ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR Light Emitting Diode I MODELNo. LTlS9OA 1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”). Please do not reproduce or cause anyone to reproduce them without Sharp’s consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment 1 L * Tooling machines * Computers If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train automobile etc.) * Rescue and security equipment * Traflic signals * Gas leakage sensor breakers * Other safety equipment I i (3) Please do not use this product for equipment which require extremely high reliability and safety in timction and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) i * Nuclear power control equipment * Medical equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. CUSTOMERS DATE: BY: APPROVAL DATE: PRESENTED BY: M.Katoh, Department General Manager of Engineering Dept.,III Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION Jad19lOO LTlSSOA Sriecification 1. Application This specification applies to the light emitting diode device Model No. LT 1 S 90A. [GaAsp/GaP(orange)chip LED device] 2. Outline dimensions and terminal connections . . . . . . . ..***.*.........Refer to the attached sheet Page 2. 3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-5. 3- 1. Absolute maximum ratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Characteristics Diagram 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 6. 4- 1. Test items and test conditions 4-2. Failure judgement criteria 5. Incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 7. 5-l. Inspection method 5-2. Description of inspection and criteria 6. Taping specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 8- 10. 6-1. Taping 6-2. Packing specification 6-3. Label 6-4. Luminous intensity rank 7. Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page’ 11. 7- 1. Reflow soldering 8. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 12. 8-1. Precautions matters for designing circuit 8-2. Cleaning method 9 Env~o~ent.......................................~.............Referto~ea~chedsheetP~e 9-1. Ozonosphere destructive chemicals. 9-2. Bromic non-burning materials 12. 2. Outline dimensi&s and terminal coMections - 3. 6 I( Cathode mark(blackl . Terminal 0 Qc unit mm PWB: Resin: Material Glass-Epoxy Epoxy connection Anod: athode Finish Drawing No. Au Plated 51201002 3. Ratings and characteristics 3- 1. Absolute maximum ratings Parameter Symbol [Power dissipation P Rating 84 I 30 IF VR Topr Storage temperature Tstg 1 ISoldering temperature(Note 2) 1 Tsol 1 (Notel) Duty ratio=l/lO,Pulse width=O. lms (Note2) Manual soldering Max.3~ -25 -25 260 (Ta=2S’C) Unit mW mA mA n-A/T V 85 ~ OC 100 1 “C 1 T 1 (Note 3)Measured by SHARP EG&G MODEL5SO(Radiometer/Photometersyste (Tolerance : f 15%) 3-3. Derating Curve Forward Current Derating Cunz 60 $ 50 ic E 40 g a $ 30 g 10 $ 60 20 i 50 z ii 5 40 -g z g 20 30 10 0 -25 0 25 50 $5100 125 Ambient Temperahue Ta(“C) I l/10 1 Duty Raito 25 50 75*5100 Ambient Temperature Ta(“c) Peak Forward Current vs. Duty Ratio (Ta=25”C) l/100 0 10 125 Jan/19/00 PAGE 5112 3-4. Characteristics Diagram(typ) (Note -Forward Current vs.Forward Voltage Relative Luminous Intensity vs. Ambient Temperature (IF=2OmA~ Ua=25W i k’i i i ii / i I tI 1I i1111i i i iiiII! i i i 1! / / II I I I I I III !I !I !I !II i !I !I I I ’ ’ ’ ‘1’ ’ ’ ’ ’ ’ ’ ’ 1 1.2 1.4 1.6 1.8 2 2.2 -60 2.4 Forward Voltage VFW) Rda!ive Lmincxs Iriiemity vs. Forward -40 -20 Cm (Ta=25“C) .eP t 72 e?, lOO!A 10% 1% 0. 1 1 10 20 40 60 80 Ambient Temprature Ta(“C) 1000% 9 @ P % 2 5 s .-8 3E 0 100 Forward Current IF(m4) (Note 1) Above characteristic data are typical data and not a guarantteed data. 100 120 4. Reliability The reliability of products shall be satisfied with items listed below. 4-1. Test items and test Confidence level: 90% Samples (xl) LTPD Defective (C) (%) conditions Test conditions Test items temperature cycling -25”c(3Omin)-+1OO”c(3Omin),3Otimes n=22, c=o 10 High temp. and high humidity storage Ta=+6O”C, 9O%RH, t-500h n=22, C=O 10 High temperature storage Ta=lOO”C,e500h n=22, C=O 10 Low temperature storage Ta=25”C,r500h n=22, C=O 10 Ta=25”c,IF=30mA,t-5OOh n=22, C=O 10 15 ooods2, 0.5ms, 3times I *X,+Y,+Z direction 200m/s2, 100-2 000-l OOHz/sweepfor 4min. , 4timesbX+Y,*Z direction Refer to the attached sheet, Page 1l/12 ltimes n=ll, C=O 20 n=ll, C=O 20 n=ll, C=O 20 Operating test Mechanical shock Variable frequency vibration Soldering heat 4-2. Failme judgement criteria * 1 Parameter SplbOl Failure judgement criteria *2 Forward voltage VF v, > U.S.L. x 1.2 Reverse current IR IR > U.S.L. ’ 2.0 Luminous intensity Iv The fkst stage value X 0.5 > Iv * 1: Measuring condition is in accordance with specification. *2: U.S.L. is shown by Upper Specification Limit. Jan/19/00 5. Incominginspection 5-1. Inspectionmethod A singlesamplingplan, normalinspectionlevel S-4basedon IS0 2859-l shallbe adopted. 5-2. Descriptionof inspectionandcriteria FIO. Inspectionitems Criteria 1 Radiationcolor Not correct 2 Taping Product insertedin reversedirection 3 Solderability 1 Plating abnormalityobservedover 50% or greaterpercentage* 1 4 Electra-optical characteristics Not conformingto the specification. 