PHILIPS 74AHCU04

INTEGRATED CIRCUITS
DATA SHEET
74AHCU04
Hex inverter
Product specification
Supersedes data of 1999 Feb 26
File under Integrated Circuits, IC06
1999 Sep 27
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
FEATURES
• ESD protection:
HBM EIA/JESD22-A114-A
exceeds 2000 V
MM EIA/JESD22-A115-A
exceeds 200 V
CDM EIA/JESD22-C101
exceeds 1000 V
• Balanced propagation delays
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C; tr = tf ≤ 3.0 ns.
SYMBOL
• Specified from
−40 to +85 and +125 °C.
TYPICAL
UNIT
propagation delay
nA to nY
CL = 15 pF;
VCC = 5 V
1.5
ns
CI
input capacitance
VI = VCC or GND
3.0
pF
CO
output capacitance
4.0
pF
CPD
power dissipation
capacitance
9.1
pF
CL = 50 pF;
f = 1 MHz;
notes 1 and 2
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
DESCRIPTION
The 74AHCU04 is high-speed Si-gate
CMOS devices and is pin compatible
with low power Schottky TTL
(LSTTL). It is specified in compliance
with JEDEC standard No. 7A.
The 74AHCU04 is a general purpose
hex inverter. Each of the six inverters
is a single stage.
FUNCTION TABLE
See note 1.
INPUT nA
OUTPUT nY
L
H
H
L
∑ (CL × VCC2 × fo) = sum of outputs;
CL = output load capacitance in pF;
VCC = supply voltage in Volts.
2. The condition is VI = GND to VCC.
PINNING
PIN
SYMBOL
DESCRIPTION
1, 3, 5, 9, 11 and 13
1A to 6A
data inputs
2, 4, 6, 8, 10 and 12
1Y to 6Y
data outputs
7
GND
ground (0 V)
14
VCC
DC supply voltage
Note
1. H = HIGH voltage level;
L = LOW voltage level.
1999 Sep 27
CONDITIONS
tPHL/tPLH
• All inputs have Schmitt-trigger
actions
• Inputs accepts voltages higher than
VCC
PARAMETER
2
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
ORDERING INFORMATION
OUTSIDE NORTH
AMERICA
PACKAGES
NORTH AMERICA
PINS
PACKAGE
MATERIAL
CODE
74AHCU04D
74AHCU04D
14
SO
plastic
SOT108-1
74AHCU04PW
74AHC04PW DH
14
TSSOP
plastic
SOT402-1
handbook, halfpage
1A
1
14 VCC
1Y
2
13 6A
2A
3
12 6Y
2Y
4
3A
5
10 5Y
3Y
6
9
GND
7
8 4Y
100 Ω
11 5A
U04
VCC VCC
handbook, halfpage
nY
nA
4A
MNA346
MNA345
Fig.1 Pin configuration.
Fig.2 Schematic diagram (one inverter).
handbook, halfpage
1
1
2
handbook, halfpage
1
1A
1Y
2
3
2A
2Y
4
5
3A
3Y
6
9
4A
4Y
8
11
5A
5Y
10
3
5
9
11
13
6A
6Y
1
4
1
6
1
8
1
10
12
13
1
12
MNA347
MNA348
Fig.3 Functional diagram.
1999 Sep 27
Fig.4 IEC logic symbol.
3
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
VCC
DC supply voltage
2.0
5.0
5.5
V
VI
input voltage
0
−
5.5
V
VO
output voltage
0
−
VCC
V
Tamb
operating ambient temperature range see DC and AC characteristics per
device
−40
+25
+85
°C
−40
+25
+125 °C
VCC = 3.3 V ±0.3 V
−
−
100
VCC = 5 V ±0.5 V
−
−
20
tr,tf (∆t/∆f) input rise and fall rates
ns/V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
CONDITIONS
MIN. MAX. UNIT
−0.5
+7.0
V
−0.5
+7.0
V
−
−20
mA
VO < −0.5 V or VO > VCC + 0.5 V; note 1
−
±20
mA
−0.5 V < VO < VCC + 0.5 V
VCC
DC supply voltage
VI
input voltage range
IIK
DC input diode current
VI < −0.5 V; note 1
IOK
DC output diode current
IO
DC output source or sink current
−
±25
mA
ICC
DC VCC or GND current
−
±75
mA
Tstg
storage temperature range
−65
+150 °C
PD
power dissipation per package
−
500
for temperature range: −40 to +125 °C;
note 2
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. For SO packages: above 70 °C the value of PD derates linearly with 8 mW/K.
