INTEGRATED CIRCUITS DATA SHEET TDA1576T FM/IF amplifier/demodulator circuit Product specification Supersedes data of February 1991 File under Integrated Circuits, IC01 1998 Nov 18 Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit TDA1576T FEATURES GENERAL DESCRIPTION • Fully balanced 4-stage limiting IF amplifier The TDA1576T is a monolithic integrated FM/IF amplifier circuit for use in mono and stereo FM-receivers of car radios or home sets. • Symmetrical quadrature demodulator • Field strength indication output for 1 mA ammeter • Detune detector for side response and noise attenuation • Detune voltage output • Internal muting circuit • 0° and 180° AF output signals • Reference voltage output • Electronic smoothing of the supply voltage. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP supply voltage (pin 1) 7.5 8.5 15 V IP supply current 10 16 23 mA ViIF(rms) input sensitivity (RMS value) −3 dB before limiting 14 22 35 µV S/N = 26 dB − 10 − µV S/N = 46 dB − 55 − µV VoAF(rms) AF output voltage (RMS value) 60 67 75 mV THD total harmonic distortion with double resonant circuits − 0.02 − % S/N signal-to-noise ratio − 72 − dB − 50 − dB 43 48 − dB Vi > 1 mV αAM AM suppression RR ripple rejection I15 maximum indicator output current − − 2 mA Tamb operating ambient temperature −30 − +80 °C f = 100 Hz ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA1576T SO20 1998 Nov 18 DESCRIPTION plastic small outline package; 20 leads; body width 7.5 mm 2 VERSION SOT163-1 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... ViIF RS 0.1 µF zero adjustment of field strength indicator 0.1 µF 3.6 kΩ 1 nF detune voltage reference voltage 0.47 µF +4.9 V GND VFB1 VFB2 ViIF VF0 VF Vref Vo(det) Vi(det) n.c. 20 19 18 17 16 15 14 13 12 11 9 10 4-STAGE LIMITER/ AMPLIFIER 25 kΩ REFERENCE VOLTAGE LEVEL DETECTOR 25 kΩ Philips Semiconductors RS FM/IF amplifier/demodulator circuit field strength 1 mA 2 V (RMS) BLOCK DIAGRAM 1998 Nov 18 handbook, full pagewidth MUTE ATTENUATOR 3 0.5 mA TDA1576T V1 DETUNE DETECTOR V2 QUADRATURE DEMODULATOR V2 3.7 kΩ 8.3 kΩ 10 Ω VP 1 2 3 4 5 6 7 8 VP +8.5 V CPS IF1 33 pF RES1 FMON RES2 IF2 VoAF1 0.1 µF 47 µF FM on 3.7 kΩ VoAF2 n.c. MEH139 6.8 nF 33 pF 560 pF audio outputs −VAF Product specification Fig.1 Block diagram. VAF TDA1576T QL = 20 fo = 10.7 MHz Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit TDA1576T PINNING SYMBOL PIN DESCRIPTION VP 1 positive supply voltage CPS 2 smoothing capacitor of power supply IF1 3 IF signal to resonant circuit RES1 4 resonant circuit input 1 FMON 5 FM-ON, standby switch RES2 6 resonant circuit input 2 IF2 7 IF signal to resonant circuit VoAF1 8 AF output voltage 1 (0° phase) VoAF2 9 AF output voltage 2 (180° phase) n.c. 10 not connected RES2 6 IF2 7 n.c. 11 not connected Vi(det) 12 detune detector input voltage for external audio reference Vo(det) 13 detune detector output voltage Vref 14 reference voltage output VF 15 level output for field strength VF0 16 zero adjust voltage for field strength ViIF 17 FM/IF input signal voltage VFB2 18 DC feedback 2 VFB1 19 DC feedback 1 GND 20 ground (0 V) 1998 Nov 18 handbook, halfpage VP 1 20 GND CPS 2 19 VFB1 IF1 3 18 VFB2 17 ViIF RES1 4 16 VF0 FMON 5 TDA1576T 15 VF 14 Vref VoAF1 8 13 Vo(det) VoAF2 9 12 Vi(det) n.c. 10 11 n.c. MEH140 Fig.2 Pin configuration. 