MAXIM DS1858

Rev 0; 1/03
Dual Temperature-Controlled Resistors with
Three Monitors
The DS1858 dual temperature-controlled nonvolatile
(NV) variable resistors with three monitors consists of
two 50kΩ 256-position linear variable resistors, three
analog monitor inputs (MON1, MON2, MON3), and a
direct-to-digital temperature sensor. The device provides an ideal method for setting and temperature-compensating bias voltages and currents in control
applications using minimal circuitry. The variable resistor settings are stored in EEPROM memory and can be
accessed over the 2-wire serial bus.
Features
♦ Five Total Monitored Channels (Temperature,
VCC, MON1, MON2, MON3)
♦ Three External Analog Inputs (MON1, MON2,
MON3)
♦ Internal Direct-to-Digital Temperature Sensor
♦ Two 50kΩ, Linear, 256-Position, Nonvolatile
Temperature-Controlled Variable Resistors
♦ Resistor Settings Changeable Every 2°C
♦ Access to Monitoring and ID Information
Configurable with Separate Device Addresses
Applications
♦ 2-Wire Serial Interface
Optical Transceivers
Optical Transponders
♦ Two Buffers with TTL/CMOS-Compatible Inputs
and Open-Drain Outputs
Instrumentation and Industrial Controls
RF Power Amps
♦ Operates from a 3.3V or 5V Supply
♦ SFF-8472 Compatible
Diagnostic Monitoring
Typical Operating Circuit
Ordering Information
PART
VCC
VCC = 3.3V
4.7kΩ
4.7kΩ
1
2-WIRE
INTERFACE
2
3
Tx-FAULT
4
5
LOS
GROUND TO
DISABLE WRITE
PROTECT
6
7
8
0.1µF
VCC
SDA
H1
SCL
L1
OUT1
IN1
OUT2
DS1858
16
15
14
13
H0
12
L0
IN2
MON3
WPEN
MON2
GND
MON1
DECOUPLING
CAP
TEMP RANGE PIN-PACKAGE
DS1858E-050
-40°C to +95°C 16 TSSOP
DS1858E-050/T&R
-40°C to +95°C
DS1858B-050
-40°C to +95°C 16-Ball CSBGA
TO LASER BIAS
CONTROL
Pin Configurations
TO LASER
MODULATION
CONTROL
10 Rx POWER*
9 Tx BIAS*
TOP VIEW
A
11 Tx POWER*
DIAGNOSTIC
INPUTS
0 TO 2.5V FS
16 TSSOP
(Tape-and-Reel)
B
IN1
OUT2
SCL
SDA
VCC
H0
H1
1 SDA
VCC 16
2 SCL
H1 15
3 OUT1
L1 14
L1
4 IN1
*Rx POWER, Tx BIAS, AND Tx POWER CAN BE
ARBITRARILY ASSIGNED TO THE MON INPUTS
C
D
WPEN
IN2
OUT1
5 OUT2
MON3
GND
L0
MON1
MON2
1
2
3
4
16-BALL CSBGA (4mm x 4mm)
1.0mm PITCH
H0 13
DS1858
L0 12
6 IN2
MON3 11
7 WPEN
MON2 10
8 GND
MON1 9
16 TSSOP
______________________________________________ Maxim Integrated Products
For pricing delivery, and ordering information please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
DS1858
General Description
DS1858
Dual Temperature-Controlled Resistors with
Three Monitors
ABSOLUTE MAXIMUM RATINGS
Voltage on VCC Relative to Ground.......................-0.5V to +6.0V
Voltage on Inputs Relative
to Ground* ................................................-0.5V to VCC + 0.5V
Voltage on Resistor Inputs Relative
to Ground* ................................................-0.5V to VCC + 0.5V
Current into Resistors............................................................5mA
Operating Temperature Range ...........................-40°C to +95°C
Programming Temperature Range .........................0°C to +70°C
Storage Temperature Range .............................-55°C to +125°C
Soldering Temperature .......................................See IPC/JEDEC
*Not to exceed 6.0V.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
(TA = -40°C to +95°C, unless otherwise noted.)
MAX
UNITS
Supply Voltage
PARAMETER
SYMBOL
VCC
(Note 1)
CONDITIONS
3.0
5.5
V
Input Logic 1 (SDA, SCL, WPEN)
VIH
(Note 2)
0.7 x Vcc
VCC + 0.3
V
Input Logic 0 (SDA, SCL, WPEN)
VIL
(Note 2)
-0.3
0.3 x VCC
V
-0.3
VCC + 0.3
V
-3
+3
mA
Resistor Inputs (L0, L1, H0, H1)
Resistor Current
IRES
Input Logic Levels (IN1, IN2)
VIH
Input logic 1
VIL
Input logic 0
MIN
TYP
1.5
0.9
V
DC ELECTRICAL CHARACTERISTICS
(VCC = 3.0V to 5.5V, TA = -40°C to +95°C, unless otherwise noted.)
PARAMETER
Supply Current
Input Leakage
SYMBOL
ICC
IIL
Input Current each I/O Pin
Low-Level Output Voltage (SDA)
CONDITIONS
MIN
MAX
2
UNITS
mA
-1
+1
µA
µA
(Note 3)
0.4 x VCC < VI/O < 0.9 x VCC
TYP
1
-10
+10
VOL1
3mA sink current
0
0.4
VOL2
6mA sink current
0
0.6
V
Full-Scale Input (MON1, MON2,
MON3)
(Note 4)
2.4875
2.5
2.5125
V
Full-Scale VCC Monitor
(Note 5)
6.5208
6.5536
6.5864
V
10
pF
40
65
100
kΩ
0.4
V
I/O Capacitance
WPEN Pullup
OUT1, OUT2 Voltage
CI/O
RWPEN
VOL1
3mA sink current
VOL2
6mA sink current
0
0
0.6
V
Digital Power-On Reset
POD
1.0
2.2
V
Analog Power-On Reset
POA
2.0
2.6
V
2
_____________________________________________________________________
Dual Temperature-Controlled Resistors with
Three Monitors
DS1858
ANALOG RESISTOR CHARACTERISTICS
(VCC = 3.0V to 5.5V, TA = -40°C to +95°C, unless otherwise noted.)
MIN
TYP
MAX
UNITS
Position 00h Resistance
PARAMETER
SYMBOL
TA = +25°C
CONDITIONS
0.7
1.0
1.25
kΩ
Position FFh Resistance
TA = +25°C
40
50
60
kΩ
Absolute Linearity
(Note 6)
-2
+2
LSB
Relative Linearity
(Note 7)
-1
+1
LSB
Temperature Coefficient
(Note 8)
50
ppm/°C
ANALOG VOLTAGE MONITORING
(VCC = 3.0V to 5.5V, TA = -40°C to +95°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
∆VMON
610
µV
Supply Resolution
∆VCC
1.6
mV
Input/Supply Accuracy
ACC
0.25
0.5
% FS
(full scale)
tframe
25
36
ms
Input Resolution
Update Rate for MON1, MON2,
MON3, Temp, or VCC
DIGITAL THERMOMETER
(VCC = 3.0V to 5.5V, TA = -40°C to +95°C, unless otherwise noted.)
