TDA7267 ® 2W MONO AMPLIFIER CAN DELIVER 2W THD 10% 12V/8Ω INTERNAL FIXED GAIN 32dB NO FEEDBACK CAPACITOR NO BOUCHEROT CELL THERMAL PROTECTION AC SHORT CIRCUIT PROTECTION SVR CAPACITOR FOR BETTER RIPPLE REJECTION LOW TURN-ON/OFF POP STAND-BY MODE MINIDIP (4+4) ORDERING NUMBER: TDA7267 DESCRIPTION The device TDA7267 is a new technology Mono Audio Amplifier in MINIDIP package specifically designed for TV application. Thanks to the fully complementary output configu- ration the device delivers a rail to rail voltage swing without need of boostrap capacitors. BLOCK DIAGRAM VS=12V VS 0.1µF IN IN 100µF 470µF + - OUT SVR 8Ω 47µF S-GND P-GND D94AU165 June1998 1/5 TDA7267 ABSOLUTE MAXIMUM RATINGS Symbol Parameter VS Operating Supply Voltage IO Top Output Put Peak Current Tj Tstg Junction Temperature Operating Temperature Range Storage Temperature Range Value Unit 18 V 1.5 A 0 to 70 °C 150 °C -40 to 125 °C PIN CONNECTION (Top view) VS 1 8 GND OUT 2 7 GND SVR 3 6 GND IN 4 5 GND D94AU163 THERMAL DATA Symbol Parameter Value Unit Rth j-amb Thermal Resistance Junction to ambient (on PCB) 80 °C/W Rth j-case Thermal Resistance Junction to case 15 °C/W ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = 12V; RL = 8Ω; f = 1KHz; unless otherwise specified.) Symbol 2/5 Parameter Test Condition Min. Typ. VS Supply Voltage Range 4.5 IS Isb Quiescent Current Stand-By Current VO AV Quiescent Output Voltage Voltage Gain RIN Input Impedance PO THD Output Power Distortion THD = 10% PO = 1W SVR Supply Voltage Rejection Vripple = 150mVrms; Fripple = 1KHz 50 EI Input Noise Voltage Rg = 10KΩ; BW = 20Hz to 20KHz 1.5 Vsb Stand-By Enable Voltage 20 Pin 3 shorted to GND 1.8 Max. Unit 18 V 30 0.3 mA mA 6 32 V dB 100 KΩ 2 1.0 W % dB 5 µV 1 V TDA7267 APPLICATION CIRCUIT VS 0.1µF IN 100µF 470µF IN OUT SVR STAND-BY VS=12V 47µF 8Ω P-GND D94AU166 APPLICATION HINTS: For 12V supply and 8Ω speaker application, its maximum power dissipation is about 1W. Assumming that max ambient temperature is 70°C. Required thermal resistance of the device and heat dissipating means must be equal to (150 - 70)/1 = 80°C/W. Junction to pin thermal resistance of the package is about 15°C/W. That means external heat sink of about 65°C/W is required. Cu ground plane of PCB can be used as heat dissipating means. Stand-By switches must be able to discharge Csvr current. 3/5 TDA7267 MINIDIP PACKAGE MECHANICAL DATA mm DIM. MIN. A TYP. MAX. MIN. 3.3 TYP. MAX. 0.130 a1 0.7 B 1.39 1.65 0.055 0.065 B1 0.91 1.04 0.036 0.041 b b1 0.028 0.5 0.38 0.020 0.5 D 0.015 0.020 9.8 0.386 E 8.8 0.346 e 2.54 0.100 e3 7.62 0.300 e4 7.62 0.300 F 7.1 0.280 I 4.8 0.189 L Z 4/5 inch 3.3 0.44 0.130 1.6 0.017 0.063 TDA7267 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1998 STMicroelectronics – Printed in Italy – All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 5/5