For TSSOP packages: above 60 °C the value of PD derates linearly with 5.5 mW/K.
1999 Sep 27
4
mW
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
DC CHARACTERISTICS
Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).
TEST CONDITIONS
SYMBOL
PARAMETER
VIL
VOH
VCC (V)
−40 to +125 UNIT
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
2.0
1.7
−
−
1.7
−
1.7
−
3.0
2.4
−
−
2.4
−
2.4
−
5.5
4.4
−
−
4.4
−
4.4
−
2.0
−
−
0.3
−
0.3
−
0.3
3.0
−
−
0.6
−
0.6
−
0.6
5.5
−
−
1.1
−
1.1
−
1.1
2.0
1.8
2.0
−
1.8
−
1.8
−
3.0
2.7
3.0
−
2.7
−
2.7
−
4.5
4.0
4.5
−
4.0
−
4.0
−
VI = VIH or VIL;
IO = −4.0 mA
3.0
2.58 −
−
2.48 −
2.40
−
VI = VIH or VIL;
IO = −8.0 mA
4.5
3.94 −
−
3.8
−
3.7
−
LOW-level output VI = VIH or VIL;
voltage; all outputs IO = 50 µA
2.0
−
0
0.2
−
0.2
−
0.2
3.0
−
0
0.3
−
0.3
−
0.3
4.5
−
0
0.5
−
0.5
−
0.5
VI = VIH or VIL;
IO = 4 mA
3.0
−
−
0.36
−
0.44
−
0.55
VI = VIH or VIL;
IO = 8 mA
4.5
−
−
0.36
−
0.44
−
0.55
−
1.0
−
2.0
±2.5
−
±10.0 µA
HIGH-level input
voltage
LOW-level input
voltage
HIGH-level output VI = VIH or VIL;
voltage; all outputs IO = −50 µA
HIGH-level output
voltage
VOL
−40 to +85
25
OTHER
VIH
Tamb (°C)
LOW-level output
voltage
V
V
V
V
V
V
II
input leakage
current
VI = VCC or GND
5.5
−
−
0.1
IOZ
3-state output
OFF current
VI = VIH or VIL;
5.5
VO = VCC or GND
−
−
±0.25 −
ICC
quiescent supply
current
VI = VCC or GND;
IO = 0
−
−
2.0
−
20
−
40
µA
CI
input capacitance
−
3
10
−
10
−
10
pF
1999 Sep 27
5.5
5
µA
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
AC CHARACTERISTICS
GND = 0 V; tr = tf ≤ 3.0 ns.
TEST CONDITIONS
SYMBOL
Tamb (°C)
PARAMETER
−40 to +85
25
WAVEFORMS
CL
MIN.
−40 to +125
UNIT
TYP.
MAX. MIN. MAX.
MIN.
MAX.
15 pF −
3.0
7.1
1.0
8.5
1.0
9.0
ns
50 pF −
4.3
10.6
1.0
12
1.0
13.5
ns
15 pF −
2.4
5.5
1.0
6.5
1.0
7.0
ns
50 pF −
3.5
7.0
1.0
8.0
1.0
9.0
ns
VCC = 3.0 to 3.6 V; note 1
tPHL/tPLH
propagation
delay nA to nY
see Figs 5 and 6
VCC = 4.5 to 5.5 V; note 2
tPHL/tPLH
propagation
delay nA to nY
see Figs 5 and 6
Notes
1. Typical values at VCC = 3.3 V.
2. Typical values at VCC = 5.0 V.
1999 Sep 27
6
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
AC WAVEFORMS
handbook, halfpage
VM(1)
nA INPUT
t PHL
t PLH
VM(1)
nY OUTPUT
MNA349
VM(1)
INPUT
VI INPUT
REQUIREMENTS
GND to VCC
50% VCC
VM(1)
OUTPUT
50% VCC
Fig.5 The input (nA) to output (nY) propagation delay.
S1
handbook, full pagewidth
VCC
PULSE
GENERATOR
VI
1000 Ω
VO
D.U.T.
CL
RT
MNA219
TEST
S1
tPLH/tPHL
open
tPLZ/tPZL
VCC
tPHZ/tPZH
GND
Fig.6 Load circuitry for switching times.
1999 Sep 27
7
VCC
open
GND
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
TYPICAL TRANSFER CHARACTERISTICS
MNA351
8
MNA352
4
30
handbook, halfpage
6
handbook, halfpage
VO
ID
VO
(V)
(mA)
(V)
ID
(mA)
VO
6
20
3
4
4
10
2
2
0
1
0
−10
0
ID
ID
2
VO
0
0
2
4
Vi (V)
6
0
1
Fig.7 VCC = 5.5 V; IO = 0.