PARAMETER
Thermometer Error
SYMBOL
TERR
CONDITIONS
-40°C to +95°C
TYP
MAX
UNITS
±3.0
°C
_____________________________________________________________________
3
DS1858
Dual Temperature-Controlled Resistors with
Three Monitors
AC ELECTRICAL CHARACTERISTICS
(VCC = 3.0V to 5.5V, TA = -40°C to +95°C, unless otherwise noted.)
PARAMETER
SYMBOL
SCL Clock Frequency
fSCL
Bus Free Time Between STOP and
START Condition
tBUF
Hold Time (Repeated)
START Condition
tHD:STA
Low Period of SCL Clock
tLOW
High Period of SCL Clock
tHIGH
Data Hold Time
tHD:DAT
Data Setup Time
tSU:DAT
Start Setup Time
tSU:STA
Rise Time of Both SDA and SCL
Signals
tR
Fall Time of Both SDA and SCL
Signals
tF
Setup Time for STOP Condition
tSU:STO
CONDITIONS
Standard mode (Note 9)
0
100
Fast mode (Note 9)
1.3
Standard mode (Note 9)
4.7
Fast mode (Notes 9, 10)
0.6
Standard mode (Notes 9, 10)
4.0
Fast mode (Note 9)
1.3
Standard mode (Note 9)
4.7
Fast mode (Note 9)
0.6
Standard mode (Note 9)
4.0
Fast mode (Notes 9, 11, 12)
0
Standard mode (Notes 9, 11, 12)
0
Fast mode (Note 9)
100
Standard mode (Note 9)
250
Fast mode (Note 9)
0.6
Standard mode (Note 9)
4.7
µs
0.9
µs
300
1000
Fast mode (Note 13)
20 + 0.1CB
300
Standard mode (Note 13)
20 + 0.1CB
300
Standard mode
4.0
(Note 13)
(Note 14)
µs
ns
20 + 0.1CB
tW
4
µs
20 + 0.1CB
0.6
kHz
µs
Standard mode (Note 13)
Fast mode
UNITS
µs
Fast mode (Note 13)
CB
Note 8:
Note 9:
MAX
400
EEPROM Write Time
Note 7:
TYP
0
Capacitive Load for Each Bus Line
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
MIN
Fast mode (Note 9)
ns
ns
µs
400
10
pF
ms
All voltages are referenced to ground.
I/O pins of fast-mode devices must not obstruct the SDA and SCL lines if VCC is switched off.
SDA and SCL are connected to VCC and all other input signals are connected to well-defined logic levels.
The maximum voltage the MON inputs will read is approximately 2.5V, even if the voltage on the inputs is greater than 2.5V.
This voltage is defining the maximum range of the analog-to-digital converter voltage and not the maximum V CC voltage.
Absolute linearity is the difference of measured value from expected value at DAC position. The expected value is a
straight line from measured minimum position to measured maximum position.
Relative linearity is the deviation of an LSB DAC setting change vs. the expected LSB change. The expected LSB change
is the slope of the straight line from measured minimum position to measured maximum position.
See the Typical Operating Characteristics.
A fast-mode device can be used in a standard-mode system, but the requirement tSU:DAT > 250ns must then be met. This
is automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the
LOW period of the SCL signal, it must output the next data bit to the SDA line tRMAX + tSU:DAT = 1000ns + 250ns = 1250ns
before the SCL line is released.
_____________________________________________________________________
Dual Temperature-Controlled Resistors with
Three Monitors
(VCC = 3.0V to 5.5V, TA = -40°C to +95°C, unless otherwise noted.)
Note 10: After this period, the first clock pulse is generated.
Note 11: The maximum tHD:DAT only has to be met if the device does not stretch the LOW period (tLOW) of the SCL signal.
Note 12: A device must internally provide a hold time of at least 300ns for the SDA signal (see the VIH MIN of the SCL signal) in order
to bridge the undefined region of the falling edge of SCL.
Note 13: CB—total capacitance of one bus line, timing referenced to 0.9 x VCC and 0.1 x VCC.
Note 14: EEPROM write begins after a STOP condition occurs.
Typical Operating Characteristics
(VCC = 5.0V, TA = +25°C, unless otherwise noted.)
SUPPLY CURRENT vs. TEMPERATURE
620
580
540
600
550
500
450
500
400
-20
0
20
40
60
80
100
3.0
4.0
4.5
5.0
VOLTAGE (V)
RESISTANCE vs. SETTING
ACTIVE SUPPLY CURRENT
vs. SCL FREQUENCY
700
DS1858 toc03
60
SDA = 5V
ACTIVE SUPPLY CURRENT (µA)
50
40
30
20
10
0
0
3.5
TEMPERATURE (°C)
50
100
150
SETTING
200
250
300
5.5
DS1858 toc04
-40
RESISTANCE (kΩ)
DS1858 toc02
650
SUPPLY CURRENT (µA)
660
SUPPLY CURRENT (µA)
SUPPLY CURRENT vs. VOLTAGE
700
DS1858 toc01
700
660
620
580
540
500
0
100
200
300
400
SCL FREQUENCY (kHz)
_____________________________________________________________________
5
DS1858
AC ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics (continued)
(VCC = 5.0V, TA = +25°C, unless otherwise noted.)
