Hologram Unit HUL7001 Hologram Unit Unit : mm Index mark for No.1 pin on reverse side (4.8 × 8.2 × 4.3 mm) Y Reference plane Focus error signal detection : SSD method Reference plane Apparent emitting point SEC. X-O-Y Apparent emitting point Reference plane ,,,,,,, ,,,,, ,, 2.55±0.2 0.25 Lead frame 3.0±0.2 : 3-beam method Low-power semiconductor laser included 4.7±0.1 O (0.2) (0.5) Tracking error signal detection 12 11 10 X 9 8 7 ,,,,,, , Smaller package size achieved through micro-mirror integration 1 2 3 4 5 6 4.33±0.2 2.55±0.2 0.50 0.78±0.2 1.33±0.2 4.8±0.1 0.8×5=4.0±0.2 Features (0.3) 11.2±0.2 8.2±0.2 ø8.0 +0 –0.05 (0.35) For optical information processing 8.1±0.2 Applications SEC. X-O-Y CD (Note): 1.Standard corner R=0.20 max. 2.Thickness of plate:Ni 1µm min.+Au 0.1µm min. 3.Thickness of hologram=2.0mm, n=1.519 Absolute Maximum Ratings (Ta = 25˚C) Parameter Laser beam output Symbol Ratings Unit PO 0.3 mW Laser reverse voltage VR(LD) 2 V Monitor PD reverse voltage VR(mon) 12 V Signal processing PD reverse voltage VR 12 V Operating ambient temperature Topr – 10 to +60 ˚C Storage temperature Tstg – 40 to +85 ˚C Unit Characteristic Specifications (Tc = 25 ± 3˚C) Parameter min typ max Unit CW 20 30 40 mA Operating current IOP *1,2 CW IRF = 10µA, VR = 5V 25 Operating voltage VOP*1,2 CW IRF = 10µA, VR = 5V Threshold current Symbol Ith*1 Conditions 35 45 mA 1.9 2.4 V Laser beam output PO *1,2 IRF = 10µA, VR = 5V 0.15 0.22 mW Focus error signal amplitude IFE*1,3 IRF = 10µA, VR = 5V 7 10 13 µA Tracking error signal amplitude ITE *1,4 IRF = 10µA, VR = 5V 0.8 1.3 1.8 µA Focus error signal defocusing DFO*1,5 IRF = 10µA, VR = 5V –8 +8 % Tracking error signal symmetry BTE*1,4 IRF = 10µA, VR = 5V – 30 Focus error signal pull-in range DFE*1,3 IRF = 10µA, VR = 5V + 30 12 % µm *1 Measurements are made using the reference optical system during measurement and the radiant power measurement system on the hologram unit shown in Fig. 2. *2 It should be noted that the RF signal amplitude in these specifications is denoted by I , and represents the amplitude of the 11T RF signal. As in the case described in *1, IRF is measured using the measurement system shown in Fig. 2. *3 The definition is illustrated in Fig. 3. *4 The definition is illustrated in Fig. 4. *5 The definition is illustrated in Fig. 5. 1 HUL7001 Hologram Unit Characteristic Specifications for Semiconductor Laser, Monitor PD, and Signaling Processing PD (Tc = 25±3˚C) Parameter Symbol Conditions min typ max Unit 775 790 805 nm 0.5 0.9 0.7 1.2 VR = 2.5V 0.2 3.0 nA VR = 5V 0.3 30 nA Semiconductor laser Oscillating wavelength λL*6 CW IRF = 10µA, VR = 5V Coherence λ*6 CW IRF = 10µA, VR = 5V Monitor PD and signal processing PD IP(mon)*7 Monitor current CW IRF = 10µA, VR = 5V ID Dark current ID(mon)*8 Capacitance between pinss Shield frequency Ct(RF1)*9 0.3 VR = 2.5V, f = 1MHz Ct(RF2)*9 fC VR = 2.5V, RL = 50Ω mA 2 pF 3 pF 40 MHz *6 Measurements are made using the radiant power measurement system on the hologram unit. The definition is presented in Fig. 2. *7 Unless otherwise indicated, the values shown are per individual element. *8 The subscript (mon) denotes the element (monitor PD). *9 C t(RF1) denotes the capacitance measured at pin No. 4 or 10 in the electrode connection diagram. Ct(RF2) denotes the capacitance measured at pin No. 5 or 9 in the electrode connection diagram. Connection Diagram (Fig. 1) (a) Pin arrangement Pin Description Gritty face Represents No.1 pin carved seal on reverse side 1 2 3 4 5 6 Pin No. 12 11 10 9 8 7 TOP VIEW (b) Chip structure Pmon P1 P2 P3 P4 P5 LD P6 P7 P8 P9 P10 LD Pmon : Semiconductor laser chip : Monitor light detecting element P1 ~ P10 : Signal-detection lightdetecting-elements Pin No. Function 1 Source voltage Applications pin 2 Monitor current output pin IP (mon) 3 Tracking error signal output pin I1 + I6 RF and focus error signal 4 Monitor PD output current IP (mon) : Output current when light is received by Pmon element Focus error signal FE = (I2+I4+I8) – (I3+I7+I9) Disk-close FE > 0 Disk-far FE < 0 Tracking error signal TE = (I1+I6) – (I5+I10) The leading beam is the beam received by light detecting elements P1 and P6. RF signal RF = I2+I3+I4+I7+I8+I9 RF and focus error signal 5 I2 + I4 output pin 6 Source voltage Applications pin 7 Source voltage Applications pin 8 Tracking error signal output pin I5 + I10 RF and focus error signal 9 I7 + I9 output pin RF and focus error signal I8 output pin 11 LD + Power supply pin 12 GND pin Electrode Connection Diagram 1,6,7 (VR) P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 3 2 I3 output pin 10 PD output current In : Output current when light is received by light detecting element N (n : 1 to 10, N = P1 to P10 ) Calculation 4 5 8 9 10 Pmon LD 2 12 GND 11 LD+ Hologram Unit HUL7001 Optical Block Diagram During Measurement (Fig. 2) (a) Radiant power measurement system of hologram unit (HUL7001) Hologram unit (HUL7001) Light detecting element (ø10mm) or laser light input element of coherence measurement system Optical axis (b) Reference optical system during measurement Apparent light emitting point 25.3mm Actuator 19.0mm PKG reference surface ø3.1mm aperture Collimator lens f = 25.3mm NA = 0.105 (Note) The aperture and the light detecting element are positioned perpendicular to the axis of the light emitted from the hologram unit; the optical axis is positioned so as to pass through the center of the aperture. Objective lens f = 4.5mm NA = 0.45 Disk : A disk satisfying CD specifications is used. The RF signal, focus error signal, and tracking error signal are measured using the above reference optical system and the equations shown in Fig. 1. Focus Error Signal Amplitude and Pull-in Range (Fig. 3) Tracking Error Signal Amplitude and Pull-in Range (Fig. 4) Tracking error signal strength Focus error signal + B IFE A 0 Objective lens movement Time Signal amplitude center ground level – DFE A : Tracking signal amplitude B : Difference between tracking signal amplitude center and electrical center Tracking error signal amplitude ITE = A Tracking error signal symmetry BTE = B ×100 (%) A IFE : Focus error signal amplitude DFE : Focus error signal pull-in range Focus Error Signal Defocusing (Fig. 5) High Jitter (ns) DJ : Objective lens movement from position where focus error signal is 0 to jittering-best position. S(DJ ) : Amount of focus error signal at DJ IFE : Focus error signal amplitude Low + Focus error signal Moving away from disk S(DJ) Approaching disk IFE Objective lens movement (µA) 0 DJ – In the diagram, point 0 is the point at which the focus error signal equals 0. Focus error signal S defocusing DFO = (DJ) ×100 (%) IEF (Definition of focus error signal defocusing) Amount of focus error signal at jitter-best position as a percentage of focus error signal amplitude (%) 3 HUL7001 Important LDHU Usage Information Panasonic’s laser detector hologram unit (LDHU) has features of using a plastic package, and of integrating a low-current-operating, high-efficiency laser and a photodetector in order to reduce the size and weight of the optical pickup. Please follow the instructions presented below to take advantage of this feature and ensure that the pickup is highly reliable. 1. Static Electricity The semiconductor laser used in the LDHU is characteristically, especially sensitive to static electricity, in semiconductor devices. Therefore care must be taken in handling the semiconductor laser. If the laser receives a pulse which causes light to be emitted in excess of the maximum rating of the laser, the laser itself could be damaged by the optical energy. Therefore it is very important to take measures to protect the LDHU from static electricity and surges when putting together assembly lines or when handling it during manufacturing processes. (1) Check all drive circuitry, including the power supply. Take sufficient preventive measures to ensure that, for example, spike currents generated when the power switch is turned on or off never exceed the absolute maximum ratings of the LDHU. Also insert appropriate protective circuits in the LDHU drive circuitry. (2) Be careful not to allow static electricity to destroy the LDHU while handling it. Effective measures for protecting against static electricity include body grounds (passing through 1MΩ), as well as conductive mats for the floor, conductive clothing, conductive shoes, and conductive containers. The tips of soldering irons must be grounded. We recommend using ionizers, etc., especially around facilities and areas where static electricity is easily generated. (3) The laser may also be destroyed by abnormal pulses from nearby equipment. Therefore fluorescent lights and measuring equipments should not be turned on or off near the laser. 