MCP454X/456X/464X/466X
7/8-Bit Single/Dual I2C Digital POT with
Nonvolatile Memory
Features
Description
• Single or Dual Resistor Network Options
• Potentiometer or Rheostat Configuration Options
• Resistor Network Resolution
- 7-bit: 128 Resistors (129 Steps)
- 8-bit: 256 Resistors (257 Steps)
• RAB Resistances Options of:
- 5 k
- 10 k
- 50 k
- 100 k
• Zero-Scale to Full-Scale Wiper Operation
• Low Wiper Resistance: 75 (typical)
• Low Tempco:
- Absolute (Rheostat): 50 ppm typical
(0°C to 70°C)
- Ratiometric (Potentiometer): 15 ppm typical
• Nonvolatile Memory
- Automatic Recall of Saved Wiper Setting
- WiperLock™ Technology
- 10 General Purpose Memory Locations
• I2C Serial Interface
- 100 kHz, 400 kHz and 3.4 MHz Support
• Serial Protocol Allows:
- High-Speed Read/Write to Wiper
- Read/Write to EEPROM
- Write Protect to be Enabled/Disabled
- WiperLock to be Enabled/Disabled
• Resistor Network Terminal Disconnect Feature
via the Terminal Control (TCON) Register
• Write Protect Feature:
- Hardware Write Protect (WP) Control Pin
- Software Write Protect (WP) Configuration Bit
• Brown-out Reset Protection (1.5V typical)
• Serial Interface Inactive Current (2.5 uA typical)
• High-Voltage Tolerant Digital Inputs: Up to 12.5V
• Wide Operating Voltage:
- 2.7V to 5.5V - Device Characteristics Specified
- 1.8V to 5.5V - Device Operation
• Wide Bandwidth (-3dB) Operation:
- 2 MHz (typ.) for 5.0 k Device
• Extended Temperature Range (-40°C to +125°C)
The MCP45XX and MCP46XX devices offer a wide
range of product offerings using an I2C interface. This
family of devices support 7-bit and 8-bit resistor
networks, nonvolatile memory configurations, and
Potentiometer and Rheostat pinouts.
WiperLock Technology allows application-specific
calibration settings to be secured in the EEPROM.
Package Types (top view)
MCP45X1
Single Potentiometer
HVC / A0
SCL
SDA
VSS
1
2
3
4
8
7
6
5
VDD
P0B
P0W
P0A
MCP45X2
Single Rheostat
HVC / A0
SCL
SDA
VSS
1
2
3
4
MSOP
HVC / A0 1
SCL 2
SDA 3
VSS 4
VDD
A1
P0B
P0W
MSOP
8 VDD HVC / A0 1
SCL 2
7 P0B
SDA
P0W
6
3
VSS 4
5 P0A
EP
9
8
7
6
5
DFN 3x3 (MF) *
8 VDD
EP
9
7 A1
6 P0B
5 P0W
DFN 3x3 (MF) *
HVC/A0
SCL
SDA
VSS
P1B
P1W
P1A
1
2
3
4
5
6
7
14
13
12
11
10
9
8
TSSOP
VDD
A1
A2
WP
P0B
P0W
P0A
HVC/A0
VDD
A1
A2
MCP46X1 Dual Potentiometers
16 15 14 13
SCL
SDA
VSS
VSS
1
2
3
4
EP
17
12 WP
11 NC
10 P0B
9 P0W
P1B
P1W
P1A
P0A
5 6 7 8
QFN-16 4x4 (ML) *
MCP46X2 Dual Rheostat
HVC/A0
SCL
SDA
VSS
P1B
1
2
3
4
5
10 VDD HVC / A0 1
9 A1
SCL 2
8 P0B
SDA
3
7 P0W
V
4
SS
P1W
6
P1B 5
MSOP
10 VDD
EP
11
9 A1
8 P0B
7 P0W
6 P1W
DFN 3x3 (MF) *
* Includes Exposed Thermal Pad (EP); see Table 3-1.
2008-2013 Microchip Technology Inc.
DS22107B-page 1
MCP454X/456X/464X/466X
Device Block Diagram
VDD
VSS
A2
A1
HVC/A0
SCL
SDA
2
I C Interface
Power-up/
Brown-out
Control
Resistor
Network 0
(Pot 0)
I2C Serial
Interface
Module &
Control
Logic
(WiperLock™
Technology)
Wiper 0
& TCON
Register
P0A
P0W
P0B
P1A
Resistor
Network 1
(Pot 1)
WP
Memory (16x9)
Wiper0 (V & NV)
Wiper1 (V & NV)
TCON
STATUS
Data EEPROM
(10 x 9-bits)
P1W
Wiper 1
& TCON
Register
P1B
For Dual Resistor Network
Devices Only
I2C
RAM
No
Mid-Scale 5.0, 10.0, 50.0, 100.0
75
129 1.8V to 5.5V
MCP4532 (3)
1
I2C
RAM
No
Mid-Scale 5.0, 10.0, 50.0, 100.0
75
129 1.8V to 5.5V
I2C
Wiper
Configuration
Rheostat
(1)
Resistance (typical)
RAB Options (k)
Wiper
- RW
()
# of Steps
WiperLock
Technology
1 Potentiometer (1)
Device
POR Wiper
Setting
Memory
Type
MCP4531 (3)
# of POTs
Control
Interface
Device Features
VDD
Operating
Range (2)
MCP4541
1 Potentiometer
EE
Yes
NV Wiper 5.0, 10.0, 50.0, 100.0
75
129 2.7V to 5.5V
MCP4542
1
Rheostat
I2C
EE
Yes
NV Wiper 5.0, 10.0, 50.0, 100.0
75
129 2.7V to 5.5V
MCP4551 (3)
1
Potentiometer (1)
I2C
RAM
No
Mid-Scale 5.0, 10.0, 50.0, 100.0
75
257 1.8V to 5.5V
MCP4552 (3)
1
Rheostat
I2C
RAM
No
Mid-Scale 5.0, 10.0, 50.0, 100.0
75
257 1.8V to 5.5V
2
(1)
MCP4561
1 Potentiometer
I C
EE
Yes
NV Wiper 5.0, 10.0, 50.0, 100.0
75
257 2.7V to 5.5V
MCP4562
1
Rheostat
I2C
EE
Yes
NV Wiper 5.0, 10.0, 50.0, 100.0
75
257 2.7V to 5.5V
MCP4631 (3)
2
Potentiometer (1)
I2C
RAM
No
Mid-Scale 5.0, 10.0, 50.0, 100.0
75
129 1.8V to 5.5V
MCP4632 (3)
2
Rheostat
I2C
RAM
No
Mid-Scale 5.0, 10.0, 50.0, 100.0
75
129 1.8V to 5.5V
MCP4641
2
Potentiometer (1)
I2C
EE
Yes
NV Wiper 5.0, 10.0, 50.0, 100.0
75
129 2.7V to 5.5V
MCP4642
2
Rheostat
I2C
EE
Yes
NV Wiper 5.0, 10.0, 50.0, 100.0
75
129 2.7V to 5.5V
2
I C
RAM
No
Mid-Scale 5.0, 10.0, 50.0, 100.0
75
257 1.8V to 5.5V
I2C
RAM
No
Mid-Scale 5.0, 10.0, 50.0, 100.0
75
257 1.8V to 5.5V
I2C
EE
Yes
NV Wiper 5.0, 10.0, 50.0, 100.0
75
257 2.7V to 5.5V
I2C
EE
Yes
NV Wiper 5.0, 10.0, 50.0, 100.0
75
257 2.7V to 5.5V
MCP4651
(3)
MCP4652 (3)
2 Potentiometer
2
Rheostat
MCP4661
2 Potentiometer
MCP4662
2
Note 1:
2:
3:
(1)
Rheostat
(1)
Floating either terminal (A or B) allows the device to be used as a Rheostat (variable resistor).
Analog characteristics only tested from 2.7V to 5.5V unless otherwise noted.
Please check Microchip web site for device release and availability
DS22107B-page 2
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
1.0
ELECTRICAL CHARACTERISTICS
1.1
Absolute Maximum Ratings†
Voltage on VDD with respect to VSS ........................................................................................................... -0.6V to +7.0V
Voltage on HVC/A0, A1, A2, SCL, SDA and WP with respect to VSS ....................................................... -0.6V to 12.5V
Voltage on all other pins (PxA, PxW, and PxB) with respect to VSS ..................................................-0.3V to VDD + 0.3V
Input clamp current, IIK (VI < 0, VI > VDD, VI > VPP ON HV pins)........................................................................... ±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) .................................................................................................. ±20 mA
Maximum output current sunk by any Output pin....................................................................................................25 mA
Maximum output current sourced by any Output pin .............................................................................................25 mA
Maximum current out of VSS pin ...........................................................................................................................100 mA
Maximum current into VDD pin ..............................................................................................................................100 mA
Maximum current into PXA, PXW & PXB pins ...................................................................................................... ±2.5 mA
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
Package power dissipation (TA = +50°C, TJ = +150°C)
MSSOP-8 .......................................................................................................................................................473 mW
MSSOP-10 .....................................................................................................................................................495 mW
DFN-8 (3x3) ......................................................................................................................................................1.76W
DFN-10 (3x3) ....................................................................................................................................................1.87W
TSSOP-14.........................................................................................................................................................1.00W
QFN-16 (4x4) ....................................................................................................................................................2.18W
Soldering temperature of leads (10 seconds) ....................................................................................................... +300°C
ESD protection on all pins 4 kV (HBM),
300V (MM)
Maximum Junction Temperature (TJ) ................................................................................................................... +150°C
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
2008-2013 Microchip Technology Inc.
DS22107B-page 3
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C TA +125°C (extended)
DC Characteristics
Parameters
Supply Voltage
HVC pin voltage
range
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Sym
Min
Typ
Max
Units
VDD
2.7
—
5.5
V
1.8
—
2.7
V
VSS
—
12.5V
V
VSS
—
VDD +
8.0V
V
1.65
V
VHV
—
Serial Interface only.
VDD The HVC pin will be at one
4.5V of three input levels
V < (VIL, VIH or VIHH). (Note 6)
DD
4.5V
VDD Start Voltage
to ensure Wiper
Reset
VBOR
VDD Rise Rate to
ensure Power-on
Reset
VDDRR
Delay after device
exits the reset state
(VDD > VBOR)
TBORD
—
10
20
µs
IDD
—
—
600
µA
Serial Interface Active,
HVC/A0 = VIH (or VIL) (Note 11)
Write all 0’s to Volatile Wiper 0
VDD = 5.5V, FSCL = 3.4 MHz
—
—
250
µA
Serial Interface Active,
HVC/A0 = VIH (or VIL) (Note 11)
Write all 0’s to Volatile Wiper 0
VDD = 5.5V, FSCL = 100 kHz
—
—
575
µA
EE Write Current (Write Cycle)
(Nonvolatile device only),
VDD = 5.5V, FSCL = 400 kHz,
Write all 0’s to Nonvolatile Wiper 0
SCL = VIL or VIH
—
2.5
5
µA
Serial Interface Inactive,
(Stop condition, SCL = SDA = VIH),
Wiper = 0
VDD = 5.5V, HVC/A0 = VIH
Supply Current
(Note 10)
—
Conditions
(Note 9)
RAM retention voltage (VRAM) < VBOR
V/ms
Note 1:
2:
3:
4:
5:
6:
7:
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4XX1 only.
MCP4XX2 only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification.
DS22107B-page 4
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C TA +125°C (extended)
DC Characteristics
Parameters
Resistance
(± 20%)
Resolution
Step Resistance
Nominal
Resistance Match
Wiper Resistance
(Note 3, Note 4)
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Sym
RAB
Min
Typ
Max
Units
Conditions
4.0
5
6.0
k
-502 devices(Note 1)
8.0
10
12.0
k
-103 devices(Note 1)
40.0
50
60.0
k
-503 devices(Note 1)
80.0
100
120.0
k
-104 devices(Note 1)
N
257
Taps
8-bit
No Missing Codes
129
Taps
7-bit
No Missing Codes
—
RAB /
(256)
—
8-bit
Note 6
—
RAB /
(128)
—
7-bit
Note 6
|RAB0 - RAB1| /
RAB
—
0.2
1.25
%
MCP46X1 devices only
|RBW0 - RBW1|
/ RBW
—
0.25
1.5
%
MCP46X2 devices only,
Code = Full-Scale
RW
—
75
160
VDD = 5.5 V, IW = 2.0 mA, code = 00h
—
75
300
VDD = 2.7 V, IW = 2.0 mA, code = 00h
—
50
—
ppm/°C TA = -20°C to +70°C
—
100
—
ppm/°C TA = -40°C to +85°C
—
150
—
ppm/°C TA = -40°C to +125°C
ppm/°C Code = Mid-scale (80h or 40h)
RS
Nominal
Resistance
Tempco
RAB/T
Ratiometeric
Tempco
VWB/T
—
15
—
Resistor Terminal
Input Voltage
Range (Terminals
A, B and W)
VA,VW,VB
Vss
—
VDD
V
Note 5, Note 6
Note 1:
2:
3:
4:
5:
6:
7:
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4XX1 only.
MCP4XX2 only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification.
2008-2013 Microchip Technology Inc.
DS22107B-page 5
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C TA +125°C (extended)
DC Characteristics
Parameters
Maximum current
through Terminal
(A, W or B)
Note 6
Leakage current
into A, W or B
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Sym
Min
Typ
Max
Units
IT
—
—
2.5
mA
Terminal A
IAW,
W = Full-Scale (FS)
—
—
2.5
mA
Terminal B
IBW,
W = Zero Scale (ZS)
—
—
2.5
mA
Terminal W
IAW or IBW,
W = FS or ZS
—
—
1.38
mA
IAB, VB = 0V,
VA = 5.5V,
RAB(MIN) = 4000
—
—
0.688
mA
IAB, VB = 0V,
VA = 5.5V,
RAB(MIN) = 8000
IWL
Conditions
Terminal A
and
Terminal B
—
—
0.138
mA
—
—
0.069
mA
—
100
—
nA
MCP4XX1 PxA = PxW = PxB = VSS
—
100
—
nA
MCP4XX2 PxB = PxW = VSS
—
100
—
nA
Terminals Disconnected
(R1HW = R0HW = 0)
IAB, VB = 0V,
VA = 5.5V,
RAB(MIN) = 40000
IAB, VB = 0V,
VA = 5.5V,
RAB(MIN) = 80000
Note 1:
2:
3:
4:
5:
6:
7:
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4XX1 only.
MCP4XX2 only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification.
DS22107B-page 6
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C TA +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Full-Scale Error
(MCP4XX1 only)
(8-bit code = 100h,
7-bit code = 80h)
VWFSE
-6.0
-0.1
—
LSb
-4.0
-0.1
—
LSb
-3.5
-0.1
—
LSb
-2.0
-0.1
—
LSb
-0.8
-0.1
—
LSb
-0.5
-0.1
—
LSb
-0.5
-0.1
—
-0.5
-0.1
—
—
+0.1
+6.0
LSb
—
+0.1
+3.0
LSb
—
+0.1
+3.5
LSb
Zero-Scale Error
(MCP4XX1 only)
(8-bit code = 00h,
7-bit code = 00h)
VWZSE
Potentiometer
Integral
Non-linearity
INL
Potentiometer
Differential
Non-linearity
DNL
Conditions
8-bit
3.0V VDD 5.5V
7-bit
3.0V VDD 5.5V
8-bit
3.0V VDD 5.5V
7-bit
3.0V VDD 5.5V
8-bit
3.0V VDD 5.5V
7-bit
3.0V VDD 5.5V
LSb
100 k 8-bit
3.0V VDD 5.5V
LSb
7-bit
3.0V VDD 5.5V
5 k
8-bit
3.0V VDD 5.5V
7-bit
3.0V VDD 5.5V
10 k
8-bit
3.0V VDD 5.5V
—
+0.1
+2.0
LSb
—
+0.1
+0.8
LSb
5 k
10 k
50 k
50 k
7-bit
3.0V VDD 5.5V
8-bit
3.0V VDD 5.5V
—
+0.1
+0.5
LSb
7-bit
3.0V VDD 5.5V
—
+0.1
+0.5
LSb
100 k 8-bit
3.0V VDD 5.5V
—
+0.1
+0.5
LSb
7-bit
3.0V VDD 5.5V
-1
±0.5
+1
LSb
8-bit
-0.5
±0.25
+0.5
LSb
7-bit
-0.5
±0.25
+0.5
LSb
8-bit
-0.25
±0.125
+0.25
LSb
7-bit
3.0V VDD 5.5V
MCP4XX1 devices only
(Note 2)
3.0V VDD 5.5V
MCP4XX1 devices only
(Note 2)
Note 1:
2:
3:
4:
5:
6:
7:
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4XX1 only.
MCP4XX2 only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification.
2008-2013 Microchip Technology Inc.
DS22107B-page 7
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C TA +125°C (extended)
DC Characteristics
Parameters
Bandwidth -3 dB
(See Figure 2-58,
load = 30 pF)
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Sym
Min
Typ
Max
Units
Conditions
BW
—
2
—
MHz
—
2
—
MHz
—
1
—
MHz
—
1
—
MHz
—
200
—
kHz
8-bit
Code = 80h
—
200
—
kHz
7-bit
Code = 40h
—
100
—
kHz
100 k 8-bit
Code = 80h
—
100
—
kHz
7-bit
Code = 40h
5 k
10 k
50 k
8-bit
Code = 80h
7-bit
Code = 40h
8-bit
Code = 80h
7-bit
Code = 40h
Note 1:
2:
3:
4:
5:
6:
7:
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4XX1 only.
MCP4XX2 only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification.
DS22107B-page 8
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C TA +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Rheostat Integral
Non-linearity
MCP45X1
(Note 4, Note 8)
MCP4XX2 devices
only (Note 4)
R-INL
Min
Typ
Max
Units
-1.5
±0.5
+1.5
LSb
-8.25
+4.5
+8.25
LSb
-1.125
±0.5
+1.125
LSb
-6.0
+4.5
+6.0
LSb
-1.5
±0.5
+1.5
LSb
-5.5
+2.5
+5.5
LSb
-1.125
±0.5
+1.125
LSb
-4.0
+2.5
+4.0
LSb
-1.5
±0.5
+1.5
LSb
-2.0
+1
+2.0
LSb
-1.125
±0.5
+1.125
LSb
-1.5
+1
+1.5
LSb
-1.0
±0.5
+1.0
LSb
-1.5
+0.25
+1.5
LSb
-0.8
±0.5
+0.8
LSb
-1.125
+0.25
+1.125
LSb
Conditions
5 k
8-bit
5.5V, IW = 900 µA
3.0V, IW = 480 µA
(Note 7)
7-bit
5.5V, IW = 900 µA
3.0V, IW = 480 µA
(Note 7)
10 k
8-bit
5.5V, IW = 450 µA
3.0V, IW = 240 µA
(Note 7)
7-bit
5.5V, IW = 450 µA
3.0V, IW = 240 µA
(Note 7)
50 k
8-bit
5.5V, IW = 90 µA
3.0V, IW = 48 µA
(Note 7)
7-bit
5.5V, IW = 90 µA
3.0V, IW = 48 µA
(Note 7)
100 k 8-bit
5.5V, IW = 45 µA
3.0V, IW = 24 µA
(Note 7)
7-bit
5.5V, IW = 45 µA
3.0V, IW = 24 µA
(Note 7)
Note 1:
2:
3:
4:
5:
6:
7:
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4XX1 only.
MCP4XX2 only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification.
2008-2013 Microchip Technology Inc.
