A-
PREPARED BY:
DATE:
APPROVED BY:
DATE:
B /‘YY
Jd
t SPEC.No:
(
ELECTRONIC COMPONENTS GROUP
SHARP CORPORATION
SPECIFICATION
DG-996011
REPRESENTATIVE
1
DIVISION:
Opto-Electronic Devices Division
Y
/
DEVICE SPECIFICATION
FOR
.
Light Emitting Diode
MODEL No.
LTlZE4OA
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp5 consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting corn use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment
* Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal)
* Measuring equipment
*
Tooling
machines
*
Computers
I
1
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals
* Gas leakage sensor breakers
l Rescue and security equipment
*
Other
safety
equipment
L
(3) Please do not use this product for equipment which require extremely high reliability
and safety in fimction and precision, such as ;
* Space equipment
* Telecommunication equipment (for trunk lines)
l
Nuclear
power
control
equipment * Medical equipment
c
1
1
. (4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S APPROVAL
DATE:
BY:
DATE:
PRESENTED BY:
I
M.Katoh,
Department General Manager of
Engineering Dept.,111
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
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MODEL
.DG-g96011.-.
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Feb/22/9!
PAGE
LTl ZE40A
LTlZE40A
Smdkation
1. Application
This specification applies to the light emitting diode device Model No. LTl ZE4OA.
[AlInGaP (dicing or scribe/brake type/Yellow
green) chip LED device]
2. Outline dimensions and temkal
connections ...*.*..**...~.......,~f~
to the attached sheet Page2.
3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-5.
3- 1. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 6.
4-1. Test items and test conditions
4-2. Failure judgement criteria
5. incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 7.
5- 1. Inspection method
5-2. Description of inspection and criteria
6. Taping specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 8- 11.
6-1. Taping
6-2. Label
6-3. Luminous intensity rank
6-4. Dominant wavelength raak
7. Packing Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...* Refer to the attached sheet Page 12.
7- 1. Dampproof package
7-2. Storage conditions
7-3. Treatment after opening
8. Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 13.
8- 1. Reflow soldering
8-2. Manual soldering
9. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 14.
9- 1. Precautions matters for designing circuit
9-2. Cleaning method
10. Ekironment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 14.
lo- 1. Ozonosphere destructive chemicals.
10-2. Bromic non-burning materials
-
l/14
Febl2219’
2. Outliue dimensionsand terminalconnections
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1.
h-l=
Plabzd
Resist
2. Pin
m
m
Conection
0
@
e-w
---
area
area
Cathode
Anode
43-o
3. Unspecified
unit
mm
PWB:
Resin:
Material
Glass-Epoxy
Epoxy
Finish
Au Plated
tol.
to be ktl. 1
Drawiug No.
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DG-99.6011
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3/14
3. Ratings and characteristics
(Notel) Duty ratio=l/lO,Puise width=O.lms
(Note2) Manual soldering Max.3second
(Note 3)Measured by SHARP EG&G MODELSSO(Radiometer/Photometersystem)
L
(Tolerance:
f 15%)
Forward Current
Derating
Curve
60
-25
b
Anbient
25
50
Temperature
75
100
125
Ta("c)
Peak Fotward Current vs. Duty Ratio
cTa=25"c)
l/100
l/10
Duty Raito
10
1
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3-4. Characteristics
1 Jud8/9!
PAGE
5114
.. \\
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Diagram(typ) (Note 1)
Forward Current
vs.Fotward
Voltage
Relative Luminous Intensity
vs. Ambient Tamerature
(IF=5mAI
fla=2573
1000
8
s
E
a
Y
t
2
l.L
0.
1
1.2
1.4 1.6 1.8
Fotward Voltage
2 2.2
VFW
B
2.4
-60 -40 -20
0
20
40
Ambient Tetwature
Relative
Lminoua
lntenaitv
VI.