0.3
0.5
DS1858 toc06
DS1858 toc05
0.4
0.2
0.1
0
-0.1
-0.2
-0.3
0.4
0.3
RESISTOR 1 INL (LSB)
0.15
RESISTOR 0 DNL (LSB)
0.05
-0.05
0.2
0.1
0
-0.1
-0.2
-0.3
-0.15
-0.4
-0.4
-0.5
-0.5
-0.25
50 75 100 125 150 175 200 225 250
0
25
POSITION
POSITION
RESISTOR 1 DNL (LSB)
RESISTANCE vs. POWER-UP VOLTAGE
+25°C
250
RESISTANCE (kΩ)
0.15
0.05
-0.05
-0.15
POSITION
1.00
150
100
0
25
0.97
0.95
0
50 75 100 125 150 175 200 225 250
0.98
0.96
50
0
50 75 100 125 150 175 200 225 250
0.99
200
-0.25
25
POSITION 00H RESISTANCE vs. TEMPERATURE
300
DS1858 toc08
0.25
0
50 75 100 125 150 175 200 225 250
RESISTANCE (kΩ)
25
DS1858 toc09
0
DS1858 toc10
RESISTOR 0 INL (LSB)
RESISTOR 1 INL (LSB)
RESISTOR 0 DNL (LSB)
0.25
DS1858 toc07
RESISTOR 0 INL (LSB)
0.5
RESISTOR 1 DNL (LSB)
1
2
3
5
4
-40 -25 -10
POWER-UP VOLTAGE (V)
POSITION
20
PPM vs. POSITION
DS1858 toc12
340
DS1858 toc11
52.30
5
290
240
52.20
ppm/°C
190
52.10
140
+25°C TO +85°C
90
52.00
40
+25°C TO -40°C
51.90
-10
51.80
-60
-40 -25 -10
5
20
35
50
TEMPERATURE (°C)
6
65
80
95
0
35
50
TEMPERATURE (°C)
POSITION FFH RESISTANCE vs. TEMPERATURE
52.40
RESISTANCE (kΩ)
DS1858
Dual Temperature-Controlled Resistors with
Three Monitors
50
100
150
POSITION
_____________________________________________________________________
200
250
300
65
80
95
Dual Temperature-Controlled Resistors with
Three Monitors
PIN
BALL
NAME
1
B2
SDA
2
A2
SCL
3
C3
OUT1
4
A1
IN1
5
B1
OUT2
6
C2
IN2
7
C1
WPEN
8
D1
GND
FUNCTION
2-Wire Serial Data I/O Pin. This pin is for serial data transfer to and from the device.
2-Wire Serial Clock Input. The serial clock input is used to clock data into and out of the device.
Open-Drain Buffer Output
TTL/CMOS-Compatible Input to Buffer
Open-Drain Buffer Output
TTL/CMOS-Compatible Input to Buffer
Write Protect Enable. The device is not write protected if WPEN is connected to ground. This pin has
an internal pullup (RWPEN). See Table 6.
Ground
9
D3
MON1
External Analog Input
10
D4
MON2
External Analog Input
11
C4
MON3
External Analog Input
12
D2
L0
Low-End Resistor 0 Terminal. It is not required that the low-end terminals be connected to a potential
less than the high-end terminals of the corresponding resistor. Voltage applied to any of the resistor
terminals cannot exceed the power-supply voltage, VCC, or go below ground.
13
B3
H0
High-End Resistor 0 Terminal. It is not required that the high-end terminals be connected to a
potential greater than the low-end terminals of the corresponding resistor. Voltage applied to any of
the resistor terminals cannot exceed the power-supply voltage, VCC, or go below ground.
14
B4
L1
Low-End Resistor 1 Terminal
15
A4
H1
High-End Resistor 1 Terminal
16
A3
VCC
Supply Voltage
Detailed Description
The user can read the registers that monitor the VCC,
MON1, MON2, MON3, and temperature analog signals.
After each signal conversion, a corresponding bit is set
that can be monitored to verify that a conversion has
occurred. The signals also have alarm flags that notify
the user when the signals go above or below the userdefined value. Interrupts can also be set for each signal.
The position values of each resistor can be independently programmed. The user can assign a unique
value to each resistor for every 2°C increment over the
-40°C to +102°C range.
Two buffers are provided to convert logic-level inputs
into open-drain outputs. Typically these buffers are
used to implement transmit (Tx) fault and loss-of-signal
(LOS) functionality. Additionally, OUT1 can be asserted
in the event that one or more of the monitored values
go beyond user-defined limits.
_____________________________________________________________________
7
DS1858
Pin Descriptions
DS1858
Dual Temperature-Controlled Resistors with
Three Monitors
PROT
AUX
PROT
MAIN
AD
PROT
MAIN
MD
MD
AD (AUXILIARY DEVICE ENABLE A0h)
TABLE
SELECT
DEVICE
ADDRESS
MD (MAIN DEVICE ENABLE)
DEVICE ADDRESS
EEPROM
128 x 8 BIT
00h-7Fh
ADDRESS
R/W
ADDRESS
ADEN ADFIX
SDA
EEPROM
72 x 8 BIT
80h-C7h
ADDRESS
TABLE 02
RESISTOR 0
LOOK-UP
TABLE
R/W
STANDARDS
TABLE
SELECT
EEPROM
72 x 8 BIT
80h-C7h
TABLE 03
RESISTOR 1
LOOK-UP
TABLE
R/W
ADDRESS
2-WIRE
INTERFACE
TEMP INDEX
DATA BUS
SCL
TEMP INDEX
R/W
PROT
MAIN
TxF
Tx FAULT
MD
OUT1
MINT
R/W
EEPROM
96 x 8 BIT
00h-5Fh
LIMITS
TxF
SRAM
32 x 8 BIT
60h-7Fh
NOT PROTECTED
MONITORS LIMIT
LOW
H0
RESISTOR 0
50kΩ FULL SCALE
256 POSITIONS
REGISTER
MONITORS LIMIT
HIGH
ADDRESS
L0
TEMP INDEX
INV1
RxL
OUT2
LOS
H1
RESISTOR 1
50kΩ FULL SCALE
256 POSITIONS
REGISTER
IN1
MINT (BIT)
L1
TABLE SELECT
PROT
MAIN
MEASUREMENT
INV2
MD
R/W
ALARM FLAGS
INV1 (BIT)
IN2
INV2 (BIT)
TABLE SELECT
VCC
INTERNAL
TEMP
ADDRESS
MUX
MON1
A/D
12-BIT
DEVICE ADDRESS
TABLE 01
EEPROM
16 x 8 BIT
80h-8Fh
ADEN (BIT)
ADFIX (BIT)
MON3
MONITORS LIMIT HIGH
A/D
CTRL
VCC
MUX
CTRL
VCC
MINT
MEASUREMENT
INTERRUPT
RWPEN
APEN
PROT AUX
PROT MAIN
MPEN
COMP CTRL
COMPARATOR
ALARM FLAGS
Figure 1. DS1858 Block Diagram
8
MASKING (TMP, VCC, MON1, MON2, MON3)
MONITORS LIMIT LOW
GND
WPEN
MPEN (BIT)
VENDOR
MON2
VCC
APEN (BIT)
_____________________________________________________________________
Dual Temperature-Controlled Resistors with
Three Monitors
SIGNAL
+FS
SIGNAL
+FS
(hex)
-FS
SIGNAL
-FS
(hex)
Temperature
127.996°C
7FFF
-128°C
8000
VCC
6.55V
FFFF
0V
0000
MON1
2.5V
FFFF
0V
0000
MON2
2.5V
FFFF
0V
0000
MON3
2.5V
FFFF
0V
0000
Table 3. Look-up Table Address for
Corresponding Temperature Values
TEMPERATURE
CORRESPONDING LOOK-UP
TABLE ADDRESS
<-40°C
80h
-40°C
80h
-38°C
81h
-36°C
82h
-34°C
83h
Table 2. Signal Comparison
SIGNAL
FORMAT
VCC
Unsigned
MON1
Unsigned
MON2
Unsigned
MON3
Unsigned
Temperature
Two’s complement
DS1858
Table 1. Scales for Monitor Channels
—
—
+98°C
C5h
+100°C
C6h
+102°C
C7h
>+102°C
C7h
Monitor Conversion Example
Monitored Signals
Each signal (VCC, MON1, MON2, MON3, and temperature) is available as a 16-bit value with 12-bit accuracy
(left-justified) over the serial bus. See Table 1 for signal
scales and Table 2 for signal format. The four LSBs
should be masked when calculating the value.