DS22107B-page 9
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C TA +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Rheostat
Differential
Non-linearity
MCP45X1
(Note 4, Note 8)
MCP4XX2 devices
only
(Note 4)
R-DNL
Min
Typ
Max
Units
-0.5
±0.25
+0.5
LSb
-1.0
+0.5
+1.0
LSb
-0.375
±0.25
+0.375
LSb
-0.75
+0.5
+0.75
LSb
-0.5
±0.25
+0.5
LSb
-1.0
+0.25
+1.0
LSb
-0.375
±0.25
+0.375
LSb
-0.75
+0.5
+0.75
LSb
-0.5
±0.25
+0.5
LSb
-0.5
±0.25
+0.5
LSb
-0.375
±0.25
+0.375
LSb
-0.375
±0.25
+0.375
LSb
-0.5
±0.25
+0.5
LSb
-0.5
±0.25
+0.5
LSb
-0.375
±0.25
+0.375
LSb
-0.375
±0.25
+0.375
LSb
Conditions
5 k
8-bit
5.5V, IW = 900 µA
3.0V, IW = 480 µA
(Note 7)
7-bit
5.5V, IW = 900 µA
3.0V, IW = 480 µA
(Note 7)
10 k
8-bit
5.5V, IW = 450 µA
3.0V, IW = 240 µA
(Note 7)
7-bit
5.5V, IW = 450 µA
3.0V, IW = 240 µA
(Note 7)
50 k
8-bit
5.5V, IW = 90 µA
3.0V, IW = 48 µA
(Note 7)
7-bit
5.5V, IW = 90 µA
3.0V, IW = 48 µA
(Note 7)
100 k 8-bit
5.5V, IW = 45 µA
3.0V, IW = 24 µA
(Note 7)
7-bit
5.5V, IW = 45 µA
3.0V, IW = 24 µA
(Note 7)
Capacitance (PA)
CAW
—
75
—
pF
f =1 MHz, Code = Full-Scale
Capacitance (Pw)
CW
—
120
—
pF
f =1 MHz, Code = Full-Scale
Capacitance (PB)
CBW
—
75
—
pF
f =1 MHz, Code = Full-Scale
Note 1:
2:
3:
4:
5:
6:
7:
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4XX1 only.
MCP4XX2 only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification.
DS22107B-page 10
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C TA +125°C (extended)
DC Characteristics
Parameters
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Sym
Min
Typ
Max
Units
Conditions
Digital Inputs/Outputs (SDA, SCK, HVC/A0, A1, A2, WP)
Schmitt Trigger
High-Input
Threshold
Schmitt Trigger
Low-Input
Threshold
Hysteresis of
Schmitt Trigger
Inputs (Note 6)
VIH
VIL
VHYS
0.45 VDD
—
—
V
0.5 VDD
—
—
V
0.7 VDD
—
VMAX
V
0.7 VDD
—
VMAX
V
0.7 VDD
—
VMAX
V
0.7 VDD
—
VMAX
V
—
—
0.2VDD
V
-0.5
—
0.3VDD
V
-0.5
—
0.3VDD
V
-0.5
—
0.3VDD
V
-0.5
—
0.3VDD
V
—
0.1VDD
—
V
N.A.
—
—
V
N.A.
—
—
V
0.1 VDD
—
—
V
0.05 VDD
—
—
V
0.1 VDD
—
—
V
0.1 VDD
—
—
V
High-Voltage Input
Entry Voltage
VIHHEN
8.5
—
12.5 (6)
V
High-Voltage Input
Exit Voltage
VIHHEX
—
—
VDD +
0.8V (6)
V
High-Voltage Limit
VMAX
—
—
12.5 (6)
V
All
Inputs
except
SDA
and
SCL
2.7V VDD 5.5V
(Allows 2.7V Digital VDD with
5V Analog VDD)
1.8V VDD 2.7V
100 kHz
SDA
and
SCL
400 kHz
1.7 MHz
3.4 Mhz
All inputs except SDA and SCL
100 kHz
SDA
and
SCL
400 kHz
1.7 MHz
3.4 Mhz
All inputs except SDA and SCL
100 kHz
SDA
and
SCL
400 kHz
VDD < 2.0V
VDD 2.0V
VDD < 2.0V
VDD 2.0V
1.7 MHz
3.4 Mhz
Threshold for WiperLock™ Technology
Pin can tolerate VMAX or less.
Note 1:
2:
3:
4:
5:
6:
7:
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4XX1 only.
MCP4XX2 only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification.
2008-2013 Microchip Technology Inc.
DS22107B-page 11
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C TA +125°C (extended)
DC Characteristics
Parameters
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Sym
Output Low
Voltage (SDA)
VOL
Weak Pull-up /
Pull-down Current
IPU
HVC Pull-up /
Pull-down
Resistance
Input Leakage Current
Pin Capacitance
Min
Typ
Max
Units
Conditions
VSS
—
0.2VDD
V
VDD < 2.0V, IOL = 1 mA
VSS
—
0.4
V
VDD 2.0V, IOL = 3 mA
—
—
1.75
mA
Internal VDD pull-up, VIHH pull-down
VDD = 5.5V, VIHH = 12.5V
—
170
—
µA
HVC pin, VDD = 5.5V, VHVC = 3V
RHVC
—
16
—
k
VDD = 5.5V, VHVC = 3V
IIL
-1
—
1
µA
VIN = VDD and VIN = VSS
CIN, COUT
—
10
—
pF
fC = 3.4 MHz
N
0h
—
1FFh
hex
8-bit device
—
1FFh
hex
7-bit device
hex
All Terminals connected
RAM (Wiper) Value
Value Range
0h
TCON POR/BOR
Value
1FFh
NTCON
EEPROM
Endurance
Endurance
—
EEPROM Range
N
0h
Initial Factory
Setting
N
EEPROM
Programming Write
Cycle Time
1M
—
—
1FFh
80h
40h
Cycles
hex
hex
8-bit
WiperLock Technology = Off
hex
7-bit
WiperLock Technology = Off
tWC
—
5
10
ms
PSS
—
0.0015
0.0035
%/%
8-bit
VDD = 2.7V to 5.5V,
VA = 2.7V, Code = 80h
—
0.0015
0.0035
%/%
7-bit
VDD = 2.7V to 5.5V,
VA = 2.7V, Code = 40h
Power Requirements
Power Supply
Sensitivity
(MCP45X2 and
MCP46X2 only)
Note 1:
2:
3:
4:
5:
6:
7:
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4XX1 only.
MCP4XX2 only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification.
DS22107B-page 12
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
SCL
93
91
90
92
SDA
STOP
Condition
START
Condition
I2C Bus Start/Stop Bits Timing Waveforms.
FIGURE 1-1:
I2C BUS START/STOP BITS REQUIREMENTS
TABLE 1-1:
I2C AC Characteristics
Param.
Symbol
No.
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40C TA +125C (Extended)
Operating Voltage VDD range is described in AC/DC characteristics
Characteristic
FSCL
D102
Cb
Bus capacitive
loading
90
TSU:STA
START condition
Setup time
91
THD:STA
START condition
Hold time
92
TSU:STO
STOP condition
Setup time
93
THD:STO STOP condition
Hold time
2008-2013 Microchip Technology Inc.
Standard mode
Fast mode
High-Speed 1.7
High-Speed 3.4
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
Min
Max
Units
0
0
0
0
—
—
—
—
4700
600
160
160
4000
600
160
160
4000
600
160
160
4000
600
160
160
100
400
1.7
3.4
400
400
400
100
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
kHz
kHz
MHz
MHz
pF
pF
pF
pF
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Conditions
Cb = 400 pF, 1.8V - 5.5V
Cb = 400 pF, 2.7V - 5.5V
Cb = 400 pF, 4.5V - 5.5V
Cb = 100 pF, 4.5V - 5.5V
Only relevant for repeated
START condition
After this period the first
clock pulse is generated
DS22107B-page 13
MCP454X/456X/464X/466X
103
102
100
101
SCL
90
106
91
92
107
SDA
In
110
109
109
SDA
Out
I2C Bus Data Timing.
FIGURE 1-2:
I2C BUS DATA REQUIREMENTS (SLAVE MODE)
TABLE 1-2:
I2C AC Characteristics
Param.
No.
Sym
Characteristic
100
THIGH
Clock high time
101
Note 1:
2:
3:
4:
5:
6:
7:
TLOW
Clock low time
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40C TA +125C (Extended)
Operating Voltage VDD range is described in AC/DC characteristics
Min
Max
Units
100 kHz mode
4000
—
ns
1.8V-5.5V
400 kHz mode
600
—
ns
2.7V-5.5V
1.7 MHz mode
120
ns
4.5V-5.5V
3.4 MHz mode
60
—
ns
4.5V-5.5V
100 kHz mode
4700
—
ns
1.8V-5.5V
400 kHz mode
1300
—
ns
2.7V-5.5V
ns
4.5V-5.5V
—
ns
4.5V-5.5V
1.7 MHz mode
320
3.4 MHz mode
160
Conditions
As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the
requirement tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not
stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal,
it must output the next data bit to the SDA line.
TR max.+tSU;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before
the SCL line is released.
The MCP46X1/MCP46X2 device must provide a data hold time to bridge the undefined part between VIH
and VIL of the falling edge of the SCL signal. This specification is not a part of the I2C specification, but
must be tested in order to ensure that the output data will meet the setup and hold specifications for the
receiving device.
Use Cb in pF for the calculations.
Not tested.
A Master Transmitter must provide a delay to ensure that difference between SDA and SCL fall times do
not unintentionally create a Start or Stop condition.
Ensured by the TAA 3.4 MHz specification test.
DS22107B-page 14
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
TABLE 1-2:
I2C BUS DATA REQUIREMENTS (SLAVE MODE) (CONTINUED)
I2C AC Characteristics
Param.
No.
Sym
102A (5)
TRSCL
102B (5)
103A
103B
(5)
(5)
106
Note 1:
2:
3:
4:
5:
6:
7:
TRSDA
TFSCL
TFSDA
THD:DAT
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40C TA +125C (Extended)
Operating Voltage VDD range is described in AC/DC characteristics
Characteristic
SCL rise time
SDA rise time
SCL fall time
SDA fall time
Data input hold
time
Min
Max
Units
Conditions
100 kHz mode
—
1000
ns
400 kHz mode
20 + 0.1Cb
300
ns
Cb is specified to be from
10 to 400 pF (100 pF maximum for 3.4 MHz mode)
1.7 MHz mode
20
80
ns
1.7 MHz mode
20
160
ns
3.4 MHz mode
10
40
ns
3.4 MHz mode
10
80
ns
After a Repeated Start
condition or an Acknowledge bit
100 kHz mode
—
1000
ns
Cb is specified to be from
10 to 400 pF (100 pF max
for 3.4 MHz mode)
400 kHz mode
20 + 0.1Cb
300
ns
1.7 MHz mode
20
160
ns
3.4 MHz mode
10
80
ns
100 kHz mode
—
300
ns
400 kHz mode
20 + 0.1Cb
300
ns
1.7 MHz mode
20
80
ns
3.4 MHz mode
10
40
ns
100 kHz mode
—
300
ns
400 kHz mode
20 + 0.1Cb (4)
300
ns
1.7 MHz mode
20
160
ns
3.4 MHz mode
10
80
ns
After a Repeated Start condition or an Acknowledge
bit
Cb is specified to be from
10 to 400 pF (100 pF max
for 3.4 MHz mode)
Cb is specified to be from
10 to 400 pF (100 pF max
for 3.4 MHz mode)
100 kHz mode
0
—
ns
1.8V-5.5V, Note 6
400 kHz mode
0
—
ns
2.7V-5.5V, Note 6
1.7 MHz mode
0
—
ns
4.5V-5.5V, Note 6
3.4 MHz mode
0
—
ns
4.5V-5.5V, Note 6
As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the
requirement tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not
stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal,
it must output the next data bit to the SDA line.
TR max.+tSU;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before
the SCL line is released.
The MCP46X1/MCP46X2 device must provide a data hold time to bridge the undefined part between VIH
and VIL of the falling edge of the SCL signal. This specification is not a part of the I2C specification, but
must be tested in order to ensure that the output data will meet the setup and hold specifications for the
receiving device.
Use Cb in pF for the calculations.
Not tested.
A Master Transmitter must provide a delay to ensure that difference between SDA and SCL fall times do
not unintentionally create a Start or Stop condition.
Ensured by the TAA 3.4 MHz specification test.
2008-2013 Microchip Technology Inc.
DS22107B-page 15
MCP454X/456X/464X/466X
I2C BUS DATA REQUIREMENTS (SLAVE MODE) (CONTINUED)
TABLE 1-2:
I2C AC Characteristics
Param.
No.
107
109
110
Sym
2:
3:
4:
5:
6:
7:
Characteristic
TSU:DAT Data input setup
time
TAA
TBUF
TSP
Note 1:
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40C TA +125C (Extended)
Operating Voltage VDD range is described in AC/DC characteristics
Output valid
from clock
Bus free time
Input filter spike
suppression
(SDA and SCL)
Min
Max
Units
Conditions
100 kHz mode
250
—
ns
400 kHz mode
100
—
ns
1.7 MHz mode
10
—
ns
3.4 MHz mode
10
—
ns
100 kHz mode
—
3450
ns
400 kHz mode
—
900
ns
1.7 MHz mode
—
150
ns
Cb = 100 pF,
Note 1, Note 7
—
310
ns
Cb = 400 pF,
Note 1, Note 5
3.4 MHz mode
—
150
ns
Cb = 100 pF, Note 1
100 kHz mode
4700
—
ns
Time the bus must be free
before a new transmission
can start
400 kHz mode
1300
—
ns
1.7 MHz mode
N.A.
—
ns
3.4 MHz mode
N.A.
—
ns
100 kHz mode
—
50
ns
400 kHz mode
—
50
ns
Note 2
Note 1
Philips Spec states N.A.
1.7 MHz mode
—
10
ns
Spike suppression
3.4 MHz mode
—
10
ns
Spike suppression
As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the
requirement tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not
stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal,
it must output the next data bit to the SDA line.
TR max.+tSU;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before
the SCL line is released.
The MCP46X1/MCP46X2 device must provide a data hold time to bridge the undefined part between VIH
and VIL of the falling edge of the SCL signal. This specification is not a part of the I2C specification, but
must be tested in order to ensure that the output data will meet the setup and hold specifications for the
receiving device.
Use Cb in pF for the calculations.
Not tested.
A Master Transmitter must provide a delay to ensure that difference between SDA and SCL fall times do
not unintentionally create a Start or Stop condition.
Ensured by the TAA 3.4 MHz specification test.
DS22107B-page 16
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 8L-DFN (3x3)
JA
—
56.7
—
°C/W
Thermal Resistance, 8L-MSOP
JA
—
211
—
°C/W
Thermal Resistance, 8L-SOIC
JA
—
149.5
—
°C/W
Thermal Resistance, 10L-DFN (3x3)
JA
—
57
—
°C/W
Thermal Resistance, 10L-MSOP
JA
—
202
—
°C/W
Thermal Resistance, 14L-MSOP
JA
—
N/A
—
°C/W
Thermal Resistance, 14L-SOIC
JA
—
95.3
—
°C/W
Thermal Resistance, 16L-QFN
JA
—
47
—
°C/W
Conditions
Temperature Ranges
Thermal Package Resistances
2008-2013 Microchip Technology Inc.
DS22107B-page 17
MCP454X/456X/464X/466X
NOTES:
DS22107B-page 18
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
450
1.7MHz, 5.5V
300
250
1.7MHz, 2.7V
200
400kHz, 5.5V
100kHz, 5.5V
150
100
400kHz, 2.7V
50
0
40
IHVC
150
100
50
100kHz, 2.7V
RHVC
0
-40
80
0
120
2
3
4
5
Temperature (°C)
FIGURE 2-1:
Device Current (IDD) vs. I2C
Frequency (fSCL) and Ambient Temperature
(VDD = 2.7V and 5.5V).
6
7
VHVC (V)
8
9
10
FIGURE 2-4:
HVC Pull-up/Pull-down
Resistance (RHVC) and Current (IHVC) vs. HVC
Input Voltage (VHVC) (VDD = 5.5V).
12
HVC VPP Threshold (V)
3
2.5
Istandby (uA)
1000
800
600
400
200
0
-200
-400
-600
-800
-1000
200
3.4MHz, 2.7V
350
RHVC (kOhms)
400
IDD (uA)
250
3.4MHz, 5.5V
IHVC (µA)
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
5.5V
2
1.5
1
2.7V
0.5
10
5.5V Entry
8
2.7V Entry
5.5V Exit
6
4
2.7V Exit
2
0
-40
0
40
80
120
Temperature (°C)
FIGURE 2-2:
Device Current (ISHDN) and
VDD. (HVC = VDD) vs. Ambient Temperature.
-40
-20
0
20
40
60
80
Ambient Temperature (°C)
100
120
FIGURE 2-5:
HVC High Input Entry/Exit
Threshold vs. Ambient Temperature and VDD.
420
IWRITE (µA)
400
380
360
5.5V
340
320
300
-40
0
40
80
120
Temperature (°C)
FIGURE 2-3:
Write Current (IWRITE) vs.
Ambient Temperature.
2008-2013 Microchip Technology Inc.
DS22107B-page 19
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
INL
DNL
0.3
0.2
0.1
80
0
60
-0.1
40
125°C
20
0
-40°C 25°C
85°C
120
100
-0.2
RW
-0.3
64 96 128 160 192 224 256
Wiper Setting (decimal)
32
260
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
INL
220
DNL
180
0
140
RW
100
-0.1
125°C
60
-40°C
20
0
32
25°C
85°C
-0.2
-0.3
64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-7:
5 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
DS22107B-page 20
0.75
-0.25
40
125°C
85°C 25°C
32
DNL
-40°C
-0.75
RW
-1.25
64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-8:
5 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
6
INL
220
0.1
1.25
60
260
0.2
125C Rw
125C INL
125C DNL
0.25
300
0.3
85C Rw
85C INL
85C DNL
80
0
Error (LSb)
Wiper Resistance (R W)
(ohms)
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
INL
20
FIGURE 2-6:
5 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
300
-40C Rw
-40C INL
-40C DNL
Error (LSb)
125C Rw
125C INL
125C DNL
4
180
2
140
RW
100
0
-40°C
60
125°C
20
0
32
85°C
25°C
Error (LSb)
85C Rw
85C INL
85C DNL
Wiper Resistance (R W )
(ohms)
100
25C Rw
25C INL
25C DNL
Wiper Resistance (R W )
(ohms)
-40C Rw
-40C INL
-40C DNL
Error (LSb)
Wiper Resistance (R W )
(ohms)
120
DNL
-2
64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-9:
5 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
5300
6000
5250
5000
RWB (Ohms)
Nominal Resistance (RAB)
(Ohms)
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
2.7V
5200
5150
5100
4000
3000
2000
-40°C
25°C
85°C
125°C
1000
5.5V
5050
0
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-10:
5 k – Nominal Resistance
() vs. Ambient Temperature and VDD.
2008-2013 Microchip Technology Inc.
0
32
64
96
128 160 192
Wiper Setting (decimal)
224
256
FIGURE 2-11:
5 k – RWB () vs. Wiper
Setting and Ambient Temperature.
DS22107B-page 21
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-12:
5 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-15:
5 k – Low-Voltage
Increment Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-13:
5 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
FIGURE 2-16:
5 k – Low-Voltage
Increment Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
FIGURE 2-14:
5 k – Power-Up Wiper
Response Time (20 ms/Div).