Fromrd
Voltare
Ua=25%)
t
0. 1
i i iiitttt i i iii/iii
1
Forward Current
10
i i iiiiltl
100
IFW
(Note 1) Above characteristicdata aretypical data andnot a guarantteeddata.
60
80 100 120
Ta("c)
4. Reliability
The reliability of products shall be satisfied with items listed below.
,-I. Test items and test conditions
Confidence level: 907
4-2. Failure judgement criteria * 1
Parameter
Symbol
Failure judgement criteria l 2
Forward voltage
vF
v, > U.S.L. x 1.2
Reverse current
IR
IR > U.S.L. x 2.0
Luminous intensity
IV
Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
1: Measuring condition is in accordance with specification.
$2: U.S.L. is shown by Upper Specification Limit.
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JIG<-9960‘1
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1
PAGE
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7114
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5. Incoming inspection
S- 1. Inspection method
A single sampling plan, normal inspection level S-4 based on IS0 2859-l shall be adopted.
AQL
Product inserted in reverse direction
7
Outline dimensions
Not conforming to the specification
8
Dust and flaw
Effect to the specification
9
Resin flash
Over the unspecified tolerance
10
Resin crack
0.3mm or greater Corn the product side face
could solder 50% or greater and less than 90% out of
judgement area * 1
* 1 Judgement area : The plated area of the product bottom
11
Solderbility
0.1%
Minor
defect
0.4%
6.Taping specification
6-l.Tapiug
6-1-l.Shape and dimension of tape(TYP.)
w
tP
Cover tape
Cathode
Width
Thickness
Carrier tape
Width
Thickness
1
WI
5.5
t 3
Wa
t 1
0.1
8.0
0.2
Thicknessof the entire unit
t2
1.2
% Material : Carrier tape...PS,Cover tape... Polyester
With cover tapeand carrier tape combined
..
DG-996011
9114
-._
6-I-2.Shape
and dimension
of reel(TYP.)
Parameter
1Symbol 1 Dimension
1
Remarks
Frange
External diameter
Spindle hole diameter
Key slit
Width
Depth
dotation for part name etc.
% Material : Reel...Polystyrene
Hub
460
C
E
U
Labeling
413
2.0
4.5
on one side of flange.(part
Febl22/9
PAGE
name,quantity,lot
No.)
’ I; DG-996011
MO&L
go.
Febl22/99
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6-1-3.Tapingspecification
(1) Lead tape:
End
40-50
pitch
(2) Cover tape strengthagainstpeeling:F=O.l-O.SN( 6 =lO”or less)
Cover tape
1
<-
’ - ‘%pe
Forward
Carrier
speed : Sum/s
tape
(3) Tape strengthagainstbending:
The radiusof bendingcircle shouldbe 30mmor more.
If it is lessthan 3Omm,the cover may peel.
(4) Jointing of tape:
There shouldnot bejoint of cover tape or carrier tape.
(5) Quantity per reel:
Average 4,OOOpcs.
per reel
(6) Others:
0 There shouldnot be missingabove continuousthree products.
@ Productsshouldbe easilytakenout.
@ Productsshouldnot be attachedto the cover tape at peeling.
PAGE
10114
,’ ,: DG-996011
M,ODEI, No. <4 “~
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Jud8/9!
PAGE
1l/14
6-2. Label
cl+
QUAIiKR
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Model number
c Quantity of products
+ EIAJ C-3 Bar code
-
0 Productionplant code(tobe indicated alphabetically)
@ Productionlot(singleor doublefigures)
Q) Year of production(tbelast two figures of the year)
@ Month of production
(to be indicatedalphabeticallywith Januarycorrespondingto A)
@ Dateof production(01- 3 1)
6-3.Lurninousintensity rank(Note 1)
Luminousintensity
A
10
19
B
14
28
C
D
E
(Note 1)
21
-
40
mcd
J?=2omA
30
30
43
84
Also I sbaIlnot asktbe delivery ratio of eachrank.
