SEME-LAB 2N7086

2N7086
MECHANICAL DATA
Dimensions in mm(inches)
4.83 (0.190)
5.08 (0.200)
0.89 (0.035)
1.14 (0.045)
3.56 (0.140)
Dia.
3.81 (0.150)
10.41 (0.410)
10.92 (0.430)
13.38 (0.527)
13.64 (0.537)
16.38 (0.645)
16.89 (0.665)
10.41 (0.410)
10.67 (0.420)
N–CHANNEL
ENHANCEMENT MODE
TRANSISTOR
V(BR)DSS
ID(A)
RDS(on)
12.07 (0.500)
19.05 (0.750)
1 2 3
200V
14A
Ω
0.16Ω
0.64 (0.025)
Dia.
0.89 (0.035)
2.54 (0.100)
BSC
3.05 (0.120)
BSC
FEATURES
• TO257AB HERMETIC PACKAGE FOR
HIGH RELIABILITY APPLICATIONS
TO–257AB Metal Package
• SCREENING OPTIONS AVAILBLE
Pin 1 – Gate
Pin 2 – Drain
Pin 3 – Source
• SIMPLE DRIVE REQUIREMENTS
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C unless otherwise stated)
VDS
Drain – Source Voltage
200V
VGS
Gate – Source Voltage
±20V
ID
Continuous Drain Current
IDM
Pulsed Drain Current 1
PD
Power Dissipation
TC = 25°C
14A
TC = 100°C
8.5A
56A
TC = 25°C
60W
TC = 100°C
23W
TJ , Tstg
Operating and Storage Temperature Range
TL
Lead Temperature (1/16” from case for 10 sec.)
Semelab plc.
–55 to 150°C
Telephone +44(0)1455 556565. Fax +44(0)1455 552612. e-mail [email protected]
Website http://www.semelab.co.uk
300°C
Prelim. 1/99
2N7086
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise stated)
Parameter
Test Conditions
Min.
STATIC ELECTRICAL RATINGS
BV(BR)DSS Drain–Source Breakdown Voltage VGS = 0
ID = 250µA
200
VGS(th)
Gate Threshold Voltage
VDS = VGS
ID = 250µA
2
IGSS
Gate – Body Leakage
VDS = 0
VGS = ±20V
IDSS
Zero Gate Voltage Drain Current
ID(on)
RDS(on)
gfs
On–State Drain Current1
VDS = 10V
VGS = 10V
Static Drain – Source On–State
VGS = 10V
Forward Transconductance1
ID = 8.5A
TJ = 125°C
VDS = 15V
IDS = 8.5A
Unit
4
V
±100
nA
25
TJ = 125°C
Resistance
Max.
V
VDS = 160V
VGS = 0
1
Typ.
250
14
µA
A
0.14
0.16
0.25
0.30
5.0
Ω
S
DYNAMIC CHARACTERISTICS
Ciss
Input Capacitance
VGS = 0
1550
Coss
Output Capacitance
VDS = 25V
500
Crss
Reverse Transfer Capacitance
f = 1MHz
220
Qg
Qgs
Qgd
td(on)
tr
Total Gate
Charge2
Gate Source
Gate Drain
Charge2
Charge2
Turn–On Delay
Rise
Time2
Time2
td(off)
Turn–Off Delay
tf
Fall Time2
Time2
pF
30
44
77
4.6
10
15
13
26
35
10
30
VGEN =10V
60
100
RL = 7.1Ω
30
80
RG = 4.7Ω
40
95
VDS = 0.5 x V(BR)DSS
VGS = 10V
ID = 14A
VDD = 100V
ID = 14A
nC
ns
SOURCE – DRAIN DIODE CHARACTERISTICS
IS
114
Continuous Current
3
ISM
Pulse Current
VSD
Forward Voltage
IF = IS
trr
Reverse Recovery Time
IF = IS
150
Qrr
Reverse Recovery Charge
dIF/dt = 100A/µs
0.5
56
VGS = 0
A
2.0
V
650
ns
µC
1Pulse
test : Pulse Width < 300µs ,Duty Cycle < 2%
of Operating Temperature
3Pulse width Limited by maximum Junction Temperature
2Independent
THERMAL RESISTANCECHARACTERISTICS
Parameter
Min.
Typ.
Max.
RthJC
Thermal resistance Junction-Case
2.1
RthJA
Thermal resistance Junction-ambient
80
RthCS
Thermal resistance Junction-ambient
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612. e-mail [email protected]
Website http://www.semelab.co.uk
Unit
K/W
1.0
Prelim. 1/99