FDC6330L Integrated Load Switch General Description Features This device is particularly suited for compact power management in portable electronic equipment where 3V to 20V input and 2.3A output current capability are needed. This load switch integrates a small N-Channel power MOSFET (Q1) which drives a large P-Channel power MOSFET (Q2) in one tiny SuperSOTTM-6 package. •V DROP V DROP = 0.2V @ V = 12V, I =2.5 A. R = 0.08 Ω IN L (ON) = 0.2V @ V = 5V,I = 1.6 A. R = 0.125 Ω. IN L (ON) • Control MOSFET (Q1) includes Zener protection for ESD ruggedness (>6kV Human Body Model). • High performance PowerTrenchTM technology for extremely low on-resistance. • SuperSOTTM-6 package design using copper lead frame for superior thermal and electrical capabilities. Applications • Power management • Load actuation 3 4 Vin,R1 Vout,C1 EQUIVALENT CIRCUIT Q2 2 5 ON/OFF Vout,C1 1 6 R1,C1 VDR OP + - IN Q1 R2 OUT ON/OFF TM SuperSOT -6 See Application Circuit Absolute Maximum Ratings Symbol o T A =25 C unless otherwise noted Parameter V IN Input Voltage Range V ON/OFF On/Off Voltage Range ID Load Current PD Maximum Power Dissipation T J , T stg Operating and Storage Temperature Range ESD Electrostatic Discharge Rating MIL-STD-883D Human-Body-Model (100pf/1500 Ohm) (Note 1) - Continuous Ratings Units 3 - 20 V 1.5 - 8 V (Note 2) 2.3 A (Note 1) 0.7 W -55 to +150 °C kV - Pulsed 10 6 Thermal Characteristics R θ JA Thermal Resistance, Junction-to-Ambient (Note 2) 180 R θ JC Thermal Resistance, Junction-to-Case (Note 2) 60 ° C/W ° C/W Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity .330 ( . Denotes pin 1) FDC6330L 7’’ 8mm 3000 units 1999 Fairchild Semiconductor Corporation FDC6330L Rev. C FDC6330L February 1999 Symbol o TA=25 C unless otherwise noted Parameter Test Conditions Min Typ Max Units 1 µA OFF Characteristics IFL ON Characteristics VDROP VIN = 20 V, VON/OFF = 250 µA Leakage Current (Note 3) Conduction Voltage R(ON) Q2 - Static On-Resistance IL Load Current VIN = 12 V, VON/OFF = 3.3 V, IL = 2.5 A 0.2 V VIN = 5 V, VON/OFF = 3.3 V, IL = 1.6 A 0.2 V 0.08 0.125 Ω VGS = -12 V, ID = -2.3 A VGS = -5 V, ID = -1.9 A VDROP = 0.2 V, VIN = 12 V, VON/OFF = 3.3 V 2.5 VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V 1.6 0.054 0.081 A Notes: 1. Range of Vin can be up to 30V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed 20V. 2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθJA is determined by the user’s board design. 3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%. FDC6330L Load Switch Application External Component Recommendation: For applications where Co ≤ 1µF. For slew rate control, select R2 in the range of 1k - 4.7kΩ . For additional in-rush current control,C1 ≤ 1000pF can be added. Select R1 so that the R1/R2 ratio ranges from 10 - 100. R1 is required to turn Q2 off. FDC6330L Rev. C FDC6330L Electrical Characteristics FDC6330L Typical Characteristics (continued) 0.5 0.4 TJ = 125°C 0.4 TJ = 125°C 0.2 V DROP (V) VDROP (V) 0.3 T = 25 °C J T = 25 °C J 0.3 0.2 0.1 0.1 V IN = 12 V VON/OF F = 1. 5 - 8 V PW =300 us, D≤ 2% 0 V IN = 5V VON/OF F = 1. 5 - 8 V PW =300 us, D≤ 2% 0 0 1 2 3 4 5 0 1 2 IL , (A) 3 4 5 IL , (A) Figure 1. Conduction Voltage Drop Variation with Load Current. Figure 2. Conduction Voltage Drop Variation with Load Current. 