Blackfin® Embedded Processor ADSP-BF522/523/524/525/526/527 Preliminary Technical Data FEATURES PERIPHERALS Up to 600 MHz high-performance Blackfin processor Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs, 40-bit shifter RISC-like register and instruction model for ease of programming and compiler-friendly support Advanced debug, trace, and performance monitoring Accepts a wide range of supply voltages for internal and I/O operations. See Operating Conditions for ADSP-BF523/525/527 on Page 29 and Operating Conditions for ADSP-BF522/524/526 on Page 27 Programmable on-chip voltage regulator (ADSP-BF523/525/527 processors only) 289-ball (12 mm x 12 mm) and 208-ball (17 mm x 17 mm) CSP_BGA packages USB 2.0 high speed on-the-go (OTG) with Integrated PHY IEEE 802.3-compliant 10/100 Ethernet MAC Parallel peripheral interface (PPI), supporting ITU-R 656 video data formats Host DMA port (HOSTDP) Two dual-channel, full-duplex synchronous serial ports (SPORTs), supporting eight stereo I2S channels 12 peripheral DMAs, 2 mastered by the Ethernet MAC Two memory-to-memory DMAs with external request lines Event handler with 54 interrupt inputs Serial peripheral interface (SPI) compatible port Two UARTs with IrDA® support Two-wire interface (TWI) controller Eight 32-bit timers/counters with PWM support 32-bit up/down counter with rotary support Real-time clock (RTC) and watchdog timer 32-bit core timer 48 general-purpose I/Os (GPIOs), with programmable hysteresis NAND flash controller (NFC) Debug/JTAG interface On-chip PLL capable of 0.5ⴛto 64ⴛ frequency multiplication MEMORY 132K bytes of on-chip memory: (See Table 1 on Page 3 for L1 and L3 memory size details) External memory controller with glueless support for SDRAM and asynchronous 8-bit and 16-bit memories Flexible booting options from external flash, SPI, and TWI memory or from host devices including SPI, TWI, and UART Code Security with LockboxTM Secure Technology One-Time-Programmable (OTP) Memory Memory management unit providing memory protection WATCHDOG TIMER OTP MEMORY RTC VOLTAGE REGULATOR* JTAG TEST AND EMULATION COUNTER PERIPHERAL SPORT0 ACCESS BUS B L1 INSTRUCTION MEMORY EAB L1 DATA MEMORY SPORT1 INTERRUPT CONTROLLER UART1 GPIO PORT F UART0 NFC DMA CONTROLLER 16 DCB DMA ACCESS BUS USB PPI SPI TIMER7-1 DEB TIMER0 BOOT ROM EXTERNAL PORT FLASH, SDRAM CONTROL GPIO PORT G GPIO PORT H EMAC HOST DMA *REGULATOR AVAILABLE ON ADSP-BF523/525/527 PROCESSORS ONLY TWI PORT J Figure 1. Processor Block Diagram Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc. Rev. PrG Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 © 2009 Analog Devices, Inc. All rights reserved. ADSP-BF522/523/524/525/526/527 Preliminary Technical Data TABLE OF CONTENTS General Description ................................................. 3 Booting Modes ................................................... 18 Portable Low-Power Architecture ............................. 3 Instruction Set Description .................................... 20 System Integration ................................................ 3 Development Tools .............................................. 21 Processor Peripherals ............................................. 3 Blackfin Processor Core .......................................... 4 Designing an Emulator-Compatible Processor Board (Target) ................................... 21 Memory Architecture ............................................ 5 Related Documents .............................................. 21 DMA Controllers .................................................. 9 Lockbox Secure Technology Disclaimer .................... 21 Host DMA Port .................................................... 9 Signal Descriptions ................................................. 22 Real-Time Clock ................................................. 10 Specifications ........................................................ 27 Watchdog Timer ................................................ 10 Operating Conditions for ADSP-BF522/524/526 ......... 27 Timers ............................................................. 10 Operating Conditions for ADSP-BF523/525/527 ......... 29 Up/Down Counter and Thumbwheel Interface .......... 10 Electrical Characteristics ....................................... 31 Serial Ports ........................................................ 11 Absolute Maximum Ratings ................................... 36 Serial Peripheral Interface (SPI) Port ....................... 11 ESD Sensitivity ................................................... 37 UART Ports ...................................................... 11 Package Information ............................................ 37 TWI Controller Interface ...................................... 12 Timing Specifications ........................................... 38 10/100 Ethernet MAC .......................................... 12 Output Drive Currents ......................................... 64 Ports ................................................................ 12 Test Conditions .................................................. 67 Parallel Peripheral Interface (PPI) ........................... 13 Environmental Conditions .................................... 71 USB On-the-go dual-role device controller ............... 14 289-Ball CSP_BGA Ball assignment ............................ 72 Code Security with Lockbox Secure Technology ......... 14 208-Ball CSP_BGA Ball assignment ............................ 75 Dynamic Power Management ................................ 14 Outline Dimensions ................................................ 78 ADSP-BF523/525/527 Voltage Regulation ................ 15 Surface Mount Design .......................................... 79 ADSP-BF522/524/526 Voltage Regulation ................ 16 Ordering Guide ..................................................... 80 Clock Signals ..................................................... 16 REVISION HISTORY 2/09—Revision PrG: Numerous small clarifications and corrections throughout document. Updated external crystal connections guidelines in Figure 6 ...................................................... Page 17 Added electrical characteristics ............................ Page 31 Added total power dissipation data ....................... Page 33 Added maximum total source/sink (IOH/IOL) current to absolute maximum ratings .............................. Page 36 Added capacitive loading data ............................. Page 68 Rev. PrG | Page 2 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data GENERAL DESCRIPTION The ADSP-BF522/524/526 and ADSP-BF523/525/527 processors are members of the Blackfin family of products, incorporating the Analog Devices/Intel Micro Signal Architecture (MSA). Blackfin processors combine a dual-MAC state-ofthe-art signal processing engine, the advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) multimedia capabilities into a single instruction-set architecture. The ADSP-BF522/524/526 and ADSP-BF523/525/527 processors are completely code compatible with other Blackfin processors. The ADSP-BF523/525/527 processors offer performance up to 600 MHz. The ADSP-BF522/524/526 processors offer performance up to 400 MHz and reduced static power consumption. Differences with respect to peripheral combinations are shown in Table 1. Memory (bytes) 1 PORTABLE LOW-POWER ARCHITECTURE Blackfin processors provide world-class power management and performance. They are produced with a low power and low voltage design methodology and feature on-chip dynamic power management, which is the ability to vary both the voltage and frequency of operation to significantly lower overall power consumption. This capability can result in a substantial reduction in power consumption, compared with just varying the frequency of operation. This allows longer battery life for portable appliances. ADSP-BF527 ADSP-BF525 ADSP-BF523 ADSP-BF526 SYSTEM INTEGRATION ADSP-BF524 Feature Host DMA USB Ethernet MAC Internal Voltage Regulator TWI SPORTs UARTs SPI GP Timers Watchdog Timers RTC Parallel Peripheral Interface GPIOs L1 Instruction SRAM L1 Instruction SRAM/Cache L1 Data SRAM L1 Data SRAM/Cache L1 Scratchpad L3 Boot ROM Maximum Speed Grade1 Maximum System Clock Speed Package Options ADSP-BF522 Table 1. Processor Comparison By integrating a rich set of industry-leading system peripherals and memory, Blackfin processors are the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leading-edge signal processing in one integrated package. 