ONSEMI MC14511BDWR2

MC14511B
BCD-To-Seven Segment
Latch/Decoder/Driver
The MC14511B BCD–to–seven segment latch/decoder/driver is
constructed with complementary MOS (CMOS) enhancement mode
devices and NPN bipolar output drivers in a single monolithic structure.
The circuit provides the functions of a 4–bit storage latch, an 8421
BCD–to–seven segment decoder, and an output drive capability. Lamp
test (LT), blanking (BI), and latch enable (LE) inputs are used to test the
display, to turn–off or pulse modulate the brightness of the display, and
to store a BCD code, respectively. It can be used with seven–segment
light–emitting diodes (LED), incandescent, fluorescent, gas discharge,
or liquid crystal readouts either directly or indirectly.
Applications include instrument (e.g., counter, DVM, etc.) display
driver, computer/calculator display driver, cockpit display driver, and
various clock, watch, and timer uses.
•
•
•
•
•
•
•
•
•
•
•
•
Low Logic Circuit Power Dissipation
High–Current Sourcing Outputs (Up to 25 mA)
Latch Storage of Code
Blanking Input
Lamp Test Provision
Readout Blanking on all Illegal Input Combinations
Lamp Intensity Modulation Capability
Time Share (Multiplexing) Facility
Supply Voltage Range = 3.0 V to 18 V
Capable of Driving Two Low–power TTL Loads, One Low–power
Schottky TTL Load or Two HTL Loads Over the Rated Temperature
Range
Chip Complexity: 216 FETs or 54 Equivalent Gates
Triple Diode Protection on all Inputs
MAXIMUM RATINGS (Voltages Referenced to VSS) (2.)
Symbol
Parameter
Value
Unit
– 0.5 to +18.0
V
VDD
DC Supply Voltage Range
Vin
Input Voltage Range, All Inputs
– 0.5 to VDD + 0.5
V
I
DC Current Drain per Input Pin
10
mA
PD
Power Dissipation,
per Package (3.)
500
mW
TA
Operating Temperature Range
– 55 to +125
Tstg
Storage Temperature Range
16
PDIP–16
P SUFFIX
CASE 648
MC14511BCP
AWLYYWW
1
16
SOIC–16
D SUFFIX
CASE 751B
14511B
AWLYWW
1
16
14511B
SOIC–16
DW SUFFIX
CASE 751G
AWLYYWW
1
16
SOEIAJ–16
F SUFFIX
CASE 966
MC14511B
AWLYWW
1
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
ORDERING INFORMATION
Shipping
MC14511BCP
PDIP–16
2000/Box
°C
MC14511BD
SOIC–16
48/Rail
– 65 to +150
°C
MC14511BDW
SOIC–16
47/Rail
MC14511BDWR2
SOIC–16
1000/Tape & Reel
MC14511BF
SOEIAJ–16
See Note 1.
MC14511BFEL
SOEIAJ–16
See Note 1.
Maximum Output Drive Current
(Source) per Output
25
mA
POHmax
Maximum Continuous Output
Power (Source) per Output (4.)
50
mA
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
4. POHmax = IOH (VDD – VOH)
March, 2000 – Rev. 3
MARKING
DIAGRAMS
Package
IOHmax
 Semiconductor Components Industries, LLC, 2000
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1
Device
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.
Publication Order Number:
MC14511B/D
MC14511B
This device contains protection circuitry to protect the inputs against damage due to high static voltages or electric fields. However, it is advised
that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high–impedance circuit. A
(Vin or Vout)
VDD.
destructive high current mode may occur if Vin and Vout are not constrained to the range VSS
Due to the sourcing capability of this circuit, damage can occur to the device if VDD is applied, and the outputs are shorted to VSS and are at a
logical 1 (See Maximum Ratings).
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD).