0.25 IL = 1A VON/OFF = 1.5 - 8 V PW =3 00 us, D≤ 2% 0.15 T = 1 25°C J 0.1 0.05 2 4 6 8 10 12 VI N , (V) Figure 3. On-Resistance Variation with Input Voltage. r(t), NORMALIZED EFFECTIVE 0 T = 25 °C J TRANSIENT THERMAL RESISTANCE R(ON) ,(Ohm) 0.2 1 0.5 D = 0.5 0.2 0.2 0.1 R θJA (t) = r(t) * R θJA R θJA =180°C/W 0.1 P(pk) 0.05 t1 0.05 0.02 0.01 0.02 0.01 0.0001 Single Pulse 0.001 t2 TJ - T A = P * R JA (t) θ Duty Cycle, D = t 1 / t 2 0.01 0.1 1 10 100 300 t 1 , TIME (sec) Figure 4.Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 2. Transient themal response will change depending on the circuit board design. FDC6330L Rev. C SuperSOTTM-6 Tape and Reel Data and Package Dimensions SSOT-6 Packaging Configuration: Figure 1.0 Customize Label Antistatic Cover Tape Conductive Embossed Carrier Tape F63TNR Label 631 Packaging Option Packaging type Standard (no flow code) TNR Qty per Reel/Tube/Bag 3,000 Reel Size 631 631 D87Z SSOT-6 Unit Orientation TNR 10,000 7” Dia 13” 184x187x47 343x343x64 Max qty per Box 9,000 20,000 Weight per unit (gm) 0.0158 0.0158 Weight per Reel (kg) 0.1440 0.4700 Box Dimension (mm) 631 Pin 1 SSOT-6 Packaging Information 343mm x 342mm x 64mm Intermediate box for D87Z Option F63TNR Label Note/Comments F63TNR Label F63TNR Label sample 184mm x 184mm x 47mm Pizza Box for Standard Option F63TNR Label LOT: CBVK741B019 QTY: 3000 FSID: FDC633N SPEC: D/C1: D9842 D/C2: Trailer SSOT-6 Tape Leader Configuration: Figure 2.0 QTY1: QTY2: SPEC REV: CPN: QARV: (F63TNR)2 Carrier Tape Cover Tape 1998 Fairchild Semiconductor Corporation Trailer Tape 160mm minimum Components Leader Tape 390mm minimum December 1998, Rev. B SuperSOTTM-6 Tape and Reel Data and Package Dimensions, continued SSOT-6 Embossed Carrier Tape Configuration: Figure 3.0 P0 D0 T E1 F K0 Wc W E2 B0 Tc A0 D1 P1 User Direction of Feed Dimensions are in millimeter Pkg type A0 B0 SSOT-6 (8mm) 3.23 +/-0.10 3.18 +/-0.10 W 8.0 +/-0.3 D0 D1 E1 E2 1.55 +/-0.05 1.00 +/-0.125 1.75 +/-0.10 F 6.25 min 3.50 +/-0.05 P1 P0 4.0 +/-0.1 4.0 +/-0.1 K0 T 1.37 +/-0.10 0.255 +/-0.150 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). Wc 0.06 +/-0.02 0.5mm maximum 20 deg maximum Typical component cavity center line B0 5.2 +/-0.3 Tc 0.5mm maximum 20 deg maximum component rotation Typical component center line Sketch A (Side or Front Sectional View) A0 Component Rotation Sketch C (Top View) Component lateral movement Sketch B (Top View) SSOT-6 Reel Configuration: Figure 4.0 Component Rotation W1 Measured at Hub Dim A Max Dim A max See detail AA Dim N 7” Diameter Option B Min Dim C See detail AA W3 13” Diameter Option Dim D min W2 max Measured at Hub DETAIL AA Dimensions are in inches and millimeters Tape Size Reel Option Dim A Dim B 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 2.165 55 0.331 +0.059/-0.000 8.4 +1.5/0 0.567 14.4 0.311 – 0.429 7.9 – 10.9 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 4.00 100 0.331 +0.059/-0.000 8.4 +1.5/0 0.567 14.4 0.311 – 0.429 7.9 – 10.9 8mm 7” Dia 7.00 177.8 8mm 13” Dia 13.00 330 Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL) December 1998, Rev. B SuperSOTTM-6 Tape and Reel Data and Package Dimensions, continued SuperSOT-6 (FS PKG Code 31, 33) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0158 1998 Fairchild Semiconductor Corporation September 1998, Rev. A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ CoolFET™ CROSSVOLT™ E2CMOSTM FACT™ FACT Quiet Series™ FAST® FASTr™ GTO™ HiSeC™ ISOPLANAR™ MICROWIRE™ POP™ PowerTrench™ QS™ Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 TinyLogic™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.