1 1 1 1 1 1 – 1 1 – 1 1 – – 1 – – 1 – – – 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1 1 8 8 8 8 8 8 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 48 48 48 48 48 48 48K 48K 48K 48K 48K 48K 16K 16K 16K 16K 16K 16K 32K 32K 32K 32K 32K 32K 32K 32K 32K 32K 32K 32K 4K 4K 4K 4K 4K 4K 32K 32K 32K 32K 32K 32K 400 MHz 600 MHz 80 MHz 133 MHz 289-Ball CSP_BGA 208-Ball CSP_BGA Maximum speed grade is not available with every possible SCLK selection. Rev. PrG | The ADSP-BF522/524/526 and ADSP-BF523/525/527 processors are highly integrated system-on-a-chip solutions for the next generation of embedded network connected applications. By combining industry-standard interfaces with a high performance signal processing core, cost-effective applications can be developed quickly, without the need for costly external components. The system peripherals include an IEEE-compliant 802.3 10/100 Ethernet MAC, a USB 2.0 high speed OTG controller, a TWI controller, a NAND flash controller, two UART ports, an SPI port, two serial ports (SPORTs), eight general purpose 32bit timers with PWM capability, a core timer, a real-time clock, a watchdog timer, a Host DMA (HOSTDP) interface, and a parallel peripheral interface (PPI). PROCESSOR PERIPHERALS The ADSP-BF522/524/526 and ADSP-BF523/525/527 processors contain a rich set of peripherals connected to the core via several high bandwidth buses, providing flexibility in system configuration as well as excellent overall system performance (see the block diagram on Page 1). These Blackfin processors contain dedicated network communication modules and high speed serial and parallel ports, an interrupt controller for flexible management of interrupts from the on-chip peripherals or external sources, and power management control functions to tailor the performance and power characteristics of the processor and system to many application scenarios. All of the peripherals, except for the general-purpose I/O, TWI, real-time clock, and timers, are supported by a flexible DMA structure. There are also separate memory DMA channels dedicated to data transfers between the processor's various memory spaces, including external SDRAM and asynchronous memory. Multiple on-chip buses running at up to 133 MHz provide enough bandwidth to keep the processor core running along with activity on all of the on-chip and external peripherals. Page 3 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data tasks. These include bit operations such as field extract and population count, modulo 232 multiply, divide primitives, saturation and rounding, and sign/exponent detection. The set of video instructions include byte alignment and packing operations, 16-bit and 8-bit adds with clipping, 8-bit average operations, and 8-bit subtract/absolute value/accumulate (SAA) operations. Also provided are the compare/select and vector search instructions. The ADSP-BF523/525/527 processors include an on-chip voltage regulator in support of the processor’s dynamic power management capability. The voltage regulator provides a range of core voltage levels when supplied from VDDEXT. The voltage regulator can be bypassed at the user's discretion. BLACKFIN PROCESSOR CORE As shown in Figure 2, the Blackfin processor core contains two 16-bit multipliers, two 40-bit accumulators, two 40-bit ALUs, four video ALUs, and a 40-bit shifter. The computation units process 8-, 16-, or 32-bit data from the register file. For certain instructions, two 16-bit ALU operations can be performed simultaneously on register pairs (a 16-bit high half and 16-bit low half of a compute register). If the second ALU is used, quad 16-bit operations are possible. The compute register file contains eight 32-bit registers. When performing compute operations on 16-bit operand data, the register file operates as 16 independent 16-bit registers. All operands for compute operations come from the multiported register file and instruction constant fields. The 40-bit shifter can perform shifts and rotates and is used to support normalization, field extract, and field deposit instructions. The program sequencer controls the flow of instruction execution, including instruction alignment and decoding. For program flow control, the sequencer supports PC relative and indirect conditional jumps (with static branch prediction), and subroutine calls. Hardware is provided to support zero-overhead looping. The architecture is fully interlocked, meaning that the programmer need not manage the pipeline when executing instructions with data dependencies. Each MAC can perform a 16-bit by 16-bit multiply in each cycle, accumulating the results into the 40-bit accumulators. Signed and unsigned formats, rounding, and saturation are supported. The ALUs perform a traditional set of arithmetic and logical operations on 16-bit or 32-bit data. In addition, many special instructions are included to accelerate various signal processing ADDRESS ARITHMETIC UNIT L3 B3 M3 I2 L2 B2 M2 I1 L1 B1 M1 I0 L0 B0 M0 SP FP P5 DAG1 P4 P3 DAG0 P2 32 32 P1 P0 TO MEMORY DA1 DA0 I3 32 PREG 32 RAB SD LD1 LD0 32 32 32 ASTAT 32 32 SEQUENCER R7.H R6.H R7.L R6.L R5.H R5.L R4.H R4.L R3.H R3.L R2.H R2.L R1.H R1.L R0.H R0.L 16 ALIGN 16 8 8 8 8 DECODE BARREL SHIFTER 40 40 40 A0 32 40 A1 32 DATA ARITHMETIC UNIT Figure 2. Blackfin Processor Core Rev. PrG | Page 4 of 80 | February 2009 LOOP BUFFER CONTROL UNIT ADSP-BF522/523/524/525/526/527 Preliminary Technical Data The address arithmetic unit provides two addresses for simultaneous dual fetches from memory. It contains a multiported register file consisting of four sets of 32-bit index, modify, length, and base registers (for circular buffering), and eight additional 32-bit pointer registers (for C-style indexed stack manipulation). 0xFFFF FFFF CORE MMR REGISTERS (2M BYTES) 0xFFE0 0000 SYSTEM MMR REGISTERS (2M BYTES) 0xFFC0 0000 RESERVED 0xFFB0 1000 SCRATCHPAD SRAM (4K BYTES) 0xFFB0 0000 RESERVED Blackfin processors support a modified Harvard architecture in combination with a hierarchical memory structure. Level 1 (L1) memories are those that typically operate at the full processor speed with little or no latency. At the L1 level, the instruction memory holds instructions only. The two data memories hold data, and a dedicated scratchpad data memory stores stack and local variable information. 0xFFA1 4000 INSTRUCTION SRAM / CACHE (16K BYTES) RESERVED INSTRUCTION BANK B SRAM (16K BYTES) 0xFFA0 8000 INSTRUCTION BANK A SRAM (32K BYTES) 0xFFA0 0000 RESERVED 0xFF90 8000 DATA BANK B SRAM / CACHE (16K BYTES) In addition, multiple L1 memory blocks are provided, offering a configurable mix of SRAM and cache. The memory management unit (MMU) provides memory protection for individual tasks that may be operating on the core and can protect system registers from unintended access. 