v
v
PIN ASSIGNMENT
B
1
16
VDD
C
2
15
f
LT
3
14
g
BI
4
13
a
LE
5
12
b
D
6
11
c
A
7
10
d
VSS
8
9
e
a
f
g
e
b
c
d
DISPLAY
0
1
2
3
4
5
6
7
8
9
TRUTH TABLE
LE BI LT
X X 0
X 0 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
1
1 1
Inputs
D
C
X
X
X
X
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
X
X
B
X
X
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
X
A
X
X
0
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
X
a
1
0
1
0
1
1
0
1
0
1
1
1
0
0
0
0
0
0
b
1
0
1
1
1
1
1
0
0
1
1
1
0
0
0
0
0
0
c
1
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
d
1
0
1
0
1
1
0
1
1
0
1
0
0
0
0
0
0
0
*
Outputs
e
f
1
1
0
0
1
1
0
0
0
0
0
0
0
1
0
1
1
1
0
0
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
X = Don’t Care
* Depends upon the BCD code previously applied when LE = 0
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2
g
1
0
0
0
1
1
1
1
1
0
1
1
0
0
0
0
0
0
Display
8
Blank
0
1
2
3
4
5
6
7
8
9
Blank
Blank
Blank
Blank
Blank
Blank
*
MC14511B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ (5.)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.1
9.1
14.1
—
—
—
4.1
9.1
14.1
4.57
9.58
14.59
—
—
—
4.1
9.1
14.1
—
—
—
Vdc
Input Voltage #
“0” Level
(VO = 3.8 or 0.5 Vdc)
(VO = 8.8 or 1.0 Vdc)
(VO = 13.8 or 1.5 Vdc)
VIL
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
4.1
—
3.9
—
3.4
—
—
—
—
—
—
—
4.1
—
3.9
—
3.4
—
4.57
4.24
4.12
3.94
3.70
3.54
—
—
—
—
—
—
4.1
—
3.5
—
3.0
—
—
—
—
—
—
—
(IOH = 0 mA)
(IOH = 5.0 mA)
(IOH = 10 mA)
(IOH = 15 mA)
(IOH = 20 mA)
(IOH = 25 mA)
10
9.1
—
9.0
—
8.6
—
—
—
—
—
—
—
9.1
—
9.0
—
8.6
—
9.58
9.26
9.17
9.04
8.90
8.70
—
—
—
—
—
—
9.1
—
8.6
—
8.2
—
—
—
—
—
—
—
Vdc
(IOH = 0 mA)
(IOH = 5.0 mA)
(IOH = 10 mA)
(IOH = 15 mA)
(IOH = 20 mA)
(IOH = 25 mA)
15
14.1
—
14
—
13.6
—
—
—
—
—
—
—
14.1
—
14
—
13.6
—
14.59
14.27
14.18
14.07
13.95
13.70
—
—
—
—
—
—
14.1
—
13.6
—
13.2
—
—
—
—
—
—
—
Vdc
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
Vin = 0 or VDD
(VO = 0.5 or 3.8 Vdc)
(VO = 1.0 or 8.8 Vdc)
(VO = 1.5 or 13.8 Vdc)
Output Drive Voltage
(IOH = 0 mA)
(IOH = 5.0 mA)
(IOH = 10 mA)
(IOH = 15 mA)
(IOH = 20 mA)
(IOH = 25 mA)
Output Drive Current
(VOL = 0.4 V)
(VOL = 0.5 V)
(VOL = 1.5 V)
Vdc
Vdc
VOH
Source
Vdc
IOL
Sink
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package) Vin = 0 or VDD,
Iout = 0 µA
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
Total Supply Current (6.) (7.)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT
5.0
10
15
IT = (1.9 µA/kHz) f + IDD
IT = (3.8 µA/kHz) f + IDD
IT = (5.7 µA/kHz) f + IDD
5. Noise immunity specified for worst–case input combination.
Noise Margin for both “1” and “0” level =
1.0 Vdc min @ VDD = 5.0 Vdc
2.0 Vdc min @ VDD = 10 Vdc
2.5 Vdc min @ VDD = 15 Vdc
6. The formulas given are for the typical characteristics only at 25_C.
7. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + 3.5 x 10–3 (CL – 50) VDDf
where: IT is in µA (per package), CL in pF, VDD in Vdc, and f in kHz is input frequency.