4 Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit TDA1576T LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VP supply voltage (pin 1) 0 15 V V2, 5, 16 voltage on pins 2, 5 and 16 0 VP V Ptot total power dissipation 0 450 mW Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −30 +80 °C THERMAL CHARACTERISTICS SYMBOL Rth j-a 1998 Nov 18 PARAMETER thermal resistance from junction to ambient in free air 5 VALUE UNIT 85 K/W Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit TDA1576T CHARACTERISTICS VP = 8.5 V; fIF = 10.7 MHz; RS = 60 Ω; fm = 400 Hz with ∆f = ±22.5 kHz; 50 µs de-emphasis (C8-9 = 6.8 nF); Tamb = 25 °C and measurements taken in Fig.1; unless otherwise specified. The demodulator circuit is adjusted at minimum second harmonic distortion for ViIF = 1 mV and a deviation ∆f = ±75 kHz. SYMBOL PARAMETER VP supply voltage (pin 1) IP supply current CONDITIONS V5 = V9 = V13 = 0 MIN. TYP. MAX. UNIT 7.5 8.5 15 V 10 16 23 mA Reference voltage Vref reference voltage (pin 14) I14 = −1 mA − 4.9 − V ∆Vref reference voltage dependence on temperature ∆V 14 ---------------------V 14 × ∆T − 0.3 − %/K I14 maximum output current short-circuit current 4 6 7.5 mA R14 ∆V 14 output resistor -----------∆I 14 I14 < 1.2 mA − 60 150 Ω IF amplifier ViIF(rms) input sensitivity (RMS value; pin 17) −3 dB before limiting 14 22 35 µV R17-18 input resistance ViIF = 200 mV (RMS) 10 − − kΩ C17-18 input capacitance ViIF = 200 mV (RMS) − 5 − pF VoIF(p-p) output voltage at pins 3 and 7 (peak-to-peak value) Z3, 7 = 10 pF parallel to 1 MΩ 610 680 750 mV R3-7 output resistance 200 250 300 Ω Demodulator R4-6 input resistance 20 30 40 kΩ C4-6 input capacitance − 1 2.5 pF R8, 9 output resistance 2.9 3.7 4.5 kΩ V8, 9 DC offset voltage on output pins at V4-6 = 0 V5 > 3 V or V3-7 = 0 or V13 < 0.3 V − 0 ±100 mV ∆V ------∆ϕ demodulator efficiency ∆V 8-9 -------------∆ϕ − 40 − mV/° demodulator efficiency dependent on supply voltage V 8-9 ----------------------------------------∆ϕ ( V P – 3V BE ) − 6.2 − mV/° V/V DC voltage ratio V8 + V9 ------------------2V 2 0.653 0.667 0.680 V/V ∆V ------∆T dependence on temperature V8 + V9 ∆------------------2V 2 ----------------------∆T − 10−5 − 1/K 1998 Nov 18 6 Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit SYMBOL TDA1576T PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Field strength output; see Fig.4 V15 output voltage ViIF = 0 0 0.1 0.25 V ViIF = 1 mV (RMS) 1.1 1.5 1.9 V ViIF = 250 mV (RMS) 3.2 3.6 4.1 V S control steepness − 0.85 − V/dec R15 output resistance − 150 200 Ω ∆V ------∆T dependence on temperature ∆V 15 V iIF = ---------------------∆T × V 15 − 0.3 − %/K I15 standby operational cut-off current V5 ≥ 3 V; V15 = 0 to 5 V − − 10 µA Zero level adjustment V16 internal bias voltage − 260 − mV R16 input resistance − 19 − kΩ S control steepness 0.87 1.0 1.2 V/V − 20 100 nA 6 30 − MΩ ViIF = 100 mV; ∆V 15 A = -----------∆V 16 Detuning detector I12 input bias current Z12 input impedance 5V Z 12 = ---------- ; see Fig.5 ∆I 12 V 13 --------V 14 output voltage ratio for ∆ϕ = ϕ(V3-7) − ϕ(V4-6) − 90° V1 = V2 = 7.5 V; R13-14 = 10 kΩ; pins 9 and 12 short-circuit; see Fig.6 I13 ∆ϕ = 9.2° (43 kHz); Q = 20 V9, 12 = 334 mV 0.45 0.5 0.55 V/V ∆ϕ = 3.5° (16 kHz); Q = 20 V9, 12 = 138 mV 0.75 0.8 0.85 V/V ∆ϕ = 14° (65 kHz); Q = 20 V9, 12 = 501 mV 0.335 0.345 0.355 V/V maximum output current V13 = 6 V; see Fig.7 0.4 0.5 0.6 mA cut-off current V13 = 2.5 V; V9, 12 = 0 − − −100 nA α = 1 dB 0.11 0.12 0.13 V/V α = 7.2 dB 0.095 0.1 0.105 V/V α ≥ 40 dB − 0.06 − V/V − − −225 nA Internal audio attenuation; see Fig.8 V 13 --------V 14 I13 output voltage ratio input current 1998 Nov 18 α = attenuation factor V13 ≤ 0.1 V 7 Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit SYMBOL TDA1576T PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Standby switch; see Fig.9 V5 input voltage for FM on 2.4 2.5 − V − 2.9 3 V V19 = 0.3 V − 350 − mV V5 = 0 to 2 V − − −100 µA V5 = 3.5 to 15 V − − 1 µA FM on (3.5VBE) − 7 − mV/K FM off (5VBE) − 10 − mV/K proportional to V1 − 3VBE 80 210 400 mV 5.8 8.3 10.8 kΩ input voltage for FM off V 3, 7 ----------------------- = 0.9 ; V 3, 7(max) linear range I5 input current V5 ------∆T temperature dependence Supply voltage smoothing V1-2 internal voltage drop R1-2 internal resistor OPERATING CHARACTERISTICS VP = 8.5 V; fIF = 10.7 MHz; RS = 60 Ω; fm = 400 Hz with ∆f = ±22.5 kHz; 50 µs de-emphasis (C8-9 = 6.8 nF); Tamb = 25 °C and measurements taken in Fig.1; unless otherwise specified. The demodulator circuit is adjusted at minimum second harmonic distortion with ViIF = 1 mV. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT IF amplifier and demodulator ViIF(rms) input sensitivity (RMS value) −3 dB before limiting 14 22 35 µV S/N = 26 dB − 10 − µV S/N = 46 dB − 55 − µV 60 67 75 mV VoAF(rms) AF output voltage (RMS value) VoN noise voltage for ViIF = 0 (RMS value; pins 8 and 9) RS = 300 Ω; f = 250 to 15000 Hz − 900 − µV weighted noise voltage in accordance with “DIN 45405” − 2 − mV S/N signal-to-noise ratio (pins 8 and 9) ViIF = 1 mV (RMS); see Fig.3 − 72 − dB αAM AM suppression ViIF = 0.5 to 200 mV; FM: 70 Hz; ±15 kHz; AM: 1 kHz; m = 30% − 50 − dB αFM FM suppression for FM off ViIF = 500 mV; V5 = 3 V 80 − − dB ∆V8, 9 AFC shift in relation to minimum second harmonic distortion α2H ViIF = 0.03 to 500 mV − 25 − mV DC offset at second harmonic distortion operating − 0 ±100 mV mute or FM off α3H distortion for third harmonic RR ripple rejection Vripple = 200 mV on VP 1998 Nov 18 f = 100 Hz 8 − 0 ±50 mV − 0.65 − % 43 48 − dB Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit TDA1576T MEH166 20 handbook, full pagewidth V8, V9 (dB) S+N 0 −20 −40 −60 N −80 10−6 Fig.3 10−5 10−4 10−3 10−2 10−1 V 1 i 17 (rms) (V) AF output voltage level on pins 8 and 9 as a function of ViIF at VP = 8.5 V; fm = 1 kHz; QL = 20 with de-emphasis. MEH143 5 handbook, full pagewidth V15 (V) 4 3 2 1 0 10−6 10−5 10−4 10−3 10−2 Fig.4 Field strength output (I16 = 0). 1998 Nov 18 9 10−1 ViIF (rms) (V) 1 Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit TDA1576T MEH144 handbook, halfpage MEH145 1 handbook, halfpage I12 V13/V14 Ri 0.5 I12 0 −1.2 V9, 12 −0.8 Fig.5 Detuning input impedance. 0.8 1.2 V9, 12 (V) MEH147 0 αVo (dB) I13 (mA) −20 0.5 −40 1.2 1 0.5 0 |V9, 12| −60 −80 0 2 4 V13 (V) 6 Fig.7 Detuning output. 1998 Nov 18 0.4 handbook, halfpage handbook, halfpage 0 0 Fig.6 Detuning curve. MEH146 1 −0.4 0 0.1 0.2 V13 /V14 Fig.8 Internal audio attenuation. 10 0.3 Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit TDA1576T MEH148 2 handbook, halfpage V3-7 V3-7 (max) ∆V5 1 0 0 1 2 V5 (V) 3 Fig.9 Standby switch. handbook, full pagewidth 33 pF 3 (1) 39 pF (1) 4 560 pF TDA1576T 1 kΩ L1 560 pF L2 390 Ω 6 39 pF 7 9 8 MBK240 33 pF C8-9 VoAF Adjustment of the demodulator circuit is obtained with an IF signal which is higher than the 3 dB limiting level; L2 should be short-circuited or detuned; L1 should be adjusted to minimum d2 distortion, and then L2 to minimum d2 distortion. (1) Coil data: L1 = L2 = 0.38 µH; Qo = 70; coil former KAN (C). Fig.10 An example of the TDA1576T when using a demodulator with two tuned circuits. 1998 Nov 18 11 Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit TDA1576T PACKAGE OUTLINE SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1998 Nov 18 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 12 Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit TDA1576T • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. SOLDERING Introduction to soldering surface mount packages • For packages with leads on two sides and a pitch (e): This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: 1998 Nov 18 13 Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit TDA1576T Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable HLQFP, HSQFP, HSOP, SMS not PLCC(3), SO, SOJ suitable suitable(2) suitable suitable suitable LQFP, QFP, TQFP not recommended(3)(4) suitable SSOP, TSSOP, VSO not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Nov 18 14 Philips Semiconductors Product specification FM/IF amplifier/demodulator circuit TDA1576T NOTES 1998 Nov 18 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545102/750/02/pp16 Date of release: 1998 Nov 18 Document order number: 9397 750 04823