0xFF90 4000 DATA BANK B SRAM (16K BYTES) 0xFF90 0000 RESERVED 0xFF80 8000 DATA BANK A SRAM / CACHE (16K BYTES) 0xFF80 4000 DATA BANK A SRAM (16K BYTES) The architecture provides three modes of operation: user mode, supervisor mode, and emulation mode. User mode has restricted access to certain system resources, thus providing a protected software environment, while supervisor mode has unrestricted access to the system and core resources. 0xFF80 0000 RESERVED 0xEF00 8000 RESERVED 0x2040 0000 ASYNC MEMORY BANK 3 (1M BYTES) 0x2030 0000 MEMORY ARCHITECTURE The Blackfin processor views memory as a single unified 4G byte address space, using 32-bit addresses. All resources, including internal memory, external memory, and I/O control registers, occupy separate sections of this common address space. The memory portions of this address space are arranged in a hierarchical structure to provide a good cost/performance balance of some very fast, low-latency on-chip memory as cache or SRAM, and larger, lower-cost and performance off-chip memory systems. See Figure 3. The on-chip L1 memory system is the highest-performance memory available to the Blackfin processor. The off-chip memory system, accessed through the external bus interface unit (EBIU), provides expansion with SDRAM, flash memory, and SRAM, optionally accessing up to 132M bytes of physical memory. The memory DMA controller provides high-bandwidth datamovement capability. It can perform block transfers of code or data between the internal memory and the external Rev. PrG | ASYNC MEMORY BANK 2 (1M BYTES) 0x2020 0000 ASYNC MEMORY BANK 1 (1M BYTES) 0x2010 0000 ASYNC MEMORY BANK 0 (1M BYTES) 0x2000 0000 RESERVED 0x08 00 0000 EXTERNAL MEMORY MAP BOOT ROM (32K BYTES) 0xEF00 0000 The Blackfin processor instruction set has been optimized so that 16-bit opcodes represent the most frequently used instructions, resulting in excellent compiled code density. Complex DSP instructions are encoded into 32-bit opcodes, representing fully featured multifunction instructions. Blackfin processors support a limited multi-issue capability, where a 32-bit instruction can be issued in parallel with two 16-bit instructions, allowing the programmer to use many of the core resources in a single instruction cycle. The Blackfin processor assembly language uses an algebraic syntax for ease of coding and readability. The architecture has been optimized for use in conjunction with the C/C++ compiler, resulting in fast and efficient software implementations. INTERNAL MEMORY MAP 0xFFA1 0000 0xFFA0 C000 SDRAM MEMORY (16M BYTES - 128M BYTES) 0x0000 0000 Figure 3. Internal/External Memory Map Internal (On-Chip) Memory The processor has three blocks of on-chip memory providing high-bandwidth access to the core. The first block is the L1 instruction memory, consisting of 64K bytes SRAM, of which 16K bytes can be configured as a four-way set-associative cache. This memory is accessed at full processor speed. The second on-chip memory block is the L1 data memory, consisting of up to two banks of up to 32K bytes each. Each memory bank is configurable, offering both cache and SRAM functionality. This memory block is accessed at full processor speed. The third memory block is a 4K byte scratchpad SRAM which runs at the same speed as the L1 memories, but is only accessible as data SRAM and cannot be configured as cache memory. External (Off-Chip) Memory External memory is accessed via the EBIU. This 16-bit interface provides a glueless connection to a bank of synchronous DRAM (SDRAM) as well as up to four banks of asynchronous memory devices including flash, EPROM, ROM, SRAM, and memory mapped I/O devices. Page 5 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data The SDRAM controller can be programmed to interface to up to 128M bytes of SDRAM. A separate row can be open for each SDRAM internal bank and the SDRAM controller supports up to 4 internal SDRAM banks, improving overall performance. The asynchronous memory controller can be programmed to control up to four banks of devices with very flexible timing parameters for a wide variety of devices. Each bank occupies a 1M byte segment regardless of the size of the devices used, so that these banks are only contiguous if each is fully populated with 1M byte of memory. NAND Flash Controller (NFC) The ADSP-BF522/524/526 and ADSP-BF523/525/527 processors provide a NAND flash controller (NFC). NAND flash devices provide high-density, low-cost memory. However, NAND flash devices also have long random access times, invalid blocks, and lower reliability over device lifetimes. Because of this, NAND flash is often used for read-only code storage. In this case, all DSP code can be stored in NAND flash and then transferred to a faster memory (such as SDRAM or SRAM) before execution. Another common use of NAND flash is for storage of multimedia files or other large data segments. In this case, a software file system may be used to manage reading and writing of the NAND flash device. The file system selects memory segments for storage with the goal of avoiding bad blocks and equally distributing memory accesses across all address locations. Hardware features of the NFC include: • Support for page program, page read, and block erase of NAND flash devices, with accesses aligned to page boundaries. • Error checking and correction (ECC) hardware that facilitates error detection and correction. ID, MAC address, etc. Hence generic parts can be shipped which are then programmed and protected by the developer within this non-volatile memory. I/O Memory Space The processor does not define a separate I/O space. All resources are mapped through the flat 32-bit address space. Onchip I/O devices have their control registers mapped into memory-mapped registers (MMRs) at addresses near the top of the 4G byte address space. These are separated into two smaller blocks, one which contains the control MMRs for all core functions, and the other which contains the registers needed for setup and control of the on-chip peripherals outside of the core. The MMRs are accessible only in supervisor mode and appear as reserved space to on-chip peripherals. Booting The processor contains a small on-chip boot kernel, which configures the appropriate peripheral for booting. If the processor is configured to boot from boot ROM memory space, the processor starts executing from the on-chip boot ROM. For more information, see Booting Modes on Page 18. Event Handling The event controller on the processor handles all asynchronous and synchronous events to the processor. The processor provides event handling that supports both nesting and prioritization. Nesting allows multiple event service routines to be active simultaneously. Prioritization ensures that servicing of a higher-priority event takes precedence over servicing of a lower-priority event. The controller provides support for five different types of events: • Emulation – An emulation event causes the processor to enter emulation mode, allowing command and control of the processor via the JTAG interface. • A single 8-bit external bus interface for commands, addresses and data. • Support for SLC (single level cell) NAND flash devices unlimited in size, with page sizes of 256 and 512 bytes. Larger page sizes can be supported in software. • RESET – This event resets the processor. • Nonmaskable Interrupt (NMI) – The NMI event