The signals are updated every frame rate (tframe) in a
round-robin fashion.
The comparison of all five signals with the high and low
user-defined values are done automatically. The corresponding flags are set to 1 within a specified time of
the occurrence of an out-of-limit condition.
Calculating Signal Values
The LSB = 100µV for VCC, and the LSB = 38.147µV for
the MON signals.
MSB (BIN)
LSB (BIN)
VOLTAGE (V)
11000000
00000000
1.875
10000000
10000000
1.255
To calculate the value of MON1, MON2, or MON3 convert the unsigned 16-bit value to decimal and multiply
by 38.147µV.
To calculate the value of the temperature, treat the
two’s complement value binary number as an unsigned
binary number, then convert to decimal and divide by
256. If the result is greater than or equal to 128, then
subtract 256 from the result.
Temperature: high byte: -128°C to +127°C signed; low
byte: 1/256°C.
Temperature Bit Weights
Monitor/VCC Bit Weights
MSB
215
214
213
212
211
210
29
28
LSB
27
26
25
24
23
22
21
20
To calculate the value of VCC, convert the unsigned 16bit value to decimal and multiply by 100µV.
VCC Conversion Examples
S
26
25
24
23
22
21
20
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
Temperature Conversion Examples
MSB (BIN)
LSB (BIN)
01000000
00000000
TEMPERATURE (°C)
64
00001111
64.059
MSB (BIN)
LSB (BIN)
VOLTAGE (V)
01000000
10000000
10000000
3.29
01011111
00000000
95
11000000
11111000
4.94
11110110
00000000
-10
11011000
00000000
-40
_____________________________________________________________________
9
DS1858
Dual Temperature-Controlled Resistors with
Three Monitors
Table 4. ADEN Address Configuration
Table 5. ADEN and ADFIX Bits
ADEN
(ADDRESS
ENABLE)
NO. OF SEPARATE
DEVICE
ADDRESSES
ADDITIONAL
INFORMATION
0
2
See Figure 2
1
1 (Main Device only)
See Figure 3
ADEN
ADFIX
AUXILIARY
ADDRESS
MAIN ADDRESS
0
0
A0h
A2h
0
1
A0h
EEPROM
(Table 01, 8Ch)
1
0
N/A
A2h
1
1
N/A
EEPROM
(Table 01, 8Ch)
MAIN DEVICE ENABLE
AUXILIARY DEVICE ENABLE
0
0
DEC
MAIN
DEVICE
AUXILIARY
DEVICE
EN
0
EN
5Fh
60h
EN
7Fh
7Fh
TABLE SELECT
DECODER
95
96
127
128
TABLE 01
TABLE 02
TABLE 03
EN
EN
EN
80h
80h
80h
MON LOOK-UP
TABLE CONTROL
R1 LOOK-UP
R0 LOOK-UP
TABLE
TABLE
SEL 8Fh
SEL C7h
SEL C7h
143
F0h
F0h
RESERVED
RESERVED
199
FFh
FFh
MEMORY PARTITION WITH ADEN BIT = 0
Figure 2. Memory Organization, ADEN = 0
MAIN DEVICE ENABLE
0
DEC
MAIN
DEVICE
0
EN
5Fh
60h
95
96
EN
7Fh
TABLE SELECT
DECODER
TABLE 00
127
128
80h
143
AUXILIARY
DEVICE
EN
TABLE 01
TABLE 02
TABLE 03
EN
EN
EN
80h
80h
80h
MON LOOK-UP
TABLE CONTROL
R1 LOOK-UP
R0 LOOK-UP
TABLE
TABLE
SEL 8Fh
SEL C7h
F0h
SEL C7h
F0h
RESERVED
199
FFh
255
FFh
MEMORY PARTITION WITH ADEN BIT = 1
Figure 3. Memory Organization, ADEN = 1
10
____________________________________________________________________
RESERVED
FFh
Dual Temperature-Controlled Resistors with
Three Monitors
Memory Protection
Memory access from either device address can be
either read/write or read only. Write protection
is accomplished by a combination of control bits in
EEPROM (APEN and MPEN in configuration register
89h) and a write-protect enable (WPEN) pin. Since the
WPEN pin is often not accessible from outside the module, this scheme effectively allows the module to be
locked by the manufacturer to prevent accidental writes
by the end user.
Separate write protection is provided for the Auxiliary
and Main Device address through distinct bits APEN
and MPEN. APEN and MPEN are bits from configuration register 89h, Table 01. Due to the location, the
APEN and MPEN bits can only be written through the
Main Device address. The control of write privileges
through the Auxiliary Device address is dependent on
the value of APEN. Care should be taken with the setting of MPEN, once set to a 1, assuming WPEN is high,
access through the Main Device is thereafter denied
unless WPEN is taken to a low level. By this means
inadvertent end-user write access can be denied.
Main Device address space 60h to 7Fh is SRAM and is
not write protected by APEN, MPEN, or WPEN. For
example, the user may reset flags set by the device.
Bytes designated as “Reserved” may be used as
scratchpad, but they will not be stored in a power cycle
because of their volatility. These bytes are reserved for
added functionality in future versions of this device.
Note that in single device mode (ADEN bit = 1), APEN
determines the protection level of Table 00, independent of WPEN.
The write-protect operation, for both Main and Auxiliary
Devices, is summarized in Tables 6 and 7.
Memory Description
Main and auxiliary memories can be accessed by two
separate device addresses. The Main Device address
is A2h (or value in Table 01 byte 8Ch, when ADFIX = 1)
and the Auxiliary Device address is A0h. A user option
is provided to respond to one or two device addresses.
This feature can be used to save component count in
SFF applications (Main Device address can be used)
or other applications where both GBIC (Auxiliary
Device address can be used) and monitoring functions
are implemented and two device addresses are needed. The memory blocks are enabled with the corresponding device address. Memory space from 80h and
up is accessible only through the Main Device address.