DS22107B-page 22
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
125C Rw
125C INL
125C DNL
INL
DNL
0.3
0.2
0.1
80
0
60
-0.1
25°C -40°C
125°C 85°C
-0.2
RW
20
-0.3
0
260
220
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
INL
DNL
125C Rw
125C INL
125C DNL
0.1
0
140
100
RW
60
25°C
125°C 85°C
20
0
0
60
40
125°C
32
-40°C
300
-0.1
-0.2
-0.3
64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-18:
10 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
2008-2013 Microchip Technology Inc.
1
32
85°C 25°C
RW
-40°C
DNL
-0.5
-1
64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-19:
10 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
0.3
180
125C Rw
125C INL
125C DNL
80
0
0.2
85C Rw
85C INL
85C DNL
0.5
20
Error (LSb)
Wiper Resistance (R W)
(ohms)
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
INL
25 50 75 100 125 150 175 200 225 250
Wiper Setting (decimal)
FIGURE 2-17:
10 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
300
-40C Rw
-40C INL
-40C DNL
100
Wiper Resistance (R W )
(ohms)
40
120
Error (LSb)
85C Rw
85C INL
85C DNL
-40C Rw
-40C INL
-40C DNL
260
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
4
3
INL
220
2
180
1
140
0
100
-40°C
60
DNL
RW
Error (LSb)
100
25C Rw
25C INL
25C DNL
Wiper Resistance (R W )
(ohms)
-40C Rw
-40C INL
-40C DNL
Error (LSb)
Wiper Resistance (R W )
(ohms)
120
-1
125°C 85°C 25°C
20
-2
0
25 50 75 100 125 150 175 200 225 250
Wiper Setting (decimal)
FIGURE 2-20:
10 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
DS22107B-page 23
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
12000
10250
10000
10200
10150
10100
RWB (Ohms)
Nominal Resistance (R AB)
(Ohms)
10300
2.7V
10050
10000
5.5V
9950
1.8V
8000
6000
4000
-40°C
25°C
85°C
125°C
2000
9900
9850
0
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-21:
10 k – Nominal Resistance
() vs. Ambient Temperature and VDD.
DS22107B-page 24
0
32
64
96 128 160 192
Wiper Setting (decimal)
224
256
FIGURE 2-22:
10 k – RWB () vs. Wiper
Setting and Ambient Temperature.
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-23:
10 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-26:
10 k – Low-Voltage
Increment Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-24:
10 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
FIGURE 2-27:
10 k – Low-Voltage
Increment Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
FIGURE 2-25:
10 k – Power-Up Wiper
Response Time (1 µs/Div).
2008-2013 Microchip Technology Inc.
DS22107B-page 25
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
INL
DNL
0.3
0.2
0.1
80
0
60
-0.1
40
125°C
25°C
85°C
20
0
-40°C
120
100
-0.2
RW
-0.3
64 96 128 160 192 224 256
Wiper Setting (decimal)
32
260
220
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
INL
DNL
125C Rw
125C INL
125C DNL
180
0
140
RW
100
-40°C
60
-0.1
-0.2
-0.1
40
0
32
-0.3
64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-29:
50 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
DS22107B-page 26
85°C 25°C
125°C
32
-40°C
RW
-0.2
-0.3
64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-30:
50 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
INL
125C Rw
125C INL
125C DNL
1
0.75
0.5
DNL
0.25
180
0
140
RW
100
-0.25
-0.5
-40°C
60
125°C 85°C 25°C
20
0.1
0
220
0.1
0.2
60
260
0.2
0.3
125C Rw
125C INL
125C DNL
DNL
300
0.3
85C Rw
85C INL
85C DNL
80
0
Error (LSb)
Wiper Resistance (R W)
(ohms)
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
INL
20
FIGURE 2-28:
50 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
300
-40C Rw
-40C INL
-40C DNL
Error (LSb)
125C Rw
125C INL
125C DNL
Error (LSb)
85C Rw
85C INL
85C DNL
Wiper Resistance (R W)
(ohms)
100
25C Rw
25C INL
25C DNL
Wiper Resistance (R W )
(ohms)
-40C Rw
-40C INL
-40C DNL
Error (LSb)
Wiper Resistance (R W )
(ohms)
120
125°C
85°C 25°C
20
0
32
64
-0.75
-1
96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-31:
50 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
60000
52000
50000
51500
1.8V
RWB (Ohms)
Nominal Resistance (R
(Ohms)
AB)
52500
51000
50500
50000
2.7V
40000
30000
20000
-40°C
25°C
85°C
125°C
10000
49500
5.5V
49000
0
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-32:
50 k – Nominal Resistance
() vs. Ambient Temperature and VDD.
2008-2013 Microchip Technology Inc.
0
32
64
96 128 160 192
Wiper Setting (decimal)
224
256
FIGURE 2-33:
50 k – RWB () vs. Wiper
Setting and Ambient Temperature.
DS22107B-page 27
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-34:
50 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-37:
50 k – Low-Voltage
Increment Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-35:
50 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
FIGURE 2-38:
50 k – Low-Voltage
Increment Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
FIGURE 2-36:
50 k – Power-Up Wiper
Response Time (1 µs/Div).
DS22107B-page 28
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
125C Rw
125C INL
125C DNL
0.2
DNL
0
60
-0.1
40
25°C -40°C
-40C Rw
-40C INL
-40C DNL
100
0.1
INL
80
120
RW
32
-0.2
64 96 128 160 192 224 256
Wiper Setting (decimal)
-40C Rw
-40C INL
-40C DNL
260
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
INL
220
DNL
125C Rw
125C INL
125C DNL
-0.1
40
-40°C
260
0
140
-0.05
100
RW
60
20
-40°C
125°C 85°C 25°C
0
32
-0.1
-0.15
-0.2
64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-40:
100 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
2008-2013 Microchip Technology Inc.
32
-0.2
-0.3
64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-41:
100 k Rheo Mode – RW
(), INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
0.15
0.05
180
RW
125°C 85°C 25°C
300
0.1
0.1
0
0.2
Error (LSb)
Wiper Resistance (R W)
(ohms)
300
0.2
60
0
FIGURE 2-39:
100 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
0.3
125C Rw
125C INL
125C DNL
DNL
80
20
Wiper Resistance (Rw)
(ohms)
0
85C Rw
85C INL
85C DNL
INL
125°C 85°C
20
25C Rw
25C INL
25C DNL
Error (LSb)
85C Rw
85C INL
85C DNL
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
INL
220
125C Rw
125C INL
125C DNL
0.6
0.4
0.2
DNL
180
0
140
RW
100
60
20
-40°C
-0.2
Error (LSb)
100
25C Rw
25C INL
25C DNL
Wiper Resistance (R W )
(ohms)
-40C Rw
-40C INL
-40C DNL
Error (LSb)
Wiper Resistance (R W )
(ohms)
120
-0.4
125°C 85°C 25°C
0
32
-0.6
64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-42:
100 k Rheo Mode – RW
(), INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
DS22107B-page 29
MCP454X/456X/464X/466X
120000
103500
103000
102500
102000
101500
101000
100500
100000
99500
99000
98500
100000
Rwb (Ohms)
Nominal Resistance (R
(Ohms)
AB)
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
1.8V
2.7V
80000
60000
40000
-40°C
25°C
85°C
125°C
20000
5.5V
0
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-43:
100 k – Nominal
Resistance () vs. Ambient Temperature and
VDD .
DS22107B-page 30
0
32
64
96 128 160 192
Wiper Setting (decimal)
224
256
FIGURE 2-44:
100 k – RWB () vs. Wiper
Setting and Ambient Temperature.
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-45:
100 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-47:
100 k – Low-Voltage
Increment Wiper Settling Time (VDD =5.5V)
(1 µs/Div).
FIGURE 2-46:
100 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
FIGURE 2-48:
100 k – Low-Voltage
Increment Wiper Settling Time (VDD = 2.7V)
(1 µs/Div)
2008-2013 Microchip Technology Inc.
DS22107B-page 31
MCP454X/456X/464X/466X
0.12
0.1
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
0.1
0.08
5.5V
%
%
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
0.06
0.04
3.0V
0.02
3.0V
0
-40
0
40
80
Temperature (°C)
120
FIGURE 2-49:
Resistor Network 0 to
Resistor Network 1 RAB (5 k) Mismatch vs. VDD
and Temperature.
-40
0.04
0.05
0.03
0.04
40
80
Temperature (°C)
0.03
5.5V
0.01
0
120
FIGURE 2-51:
Resistor Network 0 to
Resistor Network 1 RAB (50 k) Mismatch vs.
VDD and Temperature.
0.02
5.5V
0.02
0
%
%
5.5V
-0.01
3.0V
0
3.0V
-0.02
0.01
-0.01
-0.03
-0.02
-0.04
-0.03
-40
0
40
80
Temperature (°C)
120
FIGURE 2-50:
Resistor Network 0 to
Resistor Network 1 RAB (10 k) Mismatch vs.
VDD and Temperature.
DS22107B-page 32
-40
10
60
Temperature (°C)
110
FIGURE 2-52:
Resistor Network 0 to
Resistor Network 1 RAB (100 k) Mismatch vs.
VDD and Temperature.
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
4
3.5
5.5V
VOL (mV)
VIH (V)
3
2.5
2
2.7V
1.5
230
210
2.7V
190
170
150
130
5.5V
110
90
70
50
1
-40
0
40
80
120
Temperature (°C)
FIGURE 2-53:
Temperature.
-40
0
40
80
120
Temperature (°C)
VIH (SDA, SCL) vs. VDD and
FIGURE 2-55:
VOL (SDA) vs. VDD and
Temperature (IOL = 3 mA).
2
VIL (V)
5.5V
1.5
2.7V
1
-40
0
40
80
120
Temperature (°C)
FIGURE 2-54:
Temperature.
VIL (SDA, SCL) vs. VDD and
2008-2013 Microchip Technology Inc.
DS22107B-page 33
MCP454X/456X/464X/466X
2.1
Note: Unless otherwise indicated, TA = +25°C,
VDD = 5V, VSS = 0V.
Test Circuits
4.2
+5V
tWC (ms)
4.0
A
VIN
3.8
3.6
B
Offset
GND
3.4
3.2
W
+
VOUT
-
2.5V DC
3.0
-40
0
40
80
120
Temperature (°C)
FIGURE 2-56:
Nominal EEPROM Write
Cycle Time vs. VDD and Temperature.
FIGURE 2-58:
Test.
-3 db Gain vs. Frequency
1.2
1
floating
VA
A
5.5V
VDD (V)
0.8
0.6
VW
W
2.7V
0.4
IW
0.2
B
0
-40
0
40
80
VB
RBW = VW/IW
RW = (VW-VA)/IW
120
Temperature (°C)
FIGURE 2-57:
POR/BOR Trip Point vs.
VDD and Temperature.
DS22107B-page 34
FIGURE 2-59:
RBW and RW Measurement.
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
Additional descriptions of the device pins follow.
TABLE 3-1:
PINOUT DESCRIPTION FOR THE MCP454X/456X/464X/466X
Pin
Single
Dual
Rheo Pot (1) Rheo
Pot
Symbol
I/O
Buffer
Type
Weak
Pull-up/
down (1)
Standard Function
8L
8L
10L
14L
16L
1
1
1
1
16
HVC/A0
I
HV w/ST
“smart”
2
2
2
2
1
SCL
I
HV w/ST
No
I2C clock input.
3
3
3
3
2
SDA
I/O
HV w/ST
No
I2C serial data I/O. Open Drain
output
4
4
4
4
3, 4
VSS
—
P
—
Ground
—
—
5
5
5
P1B
A
Analog
No
Potentiometer 1 Terminal B
—
—
6
6
6
P1W
A
Analog
No
Potentiometer 1 Wiper Terminal
—
—
—
7
7
P1A
A
Analog
No
Potentiometer 1 Terminal A
—
5
—
8
8
P0A
A
Analog
No
Potentiometer 0 Terminal A
5
6
7
9
9
P0W
A
Analog
No
Potentiometer 0 Wiper Terminal
6
7
8
10
10
P0B
A
Analog
No
Potentiometer 0 Terminal B
—
—
—
11
12
WP
I
HV w/ST
“smart”
Hardware EEPROM Write
Protect
—
—
—
12
13
A2
I
HV w/ST
“smart”
Address 2
7
—
9
13
14
A1
I
HV w/ST
“smart”
8
8
10
14
15
VDD
—
P
—
—
—
—
—
11
NC
—
—
—
No Connection
9
9
11
—
17
EP
—
—
—
Exposed Pad (Note 2)
Legend:
Note 1:
2:
High Voltage Command /
Address 0.
Address 1
Positive Power Supply Input
HV w/ST = High Voltage tolerant input (with Schmidtt trigger input)
A = Analog pins (Potentiometer terminals)
I = digital input (high Z)
O = digital output
I/O = Input / Output
P = Power
The pin’s “smart” pull-up shuts off while the pin is forced low. This is done to reduce the standby and shutdown current.
The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively
connected to the die substrate, and therefore should be unconnected or connected to the same ground as
the device’s VSS pin.
2008-2013 Microchip Technology Inc.
DS22107B-page 35
MCP454X/456X/464X/466X
3.1
High Voltage Command / Address 0
(HVC/A0)
The HVC/A0 pin is the Address 0 input for the I2C
interface as well as the High Voltage Command pin. At
the device’s POR/BOR, the value of the A0 address bit
is latched. This input, along with the A2 and A1 pins,
completes the device address. This allows up to eight
MCP45xx/46xx devices on a single I2C bus.
During normal operation, the the voltage on this pin
determines if the I2C command is a normal command
or a High Voltage command (when HVC/A0 = VIHH).
3.2
Serial Clock (SCL)
The SCL pin is the serial interfaces Serial Clock pin.
This pin is connected to the Host Controllers SCL pin.
The MCP45XX/46XX is a slave device, so its SCL pin
accepts only external clock signals.
3.3
Serial Data (SDA)
The SDA pin is the serial interfaces Serial Data pin.
This pin is connected to the Host Controllers SDA pin.
The SDA pin is an open-drain N-channel driver.
3.7
Potentiometer Terminal A
The terminal A pin is available on the MCP4XX1
devices, and is connected to the internal potentiometer’s terminal A.
The potentiometer’s terminal A is the fixed connection
to the Full-Scale wiper value of the digital potentiometer. This corresponds to a wiper value of 0x100 for 8-bit
devices or 0x80 for 7-bit devices.
The terminal A pin does not have a polarity relative to
the terminal W or B pins. The terminal A pin can
support both positive and negative current. The voltage
on terminal A must be between VSS and VDD.
The terminal A pin is not available on the MCP4XX2
devices, and the internally terminal A signal is floating.
MCP46X1 devices have two terminal A pins, one for
each resistor network.
3.8
Write Protect (WP)
The WP pin is used to force the nonvolatile memory to
be write protected.
3.9
Address 2 (A2)
The VSS pin is the device ground reference.
The A2 pin is the I2C interface’s Address 2 pin. Along
with the A1 and A0 pins, up to 8 MCP45XX/46XX
devices can be on a single I2C bus.
3.5
3.10
3.4
Ground (VSS)
Potentiometer Terminal B
The terminal B pin is connected to the internal
potentiometer’s terminal B.
The potentiometer’s terminal B is the fixed connection
to the Zero Scale wiper value of the digital potentiometer. This corresponds to a wiper value of 0x00 for both
7-bit and 8-bit devices.
The terminal B pin does not have a polarity relative to
the terminal W or A pins. The terminal B pin can
support both positive and negative current. The voltage
on terminal B must be between VSS and VDD.
MCP46XX devices have two terminal B pins, one for
each resistor network.
3.6
Potentiometer Wiper (W) Terminal
The terminal W pin is connected to the internal potentiometer’s terminal W (the wiper). The wiper terminal is
the adjustable terminal of the digital potentiometer. The
terminal W pin does not have a polarity relative to
terminals A or B pins. The terminal W pin can support
both positive and negative current. The voltage on
terminal W must be between VSS and VDD.
Address 1 (A1)
The A2 pin is the I2C interface’s Address 1 pin. Along
with the A2 and A0 pins, up to 8 MCP45XX/46XX
devices can be on a single I2C bus.
3.11
Positive Power Supply Input (VDD)
The VDD pin is the device’s positive power supply input.
The input power supply is relative to VSS.
While the device VDD < Vmin (2.7V), the electrical
performance of the device may not meet the data sheet
specifications.
3.12
No Connect (NC)
These pins should be either connected to VDD or VSS.
3.13
Exposed Pad (EP)
This pad is conductively connected to the device’s substrate. This pad should be tied to the same potential as
the VSS pin (or left unconnected). This pad could be
used to assist as a heat sink for the device when connected to a PCB heat sink.
MCP46XX devices have two terminal W pins, one for
each resistor network.
DS22107B-page 36
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
4.0
FUNCTIONAL OVERVIEW
This Data Sheet covers a family of thirty-two Digital
Potentiometer and Rheostat devices that will be
referred to as MCP4XXX. The MCP4XX1 devices are
the Potentiometer configuration, while the MCP4XX2
devices are the Rheostat configuration.
As the Device Block Diagram shows, there are four
main functional blocks. These are:
•
•
•
•
POR/BOR Operation
Memory Map
Resistor Network
Serial Interface (I2C)
The POR/BOR operation and the Memory Map are
discussed in this section and the Resistor Network and
I2C operation are described in their own sections. The
Device Commands commands are discussed in
Section 7.0 “Device Commands”.
4.1
POR/BOR Operation
The Power-on Reset is the case where the device has
power applied to it, starting from the VSS level. The
Brown-out Reset occurs when power is applied to the
device, and that power (voltage) drops below the specified range.
The device’s RAM retention voltage (VRAM) is lower
than the POR/BOR voltage trip point (VPOR/VBOR). The
maximum VPOR/VBOR voltage is less than 1.8V.
When VPOR/VBOR < VDD < 2.7V, the electrical
performance may not meet the data sheet
specifications. In this region, the device is capable of
reading and writing to its EEPROM and incrementing,
decrementing, reading and writing to its volatile
memory if the proper serial command is executed.
4.1.1
POWER-ON RESET
When the device powers up, the device VDD will cross
the VPOR/VBOR voltage. Once the VDD voltage crosses
the VPOR/VBOR voltage the following happens:
• Volatile wiper register is loaded with value in the
corresponding nonvolatile wiper register
• The TCON register is loaded its default value
• The device is capable of digital operation
2008-2013 Microchip Technology Inc.
4.1.2
BROWN-OUT RESET
When the device powers down, the device VDD will
cross the VPOR/VBOR voltage.
Once the VDD voltage decreases below the VPOR/VBOR
voltage the following happens:
• Serial Interface is disabled
• EEPROM Writes are disabled
If the VDD voltage decreases below the VRAM voltage
the following happens:
• Volatile wiper registers may become corrupted
• TCON register may become corrupted
As the voltage recovers above the VPOR/VBOR voltage
see Section 4.1.1 “Power-on Reset”.
Serial commands not completed due to a brown-out
condition may cause the memory location (volatile and
nonvolatile) to become corrupted.
4.2
Memory Map
The device memory is 16 locations that are 9-bits wide
(16x9 bits). This memory space contains both volatile
and nonvolatile locations (see Table 4-1).
TABLE 4-1:
Address
MEMORY MAP
Function
Memory Type
00h
Volatile Wiper 0
01h
Volatile Wiper 1
RAM
02h
Nonvolatile Wiper 0
EEPROM
03h
Nonvolatile Wiper 1
EEPROM
RAM
04h
Volatile TCON Register
RAM
05h
Status Register
RAM
06h
Data EEPROM
EEPROM
07h
Data EEPROM
EEPROM
08h
Data EEPROM
EEPROM
09h
Data EEPROM
EEPROM
0Ah
Data EEPROM
EEPROM
0Bh
Data EEPROM
EEPROM
0Ch
Data EEPROM
EEPROM
0Dh
Data EEPROM
EEPROM
0Eh
Data EEPROM
EEPROM
0Fh
Data EEPROM
EEPROM
DS22107B-page 37
MCP454X/456X/464X/466X
4.2.1
4.2.1.4
NONVOLATILE MEMORY
(EEPROM)
This memory can be grouped into two uses of nonvolatile memory. These are:
• General Purpose Registers
• Nonvolatile Wiper Registers
The nonvolatile wipers starts functioning below the
devices VPOR/VBOR trip point.