6-4.Dominantwavelengthrank (Note 2)
Dominantwavelength
d
unit
(Ta=25”C)
Condition
e
f
562
565.0
568
-
566.0
569
572.0
(r
571n
-
575
unit
(Ta=25”C)
Condition
(Note 2) This rank value is the setting value of when that cla.ssiiIesit the rank and be not a guaranteevalue.
Also I shallnot askthe delivery ratio of eachrank.
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MODEL For
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7. PaclAngspecification
7- 1. Dampproofpackage
In other to avoid the absorptionof humidity iu transportand storage,
the device s arepackedin aluminumsleeve.
Label
e
-
Silicagel
Q Ree1 Label
7-2.Strageconditions
Temperature: 5 to 30°C Humidity : lessthan 6O%RH
7-3.Treatmentafter opening
(1) Pleasemakea solderingwithin 15daysafter openingunderfollowing condition;
Temperature: 5 to 30°C Humidity : lessthan 6O%RH
(2) In casethe devicesare not usedfor a long time after opening,the storagein dry box is recommendable.
Or it is better to repack the deviceswith a desiccativeby the sealerandput them in the somestorage
conditionsas7-2. Then they shouldbe usedwithiu 2 weeks.
(3) Pleasemakea solderingafter a follewing bakiugtreatmentif unusedterm shouldbe over the conditions
OfW
*Recommendable
conditions:
0 in taping
Temprature:6O”cto 65”C,Time:36to 48 hours
0 in individual (on PWB or metallic tray)
Temprature:lOO”Cto120”C,Time:2 to 3 hours
PAGE
Febl22/99
PAGE
13114
8. Soldering
8- 1.Reflow soldering
(1) It is not recommended to exceed the soldering temperature and time shown below.
Caused by substrate bend or the other mechanical stress during reflow soldering
may happen gold wire disconnection etc. Therefore please check and study your
solder reflow machine’s best condition.
(2) In case of 2 times reflow process.2nd reflow process should be done within 8 hours
after 1st reflow process.(Strage condition ; at 3O”c,RH less than 6O%RH)
’
(3) Reflow soldering temperature profile
to be done under the following condition.
MAX 250
140-160
h
Time(s)
Recommendable Thermal Model
,
(4) Recommendable Metal Mask pattern for screen print
Recommend 0.2mm to 0.3mm thickness metal mask
for screen print. Caused by solder reflow condition,
solder paste, substrate and the other material etc.,
may change solderbility.
Please check and study actual solderbility before
usage.
---mm -.-_-.-_
.-.
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R
”
Center of the produc 2
/‘----.---.- .-_-.- 4A
IF
1.25
Recommended soldar pattern (U&mm)
8-2.Manual soldering
(1) It is recommended to keep the soldering iron temperature at 350% (soldering iron
power consumption 2OW) and not to solder more than once or for over 3 seconds.
(2) When using a soldering iron, care must be taken not to damage the package.
(Pay attention not to allow any under stress or heat on package.)
L
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9-l. Precautions matters for designing circuit
This product is not designed as electromagnetic and ionized-particle radiation resistant.
9-2. Cleaning method
(1) Solvent cleaning
Recommend conditions: 0 Solvent temperature is not more than 45 degree. 0 Immersion up to 3 minutes.
(2) Ultrasonic cleaning
The affect on the device from ultrasonic bath, ultrasonic output, duration, board size and device mounting method.
Test the cleaning method under actual conditions and check for abnormalities before actual use.
(3) Solvents
Use only the following types of solvent.
water, methyl alcohol, ethyl alcohol, isopropyl alcohol
Recommend conditions: RT. 4OKHz, 3OW/l, 3 to 5 minutes
10. Environment
10-l. Ozonosphere destructive chemicals.
(1) The device doesn’t contain following substance.
(2) The device doesn’t have a production line whose process requires following substance.
Restricted part: CFCs,halones,CCh,Trichloroethane(Methychlorofotm)
1O-2. Bromic non-burning materials
The device doesn’t contain bromic non-burning materials(PBBOs,PBBs)