This memory is organized as three tables; the desired
table can be selected by the contents of memory location 7Fh, Main Device. The Auxiliary Device address
has no access to the tables, but the Auxiliary Device
address can be mapped into the Main Device’s memory space as a fourth table. Device addresses are programmable with two control bits in EEPROM.
ADEN configures memory access to respond to different device addresses (see Tables 4 and 5).
Table 6. Main Device
The default device address for EEPROM-generated
addresses is A2h.
WPEN
MPEN
PROTECT MAIN
0
X
No
If the ADEN bit is 1, additional 128 bytes of EEPROM
are accessible through the Main Device, selected as
Table 00 (see Figure 3). In this configuration, the
Auxiliary Device is not accessible. APEN controls the
protection of Table 00 regardless of the setting of
ADEN.
ADFIX (address fixed) determines whether the Main
Device address is determined by an EEPROM byte
(Table 01, byte 8Ch, when ADFIX =1). There can be up
to 128 devices sharing a common 2-wire bus, with
each device having its own unique device address.
X
0
No
1
1
Yes
Table 7. Auxiliary Device
APEN
WPEN
PROTECT AUXILIARY
0
X
No
1
X
Yes
____________________________________________________________________
11
DS1858
Variable Resistors
The value of each variable resistor is determined by
a temperature-addressed look-up table, which can
assign a unique value (00h to FFh) to each resistor for
every 2°C increment over the -40°C to +102°C range
(see Table 3). See the Temperature Conversion section
for more information.
The variable resistors can also be used in manual
mode. If the TEN bit equals 0, then the resistors are in
manual mode and the temperature indexing is disabled. The user sets the resistors in manual mode by
writing to addresses 82h and 83h in Table 01 to control
resistors 0 and 1, respectively.
DS1858
Dual Temperature-Controlled Resistors with
Three Monitors
Register Map
A description of the registers is below. The registers
are read only (R) or read/write (R/W). The R/W registers
are writable only if write protect has not been asserted
(see the Memory Description section).
Auxiliary Device
MEMORY LOCATION
(hex)
EEPROM/SRAM
R/W
DEFAULT SETTING
(hex)
NAME OF LOCATION
FUNCTION
00 to 7F
EEPROM
R/W
00
Standards Data
—
Main Device
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
SETTING
(hex)
NAME OF LOCATION
FUNCTION
00 to 01
EEPROM
R/W
00
TMPlimhi (MSB to LSB)
Contains upper limit settings for temperature.
If the limit is violated, a flag in Main Device
byte 70h is set.
02 to 03
EEPROM
R/W
00
TMPlimlo (MSB to LSB)
Contains lower limit settings for temperature. If
the limit is violated, a flag in Main Device byte
70h is set.
04 to 07
EEPROM
R
00
Reserved
—
08 to 09
EEPROM
R/W
00
VCClimhi (MSB to LSB)
Contains upper limit settings for VCC. If the
limit is violated, a flag in Main Device byte 70h
is set.
0A to 0B
EEPROM
R/W
00
VCClimlo (MSB to LSB)
Contains lower limit settings for VCC. If the
limit is violated, a flag in Main Device byte 70h
is set.
0C to 0F
EEPROM
—
00
Reserved
—
10 to 11
EEPROM
R/W
00
MON1limhi (MSB to LSB)
Contains upper limit settings for MON1. If the
limit is violated, a flag in Main Device byte 70h
is set.
12 to 13
EEPROM
R/W
00
MON1limlo (MSB to LSB)
Contains lower limit settings for MON1. If the
limit is violated, a flag in Main Device byte 70h
is set.
14 to 17
EEPROM
—
00
Reserved
18 to 19
EEPROM
R/W
00
MON2limhi (MSB to LSB)
1A to 1B
EEPROM
R/W
00
MON2limlo (MSB to LSB)
1C to 1F
EEPROM
—
00
Reserved
—
Contains upper limit settings for MON2. If the
limit is violated, a flag in Main Device byte 70h
is set.
Contains lower limit settings for MON2. If the
limit is violated, a flag in Main Device byte 70h
is set.
—
Note: SRAM defaults are power-on defaults. EEPROM defaults are factory defaults.
12
____________________________________________________________________
Dual Temperature-Controlled Resistors with
Three Monitors
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
SETTING
(hex)
NAME OF LOCATION
FUNCTION
20 to 21
EEPROM
R/W
00
MON3limhi (MSB to LSB)
Contains upper limit settings for MON3. If the
limit is violated, a flag in Main Device byte 71h
is set.
22 to 23
EEPROM
R/W
00
MON3limhi (MSB to LSB)
Contains lower limit settings for MON3. If the
limit is violated, a flag in Main Device byte 71h
is set.
24 to 5F
EEPROM
—
00
Reserved
—
60 to 61
SRAM
R
—
Measured TMP
(MSB to LSB)
Digitized measured value for temperature.
See Table 1.
62 to 63
SRAM
R
—
Measured VCC
(MSB to LSB)
Digitized measured value for VCC.
See Table 1.
64 to 65
SRAM
R
—
Measured MON1
(MSB to LSB)
Digitized measured value for MON1.
See Table 1.
66 to 67
SRAM
R
—
Measured MON2
(MSB to LSB)
Digitized measured value for MON2.
See Table 1.
68 to 69
SRAM
R
—
Measured MON3
(MSB to LSB)
Digitized measured value for MON3.
See Table 1.
6A to 6D
SRAM
R
—
Reserved
—
6E
SRAM
—
—
Logic states
—
Bit 7
—
R
X
HIZSTA
Resistor status bit. A high indicates that both
resistors are in high-impedance mode. A low
indicates that both resistors are operating
normally.
6
—
R/W
0
HIZCO
Resistor control bit. Setting this bit high
causes both resistors to go into a highimpedance state.
5
—
—
X
X
—
4
—
—
X
X
—
2
—
R
X
TXF
This status bit is high when OUT1 is high
assuming there is an external pullup resistor
on OUT1.
3
—
—
X
X
—
1
—
R
X
RXL
This status bit is high when OUT2 is high
assuming there is an external pullup resistor
on OUT2.
0
—
R
X
RDYB
This status bit goes high when VCC has fallen
below the POA level.
____________________________________________________________________
13
DS1858
Main Device (continued)
DS1858
Dual Temperature-Controlled Resistors with
Three Monitors
Main Device (continued)
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
SETTING
(hex)
NAME OF LOCATION
6F
SRAM
—
—
Conversion updates
Bit 7
—
R/W
0
TAU
6
—
R/W
0
VCCU
5
—
R/W
0
MON1U
4
14
—
R/W
0
FUNCTION
—
This bit goes high after a temperature and
address update has occurred for the
corresponding measurement in bytes 60h to
61h. This bit can be written to a 0 by the user
and monitored to verify that a conversion has
occurred.