4.2.1.1
General Purpose Registers
These locations allow the user to store up to 10 (9-bit)
locations worth of information.
4.2.1.2
Nonvolatile Wiper Registers
Special Features
There are three nonvolatile bits that are not directly
mapped into the address space. These bits control the
following functions:
• EEPROM Write Protect
• WiperLock Technology for Nonvolatile Wiper 0
• WiperLock Technology for Nonvolatile Wiper 1
The operation of WiperLock Technology is discussed in
Section 5.3. The state of the WL0, WL1, and WP bits
is reflected in the STATUS register (see Register 4-1).
EEPROM Write Protect
All internal EEPROM memory can be Write Protected.
When EEPROM memory is Write Protected, Write
commands to the internal EEPROM are prevented.
These locations contain the wiper values that are
loaded into the corresponding volatile wiper register
whenever the device has a POR/BOR event. There are
up to two registers, one for each resistor network.
Write Protect (WP) can be enabled/disabled by two
methods. These are:
The nonvolatile wiper register enables stand-alone
operation of the device (without Microcontroller control)
after being programmed to the desired value.
• External WP Hardware pin (MCP46X1 devices
only)
• Nonvolatile configuration bit
4.2.1.3
High Voltage commands are required to enable and
disable the nonvolatile WP bit. These commands are
shown in Section 7.8 “Modify Write Protect or WiperLock Technology (High Voltage)”.
Factory Initialization of Nonvolatile
Memory (EEPROM)
The Nonvolatile Wiper values will be initialized to
mid-scale value. This is shown in Table 4-2.
The General purpose EEPROM memory will be
programmed to a default value of 0xFF.
It is good practice in the manufacturing flow to
configure the device to your desired settings.
-502
5.0 k
Mid-scale
80h
40h
Disabled
-103
10.0 k
Mid-scale
80h
40h
Disabled
-503
50.0 k
Mid-scale
80h
40h
Disabled
-104
100.0 k Mid-scale
80h
40h
Disabled
Resistance
Code
Default POR
Wiper Setting
Wiper
Code
WiperLock™
Technology and
Write Protect Setting
DEFAULT FACTORY
SETTINGS SELECTION
Typical
RAB Value
TABLE 4-2:
DS22107B-page 38
8-bit 7-bit
To write to EEPROM, both the external WP pin and the
internal WP EEPROM bit must be disabled. Write
Protect does not block commands to the volatile
registers.
4.2.2
VOLATILE MEMORY (RAM)
There are four Volatile Memory locations. These are:
• Volatile Wiper 0
• Volatile Wiper 1
(Dual Resistor Network devices only)
• Status Register
• Terminal Control (TCON) Register
The volatile memory starts functioning at the RAM
retention voltage (VRAM).
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
4.2.2.1
Status (STATUS) Register
This register contains four status bits. These bits show
the state of the WiperLock bits, the Write Protect bit,
and if an EEPROM write cycle is active. The STATUS
register can be accessed via the READ commands.
Register 4-1 describes each STATUS register bit.
The STATUS register is placed at Address 05h.
REGISTER 4-1:
R-1
STATUS REGISTER (ADDRESS = 0x05)
R-1
R-1
R-1
D8:D4
R-1
R-0
EEWA
R-x
WL1 (1)
R-x
WL0 (1)
bit 7
R-x
WP (1)
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 8-4
D8:D4: Reserved. Forced to “1”
bit 3
EEWA: EEPROM Write Active Status bit
This bit indicates if the EEPROM Write Cycle is occurring.
1 = An EEPROM Write cycle is currently occurring. Only serial commands to the Volatile memory
locations are allowed (addresses 00h, 01h, 04h, and 05h)
0 = An EEPROM Write cycle is NOT currently occurring
bit 2
WL1: WiperLock Status bit for Resistor Network 1 (Refer to Section 5.3 “WiperLock™ Technology”
for further information)
WiperLock (WL) prevents the Volatile and Nonvolatile Wiper 1 addresses and the TCON register bits
R1HW, R1A, R1W, and R1B from being written to. High Voltage commands are required to enable and
disable WiperLock Technology.
1 = Wiper and TCON register bits R1HW, R1A, R1W, and R1B of Resistor Network 1 (Pot 1) are
“Locked” (Write Protected)
0 = Wiper and TCON of Resistor Network 1 (Pot 1) can be modified
Note:
bit 1
WL0: WiperLock Status bit for Resistor Network 0 (Refer to Section 5.3 “WiperLock™ Technology”
for further information)
The WiperLock Technology bits (WLx) prevents the Volatile and Nonvolatile Wiper 0 addresses and the
TCON register bits R0HW, R0A, R0W, and R0B from being written to. High Voltage commands are
required to enable and disable WiperLock Technology.
1 = Wiper and TCON register bits R0HW, R0A, R0W, and R0B of Resistor Network 0 (Pot 0) are
“Locked” (Write Protected)
0 = Wiper and TCON of Resistor Network 0 (Pot 0) can be modified
Note:
Note 1:
The WL1 bit always reflects the result of the last programming cycle to the nonvolatile WL1
bit. After a POR or BOR event, the WL1 bit is loaded with the nonvolatile WL1 bit value.
The WL0 bit always reflects the result of the last programming cycle to the nonvolatile WL0
bit. After a POR or BOR event, the WL0 bit is loaded with the nonvolatile WL0 bit value.
Requires a High Voltage command to modify the state of this bit (for nonvolatile devices only). This bit is
not directly written, but reflects the system state (for this feature).
2008-2013 Microchip Technology Inc.
DS22107B-page 39
MCP454X/456X/464X/466X
REGISTER 4-1:
bit 0
Note 1:
STATUS REGISTER (ADDRESS = 0x05) (CONTINUED)
WP: EEPROM Write Protect Status bit (Refer to the section EEPROM Write Protect for further
information)
This bit indicates the status of the write protection on the EEPROM memory. When Write Protect is
enabled, writes to all nonvolatile memory are prevented. This includes the General Purpose EEPROM
memory, and the nonvolatile Wiper registers. Write Protect does not block modification of the volatile
wiper register values or the volatile TCON register value (via Increment, Decrement, or Write
commands).
This status bit is an OR of the devices Write Protect pin (WP) and the internal nonvolatile WP bit. High
Voltage commands are required to enable and disable the internal WP EEPROM bit.
1 = EEPROM memory is Write Protected
0 = EEPROM memory can be written
Requires a High Voltage command to modify the state of this bit (for nonvolatile devices only). This bit is
not directly written, but reflects the system state (for this feature).
DS22107B-page 40
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
4.2.2.2
Terminal Control (TCON) Register
This register contains eight control bits. Four bits are for
Wiper 0, and four bits are for Wiper 1. Register 4-2
describes each bit of the TCON register.
The state of each resistor network terminal connection
is individually controlled. That is, each terminal
connection (A, B and W) can be individually connected/
disconnected from the resistor network. This allows the
system to minimize the currents through the digital
potentiometer.
The value that is written to this register will appear on
the resistor network terminals when the serial
command has completed.
When the WL1 bit is enabled, writes to the TCON
register bits R1HW, R1A, R1W, and R1B are inhibited.
When the WL0 bit is enabled, writes to the TCON
register bits R0HW, R0A, R0W, and R0B are inhibited.
On a POR/BOR this register is loaded with 1FFh
(9-bits), for all terminals connected. The Host
Controller needs to detect the POR/BOR event and
then update the Volatile TCON register value.
Additionally, there is a bit which enables the operation
of General Call commands.
2008-2013 Microchip Technology Inc.
DS22107B-page 41
MCP454X/456X/464X/466X
REGISTER 4-2:
TCON BITS (ADDRESS = 0x04) (1)
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
GCEN
R1HW
R1A
R1W
R1B
R0HW
R0A
R0W
R0B
bit 8
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 8
GCEN: General Call Enable bit
This bit specifies if I2C General Call commands are accepted
1 = Enable Device to “Accept” the General Call Address (0000h)
0 = The General Call Address is disabled
bit 7
R1HW: Resistor 1 Hardware Configuration Control bit
This bit forces Resistor 1 into the “shutdown” configuration of the Hardware pin
1 = Resistor 1 is NOT forced to the hardware pin “shutdown” configuration
0 = Resistor 1 is forced to the hardware pin “shutdown” configuration
bit 6
R1A: Resistor 1 Terminal A (P1A pin) Connect Control bit
This bit connects/disconnects the Resistor 1 Terminal A to the Resistor 1 Network
1 = P1A pin is connected to the Resistor 1 Network
0 = P1A pin is disconnected from the Resistor 1 Network
bit 5
R1W: Resistor 1 Wiper (P1W pin) Connect Control bit
This bit connects/disconnects the Resistor 1 Wiper to the Resistor 1 Network
1 = P1W pin is connected to the Resistor 1 Network
0 = P1W pin is disconnected from the Resistor 1 Network
bit 4
R1B: Resistor 1 Terminal B (P1B pin) Connect Control bit
This bit connects/disconnects the Resistor 1 Terminal B to the Resistor 1 Network
1 = P1B pin is connected to the Resistor 1 Network
0 = P1B pin is disconnected from the Resistor 1 Network
bit 3
R0HW: Resistor 0 Hardware Configuration Control bit
This bit forces Resistor 0 into the “shutdown” configuration of the Hardware pin
1 = Resistor 0 is NOT forced to the hardware pin “shutdown” configuration
0 = Resistor 0 is forced to the hardware pin “shutdown” configuration
bit 2
R0A: Resistor 0 Terminal A (P0A pin) Connect Control bit
This bit connects/disconnects the Resistor 0 Terminal A to the Resistor 0 Network
1 = P0A pin is connected to the Resistor 0 Network
0 = P0A pin is disconnected from the Resistor 0 Network
bit 1
R0W: Resistor 0 Wiper (P0W pin) Connect Control bit
This bit connects/disconnects the Resistor 0 Wiper to the Resistor 0 Network
1 = P0W pin is connected to the Resistor 0 Network
0 = P0W pin is disconnected from the Resistor 0 Network
bit 0
R0B: Resistor 0 Terminal B (P0B pin) Connect Control bit
This bit connects/disconnects the Resistor 0 Terminal B to the Resistor 0 Network
1 = P0B pin is connected to the Resistor 0 Network
0 = P0B pin is disconnected from the Resistor 0 Network
Note 1:
These bits do not affect the wiper register values.
DS22107B-page 42
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
5.0
RESISTOR NETWORK
5.1
The Resistor Network has either 7-bit or 8-bit resolution. Each Resistor Network allows zero scale to
full-scale connections. Figure 5-1 shows a block diagram for the resistive network of a device.
The Resistor Network is made up of several parts.
These include:
• Resistor Ladder
• Wiper
• Shutdown (Terminal Connections)
Devices have either one or two resistor networks,
These are referred to as Pot 0 and Pot 1.
A
RW
RS
RW
R
RAB S
The resistor ladder is a series of equal value resistors
(RS) with a connection point (tap) between the two
resistors. The total number of resistors in the series
(ladder) determines the RAB resistance (see
Figure 5-1). The end points of the resistor ladder are
connected to analog switches which are connected to
the device Terminal A and Terminal B pins. The RAB
(and RS) resistance has small variations over voltage
and temperature.
For an 8-bit device, there are 256 resistors in a string
between terminal A and terminal B. The wiper can be
set to tap onto any of these 256 resistors thus providing
257 possible settings (including terminal A and terminal
B).
8-Bit
N=
256
(1) (100h)
7-Bit
N=
128
(80h)
For a 7-bit device, there are 128 resistors in a string
between terminal A and terminal B. The wiper can be
set to tap onto any of these 128 resistors thus providing
129 possible settings (including terminal A and terminal
B).
255
(FFh)
127
(7Fh)
Equation 5-1 shows the calculation for the step
resistance.
254
(FEh)
126
(7Eh)
EQUATION 5-1:
RW (1)
RS
Resistor Ladder Module
(1)
RS CALCULATION
R AB
R S = ------------ 256
8-bit Device
RAB
R S = ------------- 128
7-bit Device
W
RW
RS
RW
1
(1) (01h)
1
(01h)
0
(00h)
0
(00h)
(1)
Analog Mux
B
Note 1:
The wiper resistance is dependent on
several factors including, wiper code,
device VDD, Terminal voltages (on A, B,
and W), and temperature.
Also for the same conditions, each tap
selection resistance has a small variation.
This RW variation has greater effects on
some specifications (such as INL) for the
smaller resistance devices (5.0 k)
compared to larger resistance devices
(100.0 k).
FIGURE 5-1:
Resistor Block Diagram.
2008-2013 Microchip Technology Inc.
DS22107B-page 43
MCP454X/456X/464X/466X
5.2
Wiper
5.3
Each tap point (between the RS resistors) is a
connection point for an analog switch. The opposite
side of the analog switch is connected to a common
signal which is connected to the Terminal W (Wiper)
pin.
A value in the volatile wiper register selects which
analog switch to close, connecting the W terminal to
the selected node of the resistor ladder.
The wiper can connect directly to Terminal B or to
Terminal A. A zero-scale connection, connects the Terminal W (wiper) to Terminal B (wiper setting of 000h). A
full-scale connection, connects the Terminal W (wiper)
to Terminal A (wiper setting of 100h or 80h). In these
configurations, the only resistance between the Terminal W and the other Terminal (A or B) is that of the analog switches.
A wiper setting value greater than full-scale (wiper
setting of 100h for 8-bit device or 80h for 7-bit devices)
will also be a Full-Scale setting (Terminal W (wiper)
connected to Terminal A). Table 5-1 illustrates the full
wiper setting map.
Equation 5-2 illustrates the calculation used to determine the resistance between the wiper and terminal B.
The MCP4XXX device’s WiperLock technology allows
application-specific calibration settings to be secured in
the EEPROM without requiring the use of an additional
write-protect pin. There are two WiperLock Technology
configuration bits (WL0 and WL1). These bits prevent
the Nonvolatile and Volatile addresses and bits for the
specified resistor network from being written.
The WiperLock technology prevents
commands from doing the following:
8-bit Device
N = 0 to 256 (decimal)
R AB N
R WB = -------------- + R W
128
7-bit Device
• Nonvolatile Wiper Register
• Volatile Wiper Register
• Volatile TCON register bits RxHW, RxA, RxW, and
RxB
High Voltage commands are required to enable and
disable WiperLock. Please refer to the Modify Write
Protect or WiperLock Technology (High Voltage)
command for operation.
TABLE 5-2:
100h
Reserved (Full-Scale (W = A)),
Increment and Decrement
commands ignored
Full-Scale (W = A),
Increment commands ignored
07Fh
041h
0FFh
081
W=N
040h
080h
W = N (Mid-Scale)
03Fh
001h
07Fh
001
W=N
000h
000h
Zero Scale (W = B)
Decrement command ignored
DS22107B-page 44
Factory Default POR
Wiper Setting
080h
3FFh
101h
DEFAULT FACTORY
SETTINGS SELECTION
Typical
RAB Value
Properties
7-bit Pot 8-bit Pot
-502
5.0 k
Mid-scale
80h
40h
-103
10.0 k Mid-scale
80h
40h
-503
50.0 k Mid-scale
80h
40h
-104
100.0 k Mid-scale
80h
40h
Resistance
Code
VOLATILE WIPER VALUE VS.
WIPER POSITION MAP
Wiper Setting
3FFh
081h
POR/BOR OPERATION WHEN
WIPERLOCK TECHNOLOGY
ENABLED
The WiperLock Technology state is not affected by a
POR/BOR event. A POR/BOR event will load the
Volatile Wiper register value with the Nonvolatile Wiper
register value, refer to Section 4.1.
N = 0 to 128 (decimal)
TABLE 5-1:
serial
For either Resistor Network 0 or Resistor Network 1
(Potx), the WLx bit controls the following:
RWB CALCULATION
R AB N
R WB = -------------- + R W
256
the
• Changing a volatile wiper value
• Writing to a nonvolatile wiper memory location
• Changing the volatile TCON register value
5.3.1
EQUATION 5-2:
WiperLock™ Technology
Wiper Code
8-bit
7-bit
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
5.4
5.4.2
Shutdown
Shutdown is used to minimize the device’s current
consumption. The MCP4XXX achieves this through the
Terminal Control Register (TCON).
5.4.1
TERMINAL CONTROL REGISTER
(TCON)
The Terminal Control (TCON) register is a volatile
register used to configure the connection of each
resistor network terminal pin (A, B, and W) to the
Resistor Network. This bits are described in
Register 4-2.
When the RxHW bit is a “0”, the selected resistor network is forced into the following state:
INTERACTION OF RxHW BIT AND
RxA, RxW, AND RxB BITS (TCON
REGISTER)
Using the TCON bits allows each resistor network (Pot
0 and Pot 1) to be individually “shutdown”.
The state of the RxHW bit does NOT corrupt the other
bit values in the TCON register nor the value of the
Volatile Wiper Registers. When the Shutdown mode is
exited (RxHW changes state from “0” to “1”):
• The device returns to the Wiper setting specified
by the Volatile Wiper value
• The RxA, RxB, and RxW bits return to controlling
the terminal connection state of that resistor network
• The PxA terminal is disconnected
• The PxW terminal is simultaneously connected to
the PxB terminal (see Figure 5-2)
• The Serial Interface is NOT disabled, and all
Serial Interface activity is executed
• Any EEPROM write cycles are completed
Alternate low power configurations may be achieved
with the RxA, RxW, and RxB bits.
Note 1: The RxHW bits are identical to the RxHW
bits of the MCP41XX/42XX devices. The
MCP42XX devices also have a SHDN
pin which forces the resistor network into
the same state as that resistor networks
RxHW bit.
2: When RxHW = “0”, the state of the TCON
register RxA, RxW, and RxB bits is overridden (ignored). When the state of the
RxHW bit returns to “1”, the TCON
register RxA, RxW, and RxB bits return to
controlling the terminal connection state.
In other words, the RxHW bit does not
corrupt the state of the RxA, RxW, and
RxB bits.
Resistor Network
A
FIGURE 5-2:
Configuration.
W
B
Resistor Network Shutdown
2008-2013 Microchip Technology Inc.
DS22107B-page 45
MCP454X/456X/464X/466X
NOTES:
DS22107B-page 46
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
6.0
SERIAL INTERFACE (I2C)
6.1
The MCP45XX/46XX devices support the I2C serial
protocol. The MCP45XX/46XX I2C’s module operates
in Slave mode (does not generate the serial clock).
Figure 6-1 shows a typical I2C Interface connection. All
I2C interface signals are high-voltage tolerant.
The MCP45XX/46XX devices use the two-wire I2C
serial interface. This interface can operate in standard,
fast or High-Speed mode. A device that sends data
onto the bus is defined as transmitter, and a device
receiving data as receiver. The bus has to be controlled
by a master device which generates the serial clock
(SCL), controls the bus access and generates the
START and STOP conditions. The MCP45XX/46XX
device works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated. Communication is initiated by the master (microcontroller) which
sends the START bit, followed by the slave address
byte. The first byte transmitted is always the slave
address byte, which contains the device code, the
address bits, and the R/W bit.