2
3
Vi (V)
−2
Fig.8 VCC = 3.0 V; IO = 0.
MNA353
2
handbook, halfpage
VO
700
VO
ID
(µA)
(V)
1.5
handbook, halfpage
Rbias = 560 kΩ
500
VCC
ID
1
0.47 µF
300
Vi
(f = 1 kHz)
0.5
input
output
100 µF
A Io
GND
100
MNA354
0
0
0
0.5
1
1.5 V (V)
i
2
−100
Fig.10 Test set-up for measuring forward
transconductance gfs = dIo/dVi at Vo is
constant (see Fig.11).
Fig.9 VCC = 2.0 V; IO = 0.
1999 Sep 27
8
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
APPLICATION INFORMATION
Some applications for the AHCU04 are:
• Linear amplifier (see Fig.12)
MNA355
• In crystal oscillator design (see Fig.13)
40
handbook, halfpage
g fs
• Astable multivibrator (see Fig.14).
(mA/V)
All values given are typical unless otherwise specified.
30
20
10
0
0
2
4
VCC (V)
6
Fig.11 Typical forward transconductance gfs as a
function of the supply voltage at
Tamb = 25 °C.
R2
handbook, halfpage
handbook, halfpage
R1
VCC
1 µF
R2
R1
U04
U04
C1
ZL
C2
out
GND
MNA053
MNA052
ZL > 10 kΩ; AOL = 12 (typical)
A OL
A u = – ------------------------------------------- ;
R1
1 + -------- ( 1 + A OL )
R2
1
V 0 max (p-p) ≈ V CC – 2 V centered at --- V CC
2
C1 = 47 pF (typical).
C2 = 33 pF (typical).
R1 = 1 to 10 MΩ (typical).
R2 optimum value depends on the frequency and required stability
against changes in VCC or average minimum ICC (ICC is typically
5 mA at VCC = 5 V and f = 10 MHz).
R1 ≥ 3 kΩ, R2 ≤ 1 MΩ.
Typical unity gain bandwidth product is 5 MHz.
AOL = open loop amplification.
Au = voltage amplification.
Fig.12 Used as a linear amplifier.
1999 Sep 27
Fig.13 Crystal oscillator configuration.
9
Philips Semiconductors
Product specification
Hex inverter
Table 1
74AHCU04
External components for resonator (f < 1 MHz)
FREQUENCY
(kHz)
R1 (MΩ) R2 (kΩ) C1 (pF)
C2 (pF)
10 to 15.9
22
220
56
20
16 to 24.9
22
220
56
10
25 to 54.9
22
100
56
10
55 to 129.9
22
100
47
5
130 to 199.9
22
47
47
5
200 to 349.9
10
47
47
5
350 to 600
10
47
47
5
handbook, halfpage
U04
RS
U04
R
C
MNA356
Note
1. All values given are typical and must be used as an
initial set-up.
Table 2
Optimum value for R2
FREQUENCY
(kHz)
3
6
10
14
>14
1999 Sep 27
R2 (kΩ)
The average ICC (mA) is approximately
3.5 + 0.05 × f (MHz) × C (pF) at VCC = 5.0 V.
OPTIMUM FOR
2.0
minimum required ICC
8.0
minimum influence due to
change in VCC
1.0
minimum required ICC
4.7
minimum influence by VCC
0.5
minimum required ICC
2.0
minimum influence by VCC
0.5
minimum required ICC
1.0
minimum influence by VCC
RS ≈ 2 × R
1
1
1 = --- ≈ ----------------T 2.2RC
Fig.14 Used as an astable multivibrator.
replace R2 by C3 with a typical value of
35 pF
10
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
PACKAGE OUTLINES
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.010 0.057
0.004 0.049
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.050
0.028
0.024
0.01
0.01
0.004
0.028
0.012
inches 0.069
0.244
0.039
0.041
0.228
0.016
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06S
MS-012AB
1999 Sep 27
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-23
97-05-22
11
o
8
0o
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
E
D
A
X
c
y
HE
v M A
Z
8
14
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.10
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1.0
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.72
0.38
8
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
1999 Sep 27
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
94-07-12
95-04-04
MO-153
12
o
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
1999 Sep 27
13
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
REFLOW(1)
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Sep 27
14
Philips Semiconductors
Product specification
Hex inverter
74AHCU04
NOTES
1999 Sep 27
15
Philips Semiconductors – a worldwide company
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Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
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72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 68
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245002/02/pp16
Date of release: 1999
Sep 27
Document order number:
9397 750 06281