can be generated by the software watchdog timer or by the NMI input signal to the processor. The NMI event is frequently used as a power-down indicator to initiate an orderly shutdown of the system. • Capability of releasing external bus interface pins during long accesses. • Support for internal bus requests of 16-bits • Exceptions – Events that occur synchronously to program flow (in other words, the exception is taken before the instruction is allowed to complete). Conditions such as data alignment violations and undefined instructions cause exceptions. • DMA engine to transfer data between internal memory and NAND flash device. One-Time Programmable Memory The processor has 64K bits of one-time programmable non-volatile memory that can be programmed by the developer only one time. It includes the array and logic to support read access and programming. Additionally, its pages can be write protected. OTP enables developers to store both public and private data on-chip. In addition to storing public and private key data for applications requiring security, it also allows developers to store completely user-definable data such as customer ID, product Rev. PrG | • Interrupts – Events that occur asynchronously to program flow. They are caused by input signals, timers, and other peripherals, as well as by an explicit software instruction. Each event type has an associated register to hold the return address and an associated return-from-event instruction. When an event is triggered, the state of the processor is saved on the supervisor stack. The processor event controller consists of two stages, the core event controller (CEC) and the system interrupt controller (SIC). The core event controller works with the system interrupt Page 6 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data controller to prioritize and control all system events. Conceptually, interrupts from the peripherals enter into the SIC and are then routed directly into the general-purpose interrupts of the CEC. Table 2. Core Event Controller (CEC) Core Event Controller (CEC) The CEC supports nine general-purpose interrupts (IVG15–7), in addition to the dedicated interrupt and exception events. Of these general-purpose interrupts, the two lowest-priority interrupts (IVG15–14) are recommended to be reserved for software interrupt handlers, leaving seven prioritized interrupt inputs to support the peripherals of the processor. Table 2 describes the inputs to the CEC, identifies their names in the event vector table (EVT), and lists their priorities. System Interrupt Controller (SIC) The system interrupt controller provides the mapping and routing of events from the many peripheral interrupt sources to the prioritized general-purpose interrupt inputs of the CEC. Although the processor provides a default mapping, the user can alter the mappings and priorities of interrupt events by writing the appropriate values into the interrupt assignment registers (SIC_IARx). Table 3 describes the inputs into the SIC and the default mappings into the CEC. Priority (0 is Highest) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Event Class Emulation/Test Control RESET Nonmaskable Interrupt Exception Reserved Hardware Error Core Timer General-Purpose Interrupt 7 General-Purpose Interrupt 8 General-Purpose Interrupt 9 General-Purpose Interrupt 10 General-Purpose Interrupt 11 General-Purpose Interrupt 12 General-Purpose Interrupt 13 General-Purpose Interrupt 14 General-Purpose Interrupt 15 EVT Entry EMU RST NMI EVX — IVHW IVTMR IVG7 IVG8 IVG9 IVG10 IVG11 IVG12 IVG13 IVG14 IVG15 Table 3. System Interrupt Controller (SIC) Peripheral Interrupt Event PLL Wakeup Interrupt DMA Error 0 (generic) DMAR0 Block Interrupt DMAR1 Block Interrupt DMAR0 Overflow Error DMAR1 Overflow Error PPI Error MAC Status SPORT0 Status SPORT1 Status Reserved Reserved UART0 Status UART1 Status RTC DMA Channel 0 (PPI/NFC) DMA 3 Channel (SPORT0 RX) DMA 4 Channel (SPORT0 TX) DMA 5 Channel (SPORT1 RX) DMA 6 Channel (SPORT1 TX) TWI DMA 7 Channel (SPI) DMA8 Channel (UART0 RX) DMA9 Channel (UART0 TX) General Purpose Interrupt (at RESET) IVG7 IVG7 IVG7 IVG7 IVG7 IVG7 IVG7 IVG7 IVG7 IVG7 IVG7 IVG7 IVG7 IVG7 IVG8 IVG8 IVG9 IVG9 IVG9 IVG9 IVG10 IVG10 IVG10 IVG10 Rev. PrG | Peripheral Interrupt ID 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Page 7 of 80 | February 2009 Default Core Interrupt ID SIC Registers 0 IAR0 IMASK0, ISR0, IWR0 0 IAR0 IMASK0, ISR0, IWR0 0 IAR0 IMASK0, ISR0, IWR0 0 IAR0 IMASK0, ISR0, IWR0 0 IAR0 IMASK0, ISR0, IWR0 0 IAR0 IMASK0, ISR0, IWR0 0 IAR0 IMASK0, ISR0, IWR0 0 IAR0 IMASK0, ISR0, IWR0 0 IAR1 IMASK0, ISR0, IWR0 0 IAR1 IMASK0, ISR0, IWR0 0 IAR1 IMASK0, ISR0, IWR0 0 IAR1 IMASK0, ISR0, IWR0 0 IAR1 IMASK0, ISR0, IWR0 0 IAR1 IMASK0, ISR0, IWR0 1 IAR1 IMASK0, ISR0, IWR0 1 IAR1 IMASK0, ISR0, IWR0 2 IAR2 IMASK0, ISR0, IWR0 2 IAR2 IMASK0, ISR0, IWR0 2 IAR2 IMASK0, ISR0, IWR0 2 IAR2 IMASK0, ISR0, IWR0 3 IAR2 IMASK0, ISR0, IWR0 3 IAR2 IMASK0, ISR0, IWR0 3 IAR2 IMASK0, ISR0, IWR0 3 IAR2 IMASK0, ISR0, IWR0 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 3. System Interrupt Controller (SIC) (Continued) Peripheral Interrupt Event DMA10 Channel (UART1 RX) DMA11 Channel (UART1 TX) OTP Memory Interrupt GP Counter DMA1 Channel (MAC RX/HOSTDP) Port H Interrupt A DMA2 Channel (MAC TX/NFC) Port H Interrupt B Timer 0 Timer 1 Timer 2 Timer 3 Timer 4 Timer 5 Timer 6 Timer 7 Port G Interrupt A Port G Interrupt B MDMA Stream 0 MDMA Stream 1 Software Watchdog Timer Port F Interrupt A Port F Interrupt B SPI Status NFC Status HOSTDP Status Host Read Done USB_EINT Interrupt USB_INT0 Interrupt USB_INT1 Interrupt USB_INT2 Interrupt USB_DMAINT Interrupt General Purpose Interrupt (at RESET) IVG10 IVG10 IVG11 IVG11 IVG11 IVG11 IVG11 IVG11 IVG12 IVG12 IVG12 IVG12 IVG12 IVG12 IVG12 IVG12 IVG12 IVG12 IVG13 IVG13 IVG13 IVG13 IVG13 IVG7 IVG7 IVG7 IVG7 IVG10 IVG10 IVG10 IVG10 IVG10 Peripheral Interrupt ID 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 Event Control The processor provides a very flexible mechanism to control the processing of events. In the CEC, three registers are used to coordinate and control events. Each register is 16 bits wide. • CEC interrupt latch register (ILAT) – Indicates when events have been latched. The appropriate bit is set when the processor has latched the event and cleared when the event has been accepted into the system. This register is updated automatically by the controller, but it may be written only when its corresponding IMASK bit is cleared. • CEC interrupt mask register (IMASK) – Controls the masking and unmasking of individual events. When a bit is set in the IMASK register, that event is unmasked and is processed by the CEC when asserted. A cleared bit in the Rev. PrG | Page 8 of 80 | Default Core Interrupt ID SIC Registers 3 IAR3 IMASK0, ISR0, IWR0 3 IAR3 IMASK0, ISR0, IWR0 4 IAR3 IMASK0, ISR0, IWR0 4 IAR3 IMASK0, ISR0, IWR0 4 IAR3 IMASK0, ISR0, IWR0 4 IAR3 IMASK0, ISR0, IWR0 4 IAR3 IMASK0, ISR0, IWR0 4 IAR3 IMASK0, ISR0, IWR0 5 IAR4 IMASK1, ISR1, IWR1 5 IAR4 IMASK1, ISR1, IWR1 5 IAR4 IMASK1, ISR1, IWR1 5 IAR4 IMASK1, ISR1, IWR1 5 IAR4 IMASK1, ISR1, IWR1 5 IAR4 IMASK1, ISR1, IWR1 5 IAR4 IMASK1, ISR1, IWR1 5 IAR4 IMASK1, ISR1, IWR1 5 IAR5 IMASK1, ISR1, IWR1 5 IAR5 IMASK1, ISR1, IWR1 6 IAR5 IMASK1, ISR1, IWR1 6 IAR5 IMASK1, ISR1, IWR1 6 IAR5 IMASK1, ISR1, IWR1 6 IAR5 IMASK1, ISR1, IWR1 6 IAR5 IMASK1, ISR1, IWR1 0 IAR5 IMASK1, ISR1, IWR1 0 IAR6 IMASK1, ISR1, IWR1 0 IAR6 IMASK1, ISR1, IWR1 0 IAR6 IMASK1, ISR1, IWR1 3 IAR6 IMASK1, ISR1, IWR1 3 IAR6 IMASK1, ISR1, IWR1 3 IAR6 IMASK1, ISR1, IWR1 3 IAR6 IMASK1, ISR1, IWR1 