2C
Refer to the Phillips I
the I2C specifications.
document for more details of
Typical I2C Interface Connections
MCP4XXX
Host
Controller
SCL
SCL
SDA
SDA
I/O
(1)
HVC/A0
(2)
A1 (2, 3)
A2 (2, 3)
Note 1: If High voltage commands are desired,
some type of external circuitry needs to
be implemented.
2: These pins have internal pull-ups. If
faster rise times are required, then
external pull-ups should be added.
3: This pin could be tied high, low, or
connected to an I/O pin of the Host
Controller.
FIGURE 6-1:
Diagram.
Typical I2C Interface Block
Signal Descriptions
The I2C interface uses up to five pins (signals). These
are:
•
•
•
•
•
SDA (Serial Data)
SCL (Serial Clock)
A0 (Address 0 bit)
A1 (Address 1 bit)
A2 (Address 2 bit)
6.1.1
SERIAL DATA (SDA)
The Serial Data (SDA) signal is the data signal of the
device. The value on this pin is latched on the rising
edge of the SCL signal when the signal is an input.
With the exception of the START and STOP conditions,
the high or low state of the SDA pin can only change
when the clock signal on the SCL pin is low. During the
high period of the clock the SDA pin’s value (high or
low) must be stable. Changes in the SDA pin’s value
while the SCL pin is HIGH will be interpreted as a
START or a STOP condition.
6.1.2
SERIAL CLOCK (SCL)
The Serial Clock (SCL) signal is the clock signal of the
device. The rising edge of the SCL signal latches the
value on the SDA pin. The MCP45XX/46XX supports
three I2C interface clock modes:
• Standard Mode: clock rates up to 100 kHz
• Fast Mode: clock rates up to 400 kHz
• High-Speed Mode (HS mode): clock rates up to
3.4 MHz
The MCP4XXX will not strech the clock signal (SCL)
since memory read acceses occur fast enough.
Depending on the clock rate mode, the interface will
display different characteristics.
6.1.3
THE ADDRESS BITS (A2:A1:A0)
There are up to three hardware pins used to specify the
device address. The number of adress pins is
determined by the part number.
Address 0 is multiplexed with the High Voltage
Command (HVC) function. So the state of A0 is latched
on the MCP4XXX’s POR/BOR event.
The state of the A2 and A1 pins should be static, that is
they should be tied high or tied low.
6.1.3.1
The High Voltage Command (HVC)
Signal
The High Voltage Command (HVC) signal is multiplexed with Address 0 (A0) and is used to indicate that
the command, or sequence of commands, are in the
High Voltage mode. High Voltage commands allow the
device’s WiperLock Technology and write protect
features to be enabled and disabled.
The HVC pin has an internal resistor connection to the
MCP45XX/46XXs internal VDD signal.
2008-2013 Microchip Technology Inc.
DS22107B-page 47
MCP454X/456X/464X/466X
6.2
I2C Operation
6.2.1.3
The MCP45XX/46XX’s I2C module is compatible with
the Philips I2C specification. The following lists some of
the modules features:
• 7-bit slave addressing
• Supports three clock rate modes:
- Standard mode, clock rates up to 100 kHz
- Fast mode, clock rates up to 400 kHz
- High-speed mode (HS mode), clock rates up
to 3.4 MHz
• Support Multi-Master Applications
• General call addressing
• Internal weak pull-ups on interface signals
The I2C 10-bit addressing mode is not supported.
The Philips I2C specification only defines the field
types, field lengths, timings, etc. of a frame. The frame
content defines the behavior of the device. The frame
content for the MCP4XXX is defined in Section 7.0.
6.2.1
I2C BIT STATES AND SEQUENCE
Figure 6-8 shows the I2C transfer sequence. The serial
clock is generated by the master. The following definitions are used for the bit states:
• Start bit (S)
• Data bit
• Acknowledge (A) bit (driven low) /
No Acknowledge (A) bit (not driven low)
• Repeated Start bit (Sr)
• Stop bit (P)
6.2.1.1
2nd Bit
SCL
S
FIGURE 6-2:
6.2.1.2
Start Bit.
Data Bit
The SDA signal may change state while the SCL signal
is Low. While the SCL signal is High, the SDA signal
MUST be stable (see Figure 6-5).
SDA
1st Bit
SCL
DS22107B-page 48
SCL
FIGURE 6-4:
Data Bit.
D0
A
8
9
Acknowledge Waveform.
Not A (A) Response
The A bit has the SDA signal high. Table 6-1 shows
some of the conditions where the Slave Device will
issue a Not A (A).
If an error condition occurs (such as an A instead of A),
then an START bit must be issued to reset the
command state machine.
MCP45XX/MCP46XX A / A
RESPONSES
Acknowledge
Bit
Response
Comment
General Call
A
Slave Address
valid
A
Slave Address
not valid
A
Device Memory Address
and specified
command
(AD3:AD0 and
C1:C0) are an
invalid combination
A
After device has
received address
and command
Communication during
EEPROM write
cycle
A
After device has
received address
and command,
and valid conditions for EEPROM
write
N.A.
I2C Module
Resets, or a “Don’t
Care” if the collision occurs on the
Masters “Start bit”.
2nd Bit
Bus Collision
Data Bit
FIGURE 6-3:
SDA
Event
The Start bit (see Figure 6-2) indicates the beginning of
a data transfer sequence. The Start bit is defined as the
SDA signal falling when the SCL signal is “High”.
1st Bit
The A bit (see Figure 6-4) is typically a response from
the receiving device to the transmitting device.
Depending on the context of the transfer sequence, the
A bit may indicate different things. Typically the Slave
device will supply an A response after the Start bit and
eight “data” bits have been received. An A bit has the
SDA signal low.
TABLE 6-1:
Start Bit
SDA
Acknowledge (A) Bit
Only if GCEN bit is
set
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
6.2.1.4
6.2.1.5
Repeated Start Bit
The Repeated Start bit (see Figure 6-5) indicates the
current Master Device wishes to continue communicating with the current Slave Device without releasing the
I2C bus. The Repeated Start condition is the same as
the Start condition, except that the Repeated Start bit
follows a Start bit (with the Data bits + A bit) and not a
Stop bit.
Stop Bit
The Stop bit (see Figure 6-6) Indicates the end of the
I2C Data Transfer Sequence. The Stop bit is defined as
the SDA signal rising when the SCL signal is “High”.
A Stop bit resets the I2C interface of all MCP4XXX
devices.
SDA A / A
The Start bit is the beginning of a data transfer
sequence and is defined as the SDA signal falling when
the SCL signal is “High”.
SCL
P
Note 1: A bus collision during the Repeated Start
condition occurs if:
FIGURE 6-6:
Transmit Mode.
• SDA is sampled low when SCL goes
from low to high.
6.2.2
• SCL goes low before SDA is asserted
low. This may indicate that another
master is attempting to transmit a
data "1".
Stop Condition Receive or
CLOCK STRETCHING
“Clock Stretching” is something that the receiving
device can do, to allow additional time to “respond” to
the “data” that has been received.
The MCP4XXX will not strech the clock signal (SCL)
since memory read acceses occur fast enough.
1st Bit
SDA
6.2.3
If any part of the I2C transmission does not meet the
command format, it is aborted. This can be intentionally
accomplished with a START or STOP condition. This is
done so that noisy transmissions (usually an extra
START or STOP condition) are aborted before they
corrupt the device.
SCL
Sr = Repeated Start
FIGURE 6-5:
Waveform.
ABORTING A TRANSMISSION
Repeat Start Condition
SDA
SCL
S
FIGURE 6-7:
1st Bit
2nd Bit 3rd Bit
4th Bit
5th Bit
6th Bit
7th Bit
8th Bit
A/A
P
Typical 8-Bit I2C Waveform Format.
SDA
SCL
START
Condition
FIGURE 6-8:
Data allowed
to change
Data or
A valid
STOP
Condition
I2C Data States and Bit Sequence.
2008-2013 Microchip Technology Inc.
DS22107B-page 49
MCP454X/456X/464X/466X
6.2.4
ADDRESSING
The address byte is the first byte received following the
START condition from the master device. The address
contains four (or more) fixed bits and (up to) three user
defined hardware address bits (pins A2, A1, and A0).
These 7-bits address the desired I2C device. The
A7:A4 address bits are fixed to “0101” and the device
appends the value of following three address pins (A2,
A1, A0). Address pins that are not present on the
device are pulled up (a bit value of ‘1’).
Since there are up to three adress bits controlled by
hardware pins, there may be up to eight MCP4XXX
devices on the same I2C bus.
Figure 6-9 shows the slave address byte format, which
contains the seven address bits. There is also a read/
write bit. Table 6-2 shows the fixed address for device.
Hardware Address Pins
The hardware address bits (A2, A1, and A0)
correspond to the logic level on the associated address
pins. This allows up to eight devices on the bus.
These pins have a weak pull-up enabled when the VDD
< VBOR. The weak pull-up utilizes the “smart” pull-up
technology and exhibits the same characteristics as the
High-voltage tolerant I/O structure.
The state of the A0 address pin is latch on POR/BOR.
This is required since High Voltage commands force
this pin (HVC/A0) to the VIHH level.
Slave Address
S A6 A5 A4 A3 A2 A1 A0 R/W
“0” “1” “0” “1”
See Table 6-2
Start
bit
A/A
R/W bit
R/W = 0 = write
R/W = 1 = read
A bit (controlled by slave device)
A = 0 = Slave Device Acknowledges byte
A = 1 = Slave Device does not Acknowledge byte
FIGURE 6-9:
I2C Control Byte.
TABLE 6-2:
Slave Address Bits in the
DEVICE SLAVE ADDRESSES
Device
Address
MCP45X1 ‘0101 11’b + A0
Comment
Supports up to
devices. Note 1
MCP45X2 ‘0101 1’b + A1:A0 Supports up to
devices. Note 1
MCP46X1 ‘0101’b + A2:A1:A0 Supports up to
devices. Note 1
MCP46X2 ‘0101 1’b + A1:A0 Supports up to
devices. Note 1
Note 1: A0 is used for High-Voltage commands
and the value is latched at POR.
6.2.5
2
4
8
4
SLOPE CONTROL
The MCP45XX/46XX implements slope control on the
SDA output.
As the device transitions from HS mode to FS mode,
the slope control parmameter will change from the HS
specification to the FS specification.
For Fast (FS) and High-Speed (HS) modes, the device
has a spike suppression and a Schmidt trigger at SDA
and SCL inputs.
DS22107B-page 50
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
6.2.6
HS MODE
After switching to the High-Speed mode, the next
transferred byte is the I2C control byte, which specifies
the device to communicate with, and any number of
data bytes plus acknowledgements. The Master
Device can then either issue a Repeated Start bit to
address a different device (at High-Speed) or a Stop bit
to return to Fast/Standard bus speed. After the Stop bit,
any other Master Device (in a Multi-Master system) can
arbitrate for the I2C bus.
2
The I C specification requires that a high-speed mode
device must be ‘activated’ to operate in high-speed
(3.4 Mbit/s) mode. This is done by the Master sending
a special address byte following the START bit. This
byte is referred to as the high-speed Master Mode
Code (HSMMC).
The MCP45XX/46XX device does not acknowledge
this byte. However, upon receiving this command, the
device switches to HS mode. The device can now communicate at up to 3.4 Mbit/s on SDA and SCL lines.
The device will switch out of the HS mode on the next
STOP condition.
See Figure 6-10 for an illustration of the HS mode command sequence.
For more information on the HS mode, or other I2C
modes, please refer to the Phillips I2C specification.
The master code is sent as follows:
1.
2.
3.
6.2.6.1
START condition (S)
High-Speed Master Mode Code (0000 1XXX),
The XXX bits are unique to the high-speed (HS)
mode Master.
No Acknowledge (A)
Slope Control
The slope control on the SDA output is different
between the Fast/Standard Speed and the High-Speed
Clock modes of the interface.
6.2.6.2
Pulse Gobbler
The pulse gobbler on the SCL pin is automatically
adjusted to suppress spikes < 10 ns during HS mode.
F/S-mode
HS-mode
P
F/S-mode
S ‘0 0 0 0 1 X X X’b
A Sr ‘Slave Address’ R/W A
HS Select Byte
Control Byte
“Data”
Command/Data Byte(s)
S = Start bit
Sr = Repeated Start bit
A = Acknowledge bit
A = Not Acknowledge bit
R/W = Read/Write bit
P = Stop bit (Stop condition terminates HS Mode)
FIGURE 6-10:
A/A
HS-mode continues
Sr ‘Slave Address’ R/W A
Control Byte
HS Mode Sequence.
2008-2013 Microchip Technology Inc.
DS22107B-page 51
MCP454X/456X/464X/466X
6.2.7
GENERAL CALL
The General Call is a method that the “Master” device
can communicate with all other “Slave” devices. In a
Multi-Master application, the other Master devices are
operating in Slave mode. The General Call address
has two documented formats. These are shown in
Figure 6-11. We have added a MCP45XX/46XX format
in this figure as well.
This will allow customers to have multiple I2C Digital
Potentiometers on the bus and have them operate in a
synchronous fashion (analogous to the DAC Sync pin
functionality). If these MCP45XX/46XX 7-bit commands conflict with other I2C devices on the bus, then
the customer will need two I2C busses and ensure that
the devices are on the correct bus for their desired
application functionality.
Dual Pot devices can not update both Pot0 and Pot1
from a single command. To address this, there are
General Call commands for the Wiper 0, Wiper 1, and
the TCON registers.
Table 6-3 shows the General Call Commands. Three
commands are specified by the I2C specification and
are not applicable to the MCP45XX/46XX (so command is Not Acknowledged) The MCP45XX/46XX
General Call Commands are Acknowledge. Any other
command is Not Acknowledged.
Note:
Only one General Call command per issue
of the General Call control byte. Any additional General Call commands are ignored
and Not Acknowledged.
DS22107B-page 52
TABLE 6-3:
7-bit
Command
GENERAL CALL COMMANDS
Comment
(1, 2, 3)
‘1000 00d’b Write Next Byte (Third Byte) to Volatile
Wiper 0 Register
‘1001 00d’b Write Next Byte (Third Byte) to Volatile
Wiper 1 Register
‘1100 00d’b Write Next Byte (Third Byte) to TCON
Register
‘1000 010’b Increment Wiper 0 Register
or
‘1000 011’b
‘1001 010’b Increment Wiper 1 Register
or
‘1001 011’b
‘1000 100’b Decrement Wiper 0 Register
or
‘1000 101’b
‘1001 100’b Decrement Wiper 1 Register
or
‘1001 101’b
Note 1:
2:
3:
Any other code is Not Acknowledged.
These codes may be used by other
devices on the I2C bus.
The 7-bit command always appends a “0”
to form 8-bits. .
“d” is the D8 bit for the 9-bit write value.
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Second Byte
S 0 0
0
0
0 0
0
0 A X X X X X
General Call Address
X
X
0
A P
“7-bit Command”
Reserved 7-bit Commands (By I2C Specification - Philips # 9398 393 40011, Ver. 2.1 January 2000)
‘0000 011’b - Reset and write programmable part of slave address by hardware.
‘0000 010’b - Write programmable part of slave address by hardware.
‘0000 000’b - NOT Allowed
MCP45XX/MCP46XX 7-bit Commands
‘1000 01x’b - Increment Wiper 0 Register.
‘1001 01x’b - Increment Wiper 1 Register.
‘1000 10x’b - Decrement Wiper 0 Register.
‘1001 10x’b - Decrement Wiper 1 Register.
The Following is a Microchip Extension to this General Call Format
Second Byte
S 0
0 0
0
0 0
0
0 A X X X X X
General Call Address
X d
0
Third Byte
A d
“7-bit Command”
d
d
d
d
d
d
d A P
“0” for General Call Command
MCP45XX/MCP46XX 7-bit Commands
‘1000 00d’b - Write Next Byte (Third Byte) to Volatile Wiper 0 Register.
‘1001 00d’b - Write Next Byte (Third Byte) to Volatile Wiper 1 Register.
‘1100 00d’b - Write Next Byte (Third Byte) to TCON Register.
The Following is a “Hardware General Call” Format
Second Byte
S 0
0 0
0
0
0 0
0
General Call Address
FIGURE 6-11:
A X X X X X
“7-bit Command”
X
n occurrences of (Data + A)
X
1
A X X X X X X X X A P
This indicates a “Hardware General Call”
MCP45XX/MCP46XX will ignore this byte and
all following bytes (and A), until
a Stop bit (P) is encountered.
General Call Formats.
2008-2013 Microchip Technology Inc.
DS22107B-page 53
MCP454X/456X/464X/466X
NOTES:
DS22107B-page 54
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
7.0
DEVICE COMMANDS
The MCP4XXX’s I2C command formats are specified in
this section. The I2C protocol does not specify how
commands are formatted.
The MCP4XXX supports four basic commands.
Depending on the location accessed, this determines
the commands that are supported.
For the Volatile Wiper Registers, these commands are:
•
•
•
•
Table 7-3 shows an overview of all the device commands and their interaction with other device features.
For the Nonvolatile wiper EEPROM, general purpose
data EEPROM, and the TCON Register these commands are:
• Write Data
• Read Data
These commands have formats for both a single
command or continuous commands. These commands
are shown in Table 7-1.
Each command has two operational states. The
operational state determines if the device commands
control the special features (Write Protect and WiperLock Technology). These operational states are
referred to as:
• Normal Serial Commands
• High-Voltage Serial Commands
I2C COMMANDS
Command
Operation
Mode
Additionally, there are two commands used to enable
or disable the special features (Write Protect and Wiper
Lock Technology) of the device. The commands are
special cases of the Increment and Decrement
High-Voltage Serial Command.
Table 7-2 shows the supported commands for each
memory location.
Write Data
Read Data
Increment Data
Decrement Data
TABLE 7-1:
Normal serial commands are those where the HVC pin
is driven to VIH or VIL. With High-Voltage Serial Commands, the HVC pin is driven to VIHH. In each mode,
there are four possible commands.
# of Bit
Clocks (1)
Write Data
Operates on
Volatile/
Nonvolatile
memory
Single
29
Both
Continuous 18n + 11 Volatile Only
Read Data
Single
29
Both
Random
48
Both
Continuous 18n + 11 Both (2)
Increment
Single
20
Volatile Only
(3)
Continuous 9n + 11 Volatile Only
20
Volatile Only
Decrement Single
(3)
Continuous 9n + 11 Volatile Only
Note 1: “n” indicates the number of times the
command operation is to be repeated.
2: This command is useful to determine if a
nonvolatile memory write cycle has
completed.
3: High Voltage Increment and Decrement
commands on select nonvolatile memory
locations enable/disable WiperLock
Technology and the software Write
Protect feature.
2008-2013 Microchip Technology Inc.
7.1
Command Byte
The MCP4XXX’s Command Byte has three fields: the
Address, the Command Operation, and 2 Data bits,
see Figure 7-1. Currently only one of the data bits is
defined (D8).
The device memory is accessed when the Master
sends a proper Command Byte to select the desired
operation. The memory location getting accessed is
contained in the Command Byte’s AD3:AD0 bits. The
action desired is contained in the Command Byte’s
C1:C0 bits, see Table 7-1. C1:C0 determines if the
desired memory location will be read, written,
Incremented (wiper setting +1) or Decremented (wiper
setting -1). The Increment and Decrement commands
are only valid on the volatile wiper registers, and in
High Voltage commands to enable/disable WiperLock
Technology and Software Write Protect.
If the Address bits and Command bits are not a valid
combination, then the MCP4XXX will generate a Not
Acknowledge pulse to indicate the invalid combination.
The I2C Master device must then force a Start Condition to reset the MCP4XXX’s 2C module.
D9 and D8 are the most significant bits for the digital
potentiometer’s wiper setting. The 8-bit devices utilize
D8 as their MSb while the 7-bit devices utilize D7 (from
the data byte) as it’s MSb.