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3
µAdc
MC14511B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (8.) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
VDD
Vdc
Min
Typ
Max
5.0
10
15
—
—
—
40
30
25
80
60
50
5.0
10
15
—
—
—
125
75
65
250
150
130
5.0
10
15
—
—
—
640
250
175
1280
500
350
5.0
10
15
—
—
—
720
290
200
1440
580
400
5.0
I0
15
—
—
—
600
200
150
750
300
220
5.0
10
15
—
—
—
485
200
160
970
400
320
5.0
10
15
—
—
—
313
125
90
625
250
180
Unit
Output Rise Time
tTLH = (0.40 ns/pF) CL + 20 ns
tTLH = (0.25 ns/pF) CL + 17.5 ns
tTLH = (0.20 ns/pF) CL + 15 ns
tTLH
Output Fall Time
tTHL = (1.5 ns/pF) CL + 50 ns
tTHL = (0.75 ns/pF) CL + 37.5 ns
tTHL = (0.55 ns/pF) CL + 37.5 ns
tTHL
Data Propagation Delay Time
tPLH = (0.40 ns/pF) CL + 620 ns
tPLH = (0.25 ns/pF) CL + 237.5 ns
tPLH = (0.20 ns/pF) CL + 165 ns
tPLH
tPHL = (1.3 ns/pF) CL + 655 ns
tPHL = (0.60 ns/pF) CL + 260 ns
tPHL = (0.35 ns/pF) CL + 182.5 ns
tPHL
Blank Propagation Delay Time
tPLH = (0.30 ns/pF) CL + 585 ns
tPLH = (0.25 ns/pF) CL + 187.5 ns
tPLH = (0.15 ns/pF) CL + 142.5 ns
tPLH
tPHL = (0.85 ns/pF) CL + 442.5 ns
tPHL = (0.45 ns/pF) CL + 177.5 ns
tPHL = (0.35 ns/pF) CL + 142.5 ns
tPHL
Lamp Test Propagation Delay Time
tPLH = (0.45 ns/pF) CL + 290.5 ns
tPLH = (0.25 ns/pF) CL + 112.5 ns
tPLH = (0.20 ns/pF) CL + 80 ns
tPLH
tPHL = (1.3 ns/pF) CL + 248 ns
tPHL = (0.45 ns/pF) CL + 102.5 ns
tPHL = (0.35 ns/pF) CL + 72.5 ns
tPHL
5.0
10
15
—
—
—
313
125
90
625
250
180
Setup Time
tsu
5.0
10
15
100
40
30
—
—
—
—
—
—
ns
Hold Time
th
5.0
10
15
60
40
30
—
—
—
—
—
—
ns
tWL
5.0
10
15
520
220
130
260
110
65
—
—
—
ns
Latch Enable Pulse Width
ns
ns
ns
ns
ns
8. The formulas given are for the typical characteristics only.
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4
MC14511B
Input LE low, and Inputs D, BI and LT high.
f in respect to a system clock.
All outputs connected to respective CL loads.
20 ns
20 ns
90%
50%
1
2f
A, B, AND C
VDD
10%
VSS
50% DUTY CYCLE
VOH
50%
ANY OUTPUT
VOL
Figure 1. Dynamic Power Dissipation Signal Waveforms
20 ns
20 ns
VDD
90%
50%
10%
INPUT C
VSS
tPHL
tPLH
VOH
90%
50%
OUTPUT g
10%
VOL
tTHL
tTLH
(a) Inputs D and LE low, and Inputs A, B, BI and LT high.
20 ns
LE
VDD
90%
50%
10%
th
VSS
tsu
VDD
INPUT C
50%
VSS
VOH
OUTPUT g
VOL
(b) Input D low, Inputs A, B, BI and LT high.
20 ns
20 ns
LE
VDD
90%
50%
10%
tWL
(c) Data DCBA strobed into latches.
Figure 2. Dynamic Signal Waveforms
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5
VSS
MC14511B
CONNECTIONS TO VARIOUS DISPLAY READOUTS
LIGHT EMITTING DIODE (LED) READOUT
VDD
VDD
COMMON
ANODE LED
COMMON
CATHODE LED
≈ 1.7 V
≈ 1.7 V
VSS
VSS
INCANDESCENT READOUT
VDD
FLUORESCENT READOUT
VDD
VDD
**
DIRECT
(LOW BRIGHTNESS)
FILAMENT
SUPPLY
VSS
VSS
VSS OR APPROPRIATE
VOLTAGE BELOW VSS.
(CAUTION: Maximum working voltage = 18.0 V)
GAS DISCHARGE READOUT
VDD
LIQUID CRYSTAL (LCD) READOUT
APPROPRIATE
VOLTAGE
EXCITATION
(SQUARE WAVE,
VSS TO VDD)
VDD
1/4 OF MC14070B
VSS
VSS
** A filament pre–warm resistor is recommended to reduce filament
thermal shock and increase the effective cold resistance of the
filament.
Direct dc drive of LCD’s not recommended for life of
LCD readouts.
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6
MC14511B
LOGIC DIAGRAM
BI 4
13 a
A 7
12 b
11 c
B 1
10 d
9 e
15 f
C 2
14 g
LT 3
D 6
LE 5
VDD = PIN 16
VSS = PIN 8
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7
MC14511B
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
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8
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MC14511B
PACKAGE DIMENSIONS
SOIC–16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
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9
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14511B
PACKAGE DIMENSIONS
SOIC–16
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751G–03
ISSUE B
A
D
9
1
8
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
h X 45 _
E
0.25
16X
M
T A
S
B
S
14X
e
L
A
0.25
B
B
A1
H
8X
M
B
M
16
q
SEATING
PLANE
T
DIM
A
A1
B
C
D
E
e
H
h
L
q
C
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10
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
10.15
10.45
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC14511B
PACKAGE DIMENSIONS
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
16
LE
9
Q1
M_
E HE
1
L
8
DETAIL P
Z
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
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11
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.78
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.031
MC14511B
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MC14511B/D