INTEGRATED CIRCUITS DATA SHEET CGY2032TS DECT 500 mW power amplifier Product specification Supersedes data of 1998 Nov 23 File under Integrated Circuits, IC17 1999 Jul 21 Philips Semiconductors Product specification DECT 500 mW power amplifier CGY2032TS FEATURES APPLICATIONS • Power Amplifier (PA) overall efficiency 55% • 1.88 to 1.9 GHz transceivers for DECT applications • 27.5 dBm saturated output power at 3.2 V • 2 GHz transceivers [Personal Handy phone System (PHS), Digital Cellular System (DCS) and Personal Communication Services (PCS)]. • 0 dBm input power • 40 dB linear gain • Operation without negative supply GENERAL DESCRIPTION • Wide operating temperature range −30 to +85 °C The CGY2032TS is a GaAs Monolithic Microwave Integrated Circuit (MMIC) power amplifier specifically designed to operate from 3.6 V battery supply. No negative supply voltage is required for operation. • SSOP16 package. QUICK REFERENCE DATA PARAMETER(1) SYMBOL MIN. TYP. MAX. UNIT VDD positive supply voltage − 3.2 − V IDD positive peak supply current − 350 − mA Po output power − 27.5 − dBm Tamb ambient temperature −30 − +85 °C Note 1. For conditions, see Chapters “AC characteristics” and “DC characteristics”. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME CGY2032TS SSOP16 DESCRIPTION VERSION plastic shrink small outline package; 16 leads; body width 4.4 mm BLOCK DIAGRAM handbook, halfpage VDD1 8 VDD2 VDD3 5 1 CGY2032TS RFI 11 16 15 10 2, 3, 4 12, 13, 14 6, 7 MGK735 GND1 GND2 GND3 Fig.1 Block diagram. 1999 Jul 21 2 RFO OPM SOT369-1 Philips Semiconductors Product specification DECT 500 mW power amplifier CGY2032TS PINNING SYMBOL PIN DESCRIPTION VDD3 1 third stage supply voltage GND3 2 third stage ground supply GND3 3 third stage ground supply GND3 4 third stage ground supply VDD2 5 second stage supply voltage GND2 6 second stage ground supply GND2 7 second stage ground supply VDD1 8 first stage supply voltage VDD2 5 12 GND3 n.c. 9 not connected GND2 6 11 RFI GND1 10 first stage ground supply GND2 7 10 GND1 RFI 11 PA input VDD1 8 9 GND3 12 third stage ground supply GND3 13 third stage ground supply GND3 14 third stage ground supply OPM 15 output pre-matching RFO 16 PA output handbook, halfpage VDD3 1 16 RFO GND3 2 15 OPM GND3 3 14 GND3 GND3 4 13 GND3 CGY2032TS n.c. MGK734 Fig.2 Pin configuration. FUNCTIONAL DESCRIPTION This switch can also be used to vary the actual supply voltage applied to the amplifier and hence, control the output power. Amplifier The CGY2032TS is a 3-stage GaAs power amplifier capable of delivering 500 mW (typ.) at 1.9 GHz into a 50 Ω load. Each amplifier stage has an open-drain configuration. The drains have to be loaded externally by adequate reactive circuits which must also provide a DC path to the supply. This device is specifically designed to work with a duty factor of 50% and can work up to 100% with good thermal performance printed-circuit boards. Biasing Internal biasing is provided inside the amplifier for class AB operation. The amplifier can be switched off by means of a single external PNP or PMOS series switch connected between the battery and the amplifier drains. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MAX. UNIT − 5.2 V − 150 °C − 450 mW input power − 15 dBm storage temperature −55 +125 °C VDD operating supply voltage Tj(max) maximum operating junction temperature Ptot total power dissipation Pi Tstg note 1 note 2 Notes 1. On Philips evaluation board. 2. On Philips evaluation board, Ptot maximum value is 800 mW. 1999 Jul 21 MIN. 3 Philips Semiconductors Product specification DECT 500 mW power amplifier CGY2032TS HANDLING Do not operate or store near strong electrostatic fields. Meets class 1 ESD test requirements [Human Body Model (HBM)], in accordance with “MIL STD 883C - method 3015”. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient VALUE UNIT 145 K/W in free air; note 1 Note 1. On Philips evaluation board, Rth(j-a) value is typically 80 K/W. DC CHARACTERISTICS Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Pins VDD1, VDD2 and VDD3 VDD positive supply voltage IDD positive peak supply current VDD = 3.2 V 1.8 3.2 4.2 V − − 800 mA AC CHARACTERISTICS VDD = 3.2 V; fRF = 1900 MHz; Pi = 0 dBm; Tamb = 25 °C; duty factor δ = 50%; 50 Ω impedance system; measured and guaranteed on the CGY2032TS evaluation board; the circuit diagram is shown in Fig.5. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Pi input power −5 0 +5 dBm δ duty factor − 50 100 % Po output power 26.5 27.5 29 dBm IDD total drain current − − 500 mA η efficiency − 55 − % Pleak RF leakage to output in power off state − −40 −35 dBm H2 second harmonic level − − −30 dBc H3 third harmonic level − − −35 dBc Stab stability (spurious levels) − −60 − dBc VDD = 0 V note 1 Note 1. The device is adjusted to provide nominal value of load power into a 50 Ω load. The device is switched off and a 6 : 1 load replaces the 50 Ω load. The device is switched on and the phase of the 6 : 1 load is varied 360 electrical degrees during a 60 seconds test period. 1999 Jul 21 4 Philips Semiconductors Product specification DECT 500 mW power amplifier CGY2032TS FCA009 30 100 handbook, full pagewidth Po (dBm) η power output (%) 26 80 22 60 efficiency 18 40 14 20 10 −20 −15 −10 0 −5 0 5 Pi (dBm) 10 Fig.3 Typical output power and efficiency versus input power at VDD = 3.2 V. MGK738 30 handbook, full pagewidth 100 η Po (dBm) (%) power output 26 80 22 60 efficiency 18 40 14 20 10 0 0.5 1 1.5 2 2.5 3 3.5 4 VDD (V) Fig.4 Typical output power and efficiency versus supply voltage at Pi = 0 dBm. 1999 Jul 21 5 0 4.5 Philips Semiconductors Product specification DECT 500 mW power amplifier CGY2032TS APPLICATION INFORMATION The CGY2032TS is operated and tested in accordance with the circuit diagram shown in Fig.5. Supply voltage switching is achieved by a single bipolar PNP transistor. handbook, full pagewidth Vbat 220 Ω 10 µF BC807 10 kΩ control BC849C 6.8 pF VDD 10 nF 47 kΩ 33 pF TRL1(1) VDD1 8 RFI 22 pF 6.8 pF TRL2(2) TRL3(3) VDD2 5 VDD3 1 RFO CGY2032TS 11 10 6, 7 GND1 GND2 2, 3, 4 12, 13, 14 GND3 16 1.2 pF 15 OPM TRL4(4) MGK736 Thickness: 0.8 mm; substrate: FR4; εr = 4.7. (1) TRL1: width = 500 µm; length = 10 mm. (2) TRL2: width = 500 µm; length = 3000 µm. (3) TRL3: width = 500 µm; length = 7 mm. (4) TRL4: adjusted for optimum matching; width = 500 µm; length = 1 to 3 mm. Fig.5 Evaluation board circuit diagram. 1999 Jul 21 6 Philips Semiconductors Product specification DECT 500 mW power amplifier CGY2032TS PACKAGE OUTLINE SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm D SOT369-1 E A X c y HE v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 8 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 1.5 0.15 0.00 1.4 1.2 0.25 0.32 0.20 0.25 0.13 5.30 5.10 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.45 0.65 0.45 0.2 0.13 0.1 0.48 0.18 10 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 94-04-20 95-02-04 SOT369-1 1999 Jul 21 EUROPEAN PROJECTION 7 o Philips Semiconductors Product specification DECT 500 mW power amplifier CGY2032TS SOLDERING If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 1999 Jul 21 8 Philips Semiconductors Product specification DECT 500 mW power amplifier CGY2032TS Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable HLQFP, HSQFP, HSOP, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable suitable(2) suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Jul 21 9 Philips Semiconductors Product specification DECT 500 mW power amplifier CGY2032TS NOTES 1999 Jul 21 10 Philips Semiconductors Product specification DECT 500 mW power amplifier CGY2032TS NOTES 1999 Jul 21 11 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 465008/04/pp12 Date of release: 1999 Jul 21 Document order number: 9397 750 05971