COMMAND BYTE
A A A A A C C D D A
D D D D 1 0 9 8
3 2 1 0
MSbits (Data)
MCP4XXX
Memory Address
Command Operation bits
00 = Write Data
01 = Increment
10 = Decrement
11 = Read Data
FIGURE 7-1:
Command Byte Format.
DS22107B-page 55
MCP454X/456X/464X/466X
TABLE 7-2:
MEMORY MAP AND THE SUPPORTED COMMANDS
Address
Command Operation
Value
00h
01h
02h
03h
04h
(2)
05h (2)
Function
Volatile Wiper 0
Volatile Wiper 1
Non Volatile Wiper 0
Non Volatile Wiper 1
Volatile TCON Register
Write Data
nn nnnn nnnn
Read Data (3)
nn nnnn nnnn
Increment Wiper
—
Decrement Wiper
—
Write Data
nn nnnn nnnn
Read Data (3)
nn nnnn nnnn
Increment Wiper
—
Decrement Wiper
—
Write Data
nn nnnn nnnn
Read Data (3)
nn nnnn nnnn
—
Wiper Lock 0 Disable
High Voltage Decrement
—
Wiper Lock 0 Enable
Write Data
nn nnnn nnnn
Read Data (3)
nn nnnn nnnn
High Voltage Increment
—
Wiper Lock 1 Disable
High Voltage Decrement
—
Wiper Lock 1 Enable
Write Data
nn nnnn nnnn
(3)
nn nnnn nnnn
Read Data
Write Data
Read Data
Data EEPROM
Note 1:
2:
3:
nn nnnn nnnn
nn nnnn nnnn
(3)
Write Data
Read Data
nn nnnn nnnn
nn nnnn nnnn
(3)
Write Data
Read Data
0Fh
nn nnnn nnnn
nn nnnn nnnn
(3)
Write Data
Read Data
0Eh (2) Data EEPROM
nn nnnn nnnn
nn nnnn nnnn
(3)
Write Data
Read Data
0Dh (2) Data EEPROM
nn nnnn nnnn
nn nnnn nnnn
(3)
Write Data
Read Data
0Ch (2) Data EEPROM
nn nnnn nnnn
nn nnnn nnnn
(3)
Write Data
Read Data
0Bh (2) Data EEPROM
nn nnnn nnnn
nn nnnn nnnn
(3)
Write Data
Read Data
nn nnnn nnnn
nn nnnn nnnn
(3)
Write Data
Read Data
0Ah (2) Data EEPROM
nn nnnn nnnn
(3)
Write Data
Read Data
09h (2) Data EEPROM
nn nnnn nnnn
Read Data (3)
Status Register
08h (2) Data EEPROM
Comment
High Voltage Increment
06h (2) Data EEPROM
07h (2) Data EEPROM
Data
(10-bits) (1)
nn nnnn nnnn
nn nnnn nnnn
(3)
nn nnnn nnnn
High Voltage Increment
—
Write Protect Disable
High Voltage Decrement
—
Write Protect Enable
The Data Memory is only 9-bits wide, so the MSb is ignored by the device.
Increment or Decrement commands are invalid for these addresses.
I2C read operation will read 2 bytes, of which the 10-bits of data are contained within.
DS22107B-page 56
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
7.2
Data Byte
7.3
Only the Read Command and the Write Command
have Data Byte(s).
The Write command concatenates the 8-bits of the
Data Byte with the one data bit (D8) contained in the
Command Byte to form 9-bits of data (D8:D0). The
Command Byte format supports up to 9-bits of data so
that the 8-bit resistor network can be set to Full-Scale
(100h or greater). This allows wiper connections to
Terminal A and to Terminal B. The D9 bit is currently
unused.
Error Condition
If the four address bits received (AD3:AD0) and the two
command bits received (C1:C0) are a valid combination, the MCP4XXX will Acknowledge the I2C bus.
If the address bits and command bits are an invalid
combination, then the MCP4XXX will Not Acknowledge
the I2C bus.
Once an error condition has occurred, any following
commands are ignored until the I2C bus is reset with a
Start Condition.
7.3.1
ABORTING A TRANSMISSION
A Restart or Stop condition in the expected data bit
position will abort the current command sequence and
data will not be written to the MCP4XXX.
TABLE 7-3:
COMMANDS
Writes
Value in
EEPROM
Operates on
Volatile/
Nonvolatile
memory
High
Voltage
(VIHH) on
HVC pin?
Impact on
WiperLock or
Write Protect
Works
when
Wiper is
“locked”?
Write Data
Yes (1)
Both
—
unlocked (1)
No
Read Data
—
Both
—
unlocked (1)
No
(1)
No
No
Command Name
Increment Wiper
—
Volatile Only
—
unlocked
Decrement Wiper
—
Volatile Only
—
unlocked (1)
High Voltage Write Data
Yes
Both
Yes
unchanged
No
High Voltage Read Data
—
Both
Yes
unchanged
Yes
High Voltage Increment Wiper
—
Volatile Only
Yes
unchanged
No
High Voltage Decrement Wiper
—
Volatile Only
Yes
unchanged
No
Modify Write Protect or WiperLock
Technology (High Voltage) - Enable
— (2)
Nonvolatile Only
Yes
locked/
protected(2)
Yes
Modify Write Protect or WiperLock
Technology (High Voltage) - Disable
— (3)
Yes
unlocked/
unprotected(3)
Yes
Note 1:
2:
3:
(2)
Nonvolatile Only
(3)
This command will only complete, if wiper is “unlocked” (WiperLock Technology is Disabled).
If the command is executed using address 02h or 03h, that corresponding wiper is locked or
if with address 0Fh, then Write Protect is enabled.
If the command is executed using with address 02h or 03h, that corresponding wiper is unlocked or
if with address 0Fh, then Write Protect is disabled.
2008-2013 Microchip Technology Inc.
DS22107B-page 57
MCP454X/456X/464X/466X
7.4
Write Data
Normal and High Voltage
The Write Command can be issued to both the Volatile
and Nonvolatile memory locations. The format of the
command, see Figure 7-2, includes the I2C Control
Byte, an A bit, the MCP4XXX Command Byte, an A bit,
the MCP4XXX Data Byte, an A bit, and a Stop (or
Restart) condition. The MCP4XXX generates the A / A
bits.
A Write command to a Volatile memory location
changes that location after a properly formatted Write
Command and the A / A clock have been received.
A Write command to a Nonvolatile memory location will
only start a write cycle after a properly formatted Write
Command have been received and the Stop condition
has occurred.
Note:
7.4.1
Writes to certain memory locations will be
dependant on the state of the WiperLock
Technology bits and the Write Protect bit.
SINGLE WRITE TO VOLATILE
MEMORY
For volatile memory locations, data is written to the
MCP4XXX after every byte transfer (during the
Acknowledge). If a Stop or Restart condition is generated during a data transfer (before the A), the data will
not be written to the MCP4XXX. After the A bit, the
master can initiate the next sequence with a Stop or
Restart condition.
7.4.3
CONTINUOUS WRITES TO
VOLATILE MEMORY
A continuous write mode of operation is possible when
writing to the volatile memory registers (address 00h,
01h, and 04h). This continuous write mode allows
writes without a Stop or Restart condition or repeated
transmissions of the I2C Control Byte. Figure 7-3
shows the sequence for three continuous writes. The
writes do not need to be to the same volatile memory
address. The sequence ends with the master sending
a STOP or RESTART condition.
7.4.4
CONTINUOUS WRITES TO
NONVOLATILE MEMORY
If a continuous write is attempted on Nonvolatile
memory, the missing Stop condition will cause the command to be an error condition (A). A Start bit is required
to reset the command state machine.
7.4.5
THE HIGH VOLTAGE COMMAND
(HVC) SIGNAL
The High Voltage Command (HVC) signal is
multiplexed with Address 0 (A0) and is used to indicate
that the command, or sequence of commands, are in
the High Voltage operational state. High Voltage
commands allow the device’s WiperLock Technology
and write protect features to be enabled and disabled.
The HVC pin has an internal resistor connection to the
MCP45XX/46XXs internal VDD signal.
Refer to Figure 7-2 for the byte write sequence.
7.4.2
SINGLE WRITE TO NONVOLATILE
MEMORY
The sequence to write to a single nonvolatile memory
location is the same as a single write to volatile memory
with the exception that the EEPROM write cycle (twc) is
started after a properly formatted command, including
the Stop bit, is received. After the Stop condition
occurs, the serial interface may immediately be
re-enabled by initiating a Start condition.
During an EEPROM write cycle, access to volatile
memory (addresses 00h, 01h, 04h, and 05h) is allowed
when using the appropriate command sequence.
Commands that address nonvolatile memory are
ignored until the EEPROM write cycle (twc) completes.
This allows the Host Controller to operate on the
Volatile Wiper registers, the TCON register, and to
Read the Status Register. The EEWA bit in the Status
register indicates the status of an EEPROM Write
Cycle.
Once a write command to a Nonvolatile memory
location has been received, no other commands should
be received before the Stop condition occurs.
Figure 7-2 show the waveform for a single write.
DS22107B-page 58
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Write bit
Fixed
Address
S 0
1
Device
Memory
Address
Variable
Address
0 1 A2 A1 A0 0
A
AD AD AD AD
3 2 1 0 0
0 x D8 A D7 D6 D5 D4 D3 D2 D1 D0 A P
WRITE Command
Control Byte
Write bit
Fixed
Address
S 0 1
Variable
Address
0 1 A2 A1 A0 0 A
Device
Memory
Address
Write “Data” bits
Command
AD AD AD AD
3 2 1 0 0
0 x D8 A D7 D6 D5 D4 D3 D2 D1 D0 A
WRITE Command
Control Byte
AD AD AD AD
3 2 1 0 0
Write Data bits
0 x D8 A D7 D6 D5 D4 D3 D2 D1 D0 A
WRITE Command
AD AD AD AD
3 2 1 0 0
Write Data bits
STOP bit
0 x D8 A D7 D6 D5 D4 D3 D2 D1 D0 A P
WRITE Command
FIGURE 7-3:
Write Data bits
I2C Write Sequence.
FIGURE 7-2:
Note:
Write “Data” bits
Command
Write Data bits
Only functions when writing the volatile wiper registers (AD3:AD0 = 00h, 01h, and 04h)
or the TCON register
I2C Continuous Volatile Wiper Write.
2008-2013 Microchip Technology Inc.
DS22107B-page 59
MCP454X/456X/464X/466X
7.5
Read Data
Normal and High Voltage
The Read Command can be issued to both the Volatile
and Nonvolatile memory locations. The format of the
command, see Figure 7-4, includes the Start condition,
I2C Control Byte (with R/W bit set to “0”), A bit,
MCP4XXX Command Byte, A bit, followed by a
Repeated Start bit, I2C Control Byte (with R/W bit set to
“1”), and the MCP4XXX transmitting the requested
Data High Byte, and A bit, the Data Low Byte, the Master generating the A, and Stop condition.
The I2C Control Byte requires the R/W bit equal to a
logic one (R/W = 1) to generate a read sequence. The
memory location read will be the last address
contained in a valid write MCP4XXX Command Byte or
address 00h if no write operations have occurred since
the device was reset (Power-on Reset or Brown-out
Reset).
During a write cycle (Write or High Voltage Write to a
Nonvolatile memory location) the Read command can
only read the Volatile memory locations. By reading the
Status Register (04h), the Host Controller can
determine when the write cycle has completed (via the
state of the EEWA bit).
Read operations initially include the same address byte
sequence as the write sequence (shown in Figure 6-9).
This sequence is followed by another control byte
(including the Start condition and Ackowledge) with the
R/W bit equal to a logic one (R/W = 1) to indicate a
read. The MCP4XXX will then transmit the data contained in the addressed register. This is followed by the
master generating an A bit in preparation for more data,
or an A bit followed by a Stop. The sequence is ended
with the master generating a Stop or Restart condition.
7.5.2
CONTINUOUS READS
Continuous reads allows the device’s memory to be
read quickly. Continuous reads are possible to all memory locations. If a nonvolatile memory write cycle is
occurring, then Read commands may only access the
volatile memory locations.
Figure 7-6 shows the sequence for three continuous
reads.
For continuous reads, instead of transmitting a Stop
or Restart condition after the data transfer, the master
reads the next data byte. The sequence ends with the
master Not Acknowledging and then sending a Stop or
Restart.
7.5.3
THE HIGH VOLTAGE COMMAND
(HVC) SIGNAL
The High Voltage Command (HVC) signal is
multiplexed with Address 0 (A0) and is used to indicate
that the command, or sequence of commands, are in
the High Voltage mode. High Voltage commands allow
the device’s WiperLock Technology and write protect
features to be enabled and disabled.
The HVC pin has an internal resistor connection to the
MCP4XXXs internal VDD signal.
7.5.4
IGNORING AN I2C TRANSMISSION AND
“FALLING OFF” THE BUS
The MCP4XXX expects to receive entire, valid I2C
commands and will assume any command not defined
as a valid command is due to a bus corruption and will
enter a passive high condition on the SDA signal. All
signals will be ignored until the next valid Start
condition and Control Byte are received.
The internal address pointer is maintained. If this
address pointer is for a nonvolatile memory address
and the read control byte addresses the device during
a Nonvolatile Write Cycle (tWC) the device will respond
with an A bit.
7.5.1
SINGLE READ
Figure 7-4 show the waveforms for a single read.
For single reads the master sends a STOP or
RESTART condition after the data byte is sent from the
slave.
7.5.1.1
Random Read
Figure 7-5 shows the sequence for a Random Reads.
Refer to Figure 7-5 for the random byte read
sequence.
DS22107B-page 60
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Read bit
S 0
1
STOP bit
Variable
Address
Fixed
Address
Read Data bits
0 1 A2 A1 A0 1
A 0
0
0
0 D8 A1 D7 D6 D5 D4 D3 D2 D1 D0 A2
0 0 0
P
Read bits
Control Byte
Note 1: Master Device is responsible for A / A signal. If a A signal occurs, the MCP45XX/46XX will
abort this transfer and release the bus.
2: The Master Device will Not Acknowledge, and the MCP45XX/46XX will release the bus so the
Master Device can generate a Stop or Repeated Start condition.
3: The MCP45xx/46xx retains the last “Device Memory Address” that it has received. This is the
MCP45XX/46XX does not “corrupt” the “Device Memory Address” after Repeated Start or
Stop conditions.
4: The Device Memory Address pointer defaults to 00h on POR and BOR conditions.
I2C Read (Last Memory Address Accessed).
FIGURE 7-4:
Write bit
Fixed
Address
S 0 1
0
Repeated Start bit
Device
Memory
Address
Variable
Address
1 A2 A1 A0 0
A
Command
AD AD AD AD
3 2 1 0 1
1
x X A Sr
READ Command
Control Byte
STOP bit
Read bit
0
1 0
1 A2 A1 A0 1
A 0
Control Byte
Read Data bits
0
0
0 0 0
0 D8 A1 D7 D6 D5 D4 D3 D2 D1 D0 A2
P
Read bits
Note 1: Master Device is responsible for A / A signal. If a A signal occurs, the MCP45XX/46XX will
abort this transfer and release the bus.
2: The Master Device will Not Acknowledge, and the MCP45XX/46XX will release the bus so the
Master Device can generate a Stop or Repeated Start condition.
3: The MCP45XX/46XX retains the last “Device Memory Address” that it has received. This is
the MCP45XX/46XX does not “corrupt” the “Device Memory Address” after Repeated Start or
Stop conditions.
FIGURE 7-5:
I2C Random Read.
2008-2013 Microchip Technology Inc.
DS22107B-page 61
MCP454X/456X/464X/466X
Read bit
Fixed
Address
S 0 1
0
Variable
Address
Read Data bits
1 A2 A1 A0 1 A
0
0
0
0 0 0
0 D8 A1 D7 D6 D5 D4 D3 D2 D1 D0 A1
Read bits
Control Byte
Read Data bits
0
0
0
0 0 0
0 D8 A1 D7 D6 D5 D4 D3 D2 D1 D0 A1
STOP bit
Read Data bits
0
0
0
0 0 0
0 D8 A1 D7 D6 D5 D4 D3 D2 D1 D0 A2
P
Note 1: Master Device is responsible for A / A signal. If a A signal occurs, the MCP45XX/46XX will
abort this transfer and release the bus.
2: The Master Device will Not Acknowledge, and the MCP45XX/46XX will release the bus so the
Master Device can generate a Stop or Repeated Start condition.
FIGURE 7-6:
DS22107B-page 62
I2C Continuous Reads.
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
7.6
Increment Wiper
Normal and High Voltage
The advantage of using an Increment Command
instead of a read-modify-write series of commands is
speed and simplicity. The wiper will transition after each
Command Acknowledge when accessing the volatile
wiper registers.
The Increment Command provide a quick and easy
method to modify the potentiometer’s wiper by +1 with
minimal overhead. The Increment Command will only
function on the volatile wiper setting memory locations
00h and 01h. The Increment Command to Nonvolatile
addresses will be ignored and will generate a A.
Note:
TABLE 7-4:
Current Wiper
Setting
Table 7-2 shows the valid addresses for
the Increment Wiper command. Other
addresses are invalid.
When executing an Increment Command, the volatile
wiper setting will be altered from n to n+1 for each
Increment Command received. The value will increment up to 100h max on 8-bit devices and 80h on 7-bit
devices. If multiple Increment Commands are received
after the value has reached 100h (or 80h), the value will
not be incremented further. Table 7-4 shows the
Increment Command versus the current volatile wiper
value.
The Increment Command will most commonly be
performed on the Volatile Wiper locations until a
desired condition is met. The value in the Volatile Wiper
register would need to be read using a Read operation
in order to write the new setting to the corresponding
Nonvolatile wiper memory using a Write operation. The
MCP4XXX is responsible for generating the A bits.
Write bit
S 0 1
0
Variable
Address
1 A2 A1 A0 0
Control Byte
A
Device
Memory
Address
8-bit
Pot
3FFh
081h
3FFh
101h
Reserved
No
(Full-Scale (W = A))
080h
100h
Full-Scale (W = A)
07Fh
041h
0FFh
081
W=N
040h
080h
W = N (Mid-Scale)
03Fh
001h
07Fh
001
W=N
000h
000h
Zero Scale (W = B) Yes
No
Yes
THE HIGH VOLTAGE COMMAND
(HVC) SIGNAL
The High Voltage Command (HVC) signal is multiplexed with Address 0 (A0) and is used to indicate that
the command, or sequence of commands, are in the
High Voltage mode. Signals > VIHH (~8.5V) on the
HVC/A0 pin puts MCP45XX/46XX devices into High
Voltage mode. High Voltage commands allow the
device’s WiperLock Technology and write protect
features to be enabled and disabled.
The command sequence can go from an
increment to any other valid command for
the specified address. Issuing an increment or decrement to a nonvolatile location will cause an error condition (A will be
generated).
Fixed
Address
Increment
Command
Operates?
Wiper (W)
Properties
7-bit
Pot
7.6.1
Refer to Figure 7-7 for the Increment Command
sequence. The sequence is terminated by the Stop
condition. So when executing a continuous command
string, the Increment command can be followed by any
other valid command. This means that writes do not
need to be to the same volatile memory address.
Note:
INCREMENT OPERATION VS.
VOLATILE WIPER VALUE
Note:
There is a required delay after the HVC pin
is driven to the VIHH level to the 1st edge
of the SCL pin.
The HVC pin has an internal resistor connection to the
MCP45XX/46XXs internal VDD signal.