3 IAR6 IMASK1, ISR1, IWR1 IMASK register masks the event, preventing the processor from servicing the event even though the event may be latched in the ILAT register. This register may be read or written while in supervisor mode. (Note that general-purpose interrupts can be globally enabled and disabled with the STI and CLI instructions, respectively.) • CEC interrupt pending register (IPEND) – The IPEND register keeps track of all nested events. A set bit in the IPEND register indicates the event is currently active or nested at some level. This register is updated automatically by the controller but may be read while in supervisor mode. February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data The SIC allows further control of event processing by providing three pairs of 32-bit interrupt control and status registers. Each register contains a bit corresponding to each of the peripheral interrupt events shown in Table 3 on Page 7. • SIC interrupt mask registers (SIC_IMASKx) – Control the masking and unmasking of each peripheral interrupt event. When a bit is set in these registers, that peripheral event is unmasked and is processed by the system when asserted. A cleared bit in the register masks the peripheral event, preventing the processor from servicing the event. The 2-D DMA capability supports arbitrary row and column sizes up to 64K elements by 64K elements, and arbitrary row and column step sizes up to ±32K elements. Furthermore, the column step size can be less than the row step size, allowing implementation of interleaved data streams. This feature is especially useful in video applications where data can be deinterleaved on the fly. Examples of DMA types supported by the processor DMA controller include: • A single, linear buffer that stops upon completion • SIC interrupt status registers (SIC_ISRx) – As multiple peripherals can be mapped to a single event, these registers allow the software to determine which peripheral event source triggered the interrupt. A set bit indicates the peripheral is asserting the interrupt, and a cleared bit indicates the peripheral is not asserting the event. • A circular, auto-refreshing buffer that interrupts on each full or fractionally full buffer • SIC interrupt wakeup enable registers (SIC_IWRx) – By enabling the corresponding bit in these registers, a peripheral can be configured to wake up the processor, should the core be idled or in sleep mode when the event is generated. For more information see Dynamic Power Management on Page 14. In addition to the dedicated peripheral DMA channels, there are two memory DMA channels provided for transfers between the various memories of the processor system. This enables transfers of blocks of data between any of the memories—including external SDRAM, ROM, SRAM, and flash memory—with minimal processor intervention. Memory DMA transfers can be controlled by a very flexible descriptor-based methodology or by a standard register-based autobuffer mechanism. Because multiple interrupt sources can map to a single generalpurpose interrupt, multiple pulse assertions can occur simultaneously, before or during interrupt processing for an interrupt event already detected on this interrupt input. The IPEND register contents are monitored by the SIC as the interrupt acknowledgement. The appropriate ILAT register bit is set when an interrupt rising edge is detected (detection requires two core clock cycles). The bit is cleared when the respective IPEND register bit is set. The IPEND bit indicates that the event has entered into the processor pipeline. At this point the CEC recognizes and queues the next rising edge event on the corresponding event input. The minimum latency from the rising edge transition of the generalpurpose interrupt to the IPEND output asserted is three core clock cycles; however, the latency can be much higher, depending on the activity within and the state of the processor. DMA CONTROLLERS The processor has multiple, independent DMA channels that support automated data transfers with minimal overhead for the processor core. DMA transfers can occur between the processor's internal memories and any of its DMA-capable peripherals. Additionally, DMA transfers can be accomplished between any of the DMA-capable peripherals and external devices connected to the external memory interfaces, including the SDRAM controller and the asynchronous memory controller. DMA-capable peripherals include the Ethernet MAC, NFC, HOSTDP, USB, SPORTs, SPI port, UARTs, and PPI. Each individual DMA-capable peripheral has at least one dedicated DMA channel. • 1-D or 2-D DMA using a linked list of descriptors • 2-D DMA using an array of descriptors, specifying only the base DMA address within a common page The processor also has an external DMA controller capability via dual external DMA request pins when used in conjunction with the external bus interface unit (EBIU). This functionality can be used when a high speed interface is required for external FIFOs and high bandwidth communications peripherals such as USB 2.0. It allows control of the number of data transfers for memory DMA. The number of transfers per edge is programmable. This feature can be programmed to allow memory DMA to have an increased priority on the external bus relative to the core. HOST DMA PORT The host port interface allows an external host to be a DMA master to transfer data in and out of the device. The host device masters the transactions and the Blackfin is the DMA slave. The host port is enabled through the PAB interface. Once enabled, the DMA is controlled by the external host, which can then program the DMA to send/receive data to any valid internal or external memory location. The host port interface controller has the following features. The processor DMA controller supports both one-dimensional (1-D) and two-dimensional (2-D) DMA transfers. DMA transfer initialization can be implemented from registers or from sets of parameters called descriptor blocks. Rev. PrG | Page 9 of 80 | • Allows external master to configure DMA read/write data transfers and read port status. • Uses asynchronous memory protocol for external interface. • 8-/16-bit external data interface to host device. • Half duplex operation • Little-/big-endian data transfer. • Acknowledge mode allows flow control on host transactions. • Interrupt mode guarantees a burst of FIFO depth host transactions. February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data REAL-TIME CLOCK The real-time clock (RTC) provides a robust set of digital watch features, including current time, stopwatch, and alarm. The RTC is clocked by a 32.768 kHz crystal external to the Blackfin processor. The RTC peripheral has dedicated power supply pins so that it can remain powered up and clocked even when the rest of the processor is in a low-power state. The RTC provides several programmable interrupt options, including interrupt per second, minute, hour, or day clock ticks, interrupt on programmable stopwatch countdown, or interrupt at a programmed alarm time. The 32.768 kHz input clock frequency is divided down to a 1 Hz signal by a prescaler. The counter function of the timer consists of four counters: a 60-second counter, a 60-minute counter, a 24-hour counter, and an 32,768-day counter. When enabled, the alarm function generates an interrupt when the output of the timer matches the programmed value in the alarm control register. There are two alarms: The first alarm is for a time of day. The second alarm is for a day and time of that day. The stopwatch function