4 Hologram Unit 2. LDHU Heat-Release Design The semiconductor laser, which is the light emitting device, naturally has a limited service life. This service life is shortened as the temperature is increased. Therefore the design should include suitable heat-releasing measures. Heat release from the lead frame and the back of the package must be incorporated into the design in order to improve heatreleasing capabilities. For assistance in evaluating heat-releasing capabilities (thermal resistance), please contact us. 3. Storing LDHU Units After Removal from Aluminum-Laminated Bags If supplies are stored prior to mounting for extended periods of time in a high-humidity environment, subsequent heating during solder mounting will cause moisture in the parts to vaporize. This may cause problems related to part characteristics. In order to prevent moisture absorption, LDHU units are packaged in moistureproof aluminum-laminated bags which are sealed together with silica gel before shipping. After LDHU units are removed from these moistureproof bags, the mounting process should be completed quickly. Unused LDHU units which have been unsealed and require extended storage should be put back in their aluminum-laminated bags (along with the silicagel) and resealed. The recommended environment for LDHU mounting is a temperature range of 5˚C to 35˚C and a relative humidity range of 45% to75%. (To prevent excessive humidity and because static electricity occurs more easily if the humidity is too low.) Hologram Unit HUL7001 4. Important Information Regarding Soldering Special plastics are used in the LDHU package and hologram. Therefore only the leads (pins) should be heated (during soldering iron, dip, etc.), and soldering time should be short. Total heating methods such as reflow soldering should be avoided. (This device is gold-plated to ensure good solder adhesion, so a short soldering time is sufficient.) It is also recommended that a heat sink or other means be used to improve the package’s heat-releasing effects in order to prevent the package from becoming hot as a result of heat transfer and radiation even when the leads are heated. Soldering location , , ,,, , A A A : Make sure there is a gap of at least 1mm. Soldering temperature and time Temperature : 260˚C maximum Time : 5 seconds maximum 5. Flux cleaning method Alcohol is recommended as a solvent for flux cleaning. Chlorine base solvents in particular are a cause of lead corrosion and device deterioration. Petroleum base solvents should be avoided since they deteriorate the adhesive between the hologram and package. In addition, ultrasonic cleaning should be avoided since the device is hollow. Care should be taken in brushing the hologram surface, as this may scratch the back side. 6. Mechanical stress (1) Pressure on the package The LDHU package is made thin in order to reduce its size. Therefore, pressure on the package resulting of heat release, etc. may cause problems such as a change in the package shape or changes to its characteristics. In the point pressure application, force should be limited to 1kgf (9.8N) or less, but please design so that the area pressure application can be adopted as much as possible. (2) Lead formation and cutting In cases where lead formation and cutting are required, these actions must be performed at normal temperatures prior to soldering. Machining steps performed at high temperatures immediately after soldering, or after the solder has hardened should be avoided. In addition, steps should be taken to ensure that excessive mechanical stress is not applied during lead formation and cutting. Special care should be taken to avoid stress on the lead bases of the package, as this may create problems such as chipping the resin. 7. Other issues (1) The surface of the hologram is very important for light emission and light detecting. Therefore care should be taken to ensure that there are no fingerprints on the surface, residual flux after soldering, or adhering dust. (2) Viewing the laser beam with the naked eye is extremely dangerous and may result in blindness. Do not look directly at the laser while it is operating. (3) The products listed in this document are intended for use in standard applications, i.e., general electronic devices (such as office equipment, measuring equipment, and consumer electronics products). Customers considering applications involving special quality and reliability requirements and carrying a risk of loss of human life or bodily damage in the event of an accident or malfunction, or specific applications (such as aerospace applications, transportation equipment, combustion equipment, and safety devices), and customers considering applications other than the standard applications intended by us should contact our sales office before using these products. 5