Command
AD AD AD AD
3 2 1 0 0
1 x
AD AD AD AD
X A 4 3 2 1 0
INCR Command (n+1)
1 x
X A P (2)
INCR Command (n+2)
Note 1: Increment Command (INCR) only functions when accessing the volatile wiper reg-
isters (AD3:AD0 = 0h and 1h).
2: This command sequence does not need to terminate (using the Stop bit) and can
change to any other desired command sequence (Increment, Read, or Write).
FIGURE 7-7:
I2C Increment Command Sequence.
2008-2013 Microchip Technology Inc.
DS22107B-page 63
MCP454X/456X/464X/466X
7.7
Decrement Wiper
Normal and High Voltage
The Decrement Command provide a quick and easy
method to modify the potentiometer’s wiper by -1 with
minimal overhead. The Decrement Command will only
function on the volatile wiper setting memory locations
00h and 01h. Decrement Commands to Nonvolatile
addresses will be ignored and will generate an A bit.
Note:
The advantage of using an Decrement Command
instead of a read-modify-write series of commands is
speed and simplicity. The wiper will transition after each
Command Acknowledge when accessing the volatile
wiper registers.
TABLE 7-5:
Current Wiper
Setting
Table 7-2 shows the valid addresses for
the Decrement Wiper command. Other
addresses are invalid.
When executing a Decrement Command, the volatile
wiper setting will be altered from n to n-1 for each
Decrement Command received. The value will
decrement down to 000h min. If multiple Decrement
Commands are received after the value has reached
000h, the value will not be decremented further.
Table 7-5 shows the Increment Command versus the
current volatile wiper value.
The Decrement Command will most commonly be
performed on the Volatile Wiper locations until a
desired condition is met. The value in the Volatile Wiper
register would need to be read using a Read operation
in order to write the new setting to the corresponding
Nonvolatile wiper memory using a Write operation. The
MCP4XXX is responsible for generating the A bits.
Refer to Figure 7-8 for the Decrement Command
sequence. The sequence is terminated by the Stop
condition. So when executing a continuous command
string, the Increment command can be followed by any
other valid command. This means that writes do not
need to be to the same volatile memory address.
Note:
The command sequence can go from an
increment to any other valid command for
the specified address. Issuing an
increment or decrement to a nonvolatile
location will cause an error condition (A
will be generated).
Write bit
Fixed
Address
S 0 1
0
Variable
Address
1 A2 A1 A0 0 A
Control Byte
DECREMENT OPERATION VS.
VOLATILE WIPER VALUE
Wiper (W)
Properties
Decrement
Command
Operates?
7-bit
Pot
8-bit
Pot
3FFh
081h
3FFh
101h
Reserved
No
(Full-Scale (W = A))
080h
100h
Full-Scale (W = A)
07Fh
041h
0FFh
081
W=N
040h
080h
W = N (Mid-Scale)
03Fh
001h
07Fh
001
W=N
000h
000h
Zero Scale (W = B) No
7.7.1
Yes
Yes
THE HIGH VOLTAGE COMMAND
(HVC) SIGNAL
The High Voltage Command (HVC) signal is
multiplexed with Address 0 (A0) and is used to indicate
that the command, or sequence of commands, are in
the High Voltage mode. Signals > VIHH (~8.5V) on the
HVC/A0 pin puts MCP45XX/46XX devices into High
Voltage mode. High Voltage commands allow the
device’s WiperLock Technology and write protect
features to be enabled and disabled.
Note:
There is a required delay after the HVC pin
is driven to the VIHH level to the 1st edge
of the SCL pin.
The HVC pin has an internal resistor connection to the
MCP45XX/46XXs internal VDD signal.
Device
Memory
Address Command
AD AD AD AD
3 2 1 0 1
AD AD AD AD
0 X X A 4 3 2 1 1
DECR Command (n-1)
0 X X A P (2)
DECR Command (n-2)
Note 1: Decrement Command (DECR) only functions when accessing the volatile wiper
registers (AD3:AD0 = 0h and 1h).
2: This command sequence does not need to terminate (using the Stop bit) and can
change to any other desired command sequence (INCR, Read, or Write).
FIGURE 7-8:
DS22107B-page 64
I2C Decrement Command Sequence.
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
7.8
7.8.1
Modify Write Protect or WiperLock
Technology (High Voltage)
Enable and Disable
These commands are special cases of the High Voltage Decrement Wiper and the High Voltage Increment Wiper commands to the nonvolatile memory
locations 02h, 03h, and 0Fh. This command is used to
enable or disable either the software Write Protect,
wiper 0 WiperLock Technology, or wiper 1 WiperLock
Technology. Table 7-6 shows the memory addresses,
the High Voltage command and the result of those
commands on the nonvolatile WP, WL0, 0r WL1 bits.
TABLE 7-6:
Memory
Address
00h
SINGLE MODIFY (ENABLE OR
DISABLE) WRITE PROTECT OR
WIPERLOCK TECHNOLOGY (HIGH
VOLTAGE)
Figure 7-9 (Disable) and Figure 7-10 (Enable) show
the formats for a single Modify Write Protect or WiperLock Technology command.
A Modify Write Protect or WiperLock Technology
Command will only start an EEPROM write cycle (twc)
after a properly formatted Command has been
received and the Stop condition occurs.
During an EEPROM write cycle, only serial commands
to Volatile memory (addresses 00h, 01h, 04h, and 05h)
are accepted. All other serial commands are ignored
until the EEPROM write cycle (twc) completes. This
allows the Host Controller to operate on the Volatile
Wiper registers and the TCON register, and to Read
the Status Register. The EEWA bit in the Status register
indicates the status of an EEPROM Write Cycle.
ADDRESS MAP TO MODIFY WRITE PROTECT AND WIPERLOCK TECHNOLOGY
Commands and Result
High Voltage Decrement Wiper
High Voltage Increment Wiper
Wiper 0 register is incremented
Wiper 0 register is incremented
01h
Wiper 1 register is decremented
Wiper 1 register is incremented
02h
WL0 is enabled
WL0 is disabled
03h
WL1 is enabled
WL1 is disabled
TCON register not changed
TCON register not changed
Reserved
Reserved
WP is enabled
WP is disabled
04h (1)
05h - 0Eh (1)
0Fh
Note 1:
Reserved addresses: Increment or Decrement commands are invalid for these addresses.
Write bit
Fixed
Address
S 0 1
0
Device
Memory
Address
Variable
Address
1 A2 A1 A0 0
A
AD AD AD AD
3 2 1 0 0
I2C Disable Command Sequence.
Write bit
Fixed
Address
S 0
1 0
Device
Memory
Address
Variable
Address
1 A2 A1 A0 0 A
Command (Decrement)
AD AD AD AD
3 2 1 0 1
Control Byte
FIGURE 7-10:
1 X X A P
Disable Command
Control Byte
FIGURE 7-9:
Command (Increment)
0 X X A P
Enable Command
2
I C Enable Command Sequence.
2008-2013 Microchip Technology Inc.
DS22107B-page 65
MCP454X/456X/464X/466X
NOTES:
DS22107B-page 66
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
8.0
APPLICATIONS EXAMPLES
Nonvolatile digital potentiometers have a multitude of
practical uses in modern electronic circuits. The most
popular uses include precision calibration of set point
thresholds, sensor trimming, LCD bias trimming, audio
attenuation, adjustable power supplies, motor control
overcurrent trip setting, adjustable gain amplifiers and
offset trimming. The MCP454X/456X/464X/466X
devices can be used to replace the common mechanical trim pot in applications where the operating and
terminal voltages are within CMOS process limitations
(VDD = 2.7V to 5.5V).
8.1
Using Shutdown
Common A
Input
A
To base
of Transistor
(or Amplifier)
W
B
Input
Software Reset Sequence
Note:
‘1’ ‘1’ ‘1’ ‘1’ ‘1’ ‘1’ ‘1’ ‘1’
Bias
FIGURE 8-1:
Example Application Circuit
using Terminal Disconnects.
2008-2013 Microchip Technology Inc.
S
P
Nine bits of ‘1’
Start bit
Stop bit
Start bit
FIGURE 8-2:
Format.
Software Reset Sequence
The 1st Start bit will cause the device to reset from a
state in which it is expecting to receive data from the
Master Device. In this mode, the device is monitoring
the data bus in Receive mode and can detect the Start
bit forces an internal Reset.
The nine bits of ‘1’ are used to force a Reset of those
devices that could not be reset by the previous Start bit.
This occurs only if the MCP45XX/46XX is driving an A
bit on the I2C bus, or is in output mode (from a Read
command) and is driving a data bit of ‘0’ onto the I2C
bus. In both of these cases, the previous Start bit could
not be generated due to the MCP45XX/46XX holding
the bus low. By sending out nine ‘1’ bits, it is ensured
that the device will see a A bit (the Master Device does
not drive the I2C bus low to acknowledge the data sent
by the MCP45XX/46XX), which also forces the
MCP45XX/46XX to reset.
The 2nd Start bit is sent to address the rare possibility
of an erroneous write. This could occur if the Master
Device was reset while sending a Write command to
the MCP45XX/46XX, AND then as the Master Device
returns to normal operation and issues a Start condition
while the MCP45XX/46XX is issuing an Acknowledge.
In this case, if the 2nd Start bit is not sent (and the Stop
bit was sent) the MCP45XX/46XX could initiate a write
cycle.
Note:
Common B
This technique is documented in AN1028.
At times it may become necessary to perform a Software Reset Sequence to ensure the MCP45XX/46XX
device is in a correct and known I2C Interface state.
This technique only resets the I2C state machine.
This is useful if the MCP45XX/46XX device powers up
in an incorrect state (due to excessive bus noise, ...), or
if the Master Device is reset during communication.
Figure 8-2 shows the communication sequence to software reset the device.
S
Figure 8-1 shows a possible application circuit where
the independent terminals could be used. Disconnecting the wiper allows the transistor input to be taken to
the Bias voltage level (disconnecting A and or B may be
desired to reduce system current). Disconnecting Terminal A modifies the transistor input by the RBW rheostat value to the Common B. Disconnecting Terminal B
modifies the transistor input by the RAW rheostat value
to the Common A. The Common A and Common B
connections could be connected to VDD and VSS.
Balance
8.2
The potential for this erroneous write
ONLY occurs if the Master Device is reset
while sending a Write command to the
MCP45XX/46XX.
The Stop bit terminates the current I2C bus activity. The
MCP45XX/46XX wait to detect the next Start condition.
This sequence does not effect any other I2C devices
which may be on the bus, as they should disregard this
as an invalid command.
DS22107B-page 67
MCP454X/456X/464X/466X
8.3
Figure 8-3 shows two I2C bus configurations. In many
cases, the single I2C bus configuration will be
adequate. For applications that do not want all the
MCP45XX/46XX devices to do General Call support, or
have a conflict with General Call commands, the
multiple I2C bus configuration would be used.
Using the General Call Command
The use of the General Call Address Increment, Decrement, or Write commands is analogous to the “Load”
feature (LDAC pin) on some DACs (such as the
MCP4921). This allows all the devices to “Update” the
output level “at the same time”.
For some applications, the ability to update the wiper
values “at the same time” may be a requirement, since
the delay from writing to one wiper value and then the
next may cause application issues. A possible example
would be a “tuned” circuit that uses several MCP45XX/
46XX in rheostat configuration. As the system condition
changes (temperature, load, ...) these devices need to
be changed (incremented/decremented) to adjust for
the system change. These changes will either be in the
same direction or in opposite directions. With the
Potentiometer device, the customer can either select
the PxB terminals (same direction) or the PxA
terminal(s) (opposite direction).
Single I2C Bus Configuration
Device 1
Host
Controller
Device 4
Device 2
Multiple I2C Bus Configuration
Device 1a
Device 3a
Device na
Host
Bus a
Controller
Figure 8-4 shows that the update of six devices takes
6*TI2CDLY time in “normal” operation, but only
1*TI2CDLY time in “General Call” operation.
Note:
Device n
Device 3
Device 4a
Device 2a
The application system may need to
partition the I2C bus into multiple busses to
ensure that the MCP45XX/46XX General
Call commands do not conflict with the
General Call commands that the other I2C
devices may have defined. Also, if only a
portion of the MCP45XX/46XX devices are
to require this synchronous operation,
then the devices that should not receive
these commands should be on the second
I2C bus.
Device 1b
Device 3b
Device nb
Bus b
Device 4b
Device 2b
Device 1n
Device 3n
Device nn
Bus n
Device 2n
FIGURE 8-3:
Configurations.
Device 4n
Typical Application I2C Bus
Normal Operation
INC
POT01
TI2CDLY
INC
POT02
TI2CDLY
INC
POT03
TI2CDLY
INC
POT04
TI2CDLY
INC
POT05
TI2CDLY
INC
POT06
TI2CDLY
General Call Operation
INC
POTs 01-06
TI2CDLY
INC
POTs 01-06
TI2CDLY
INC
POTs 01-06
TI2CDLY
INC
POTs 01-06
TI2CDLY
INC
POTs 01-06
TI2CDLY
INC
POTs 01-06
TI2CDLY
TI2CDLY = Time from one I2C command completed to completing the next I2C command.
FIGURE 8-4:
Updates.
DS22107B-page 68
Example Comparison of “Normal Operation” vs. “General Call Operation” wiper
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
8.4
Implementing Log Steps with a
Linear Digital Potentiometer
In audio volume control applications, the use of
logarithmic steps is desirable, since the human ear
hears in a logarithmic manner. The use of a linear
potentiometer can approximate a log potentiometer,
but with fewer steps. An 8-bit potentiometer can
achieve fourteen 3 dB log steps plus a 100% (0 dB)
and a mute setting.
Figure 8-5 shows a block diagram of one of the
MCP45x1 resistor networks being used to attenuate an
input signal. In this case, the attenuation will be ground
referenced. Terminal B can be connected to a common
mode voltage, but the voltages on the A, B and Wiper
terminals must not exceed the MCP45x1’s VDD/VSS
voltage limits.
MCP45X1
P0A
P0W
EQUATION 8-1:
dB CALCULATIONS
(VOLTAGE)
L = 20 * log10 (VOUT / VIN)
dB
-3
-2
-1
EQUATION 8-2:
VOUT / VIN Ratio
0.70795
0.79433
0.89125
dB CALCULATIONS
(RESISTANCE) - CASE 1
Terminal B connected to Ground (see Figure 8-5)
L = 20 * log10 (RBW / RAB)
EQUATION 8-3:
dB CALCULATIONS
(RESISTANCE) - CASE 2
Terminal B through RB2GND to Ground
L = 20 * log10 ( (RBW + RB2GND) / (RAB + RB2GND) )
P0B
FIGURE 8-5:
Signal Attenuation Block
Diagram - Ground Referenced.
Equation 8-1 shows the equation to calculate voltage
dB gain ratios for the digital potentiometer, while
Equation 8-2 shows the equation to calculate
resistance dB gain ratios. These two equations assume
that the B terminal is connected to ground.
If terminal B is not directly resistively connected to
ground, then this terminal B to ground resistance
(RB2GND) must be included into the calculation.
Equation 8-3 shows this equation.
2008-2013 Microchip Technology Inc.
Table 8-1 shows the codes that can be used for 8-bit
digital potentiometers to implement the log attenuation.
The table shows the wiper codes for -3 dB, -2 dB, and
-1 dB attenuation steps. This table also shows the
calculated attenuation based on the wiper code’s linear
step. Calculated attenuation values less than the
desired attenuation are shown with red text. At lower
wiper code values, the attenuation may skip a step, if
this occurs the next attenuation value is colored
magenta to highlight that a skip occurred. For example,
in the -3 dB column the -48 dB value is highlighted
since the -45 dB step could not be implemented (there
are no wiper codes between 2 and 1).
DS22107B-page 69
MCP454X/456X/464X/466X
TABLE 8-1:
LINEAR TO LOG ATTENUATION FOR 8-BIT DIGITAL POTENTIOMETERS
-3 dB Steps
# of
Steps
-2 dB Steps
-1 dB Steps
Calculated
Calculated
Calculated
Desired
Wiper
Desired
Wiper
Desired
Wiper
Attenuation
Attenuation
Attenuation
Attenuation Code
Attenuation Code
Attenuation Code
(1)
(1)
(1)
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
Note 1:
0 dB
-3 dB
-6 dB
-9dB
-12 dB
-15 dB
-18 dB
-21 dB
-24 dB
-27 dB
-30 dB
-33 dB
-36 dB
-39 dB
-42 dB
-48 dB
Mute
0 dB
256
0 dB
-1 dB
228 -1.006 dB
-2 dB
203 -2.015 dB
-3 dB
181 -3.011 dB
-4 dB
162 -3.975 dB
-5 dB
144 -4.998 dB
-6 dB
128 -6.021 dB
-7 dB
114 -7.027 dB
-8 dB
102 -7.993 dB
-9 dB
91 -8.984 dB
-10 dB
81 -9.995 dB
-11 dB
72 -11.018 dB
-12 dB
64 -12.041 dB
-13 dB
57 -13.047 dB
-14 dB
51 -14.013 dB
-15 dB
46 - 14.910 dB
-16 dB
41 -15.909 dB
-17 dB
36 -17.039 dB
-18 dB
32 -18.062 dB
-19 dB
29 -18.917 dB
-20 dB
26 -19.865 dB
-21 dB
23 - 20.930 dB
-22 dB
20 -22.144 dB
-23 dB
18 -23.059 dB
-24 dB
16 -24.082 dB
-25 dB
14 -25.242 dB
-26 dB
13 -25.886 dB
-27dB
11 -27.337 dB
-28 dB
10 -28.165 dB
-29 dB
9 -29.080 dB
-30 dB
8 -30.103 dB
-31 dB
7 -31.263 dB
-33 dB
6 -32.602 dB
-34 dB
5 -34.185 dB
-36 dB
4 -36.124 dB
-39 dB
3 -38.622 dB
-42 dB
2 -42.144 dB
-48 dB
1 -48.165 dB
Mute
0
Mute
Attenuation values do not include errors from Digital Potentiometer errors, such as Full Scale Error or Zero
Scale Error.
DS22107B-page 70
256
181
128
91
64
46
32
23
16
11
8
6
4
3
2
1
0
0 dB
-3.011 dB
-6.021 dB
-8.984 dB
-12.041 dB
-14.910 dB
-18.062 dB
-20.930 dB
-24.082 dB
-27.337 dB
-30.103 dB
-32.602 dB
-36.124 dB
-38.622 dB
-42.144 dB
-48.165 dB
Mute
0 dB
-2 dB
-4 dB
-6 dB
-8 dB
-10 dB
-12 dB
-14 dB
-16 dB
-18 dB
-20 dB
-22 dB
-24 dB
-26 dB
-28 dB
-30 dB
-32 dB
-34 dB
-36 dB
-38 dB
-42 dB
-48 dB
Mute
256
203
162
128
102
81
64
51
41
32
26
20
16
13
10
8
6
5
4
3
2
1
0
0 dB
-2.015 dB
-3.975 dB
-6.021 dB
-7.993 dB
-9.995 dB
-12.041 dB
-14.013 dB
-15.909 dB
-18.062 dB
-19.865 dB
-22.144 dB
-24.082 dB
-25.886 dB
-28.165 dB
-30.103 dB
-32.602 dB
-34.185 dB
-36.124 dB
-38.622 dB
-42.144 dB
-48.165 dB
Mute
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
8.5
8.5.2
Design Considerations
In the design of a system with the MCP4XXX devices,
the following considerations should be taken into
account:
LAYOUT CONSIDERATIONS
Several layout considerations may be applicable to
your application. These may include:
• Power Supply Considerations
• Layout Considerations
• Noise
• Footprint Compatibility
• PCB Area Requirements
8.5.1
8.5.2.1
POWER SUPPLY
CONSIDERATIONS
The typical application will require a bypass capacitor
in order to filter high-frequency noise, which can be
induced onto the power supply's traces. The bypass
capacitor helps to minimize the effect of these noise
sources on signal integrity. Figure 8-6 illustrates an
appropriate bypass strategy.