counts down from a programmed value, with one-second resolution. When the stopwatch is enabled and the counter underflows, an interrupt is generated. Like the other peripherals, the RTC can wake up the processor from sleep mode upon generation of any RTC wakeup event. Additionally, an RTC wakeup event can wake up the processor from deep sleep mode or cause a transition from the hibernate state. Connect RTC pins RTXI and RTXO with external components as shown in Figure 4. RTXI expires before being reset by software. The programmer initializes the count value of the timer, enables the appropriate interrupt, then enables the timer. Thereafter, the software must reload the counter before it counts to zero from the programmed value. This protects the system from remaining in an unknown state where software, which would normally reset the timer, has stopped running due to an external noise condition or software error. If configured to generate a hardware reset, the watchdog timer resets both the core and the processor peripherals. After a reset, software can determine if the watchdog was the source of the hardware reset by interrogating a status bit in the watchdog timer control register. The timer is clocked by the system clock (SCLK), at a maximum frequency of fSCLK. TIMERS There are nine general-purpose programmable timer units in the processors. Eight timers have an external pin that can be configured either as a pulse width modulator (PWM) or timer output, as an input to clock the timer, or as a mechanism for measuring pulse widths and periods of external events. These timers can be synchronized to an external clock input to the several other associated PF pins, an external clock input to the PPI_CLK input pin, or to the internal SCLK. The timer units can be used in conjunction with the two UARTs to measure the width of the pulses in the data stream to provide a software auto-baud detect function for the respective serial channels. The timers can generate interrupts to the processor core providing periodic events for synchronization, either to the system clock or to a count of external signals. In addition to the eight general-purpose programmable timers, a ninth timer is also provided. This extra timer is clocked by the internal processor clock and is typically used as a system tick clock for generation of operating system periodic interrupts. RTXO R1 X1 C1 UP/DOWN COUNTER AND THUMBWHEEL INTERFACE C2 A 32-bit up/down counter is provided that can sense 2-bit quadrature or binary codes as typically emitted by industrial drives or manual thumb wheels. The counter can also operate in general-purpose up/down count modes. Then, count direction is either controlled by a level-sensitive input pin or by two edge detectors. SUGGESTED COMPONENTS: X1 = ECL IPTEK EC38J (THROUGH-HOLE PACKAGE) OR EPSON MC405 12 pF LOAD (SURFACE-MOUNT PACKAGE) C1 = 22 pF C2 = 22 pF R1 = 10 MΩ NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECI FIED FOR X1. CONTACT CRYSTAL MANUFACTURER FOR DETAILS. C1 AND C2 SPECIFICATIONS ASSUME BOARD TRACE CAPACITANCE OF 3 pF. A third input can provide flexible zero marker support and can alternatively be used to input the push-button signal of thumb wheels. All three pins have a programmable debouncing circuit. Figure 4. External Components for RTC WATCHDOG TIMER The processor includes a 32-bit timer that can be used to implement a software watchdog function. A software watchdog can improve system availability by forcing the processor to a known state through generation of a hardware reset, nonmaskable interrupt (NMI), or general-purpose interrupt, if the timer Rev. PrG | An internal signal forwarded to the timer unit enables one timer to measure the intervals between count events. Boundary registers enable auto-zero operation or simple system warning by interrupts when programmable count values are exceeded. Page 10 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data SERIAL PORTS The processors incorporate two dual-channel synchronous serial ports (SPORT0 and SPORT1) for serial and multiprocessor communications. The SPORTs support the following features: • I2S capable operation. • Bidirectional operation – Each SPORT has two sets of independent transmit and receive pins, enabling eight channels of I2S stereo audio. • Buffered (8-deep) transmit and receive ports – Each port has a data register for transferring data words to and from other processor components and shift registers for shifting data in and out of the data registers. • Clocking – Each transmit and receive port can either use an external serial clock or generate its own, in frequencies ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz. • Word length – Each SPORT supports serial data words from 3 to 32 bits in length, transferred most-significant-bit first or least-significant-bit first. • Framing – Each transmit and receive port can run with or without frame sync signals for each data word. Frame sync signals can be generated internally or externally, active high or low, and with either of two pulse widths and early or late frame sync. • Companding in hardware – Each SPORT can perform A-law or μ-law companding according to ITU recommendation G.711. Companding can be selected on the transmit and/or receive channel of the SPORT without additional latencies. SPI port provides a full-duplex, synchronous serial interface, which supports both master/slave modes and multimaster environments. The SPI port’s baud rate and clock phase/polarities are programmable, and it has an integrated DMA channel, configurable to support transmit or receive data streams. The SPI’s DMA channel can only service unidirectional accesses at any given time. The SPI port’s clock rate is calculated as: f SCLK SPI Clock Rate = -----------------------------------2 × SPI_BAUD Where the 16-bit SPI_BAUD register contains a value of 2 to 65,535. During transfers, the SPI port simultaneously transmits and receives by serially shifting data in and out on its two serial data lines. The serial clock line synchronizes the shifting and sampling of data on the two serial data lines. UART PORTS The processors provide two full-duplex universal asynchronous receiver/transmitter (UART) ports, which are fully compatible with PC-standard UARTs. Each UART port provides a simplified UART interface to other peripherals or hosts, supporting full-duplex, DMA-supported, asynchronous transfers of serial data. A UART port includes support for five to eight data bits, one or two stop bits, and none, even, or odd parity. Each UART port supports two modes of operation: • PIO (programmed I/O) – The processor sends or receives data by writing or reading I/O mapped UART registers. The data is double-buffered on both transmit and receive. • DMA operations with single-cycle overhead – Each SPORT can automatically receive and transmit multiple buffers of memory data. The processor can link or chain sequences of DMA transfers between a SPORT and memory. • DMA (direct memory access) – The DMA controller transfers both transmit and receive data. This reduces the number and frequency of interrupts required to transfer data to and from memory. The UART has two dedicated DMA channels, one for transmit and one for receive. These DMA channels have lower default priority than most DMA channels because of their relatively low service rates. • Interrupts – Each transmit and receive port generates an interrupt upon completing the transfer of a data word or after transferring an entire data buffer, or buffers, through DMA. • Multichannel capability – Each SPORT supports 