This bit goes high after a VCC update has
occurred for the corresponding measurement
in bytes 62h to 63h. This bit can be written to
a 0 by the user and monitored to verify that a
conversion has occurred.
This bit goes high after a MON1 update has
occurred for the corresponding measurement
in bytes 64h to 65h. This bit can be written to
a 0 by the user and monitored to verify that a
conversion has occurred.
MON2U
This bit goes high after a MON2 update has
occurred for the corresponding measurement
in bytes 66h to 67h. This bit can be written to
a 0 by the user and monitored to verify that a
conversion has occurred.
MON3U
This bit goes high after a MON3 update has
occurred for the corresponding measurement
in bytes 68h to 69h. This bit can be written to
a 0 by the user and monitored to verify that a
conversion has occurred.
3
—
—
0
2
—
—
0
0
—
1
—
—
0
X
—
0
0
—
—
70
SRAM
R
X
—
Alarm flags
—
Bit 7
—
—
—
TMPhi
This alarm flag goes high when the upper limit
of the temperature setting is violated.
6
—
—
—
TMPlo
This alarm flag goes high when the lower limit
of the temperature setting is violated.
5
—
—
—
VCChi
This alarm flag goes high when the upper limit
of the VCC setting is violated.
____________________________________________________________________
Dual Temperature-Controlled Resistors with
Three Monitors
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
SETTING
(hex)
NAME OF LOCATION
FUNCTION
4
—
—
—
VCClo
This alarm flag goes high when the lower limit
of the VCC setting is violated.
3
—
—
—
MON1hi
This alarm flag goes high when the upper limit
of the MON1 setting is violated.
2
—
—
—
MON1lo
This alarm flag goes high when the lower limit
of the MON1 setting is violated.
1
—
—
—
MON2hi
This alarm flag goes high when the upper limit
of the MON2 setting is violated.
0
—
—
—
MON2lo
This alarm flag goes high when the lower limit
of the MON2 setting is violated.
71
SRAM
R
—
Alarm flags
—
Bit 7
—
—
—
MON3hi
This alarm flag goes high when the upper limit
of the MON3 setting is violated.
6
—
—
—
MON3lo
This alarm flag goes high when the lower limit
of the MON3 setting is violated.
5
—
—
—
X
—
4
—
—
—
X
—
3
—
—
—
X
—
2
—
—
—
X
—
1
—
—
—
X
—
0
—
—
—
MINT
A mask of all flags located in Table 01 byte
88h determines the value of MINT. MINT is
maskable to 0 if no interrupt is desired by
setting Table 01 byte 88h to 0.
72 to 7E
SRAM
R
00
Reserved
—
7F
SRAM
R/W
—
Table select
—
Bit 7
—
—
0
X
—
6
—
—
0
X
—
5
—
—
0
X
—
4
—
—
0
X
—
3
—
—
0
X
—
2
—
—
0
X
—
1
—
—
0
Table select bits
Set bits = 00 to select Table 00, set bits = 01
to select Table 01, set bits = 10 to select
Table 02, set bits = 11 to select Table 03.
0
—
—
0
____________________________________________________________________
15
DS1858
Main Device (continued)
DS1858
Dual Temperature-Controlled Resistors with
Three Monitors
Table 01h
MEMORY
EEPROM/
LOCATION
SRAM
(hex)
16
R/W
DEFAULT
SETTING
(hex)
NAME OF
LOCATION
FUNCTION
80
SRAM
R/W
Mode
—
Bit 7
—
—
0
X
—
6
—
—
0
X
—
5
—
—
0
X
—
4
—
—
0
X
—
3
—
—
0
X
—
2
—
—
0
X
—
1
—
—
1
TEN
If TEN = 0, the temperature conversions update and the
resistors can be controlled manually. The user sets the
resistor in manual mode by writing to addresses 82h and
83h in Table 01 to control resistors 0 and 1, respectively.
0
—
—
1
AEN
AEN = 0 provides manual control of the temperature
index.
81
SRAM
R
—
Temp index
This byte is the temperature-calculated index used to
select the address of resistor settings in the look-up
tables.
82
SRAM
R/W
00
Resistor 0
Resistor 0 position values from 00h to FFh.
83
SRAM
R/W
00
Resistor 1
Resistor 1 position values from 00h to FFh.
84 to 87
SRAM
—
00
Reserved
—
Interrupt enable
This byte configures a maskable interrupt, determining
which event asserts a buffer 1 output (MINT set to 1, see
register 89h in Table 01). If any combination of
temperature, VCC, MON1, MON2, or MON3 is desired to
generate an interrupt, the corresponding bits are set to 1.
If interrupt generation is not desired, set all bits to 0.
88
EEPROM
R/W
Bit 7
—
—
1
TMP
—
6
—
—
1
VCC
—
5
—
—
1
MON1
—
4
—
—
1
MON2
—
3
—
—
1
MON3
—
2
—
—
0
X
—
1
—
—
0
X
—
0
—
—
0
X
—
89
EEPROM
R/W
Configuration
—
Bit 7
—
—
0
X
—
6
—
—
0
X
____________________________________________________________________
Dual Temperature-Controlled Resistors with
Three Monitors
MEMORY
EEPROM/
LOCATION
SRAM
(hex)
R/W
DEFAULT
SETTING
(hex)
NAME OF
LOCATION
FUNCTION
5
—
—
0
ADEN
Controls if the device responds to one or two device
addresses (see the Memory Description section and
Table 5).
4
—
—
0
ADFIX
Controls the means by which Main and Auxiliary Device
addresses are set (see the Memory Description section
and Table 5).
3
—
—
0
APEN
Controls auxiliary write protect. See the Memory
Description section.
2
—
—
0
MPEN
Controls main write protect. See the Memory Description
section.
1
—
—
0
INV1
Configures buffer 1 with OUT1 = MINT +
(INV1 [XOR] IN1).
Configures buffer 2 with OUT2 = INV2 [XOR] IN2.
0
—
—
0
INV2
8A to 8B
EEPROM
—
00
Reserved
8C
EEPROM
R/W
A2
Device address
Contains Main Device address if the bit ADFIX = 1. If
ADFIX = 0, then address A2h is used.
8D to 8F
EEPROM
—
—
Reserved
—
Table 02h
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
SETTING
(hex)
NAME OF LOCATION
80 to C7
EEPROM
R/W
FF
Resistor 0 Temp LUT
F0 to FF
EEPROM
R
FF
Reserved
—
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
SETTING
(hex)
NAME OF LOCATION
FUNCTION
80 to C7
EEPROM
R/W
FF
Resistor 1 Temp LUT
F0 to FF
EEPROM
R
FF
Reserved
FUNCTION
Look-up table for Resistor 0.
