FDR8521L P-Channel MOSFET With Gate Driver For Load Switch Application General Description Features This device is designed for configuration as a load switch and is particularly suited for power management in portable battery powered electronic equipment. Designed to operate from 3V to 20V input and supply up to 2.9A, the device features a small N-Channel MOSFET (Q1) together with a large P-Channel Power MOSFET (Q2) in a single SO-8 package. •V Applications • DROP V DROP •V DROP V DROP = 0.07 V @ V = 12 V, I = 1 A.R(ON) = 0.07 Ω IN L = 0.115 V @ V = 5 V, I = 1 A.R(ON) = 0.115 Ω. IN L = 0.2 V @ V = 12 V, I =2.9 A.R(ON) = 0.07 Ω IN L = 0.2 V @ V = 5 V,I = 1.8 A.R(ON) = 0.115 Ω. IN L • Control MOSFET (Q1) includes Zener protection for ESD ruggedness (>6kV Human Body Model). High density cell design for extremely low on-resistance. • Power management • Load switch VOU T,C1,CO 5 VOU T,C1,CO 6 R2 7 R2 8 4 Q2 VIN ,R1,C i EQUIVALENT CIRCUIT Q1 3 R1,R 2,C1 2 C1,CO 1 VO N/ OFF VDR OP + - IN OUT ON/OFF pin 1 TM SuperSOT -8 See Application Cir cuit Absolute Maximum Ratings Symbol T A =25 oC unless otherwise noted Parameter V IN Input Voltage Range V ON/OFF On/Off Voltage Range ID Load Current PD Maximum Power Dissipation T J , T stg Operating and Storage Temperature Range ESD Electrostatic Discharge Rating MIL-STD-883D Human-Body-Model (100pf/1500 Ohm) (Note 1) - Continuous Ratings Units 3 - 20 V 2.5 - 8 V (Note 2) 2.9 A (Note 2) 0.8 W -55 to +150 °C kV - Pulsed 8 6 Thermal Characteristics R θ JA Thermal Resistance, Junction-to-Ambient (Note 2) 156 ° C/W R θ JC Thermal Resistance, Junction-to-Case (Note 2) 40 ° C/W Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity 8521L FDR8521L 13’’ 12mm 3000 units 2000 Fairchild Semiconductor International FDR8521L Rev. C FDR8521L August 2000 Symbol o TA=25 C unless otherwise noted Parameter Test Conditions Min Typ Max Units 1 µA 0.070 0.115 0.200 0.200 0.070 0.115 V OFF Characteristics IFL Forward Leakage Current ON Characteristics VIN = 20 V, VON/OFF = 250 µA (Note 3) VDROP Conduction Voltage R(ON) Q2 - Static On-Resistance IL Load Current VIN = 12 V, VON/OFF = 3.3 V, IL = 1 A VIN = 5 V, VON/OFF = 3.3 V, IL = 1 A VIN = 12 V, VON/OFF = 3.3 V, IL = 2.9 A VIN = 5 V, VON/OFF = 3.3 V, IL = 1.8 A VGS = -12 V, ID = 2.9 A VGS = -5 V, ID = 1.8 A VDROP = 0.2 V, VIN = 12 V, VON/OFF = 3.3 V VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V 0.053 0.085 0.054 0.090 Ω 2.9 1.8 A Notes: 1. Range of VIN can be up to 25V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -20V. 2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθJA is determined by the user’s board design. 3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%. FDR8521L Load Switch Application APPLICATION CIRCUIT Q2 IN O UT R1 C1 R2 Ci Co ON/OFF LOAD Q1 External Component Recommendation: For applications where Co ≤ 1µF. For slew rate control, select R2 in the range of 470 - 10kΩ . For additional in-rush current control,C1 ≤ 1000pF can be added. Select R1 so that the R1/R2 ratio ranges from 10 - 100. R1 is required to turn Q2 off. FDR8521L Rev. C FDR8521L Electrical Characteristics (continued) 0.7 1 VIN = 12V VON/OFF = 1.5 - 8V PW = 300µS, D < 2% 0.6 VIN = 5V VON/OFF = 1.5 - 8V PW = 300µS, D < 2% 0.8 o 0.5 TA = 125 C VDROP (V) VDROP (V) FDR8521L Typical Characteristics 0.4 o TA = 25 C 0.3 o TA = 125 C 0.6 o TA = 25 C 0.4 0.2 0.2 0.1 0 0 0 1 2 3 4 5 6 7 0 8 1 2 3 4 5 6 7 8 IL (A) IL (A) Figure 1. Conduction Voltage Drop Variation with Load Current. Figure 2. Conduction Voltage Drop Variation with Load Current. 0.3 IL = 1A VON/OFF = 1.5V -8V 0.25 PW = 300µS, D < 2% 0.15 o TA = 125 C 0.1 0.05 o TA = 25 C 0 2 4 6 8 10 12 VIN, INPUT VOLTAGE (V) Figure 3. On-Resistance Variation with Input Voltage. TRANSIENT THERMAL RESISTANCE 1 r(t), NORMALIZED EFFECTIVE VDROP (V) 0.2 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D = 0.5 R θJA (t) = r(t) * R θJA R θJA = 156 °C/W 0.2 0.1 0.05 P(pk) 0.02 t1 0.01 Single Pulse 0.002 0.001 0.0001 0.001 t2 TJ - TA = P * R JA (t) θ Duty Cycle, D = t 1/ t 2 0.01 0.1 1 10 100 300 t1 , TIME (sec) Figure 4.Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 2. Transient themal response will change depending on the circuit board design. FDR8521L Rev. C SuperSOTTM-8 Tape and Reel Data and Package Dimensions SSOT-8 Packaging Configuration: Figure 1.0 Customized Label Packaging Description: F63TNR Label Anti static Cover Tape SSOT-8 parts are shipped in tape. The carrier tape is made from a di ssipat ive (carbo n filled) po ly carbon ate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film , adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped w ith 3,000 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 500 unit s per 7" or 177cm diameter reel. This and some other options are further described in the Packagin g Information table. These full reels are in di vidu ally barcod e labeled and placed inside a standard intermediate box (ill ustrated in figure 1.0) made of recyclable corrugated brow n paper. One box contains two reels maximum. And t hese boxes are placed ins ide a barcode labeled shipp ing bo x whic h comes in di fferent sizes depend in g on t he nu mber of parts shippe d. Static Dissi pat ive Emboss ed Carrier Tape F852 831N F852 831N F852 831N F852 831N F852 831N Pin 1 SSOT-8 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Standard (no f l ow c ode ) TNR D84Z SSOT-8 Unit Orientation TNR 3,000 500 13" D ia 7" Dia 343x64x343 184x187x47 Max qty per Box 6,000 1,000 Weight per unit (gm) 0.0416 0.0416 Weight per Reel (kg) 0.5615 0.0980 343mm x 342mm x 64mm Intermediate box for Standar d and L99Z Opti ons Note/Comments F63TNR Label F63TNR Label F63TNR Labe l sa mpl e 184mm x 187mm x 47mm Pizza Box fo r D84Z Option F63TNR Label SSOT-8 Tape Leader and Trailer Configuration: Figur e 2.0 LOT: CBVK741B019 QTY: 3000 FSID: FDR835N SPEC: D/C1: D9842 D/C2: QTY1: QTY2: SPEC REV: CPN: N/F: F (F63TNR)3 Carrier Tape Cover Tape Components Traile r Tape 300mm mi nimum or 38 empty pockets Lead er Tape 500mm mi nimum or 62 empty poc kets August 1999, Rev. C SuperSOTTM-8 Tape and Reel Data and Package Dimensions, continued SSOT-8 Embossed Carrier Tape Configuration: Figur e 3.0 P0 D0 T E1 F K0 Wc W E2 B0 Tc A0 D1 P1 User Direction of Feed Dimensions are in millimeter Pkg type A0 B0 SSOT-8 (12mm) 4.47 +/-0.10 5.00 +/-0.10 W 12.0 +/-0.3 D0 D1 E1 E2 1.55 +/-0.05 1.50 +/-0.10 1.75 +/-0.10 F 10.25 mi n 5.50 +/-0.05 P1 P0 8.0 +/-0.1 4.0 +/-0.1 K0 T Wc 1.37 +/-0.10 0.280 +/-0.150 9.5 +/-0.025 Notes : A0, B0, and K0 dimensions are deter mined with r espec t to t he EIA/Jedec RS-481 rotationa l and lateral movement requi remen ts (see sketches A, B, and C). 0.06 +/-0.02 0.5mm maximum 20 deg maximum Typical component cavity center line B0 Tc 0.5mm maximum 20 deg maximum component rotation Typical component center line Sketch A (Si de or Front Sectional View) A0 Component Rotation Sketch C (Top View) Component lateral movement Sketch B (Top View) SSOT-8 Reel Configuration: Figur e 4.0 Component Rotation W1 Measured at Hub Dim A Max Dim A max See detail AA Dim N 7" Diameter Option B Min Dim C See detail AA W3 13" Diameter Option Dim D min W2 max Measured at Hub DETAIL AA Dimensions are in inches and millimeters Tape Size Reel Option Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL) 12mm 7" Dia 7.00 177.8 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 5.906 150 0.488 +0.078/-0.000 12.4 +2/0 0.724 18.4 0.469 – 0.606 11.9 – 15.4 12mm 13" Dia 13.00 330 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 7.00 178 0.488 +0.078/-0.000 12.4 +2/0 0.724 18.4 0.469 – 0.606 11.9 – 15.4 1998 Fairchild Semiconductor Corporation July 1999, Rev. C SuperSOTTM-8 Tape and Reel Data and Package Dimensions, continued SuperSOT-8 (FS PKG Code 34, 35) 1:1 Scale 1:1 on letter size paper Di mensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0416 September 1998, Rev. A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ E2CMOSTM EnSignaTM FACT™ FACT Quiet Series™ FAST® FASTr™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ POP™ PowerTrench® QFET™ QS™ QT Optoelectronics™ Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ UHC™ VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. F1