128 channels out of a 1024-channel window and is compatible with the H.100, H.110, MVIP-90, and HMVIP standards. Each UART port's baud rate, serial data format, error code generation and status, and interrupts are programmable: • Supporting bit rates ranging from (fSCLK/1,048,576) to (fSCLK/16) bits per second. SERIAL PERIPHERAL INTERFACE (SPI) PORT • Supporting data formats from seven to 12 bits per frame. The processors have an SPI-compatible port that enables the processor to communicate with multiple SPI-compatible devices. • Both transmit and receive operations can be configured to generate maskable interrupts to the processor. The SPI interface uses three pins for transferring data: two data pins (Master Output-Slave Input, MOSI, and Master InputSlave Output, MISO) and a clock pin (serial clock, SCK). An SPI chip select input pin (SPISS) lets other SPI devices select the processor, and seven SPI chip select output pins (SPISEL7–1) let the processor select other SPI devices. The SPI select pins are reconfigured general-purpose I/O pins. Using these pins, the Rev. PrG | The UART port’s clock rate is calculated as: f SCLK UART Clock Rate = ----------------------------------------------16 × UART_Divisor Where the 16-bit UART_Divisor comes from the UART_DLH (most significant 8 bits) and UART_DLL (least significant 8 bits) registers. Page 11 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data • Frame status delivery to memory via DMA, including frame completion semaphores, for efficient buffer queue management in software. In conjunction with the general-purpose timer functions, autobaud detection is supported. The capabilities of the UARTs are further extended with support for the infrared data association (IrDA®) serial infrared physical layer link specification (SIR) protocol. • Tx DMA support for separate descriptors for MAC header and payload to eliminate buffer copy operations. • Convenient frame alignment modes support even 32-bit alignment of encapsulated Rx or Tx IP packet data in memory after the 14-byte MAC header. TWI CONTROLLER INTERFACE The processors include a two wire interface (TWI) module for providing a simple exchange method of control data between multiple devices. The TWI is compatible with the widely used I2C® bus standard. The TWI module offers the capabilities of simultaneous master and slave operation, support for both 7-bit addressing and multimedia data arbitration. The TWI interface utilizes two pins for transferring clock (SCL) and data (SDA) and supports the protocol at speeds up to 400k bits/sec. The TWI interface pins are compatible with 5 V logic levels. • Programmable Ethernet event interrupt supports any combination of: • Any selected Rx or Tx frame status conditions. • PHY interrupt condition. • Wakeup frame detected. • Any selected MAC management counter(s) at halffull. Additionally, the TWI module is fully compatible with serial camera control bus (SCCB) functionality for easier control of various CMOS camera sensor devices. • DMA descriptor error. • 47 MAC management statistics counters with selectable clear-on-read behavior and programmable interrupts on half maximum value. 10/100 ETHERNET MAC The ADSP-BF526 and ADSP-BF527 processors offer the capability to directly connect to a network by way of an embedded Fast Ethernet Media Access Controller (MAC) that supports both 10-BaseT (10M bits/sec) and 100-BaseT (100M bits/sec) operation. The 10/100 Ethernet MAC peripheral on the processor is fully compliant to the IEEE 802.3-2002 standard and it provides programmable features designed to minimize supervision, bus use, or message processing by the rest of the processor system. • Programmable Rx address filters, including a 64-bin address hash table for multicast and/or unicast frames, and programmable filter modes for broadcast, multicast, unicast, control, and damaged frames. • Advanced power management supporting unattended transfer of Rx and Tx frames and status to/from external memory via DMA during low-power sleep mode. • System wakeup from sleep operating mode upon magic packet or any of four user-definable wakeup frame filters. Some standard features are: • Support of MII and RMII protocols for external PHYs. • Support for 802.3Q tagged VLAN frames. • Full duplex and half duplex modes. • Programmable MDC clock rate and preamble suppression. • Data framing and encapsulation: generation and detection of preamble, length padding, and FCS. • In RMII operation, seven unused pins may be configured as GPIO pins for other purposes. • Media access management (in half-duplex operation): collision and contention handling, including control of retransmission of collision frames and of back-off timing. PORTS • Flow control (in full-duplex operation): generation and detection of PAUSE frames. Because of the rich set of peripherals, the processor groups the many peripheral signals to four ports—Port F, Port G, Port H, and Port J. Most of the associated pins are shared by multiple signals. The ports function as multiplexer controls. • Station management: generation of MDC/MDIO frames for read-write access to PHY registers. General-Purpose I/O (GPIO) • SCLK operating range down to 25 MHz (active and sleep operating modes). • Internal loopback from Tx to Rx. Some advanced features are: • Buffered crystal output to external PHY for support of a single crystal system. • Automatic checksum computation of IP header and IP payload fields of Rx frames. The processor has 48 bidirectional, general-purpose I/O (GPIO) pins allocated across three separate GPIO modules—PORTFIO, PORTGIO, and PORTHIO, associated with Port F, Port G, and Port H, respectively. Port J does not provide GPIO functionality. Each GPIO-capable pin shares functionality with other processor peripherals via a multiplexing scheme; however, the GPIO functionality is the default state of the device upon power-up. Neither GPIO output nor input drivers are active by • Independent 32-bit descriptor-driven Rx and Tx DMA channels. Rev. PrG | Page 12 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data default. Each general-purpose port pin can be individually controlled by manipulation of the port control, status, and interrupt registers: • GPIO direction control register – Specifies the direction of each individual GPIO pin as input or output. • GPIO control and status registers – The processor employs a “write one to modify” mechanism that allows any combination of individual GPIO pins to be modified in a single instruction, without affecting the level of any other GPIO pins. Four control registers are provided. One register is written in order to set pin values, one register is written in order to clear pin values, one register is written in order to toggle pin values, and one register is written in order to specify a pin value. Reading the GPIO status register allows software to interrogate the sense of the pins. • GPIO interrupt mask registers – The two GPIO interrupt mask registers allow each individual GPIO pin to function as an interrupt to the processor. Similar to the two GPIO control registers that are used to set and clear individual pin values, one GPIO interrupt mask register sets bits to enable interrupt function, and the other GPIO interrupt mask register clears bits to disable interrupt function. GPIO pins defined as inputs can be configured to generate hardware interrupts, while output pins can be triggered by software interrupts. • GPIO interrupt sensitivity registers – The two GPIO interrupt sensitivity registers specify whether individual pins are level- or