Table 03h
Look-up table for Resistor 1.
____________________________________________________________________
17
DS1858
Table 01h (continued)
Temperature Conversion
The direct-to-digital temperature sensor measures temperature through the use of an on-chip temperature
measurement technique with an operating range from
-40°C to +102°C. Temperature conversions are initiated
upon power-up, and the most recent conversion is
stored in memory locations 60h and 61h of the Main
Device, which are updated every tframe. Temperature
conversions do not occur during an active read or write
to memory.
The value of each resistor is determined by the temperature-addressed look-up table. The look-up table assigns
a unique value to each resistor for every 2°C increment
with a 1°C hysteresis at a temperature transition over the
operating temperature range (see Figure 4).
M6
M5
DECREASING
TEMPERATURE
MEMORY LOCATION
DS1858
Dual Temperature-Controlled Resistors with
Three Monitors
M4
M3
INCREASING
TEMPERATURE
M2
M1
2
2-Wire Operation
Clock and Data Transitions: The SDA pin is normally
pulled high with an external resistor or device. Data on
the SDA pin may only change during SCL-low time
periods. Data changes during SCL-high periods will
indicate a start or stop condition depending on the conditions discussed below. See the timing diagrams in
Figures 5 and 6 for further details.
18
6
8
10
12
TEMPERATURE (°C)
Power-Up and Low-Voltage Operation
During power-up, the device is inactive until V CC
exceeds the digital power-on-reset voltage (POD). At this
voltage, the digital circuitry, which includes the 2-wire
interface, becomes functional. However, EEPROM
backed registers/settings cannot be internally read
(recalled into shadow SRAM) until VCC exceeds the analog power-on-reset voltage (POA) at which time the
remainder of the device becomes fully functional. Once
VCC exceeds POA, the RDYB bit in byte 6Eh of the Main
Device memory is timed to go from a 1 to a 0 and indicates when analog to digital conversions begin. If VCC
ever dips below POA, the RDYB bit will read as a 1 again.
Once a device exceeds POA and the EEPROM is
recalled, the values remain active (recalled) until VCC falls
below POD.
For 2-wire device addresses sourced from EEPROM
(ADFIX = 1), the device address defaults to A2h until
VCC exceeds POA and the EEPROM values are recalled.
The Auxiliary Device (A0h) is always available within this
voltage window (between POD and the EEPROM recall)
regardless of the programmed state of ADEN.
Furthermore, as the device powers-up, the VCClo alarm
flag (bit 4 of 70h in Main Device) will default to a 1 until
the first VCC analog-to-digital conversion occurs and sets
or clears the flag accordingly.
4
Figure 4. Look-Up Table Hysteresis
Start Condition: A high-to-low transition of SDA with
SCL high is a start condition, which must precede any
other command. See the timing diagrams in Figures 5
and 6 for further details.
Stop Condition: A low-to-high transition of SDA with
SCL high is a stop condition. After a read or write
sequence, the stop command places the DS1858 into a
low-power mode. See the timing diagrams in Figures 5
and 6 for further details.
Acknowledge: All address and data bytes are transmitted through a serial protocol. The DS1858 pulls the
SDA line low during the ninth clock pulse to acknowledge that it has received each word.
Standby Mode: The DS1858 features a low-power
mode that is automatically enabled after power-on,
after a stop command, and after the completion of all
internal operations.
Device Addressing: The DS1858 must receive an 8-bit
device address word following a start condition to
enable a specific device for a read or write operation.
The address word is clocked into this part’s MSB to
LSB. The address byte consists of Ah (1010) followed
by either A2h or the value in Table 01 8Ch for the Main
Device or A0h for the Auxiliary Device then the R/W bit.
This byte must match the address programmed into
Table 01 8Ch or A0h (for the Auxiliary Device). If a
device address match occurs, this part will output a
zero for one clock cycle as an acknowledge and the
corresponding block of memory is enabled (see the
Memory Organization section). If the R/W bit is high, a
read operation is initiated. If the R/W is low, a write
operation is initiated (see the Memory Organization
____________________________________________________________________
Dual Temperature-Controlled Resistors with
Three Monitors
be allowed to proceed if the internal write cycle has
completed and the DS1858 responds with a zero.
Write Operations
Read Operations
After receiving a matching address byte with the R/W
bit set low, provided there is no write protect, the
device goes into the write mode of operation (see the
Memory Organization section). The master must transmit an 8-bit EEPROM memory address to the device to
define the address where the data is to be written. After
the byte has been received, the DS1858 transmits a
zero for one clock cycle to acknowledge the address
has been received. The master must then transmit an
8-bit data word to be written into this address. The
DS1858 again transmits a zero for one clock cycle to
acknowledge the receipt of the data. At this point, the
master must terminate the write operation with a stop
condition. The DS1858 then enters an internally timed
write process tw to the EEPROM memory. All inputs are
disabled during this byte write cycle.
After receiving a matching address byte with the R/W bit
set high, the device goes into the read mode of operation. There are three read operations: current address
read, random read, and sequential address read.
Page Write
The DS1858 is capable of an 8-byte page write. A page
is any 8-byte block of memory starting with an address
evenly divisible by eight and ending with the starting
address plus seven. For example, addresses 00h
through 07h constitute one page. Other pages would
be addresses 08h through 0Fh, 10h through 17h, 18h
through 1Fh, etc.
A page write is initiated the same way as a byte write,
but the master does not send a STOP condition after
the first byte. Instead, after the slave acknowledges the
data byte has been received, the master can send up
to seven more bytes using the same nine-clock
sequence. The master must terminate the write cycle
with a STOP condition or the data clocked into the
DS1858 will not be latched into permanent memory.
The address counter rolls on a page during a write. The
counter does not count through the entire address
space as during a read. For example, if the starting
address is 06h and 4 bytes are written, the first byte
goes into address 06h. The second goes into address
07h. The third goes into address 00h (not 08h). The
fourth goes into address 01h. If more than 9 bytes or
more are written before a STOP condition is sent, the
first bytes sent are overwritten. Only the last 8 bytes of
data are written to the page.
Acknowledge Polling: Once the internally timed write
has started and the DS1858 inputs are disabled,
acknowledge polling can be initiated. The process
involves transmitting a start condition followed by the
device address. The R/W bit signifies the type of operation that is desired. The read or write sequence will only
Current Address Read
The DS1858 has an internal address register that maintains the address used during the last read or write
operation, incremented by one. This data is maintained
as long as VCC is valid. If the most recent address was
the last byte in memory, then the register resets to the
first address.
Once the device address is clocked in and acknowledged by the DS1858 with the R/W bit set to high, the
current address data word is clocked out. The master
does not respond with a zero, but does generate a stop
condition afterwards.