In this example, the recommended bypass capacitor
value is 0.1 µF. This capacitor should be placed as
close (within 4 mm) to the device power pin (VDD) as
possible.
The power source supplying these devices should be
as clean as possible. If the application circuit has
separate digital and analog power supplies, VDD and
VSS should reside on the analog plane.
VDD
Noise
Inductively-coupled AC transients and digital switching
noise can degrade the input and output signal integrity,
potentially masking the MCP4XXX’s performance.
Careful board layout minimizes these effects and
increases the Signal-to-Noise Ratio (SNR). Multi-layer
boards utilizing a low-inductance ground plane,
isolated inputs, isolated outputs and proper decoupling
are critical to achieving the performance that the silicon
is capable of providing. Particularly harsh
environments may require shielding of critical signals.
If low noise is desired, breadboards and wire-wrapped
boards are not recommended.
8.5.2.2
Footprint Compatibility
The specification of the MCP4XXX pinouts was done to
allow systems to be designed to easily support the use
of either the dual (MCP46XX) or quad (MCP44XX)
device.
Figure 8-7 shows how the dual pinout devices fit on the
quad device footprint. For the Rheostat devices, the
dual device is in the MSOP package, so the footprints
would need to be offset from each other.
0.1 µF
VDD
MCP44X1 Quad Potentiometers
W
B
SCL
P3A
P3W
P3B
HVC/A0
SCL
SDA
VSS
P1B
P1W
P1A
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
12
12
11
P2A
P2W
P2B
VDD
A1
RESET
WP
P0B
P0W
P0A
MCP42X1 Pinout (1)
TSSOP
MCP44X2 Quad Rheostat
SDA
VSS
FIGURE 8-6:
Connections.
PIC® Microcontroller
A
MCP454X/456X/
464X/466X
0.1 µF
VSS
Typical Microcontroller
P3W
P3B
HVC/A0
SCL
SDA
VSS
P1B
1
2
3
4
5
6
7
14
13
12
11
10
9
8
P2W
P2B
VDD
A1
P0B
P0W
P1W
MCP42X2 Pinout
TSSOP
Note 1: Pin 15 (RESET) is the Address A2 (A2)
pin on the MCP46x1 device.
FIGURE 8-7:
Quad Pinout (TSSOP
Package) vs. Dual Pinout.
2008-2013 Microchip Technology Inc.
DS22107B-page 71
MCP454X/456X/464X/466X
Figure 8-8 shows possible layout implementations for
an application to support the quad and dual options on
the same PCB.
Potentiometers Devices
MCP44X1
MCP46X1
8.5.2.3
PCB Area Requirements
In some applications, PCB area is a criteria for device
selection. Table 8-2 shows the package dimensions
and area for the different package options. The table
also shows the relative area factor compared to the
smallest area. For space critical applications, the QFN
package would be the suggested package.
PACKAGE FOOTPRINT (1)
TABLE 8-2:
MS
3.00
4.90
14.70
1.63
DFN (3x3)
MF
3.00
3.00
9.00
1
MSOP
UN
3.00
4.90
14.70
1.63
DFN (3x3)
MF
3.00
3.00
9.00
1
ST
5.10
6.40
32.64
3.62
ML
4.00
4.00
16.00
1.78
ST
6.60
6.40
42.24
3.63
ML
4.00
4.00
16.00
1.78
Code
MSOP
Pins
Relative Area
Package Footprint
Area (mm2)
Package
Type
Dimensions
(mm)
X
Y
Rheostat Devices
MCP46X2
8
MCP44X2
10
14 TSSOP
QFN (4x4)
FIGURE 8-8:
Dual Devices.
Layout to Support Quad and
TSSOP(2)
16
QFN (4x4)
(2)
Note 1: Does not include recommended land
pattern dimensions.
2: These packages are for the Quad output
devices (MCP44x1).
8.5.3
RESISTOR TEMPCO
Characterization curves of the resistor temperature
coefficient (Tempco) are shown in Figure 2-10,
Figure 2-21, Figure 2-32, and Figure 2-43.
These curves show that the resistor network is
designed to correct for the change in resistance as
temperature increases. This technique reduces the
end-to-end change in RAB resistance.
8.5.4
HIGH VOLTAGE TOLERANT PINS
High Voltage support (VIHH) on the Serial Interface pins
supports user configuration of the Nonvolatile
EEPROM, Write Protect, and WiperLock feature.
Note:
DS22107B-page 72
In many applications, the High Voltage will
only be present at the manufacturing
stage so as to “lock” the Nonvolatile wiper
value (after calibration) and the contents
of the EEPROM. This ensures that since
High Voltage is not present under normal
operating conditions, that these values
can not be modified.
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
9.0
DEVICE OPTIONS
Additional, custom devices are available. These
devices have weak pull-up resistors on the SDA and
SCL pins. This is useful for applications where the
wiper value is programmed during manufacture and not
modified by the system during normal operation.
Please contact your local sales office for current information and minimum volume requirements.
9.1
Custom Options
The custom device will have a “P” (for Pull-up) after the
resistance version in the Product Identification System.
These devices will not be available through Microchip’s
online Microchip Direct nor Microchip’s Sample
systems.
Example part number:
MCP4641-103PE/ST
2008-2013 Microchip Technology Inc.
DS22107B-page 73
MCP454X/456X/464X/466X
NOTES:
DS22107B-page 74
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
10.0
DEVELOPMENT SUPPORT
10.1
Development Tools
10.2
Technical Documentation
Several additional technical documents are available to
assist you in your design and development. These
technical documents include Application Notes,
Technical Briefs, and Design Guides. Table 10-2
shows some of these documents.
Several development tools are available to assist in
your design and evaluation of the MCP45XX/46XX
devices. The currently available tools are shown in
Table 10-1.
These boards may be purchased directly from the
Microchip web site at www.microchip.com.
TABLE 10-1:
DEVELOPMENT TOOLS
Board Name
Part #
Supported Devices
MCP46XXDM-PTPLS
MCP46XX
MCP46XX Evaluation Board
MCP46XXEV
MCP4631/41/51/61
MCP43XX Evaluation Board
MCP43XXEV
MCP4331/41/51/61
MCP4XXXDM-DB
MCP42XXX, MCP42XX, MCP46XX,
MCP4021, and MCP4011
8-pin SOIC/MSOP/TSSOP/DIP Evaluation Board
SOIC8EV
Any 8-pin device in DIP, SOIC,
MSOP, or TSSOP package
14-pin SOIC/MSOP/DIP Evaluation Board
SOIC14EV
Any 14-pin device in DIP, SOIC, or
MSOP package
MCP46XX PICTail Plus Daughter Board
(2)
MCP4XXX Digital Potentiometer Daughter Board
(1)
Note 1: Requires the use of a PICDEM Demo Board (see User’s Guide for details)
2: Requires the use of the PIC24 Explorer 16 Demo Board (see User’s Guide for details)
3: The desired MCP46XX device (in MSOP package) must be soldered onto the extra board.
TABLE 10-2:
TECHNICAL DOCUMENTATION
Application
Note Number
Title
Literature #
TB3073
Implementing a 10-bit Digital Potentiometer using a Quad 8-bit Digital Potentiometer
Technical Brief
DS93073
AN1316
Using Digital Potentiometers for Programmable Amplifier Gain
DS01316
AN1080
Understanding Digital Potentiometers Resistor Variations
DS01080
AN737
Using Digital Potentiometers to Design Low Pass Adjustable Filters
DS00737
AN692
Using a Digital Potentiometer to Optimize a Precision Single-Supply Photo Detect
DS00692
AN691
Optimizing the Digital Potentiometer in Precision Circuits
DS00691
AN219
Comparing Digital Potentiometers to Mechanical Potentiometers
DS00219
—
Digital Potentiometer Design Guide
DS22017
—
Signal Chain Design Guide
DS21825
2008-2013 Microchip Technology Inc.
DS22107B-page 75
MCP454X/456X/464X/466X
NOTES:
DS22107B-page 76
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
11.0
PACKAGING INFORMATION
11.1
Package Marking Information
8-Lead DFN (3x3)
XXXX
XYWW
NNN
Example:
Part Number
Code
Part Number
Code
MCP4541-502E/MF
DACJ
MCP4542-502E/MF
DACP
MCP4541-103E/MF
DACK
MCP4542-103E/MF
DACQ
MCP4541-104E/MF
DACM
MCP4542-104E/MF
DACS
MCP4541-503E/MF
DACL
MCP4542-503E/MF
DACR
MCP4561-502E/MF
DADB
MCP4562-502E/MF
DADF
MCP4561-103E/MF
DADC
MCP4562-103E/MF
DADG
MCP4561-104E/MF
DADE
MCP4562-104E/MF
DADJ
MCP4561-503E/MF
DADD
MCP4562-503E/MF
DADH
Part Number
Code
Part Number
Code
MCP4541-103E/MS
454113
MCP4542-103E/MS
454213
MCP4541-104E/MS
454114
MCP4542-104E/MS
454214
MCP4541-502E/MS
454152
MCP4542-502E/MS
454252
MCP4541-503E/MS
454153
MCP4542-503E/MS
454253
MCP4561-103E/MS
456113
MCP4562-103E/MS
456213
8-Lead MSOP
XXXXXX
YWWNNN
MCP4561-104E/MS
456114
MCP4562-104E/MS
456214
MCP4561-502E/MS
456152
MCP4562-502E/MS
456252
MCP4561-503E/MS
456153
MCP4562-503E/MS
456253
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DACJ
E841
256
Example
454113
841256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2008-2013 Microchip Technology Inc.
DS22107B-page 77
MCP454X/456X/464X/466X
Package Marking Information (Continued)
10-Lead DFN (3x3)
XXXX
YYWW
NNN
Example:
Part Number
Code
Part Number
Code
MCP4642-502E/MF
AAFA
MCP4662-502E/MF
AAQA
MCP4642-103E/MF
AAGA
MCP4662-103E/MF
AARA
MCP4642-104E/MF
AAJA
MCP4662-104E/MF
AATA
MCP4642-503E/MF
AAHA
MCP4662-503E/MF
AASA
AAFA
0841
256
10-Lead MSOP
XXXXXX
YWWNNN
Example
Part Number
Code
Part Number
Code
MCP4642-502E/UN
464252
MCP4662-502E/UN
466252
MCP4642-103E/UN
464213
MCP4662-103E/UN
466213
MCP4642-104E/UN
464214
MCP4662-104E/UN
466214
MCP4642-503E/UN
464253
MCP4662-503E/UN
466253
14-Lead TSSOP (MCP4641, MCP4661)
841256
Example
XXXXXXXX
4641502E
YYWW
0841
NNN
256
16-Lead QFN (MCP4641, MCP4661)
XXXXX
XXXXXX
XXXXXX
YWWNNN
DS22107B-page 78
463252
Example
4641
502
e3
E/ML^^
841256
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2008-2013 Microchip Technology Inc.
DS22107B-page 79
MCP454X/456X/464X/466X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22107B-page 80
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
%
!"#$
!"#$%!&!!
'#(
$
)**%%% *#
2008-2013 Microchip Technology Inc.
DS22107B-page 81
MCP454X/456X/464X/466X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22107B-page 82
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2008-2013 Microchip Technology Inc.
DS22107B-page 83
MCP454X/456X/464X/466X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22107B-page 84
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2008-2013 Microchip Technology Inc.
DS22107B-page 85
MCP454X/456X/464X/466X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22107B-page 86
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2008-2013 Microchip Technology Inc.
DS22107B-page 87
MCP454X/456X/464X/466X
UN
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22107B-page 88
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
UN
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2008-2013 Microchip Technology Inc.
DS22107B-page 89
MCP454X/456X/464X/466X
10-Lead Plastic Micro Small Outline Package (UN) [MSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22107B-page 90
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2008-2013 Microchip Technology Inc.
DS22107B-page 91
MCP454X/456X/464X/466X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22107B-page 92
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2008-2013 Microchip Technology Inc.
DS22107B-page 93
MCP454X/456X/464X/466X
&'
(
))
%
!"#($
!"#$%!&!!
'#(
$
)**%%% *#
D2
D
EXPOSED
PAD
e
E
E2
2
2
1
b
1
TOP VIEW
K
N
N
NOTE 1
L
BOTTOM VIEW
A3
A
A1
A!
!
G !
H" 8
('!
GG<<
H
H
HJ
K
5L
'
J6N
5
$
((
5
>
@
#!!
;
J6O$
<
<7
!$'$O$
<
J6G
<7
!$'$G
L>?@
<
?@
>
L>
?@
>
L>
@
O$
8
>
;
;>
@
G
G
;
>
@
<7
!$'$
Q
R
%
5 '56!"$7(" 6&8" "!8
$%$
'#!!%!"$
; !
$
<=5>
?@) ?! !
76"!
%%
"
!
<) ( !
&"!"%
"
&(
(
"
!!
R
% @5?
DS22107B-page 94
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2008-2013 Microchip Technology Inc.
DS22107B-page 95
MCP454X/456X/464X/466X
NOTES:
DS22107B-page 96
2008-2013 Microchip Technology Inc.
MCP454X/456X/464X/466X
APPENDIX A:
REVISION HISTORY
Revision B (February 2013)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
Updated the DFN package pinout on page 1.
Updated the Absolute Maximum Ratings† page
format and added Total Power Dissipation
values for each package type.
Updated the typical thermal package resistance
values for the 8L-DFN (3x3) and 8L-SOIC packages in the Temperature characteristics table.
Added new Figure 2-59 to Section 2.1 “Test
Circuits”.
Corrected values in Figure 5-1.
Added description of wiper value on POR/BOR
(Section 5.2 “Wiper”).
Removed Section 8.1.
Added Section 8.4 “Implementing Log Steps
with a Linear Digital Potentiometer”.
Added Section 8.5.2.2 “Footprint Compatibility”.
Added Section 8.5.2.3 “PCB Area Requirements”.
Updated Table 8-2.
Enhanced the listing of development tools and
technical documentation in Section 10.0
“Development support”.
Updated Table 10-1 and Table 10-2.
Updated Section 11.0 “Packaging Information” with package available landing pattern
diagrams.
Revision A (November 2008)
• Original Release of this Document.
2008-2012 Microchip Technology Inc.
DS22107B-page 97
MCP454X/456X/464X/466X
NOTES:
DS22107B-page 98
2008-2012 Microchip Technology Inc.
MCP454X/456X/464X/466X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
XXX
X
/XX
Resistance Temperature Package
Version
Range
Device:
MCP4541:
MCP4541T:
MCP4542:
MCP4542T:
MCP4561:
MCP4561T:
MCP4562:
MCP4562T:
MCP4641:
MCP4641T:
MCP4642:
MCP4642T:
MCP4661:
MCP4661T:
MCP4662:
MCP4662T:
Resistance Version:
Single Nonvolatile 7-bit Potentiometer
Single Nonvolatile 7-bit Potentiometer
(Tape and Reel)
Single Nonvolatile 7-bit Rheostat
Single Nonvolatile 7-bit Rheostat
(Tape and Reel)
Single Nonvolatile 8-bit Potentiometer
Single Nonvolatile 8-bit Potentiometer
(Tape and Reel)
Single Nonvolatile8-bit Rheostat
Single Nonvolatile 8-bit Rheostat
(Tape and Reel)
Dual Nonvolatile 7-bit Potentiometer
Dual Nonvolatile 7-bit Potentiometer
(Tape and Reel)
Dual Nonvolatile 7-bit Rheostat
Dual Nonvolatile 7-bit Rheostat
(Tape and Reel)
Dual Nonvolatile 8-bit Potentiometer
Dual Nonvolatile 8-bit Potentiometer
(Tape and Reel)
Dual Nonvolatile8-bit Rheostat
Dual Nonvolatile 8-bit Rheostat
(Tape and Reel)
502 = 5 k
103 = 10 k
503 = 50 k
104 = 100 k
Temperature Range:
E
= -40°C to +125°C
Package:
MF
ML
MS
ST
UN
=
=
=
=
=
Plastic Dual Flat No-lead (3x3 DFN), 8/10-lead
Plastic Quad Flat No-lead (QFN), 16-lead
Plastic Micro Small Outline (MSOP), 8-lead
Plastic Thin Shrink Small Outline (TSSOP), 14-lead
Plastic Micro Small Outline (MSOP), 10-lead
2008-2013 Microchip Technology Inc.
Examples:
a)
b)
c)
d)
e)
MCP4541-502E/XX:
MCP4541-103E/XX:
MCP4541-503E/XX:
MCP4541-104E/XX:
MCP4541T-104E/XX:
5 k 8LD Device
10 k, 8-LD Device
50 k, 8LD Device
100 k, 8LD Device
T/R, 100 k, 8LD Device
a)
b)
c)
d)
e)
MCP4542-502E/XX:
MCP4542-103E/XX:
MCP4542-503E/XX:
MCP4542-104E/XX:
MCP4542T-104E/XX:
5 k 8LD Device
10 k, 8-LD Device
50 k, 8LD Device
100 k, 8LD Device
T/R, 100 k, 8LD Device
a)
b)
c)
d)
e)
MCP4561-502E/XX:
MCP4561-103E/XX:
MCP4561-503E/XX:
MCP4561-104E/XX:
MCP4561T-104E/XX:
5 k 8LD Device
10 k, 8-LD Device
50 k, 8LD Device
100 k, 8LD Device
T/R, 100 k, 8LD Device
a)
b)
c)
d)
e)
MCP4562-502E/XX:
MCP4562-103E/XX:
MCP4562-503E/XX:
MCP4562-104E/XX:
MCP4562T-104E/XX:
5 k 8LD Device
10 k, 8-LD Device
50 k, 8LD Device
100 k, 8LD Device
T/R, 100 k, 8LD Device
a)
b)
c)
d)
e)
MCP4641-502E/XX:
MCP4641-103E/XX:
MCP4641-503E/XX:
MCP4641-104E/XX:
MCP4641T-104E/XX:
5 k 8LD Device
10 k, 8-LD Device
50 k, 8LD Device
100 k, 8LD Device
T/R, 100 k, 8LD Device
a)
b)
c)
d)
e)
MCP4642-502E/XX:
MCP4642-103E/XX:
MCP4642-503E/XX:
MCP4642-104E/XX:
MCP4642T-104E/XX:
5 k 8LD Device
10 k, 8-LD Device
50 k, 8LD Device
100 k, 8LD Device
T/R, 100 k, 8LD Device
a)
b)
c)
d)
e)
MCP4661-502E/XX:
MCP4661-103E/XX:
MCP4661-503E/XX:
MCP4661-104E/XX:
MCP4661T-104E/XX:
5 k 8LD Device
10 k, 8-LD Device
50 k, 8LD Device
100 k, 8LD Device
T/R, 100 k, 8LD Device
a)
b)
c)
d)
e)
MCP4662-502E/XX:
MCP4662-103E/XX:
MCP4662-503E/XX:
MCP4662-104E/XX:
MCP4662T-104E/XX:
5 k 8LD Device
10 k, 8-LD Device
50 k, 8LD Device
100 k, 8LD Device
T/R, 100 k, 8LD Device
XX
=
=
=
=
=
MF for 8/10-lead 3x3 DFN
ML for 16-lead QFN
MS for 8-lead MSOP
ST for 14-lead TSSOP
UN for 10-lead MSOP
DS22107B-page 99
MCP454X/456X/464X/466X
NOTES:
DS22107B-page 100
2008-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2008-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-032-0
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2008-2013 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS22107B-page 101
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS22107B-page 102
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
11/29/12
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