TI TDA7263L

TDA7263L
6 + 6W STEREO AMPLIFIER WITH MUTING
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FEATURES
Figure 1. Package
WIDE SUPPLY VOLTAGE RANGE
HIGH OUTPUT POWER
6+6W @ VS=20V, RL = 8Ω, THD=10%
MUTE FACILITY (POP FREE) WITH LOW
CONSUMPTION
AC SHORT CIRCUIT PROTECTION
THERMAL OVERLOAD PROTECTION
SIP10
Table 1. Order Codes
DESCRIPTION
Part Number
Package
TDA7263L
SIP10
The TDA7263L is class AB dual audio power amplifier assembled in Single IN Line 10 pins package,
specially designed for high quality sound application
as HI-FI music centers and stereo TV sets.
Figure 2. Block Diagram
R7 1K
+VS
=
MUTE
SW
C3
47µF
C4
0.1µF
3
9
1
IN (R)
C10 1000µF
10
+
-
C1 100nF
27K
2
C6
47µF
TDA7263L
C2 100nF
IN (L)
C5
1000µF
5
R1
1.5K
R2
47
27K
4
6
RL
(R)
R5
4.7
C11 1000µF
7
+
-
C8
0.1µF
C7
47µF
R3
1.5K
R4
47
C9
0.1µF
RL
(L)
R6
4.7
D02AU1426
September 2004
Rev. 2
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TDA7263L
Table 2. Absolute Maximum Ratings
Symbol
Value
Unit
VS
Supply Voltage without Load
30
V
IO
Output Peak Current (repetitive f >20Hz)
1.7
A
IO
Output Peak Current (non repetitive, t = 100µs)
2
A
Ptot
Total Power Dissipation (Tcase = 70°C)
8
W
Top
Operating Temperature Range
0 to 70
°C
-40 to 150
°C
Tstg,Tj
Parameter
Storage & Junction Temperature
Figure 3. Pin Connection (Top view)
OUTPUT(1)
10
9
+VS
8
N.C.
7
OUTPUT(2)
6
GND
5
NON INVERTING INPUT(2)
4
INVERTING INPUT(2)
3
SVR/MUTING
2
INVERTING INPUT(1)
1
NON INVERTING INPUT(1)
D02AU1427
Figure 4. Block Diagram
CFCOUP1
RFI 27K
IN- L
IN+ L
2
+
1
-
10
L
OUT L
RF1
SVR
3
SC
PROTECTION
MUTE
RF2
+VS
IN+ R
IN- R
REFERENCES
Tj
TURN-ON
AND OFF
TH
PROTECTION
9
5
+
4
-
R
7
OUT R
RF3
RFI 27K
6
GND
RF4
CFCOUP1
D02AU1428
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TDA7263L
Table 3. Thermal Data
Symbol
Rth j-case
Parameter
Thermal resistance junction to case
Max
Value
Unit
9
°C/W
Table 4. ELECTRICAL CHARACTERISTCS
(Refer to the stereo test and application circuit, VS = 20V; RL = 8Ω; Gv = 30dB; f = 1KHz; Tamb = 25°C
unless otherwise specified.)
Symbol
VS
Parameter
Supply Voltage
Test Condition
Min.
10
Typ.
VO
Quiescent Output Voltage
9.5
Iq
Total Quiescent Current
70
PO
Output Power (RMS)
d = 10%; Tamb = 85°C
5
6
4
Total Harmonic Distortion
d = 1%
PO = 1W, f = 1kHz
5
0.03
d
Cross Talk
RI
Input Resistance
95
mA
W
W
%
0.3
0.5
RS = 10K&; f = 1KHz
70
dB
RS = 10K&; f = 10KHz
60
dB
200
KΩ
100
fL
Low Frequency Roll-off (-3dB)
40
Hz
fH
High Frequency Roll-off (-3dB)
80
KHz
eN
Total Input Noise Voltage
1.5
mV
A Curve; RS = 10KΩ
f = 22Hz to 22KHz; RS = 10KΩ
SVR
Supply Voltage Rejection
(each channel)
Tj
Thermal Shutdown Junction
Temperature
MUTE FUNCTION
VTMUTE Mute Threshold
3
Unit
V
V
f = 100Hz to 10KHz; PO = 0.1 to 3W
CT
Max.
24
VTPLAY
Play Threshold
ATTAM
Mute Attenuation
IqMUTE
Quiescent Current @ Mute
3
RS = 10KΩ; f = 100Hz; Vr = 0.5V
45
V
dB
145
°C
1
70
10
60
1.6
V
4.5
V
100
dB
7
10
mA
TYPICAL CHARACTERISTICS
(referred to the typical Application Circuit, VS = 20V, RL = 8Ω, unless otherwise specified)
Figure 5. Output Power vs. Supply Voltage
Figure 6. Distortion vs. Output Power
d% 10
5
2
1
0.5
f =15KHz
0.2
0.1
0.05
f =1KHz
0.02
0.01
100m
200m
300m
500m 700m
1
Pout (W)
2
3
4
5
6
78
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TDA7263L
Figure 7. Quiescent Current vs. Supply Voltage
Figure 10. Output Attenuation & Quiescent
Current vs. Vpin3
Figure 8. Supply Voltage Rejection vs. Freq.
