S07J

S07B / 07D / 07G / 07J / 07M
VISHAY
Vishay Semiconductors
Small Surface Mount Diodes
Features
•
•
•
•
For surface mounted applications
Low profile package
Ideal for automated placement
Glass passivated
17249
Packaging codes-options:
GS18 - 10 K per 13" reel (8 mm tape), 50 K/box
GS08 - 3 K per 7" reel (8 mm tape), 30 K/box
• High temperature soldering:
260 °C/ 10 seconds at terminals
Mechanical Data
Case: JEDEC -DO219-AB (SMF®) Plastic case
Polarity: Band denotes cathode end
Weight: approx. 0.01 g
Parts Table
Part
Marking
S07B
SB
S07D
SD
S07G
SG
S07J
SJ
S07M
SM
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
Parameter
Test condition
Maximum repetitive peak reverse voltage
Part
Symbol
Value
Unit
S07B
VRRM
100
V
S07D
VRRM
200
V
S07G
VRRM
400
V
S07J
VRRM
600
V
S07M
VRRM
1000
V
S07B
VRMS
70
V
S07D
VRMS
140
V
S07G
VRMS
280
V
S07J
VRMS
420
V
S07M
VRMS
700
V
S07B
VDC
100
V
S07D
VDC
200
V
S07G
VDC
400
V
S07J
VDC
600
V
S07M
VDC
1000
V
Maximum average forward rectified current T = 75 °C1)
tp
IF(AV)
1.5
A
1)
IF(AV)
0.7
A
IFSM
25
A
Maximum RMS voltage
Maximum DC blocking voltage
TA = 65 °C
Peak forward surge current 8.3 ms single
half sine-wave
1)
TL = 25 °C
Averaged over any 20 ms period
Document Number 85733
Rev. 1.8, 24-Mar-04
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S07B / 07D / 07G / 07J / 07M
VISHAY
Vishay Semiconductors
Thermal Characteristics
Tamb = 25 °C, unless otherwise specified
Parameter
Test condition
Symbol
Value
Unit
RθJA
180
K/W
TJ, TSTG
- 55 to + 150
°C
Thermal resistance junction to
ambient air2)
Operating junction and storage
temperature range
2)
Mounted on epoxy substrate with 3 x 3 mm CU pads (≥ 40 µm thick)
Electrical Characteristics
Tamb = 25 °C, unless otherwise specified
Parameter
Test condition
Maximum instantaneous
forward voltage
1.0 A3)
Maximum DC reverse current at TA = 25 °C
rated DC blocking voltage
Reverse recovery time
Max
Unit
VF
Min
Typ.
1.1
V
IR
10
µA
TA = 125 °C
IR
50
µA
IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A
trr
1.8
µs
Typical capacitance at 4 V, MHz
3)
Symbol
4
Cj
pF
Pulse test: 300 µ pulse width, 1 % duty cycle
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
1.2
Instantaneous Forward Current (mA)
1000
Average Forward Current (A)
Resistive or Inductive Load
1.0
0.8
0.6
0.4
0.2
3.0 x 3.0mm 40 µm
Thick Copper Pad Areas
0
17375
0
20
40
60
80
100
Ambient Temperature (jC)
Fig. 1 Forward Current Derating Curve
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120
140
TJ = 150°C
TJ = 100°C
100
600
160
17376
TJ = 25°C
700
800
900
1000
1100
Instantaneous Forward Voltage (mV)
Fig. 2 Typical Instantaneous Forward Characteristics
Document Number 85733
Rev. 1.8, 24-Mar-04
S07B / 07D / 07G / 07J / 07M
VISHAY
Vishay Semiconductors
Instantaneous Reverse Current (µA)
100
TJ = 150°C
10
TJ = 125°C
TJ = 100°C
1
TJ = 75°C
TJ = 50°C
0.1
TJ = 25°C
0.01
0
100
200
300
400
500
600
700
800
900
Instantaneous Reverse Voltage (V)
17377
Fig. 3 Typical Instantaneous Reverse Characteristics
10
9
8
C (pF)
7
6
5
4
3
2
1
0
17378
0
5
10
15
20
VR (V)
25
30
35
40
Fig. 4 Capacitance vs. Reverse Voltage
Document Number 85733
Rev. 1.8, 24-Mar-04
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S07B / 07D / 07G / 07J / 07M
VISHAY
Vishay Semiconductors
Package Dimensions in mm
Cathode Band
T op View
1.8 ± 0.1
1.0 ± 0.2
2.8 ± 0.1
5
0.05 - 0.30
0.98 ± 0.1
5
Detail Z
enlarged
Z
0.60 ± 0.25
0.00 - 0.10
3.7 ± 0.2
1.6
1.3
1.4
17247
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Document Number 85733
Rev. 1.8, 24-Mar-04
VISHAY
S07B / 07D / 07G / 07J / 07M
Vishay Semiconductors
Blistertape for SMF
PS
18513
Document Number 85733
Rev. 1.8, 24-Mar-04
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S07B / 07D / 07G / 07J / 07M
VISHAY
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and
operatingsystems with respect to their impact on the health and safety of our employees and the public, as
well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the
use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
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Document Number 85733
Rev. 1.8, 24-Mar-04