Single Read
A random read requires a dummy byte write sequence to
load in the data byte address. Once the device and data
address bytes are clocked in by the master, and
acknowledged by the DS1858, the master must generate
another start condition. The master now initiates a current
address read by sending the device address with the
R/W bit set high. The DS1858 acknowledges the device
address and serially clocks out the data byte.
Sequential Address Read
Sequential reads are initiated by either a current
address read or a random address read. After the master receives the first data byte, the master responds
with an acknowledge. As long as the DS1858 receives
this acknowledge after a byte is read, the master can
clock out additional data words from the DS1858. After
reaching address FFh, it resets to address 00h.
The sequential read operation is terminated when the
master initiates a stop condition. The master does not
respond with a zero.
For a more detailed description of 2-wire theory of
operation, see the following section.
2-Wire Serial Port Operation
The 2-wire serial port interface supports a bidirectional
data transmission protocol with device addressing. A
device that sends data on the bus is defined as a transmitter, and a device receiving data as a receiver. The
device that controls the message is called a master.
The devices that are controlled by the master are
____________________________________________________________________
19
DS1858
section). If the address does not match, this part
returns to a low-power mode.
DS1858
Dual Temperature-Controlled Resistors with
Three Monitors
slaves. The bus must be controlled by a master device
that generates the serial clock (SCL), controls the bus
access, and generates the start and stop conditions.
The DS1858 operates as a slave on the 2-wire bus.
Connections to the bus are made through the opendrain I/O lines SDA and SCL. The following I/O terminals control the 2-wire serial port: SDA, SCL. Timing
diagrams for the 2-wire serial port can be found in
Figures 5 and 6. Timing information for the 2-wire serial
port is provided in the AC Electrical Characteristics
table for 2-wire serial communications.
The following bus protocol has been defined:
•
Data transfer may be initiated only when the bus is
not busy.
•
During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as control signals.
Accordingly, the following bus conditions have been
defined:
Bus not busy: Both data and clock lines remain high.
Start data transfer: A change in the state of the data
line from high to low while the clock is high defines a
start condition.
Stop data transfer: A change in the state of the data
line from low to high while the clock line is high defines
the stop condition.
Data valid: The state of the data line represents valid
data when, after a start condition, the data line is stable
for the duration of the high period of the clock signal. The
data on the line can be changed during the low period of
the clock signal. There is one clock pulse per bit of data.
Figures 5 and 6 detail how data transfer is accomplished
on the 2-wire bus. Depending upon the state of the R/W
bit, two types of data transfer are possible.
Each data transfer is initiated with a start condition and
terminated with a stop condition. The number of data
bytes transferred between start and stop conditions is
not limited and is determined by the master device. The
information is transferred byte-wise and each receiver
acknowledges with a ninth bit.
Within the bus specifications a regular mode (100kHz
clock rate) and a fast mode (400kHz clock rate) are
defined. The DS1858 works in both modes.
Acknowledge: Each receiving device, when
addressed, is obliged to generate an acknowledge
after the byte has been received. The master device
must generate an extra clock pulse, which is associated with this acknowledge bit.
20
A device that acknowledges must pull down the SDA line
during the acknowledge clock pulse in such a way that
the SDA line is a stable low during the high period of the
acknowledge-related clock pulse. Setup and hold times
must be taken into account. A master must signal an end
of data to the slave by not generating an acknowledge bit
on the last byte that has been clocked out of the slave. In
this case, the slave must leave the data line high to
enable the master to generate the stop condition.
1) Data transfer from a master transmitter to a slave
receiver. The first byte transmitted by the master is
the command/control byte. Next follows a number
of data bytes. The slave returns an acknowledge
bit after each received byte.
2)
Data transfer from a slave transmitter to a master
receiver. The master transmits the first byte (the
command/control byte) to the slave. The slave
then returns an acknowledge bit. Next follows a
number of data bytes transmitted by the slave to
the master. The master returns an acknowledge
bit after all received bytes other than the last byte.
At the end of the last received byte, a not
acknowledge can be returned.
The master device generates all serial clock pulses and
the start and stop conditions. A transfer is ended with a
stop condition or with a repeated start condition. Since
a repeated start condition is also the beginning of the
next serial transfer, the bus will not be released.
The DS1858 can operate in the following three modes:
1)
2)
3)
Slave Receiver Mode: Serial data and clock are
received through SDA and SCL, respectively.
After each byte is received, an acknowledge bit is
transmitted. Start and stop conditions are recognized as the beginning and end of a serial transfer. Address recognition is performed by hardware
after the slave (device) address and direction bit
have been received.
Slave Transmitter Mode: The first byte is
received and handled as in the slave receiver
mode. However, in this mode the direction bit
indicates that the transfer direction is reversed.
Serial data is transmitted on SDA by the DS1858,
while the serial clock is input on SCL. Start and
stop conditions are recognized as the beginning
and end of a serial transfer.
Slave Address: Command/control byte is the first
byte received following the start condition from the
master device. The command/control byte consists of 4-bit control code. They are used by the
master device to select which of eight possible
____________________________________________________________________
Dual Temperature-Controlled Resistors with
Three Monitors
Following the start condition, the DS1858 monitors the
SDA bus checking the device type identifier being
transmitted. Upon receiving the 1010 control code, the
appropriate device address bits, and the read/write bit,
the slave device outputs an acknowledge signal on the
SDA line.
Chip Topology
TRANSISTOR COUNT: 44149
SUBSTRATE CONNECTED TO GROUND
SDA
MSB
SLAVE ADDRESS
R/W
DIRECTION
BIT
ACKNOWLEDGEMENT
SIGNAL FROM RECEIVER
ACKNOWLEDGEMENT
SIGNAL FROM RECEIVER
SCL
1
2
START
CONDITION
6
7
8
9
1
2
3–7
8
ACK
9
ACK
REPEATED IF MORE BYTES
ARE TRANSFERRED
STOP
CONDITION
OR REPEATED
START
CONDITION
Figure 5. 2-Wire Data Transfer Protocol
____________________________________________________________________
21
DS1858
devices on the bus is to be accessed. When reading or writing the DS1858, the device-select bits
must match one of two valid device addresses,
00h or the address registered in Table 01 location
8Ch. The last bit of the command/control byte
(R/W) defines the operation to be performed.
When set to a ‘1’ a read operation is selected, and
when set to a ‘0’ a write operation is selected. The
slave address can be set by the EEPROM.
DS1858
Dual Temperature-Controlled Resistors with
Three Monitors
SDA
tBUF
tHD:STA
tLOW
tR
tSP
tF
SCL
tHD:STA
STOP
tSU:STA
tHIGH
tSU:DAT
START
REPEATED
START
tSU:STO
tHD:DAT
Figure 6. 2-Wire AC Characteristics
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implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
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