Figure 11. Total Power Dissipation vs. Output
Power
Figure 9. Crosstalk vs. Frequency
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TDA7263L
Figure 12. PC Board Component Layout
Figure 13. Evaluation Board Top Layer Layout
Figure 14. Evaluation Board Bottom Layer Layout
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TDA7263L
4
APPLICATION SUGGESTION
The recommended values of the components are those shown on the typical application circuit. Different
values can be used; the following table can help the designer.
Component
Recomm.
Value
R1 and R3
1.5KΩ
Close loop gain setting (*)
Increase of gain
Decrease of gain
R2 and R4
47Ω
Close loop gain setting (*)
Decrease of gain
Increase of gain
R5 and R6
4.7Ω
Frequency stability
Danger of oscillations
C1 and C2
100nF
Input DC decoupling
Higher SVR
Higher low frequency cutoff
C3
47µF
- Ripple Rejection
- Mute time constant
Increase of the Switch-on
time
- Degradation of SVR
- Worse turn-off pop by muting
C4
100nF
Supply Voltage Bypass
C5
1000µF
Supply Voltage Bypass
C6 and C7
47µF
Feedback input DC
decoupling
C8 and C9
0.1µF
Frequency stability
Danger of oscillations
C10 and C11
1000µF
Output DC decoupling
Higher low-frequency cut-off
Purpose
Larger Than
Smaller Than
Danger of oscillations
Increase of the Switch-on
time
Danger of Switch-on time
(*) Closed loop gain must be higher than 26dB
5
BUILT-IN PROTECTION SYSTEMS
5.1 Thermal Shut-down
The presence of a thermal limiting circuit offers the following advantages:
1 an overload on the output (even if it is permanent), or an excessive ambient temperature can be easily
withstood.
2 the heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no
device damage in the case of excessive junction temperature; if for any reason the junction temperature
increases up to 145°C. the thermal shutdown simply reduces the output power and therefore the power
dissipation.
The maximum allowable power dissipation depends upon the thermal resistance junction-ambient. Figure
15 shows the dissipable power as a function of ambient temperature for different heatsink thermal resistance.
5.2 Short Circuit (AC Conditions)
The TDA7263L can withstand accidental short circuits across the speaker made by a wrong connection
during normal play operation.
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TDA7263L
6
HEAT SINK DIMENSIONING:
In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important
the dimensioning of the Heat Sinker RTh (°C/W).
The parameters that influence the dimensioning are:
– Maximum dissipated power for the device (Pdmax)
– Max thermal resistance Junction to case (R Th j-c)
– Max. ambient temperature Tamb max
– Quiescent current Iq (mA)
6.1 Example:
VCC = 20V, Rload = 8ohm, RTh j-c = 9 °C/W , Tamb max = 50°C
2
2 Vcc
Pdmax = (N° channels) · -------------------------- + I q ⋅ V cc
2
Π ⋅ R lo ad
Pdmax = 2 · ( 2.5 ) + 0.5 = 5.5W
150 – T am b max
150 – 50
(Heat Sinker) R Th c-a = ----------------------------------------- – R T h j-c = ---------------------- – 9 = 9.0°C /W
5.5
P d max
In figure 11 is shown the Power derating curve for the device.
Figure 15. Power Derating Curve
10
8
(b)
Pd (W)
6
a)
(a)
(c)
Infinite Heatsink
b)
5.0 °C/ W
c)
7.0 °C/ W
4
2
0
0
40
80
120
160
Tamb (°C)
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TDA7263L
Figure 16. SIP10 Mechanical Data & Package Dimensions
DIM.
mm
MIN.
inch
TYP.
MAX.
A
TYP.
2.7
3
B
0.280
0.106
0.118
24.8
b1
0.976
0.5
0.85
1.6
0.033
0.063
3.3
0.130
c1
0.43
0.017
c2
1.32
0.052
D
23.7
0.933
14.5
0.571
e
2.54
0.100
e3
22.86
L
Weight: 2.02gr
0.020
C
d1
OUTLINE AND
MECHANICAL DATA
MAX.
7.1
a1
b3
MIN.
0.900
3.1
0.122
L1
3
0.118
L2
17.6
0.693
L3
0.25
L4
0.254
0.010
0.010
M
3.2
0.126
N
1
0.039
P
0.15
SIP10
0.006
C
D
L1
L3
c2
N
P
1
1
0
L
L4
a1
L2
A
d1
M
b1
b3
e
c
1
e3
B
SIP10
0016108 D
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TDA7263L
Table 5. Revision History
Date
Revision
Description of Changes
June 2003
1
First Issue
September 2004
2
Changed Status and the graphic aspect in compliant to the new rules
“Corporate Technical Pubblications Design Guide”
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TDA7263L
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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