5 Outline dimensions Not conformingto the specification 6 Appearance Dust : @0.8mmor more Defect AW Major defect 0.1% Minor defect 0.4% Thread dust : 2.5mmor morein lengthand0.25mmor morein width Air bubbles: $0.8mm or more Scratch: 2.5mmor morein lengthand0.25mmor morein width However&e product is qualifiedasa goodunit if the scrachdoesnot touch the Auwire.whenseent?omthe tiont. Resinbarr : Over the unspecifiedtolerance Resinond platedcrack :0.3mmor more could solder50% or greaterandlessthan 90% out of judgememarea* 1 * 1 Judgementarea: The plated areaof the product bottom 7 Solderability2 I.._ i-. . DG-001020 6.Taping specification 6- 1.Taping 6-1-l.Shape and dimension of tape(TYP.) oncay square 6-l-2.Shape and dimension of reel(TYP.) enson exe Jad19lOO 1 Jan/19/00 DG-001020 1 PAGE I 6-l-3.TaDinr! SDecification (1) Lead-tap;: a 000000 End Beginning 40-50 pitch (2) Cover tapestrengthagainstpeeling:F=O.l--O.SN(0 =IO”or less) Cover tape 1 <- ’ Forward Carrier - ‘yape speed : ~DIIU/S tape (3) Tape strengthagainstbending: The radiusof bendingcircle shouldbe 3Ommor more. If it is lessthan 3Omm,the cover may peel. Thereshouldnot bejoint of cover tapeor carrier tape. (4) Jointing of tape: Average 3,OOOpcs. perreel (5) Quantity per reel: Average0.02gI product (6) Massper product: Average 15OgI packing (7)Massper packing: @ There should not be missingabovecontinuousthree products. (8) Others: @ Productsshouldbe easilytakenout. @ Productsshouldnot be attachedto the cover tapeat peeling. 6-2. Packingspecification 6-2-l. Dampproofpackage In other to avoid the absorptionof humidity in transportandstorage, the productsare packed in aluminumsleeve. Label b - Silicagel Q Ree1 Label __ 6-2-2.Strageconditions Temperature: 5 to 30°C Humidity : lessthan6O%RH 6-2-3.Treatmentafter opening (1) Pleasemakea solderingwithin 15 daysafter openingunder following condition; Temperature: 5 to 30°C Humidity : lessthan6O%RH (2) In casethe devicesarenot usedfor a long timeafler opening,the storagein dry box is recommendable. Or it is better to repackthe deviceswith a desiccativeby the sealerandput them in the somestorage conditionsas6-2-2. Then they shouldbe usedwithin 15days. (3) Pleasemakea solderingafter a following bakingtreatmentif unusedterm shouldbe over the conditionsof (2) *Recommendable conditions: 0 in taping Temprature:60”Cto 65”C,Time:36to 48hours 0 in individual (on PWB or metallictray) Temprature:100”Cto120°C ,Time:2 to 3 hours 6-3. Label SHARP CORPORATION PART No. QUANTITY LTlS9OA 3000 + Model number + Quantity ofproducts ...-j - EIAJ C-3 Bar code lm..w”.- (Notel)Lot numberindication clclcloclclclcl--__ a 0 000 0 Productionplant code(tobe indicatedalphabetically) @ Productionlot(singleor doublefigures) @ Year of production(thelasttwo figuresof theyear) @ Month of production (to be indicatedalphabeticallywith Januarycorrespondingto A) @ Dateof production(0l-3 1) 64Luminous intensityrank (Note2)(Note3) Rank C D E F G’ Luminousintensity 4.7 - 12.9 9.6 13.9 - 18.6 26.9 20.0 28.8 - 38.8 (56.0) Unit (Ta=25”c) Condition mcd Ir=2omA (Tolerance: zk 15%) (Note 2) Not askthe delivery ratio of eachrank. (Note 3) In caseof the distributionof the luminousintensity shift to high, at that point new upperrank is prescribedand lower rank is delete. 7. Soldering 7-1 .Reflow soldering (1) It is not recommended to exceed the ‘soldering temperature and time shown below. Caused by substrate bend or the other mecha&al stress during reflow soldering may happen Au wire disconnection etc. Thnefore please check and study your solder reflow machine’s best condition. (2) Reflow soldering temperature protile to be done under the following condition. MAX 250 140-160 Time(s) Recommendable Thermal Model (3) Recommendable Metal Mask pattern for screen print Recommend OSmm to 0.7mm thickness metal mask for screen print. Caused by solder reflow condition, solder paste, substrate and the other material etc., may change solderability. Please check and study actual solderability before Center -. -. I cd the / %L - 1.75 J= 2 Recommended soldar pattern (U&mm) product 8. Precautions for use 8- 1. Precautions matters for designing circuit This product is not designed as electromagnetic and ionized-particle radiation resistant. 8-2. Cleaning method Please use only the foIlowing types of solvent.“water” Recommend conditions: RT. 4OlrHz, 3OWA, time is less than 3 minutes Please check the effect on the product from ultrasonic bath, ultrasonic output, duration, board size method. and product mounting Please test the cleaning method under actual conditions and check for abnormalities before actual use. 9. Environment 9-l. Ozonosphere destructive chemicals. (1) The product doesn’t corttain following substance. (2) The product doesn’t have a production line whose process requires following substance. Restricted part: CFCs,halones,CCl.+Trichloroethaue(Methychlorofonn) 9-2. Bromic non-burning materials The product doesn’t contain bromic non-burning materials(PBBOs,PBBs) LT1S90A, surface mount, sunset orange, 3 mm x 3 mm, 610 nm, chip LED