edge-sensitive and specify—if edge-sensitive— whether just the rising edge or both the rising and falling edges of the signal are significant. One register selects the type of sensitivity, and one register selects which edges are significant for edge-sensitivity. PARALLEL PERIPHERAL INTERFACE (PPI) The processor provides a parallel peripheral interface (PPI) that can connect directly to parallel A/D and D/A converters, video encoders and decoders, and other general-purpose peripherals. The PPI consists of a dedicated input clock pin, up to three frame synchronization pins, and up to 16 data pins. The input clock supports parallel data rates up to half the system clock rate and the synchronization signals can be configured as either inputs or outputs. The PPI supports a variety of general-purpose and ITU-R 656 modes of operation. In general-purpose mode, the PPI provides half-duplex, bidirectional data transfer with up to 16 bits of data. Up to three frame synchronization signals are also provided. In ITU-R 656 mode, the PPI provides half-duplex bidirectional transfer of 8- or 10-bit video data. Additionally, on-chip decode of embedded start-of-line (SOL) and start-offield (SOF) preamble packets is supported. Rev. PrG | General-Purpose Mode Descriptions The general-purpose modes of the PPI are intended to suit a wide variety of data capture and transmission applications. Three distinct submodes are supported: 1. Input mode – Frame syncs and data are inputs into the PPI. 2. Frame capture mode – Frame syncs are outputs from the PPI, but data are inputs. 3. Output mode – Frame syncs and data are outputs from the PPI. Input Mode Input mode is intended for ADC applications, as well as video communication with hardware signaling. In its simplest form, PPI_FS1 is an external frame sync input that controls when to read data. The PPI_DELAY MMR allows for a delay (in PPI_CLK cycles) between reception of this frame sync and the initiation of data reads. The number of input data samples is user programmable and defined by the contents of the PPI_COUNT register. The PPI supports 8-bit and 10-bit through 16-bit data, programmable in the PPI_CONTROL register. Frame Capture Mode Frame capture mode allows the video source(s) to act as a slave (for frame capture for example). The ADSP-BF522/524/526 and ADSP-BF523/525/527 processors control when to read from the video source(s). PPI_FS1 is an HSYNC output and PPI_FS2 is a VSYNC output. Output Mode Output mode is used for transmitting video or other data with up to three output frame syncs. Typically, a single frame sync is appropriate for data converter applications, whereas two or three frame syncs could be used for sending video with hardware signaling. ITU-R 656 Mode Descriptions The ITU-R 656 modes of the PPI are intended to suit a wide variety of video capture, processing, and transmission applications. Three distinct submodes are supported: 1. Active video only mode 2. Vertical blanking only mode 3. Entire field mode Active Video Mode Active video only mode is used when only the active video portion of a field is of interest and not any of the blanking intervals. The PPI does not read in any data between the end of active video (EAV) and start of active video (SAV) preamble symbols, or any data present during the vertical blanking intervals. In this mode, the control byte sequences are not stored to memory; they are filtered by the PPI. After synchronizing to the start of Field 1, the PPI ignores incoming samples until it sees an SAV code. The user specifies the number of active video lines per frame (in PPI_COUNT register). Page 13 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data In this mode, the PPI only transfers vertical blanking interval (VBI) data. processor enters the hibernate state. Control of clocking to each of the processor peripherals also reduces power consumption. See Table 4 for a summary of the power settings for each mode. Entire Field Mode Full-On Operating Mode—Maximum Performance In this mode, the entire incoming bit stream is read in through the PPI. This includes active video, control preamble sequences, and ancillary data that may be embedded in horizontal and vertical blanking intervals. Data transfer starts immediately after synchronization to Field 1. Data is transferred to or from the synchronous channels through eight DMA engines that work autonomously from the processor core. In the full-on mode, the PLL is enabled and is not bypassed, providing capability for maximum operational frequency. This is the power-up default execution state in which maximum performance can be achieved. The processor core and all enabled peripherals run at full speed. USB ON-THE-GO DUAL-ROLE DEVICE CONTROLLER In the active mode, the PLL is enabled but bypassed. Because the PLL is bypassed, the processor’s core clock (CCLK) and system clock (SCLK) run at the input clock (CLKIN) frequency. DMA access is available to appropriately configured L1 memories. Vertical Blanking Interval Mode The USB clock (USB_XI) is provided through a dedicated external crystal or crystal oscillator. See Universal Serial Bus (USB) On-The-Go—Receive and Transmit Timing on Page 54 for related timing requirements. If using a crystal to provide the USB clock, use a parallel-resonant, fundamental mode, microprocessor-grade crystal. The USB on-the-go dual-role device controller includes a phase locked loop with programmable multipliers to generate the necessary internal clocking frequency for USB. The multiplier value should be programmed based on the USB_XI frequency to achieve the necessary 480 MHz internal clock for USB high speed operation. For example, for a USB_XI crystal frequency of 24 MHz, the USB_PLLOSC_CTRL register should be programmed with a multiplier value of 20 to generate a 480 MHz internal clock. Active Operating Mode—Moderate Dynamic Power Savings In the active mode, it is possible to disable the control input to the PLL by setting the PLL_OFF bit in the PLL control register. This register can be accessed with a user-callable routine in the on-chip ROM called bfrom_SysControl(). If disabled, the PLL control input must be re-enabled before transitioning to the full-on or sleep modes. Table 4. Power Settings PLL Mode/State PLL Bypassed Full On Enabled No Active Enabled/ Yes Disabled Sleep Enabled — Deep Sleep Disabled — Hibernate Disabled — CODE SECURITY WITH LOCKBOX SECURE TECHNOLOGY A security system consisting of a blend of hardware and software provides customers with a flexible and rich set of code security features with Lockbox secure technology. Key features include: • OTP memory • Unique chip ID Core Clock (CCLK) Enabled Enabled System Clock (SCLK) Enabled Enabled Core Power On On Disabled Enabled On Disabled Disabled On Disabled Disabled Off For more information about PLL controls, see the “Dynamic Power Management” chapter in the ADSP-BF542x Blackfin Processor Hardware Reference. Sleep Operating Mode—High Dynamic Power Savings • Code authentication • Secure mode of operation The security scheme is based upon the concept of authentication of digital signatures using standards-based algorithms and provides a secure processing environment in which to execute code and protect assets. See Lockbox Secure Technology Disclaimer on Page 21. DYNAMIC POWER MANAGEMENT The processor provides five operating modes, each with a different performance/power profile. In addition, dynamic power management provides the control functions to dynamically alter the processor core supply voltage, further reducing power dissipation. When configured for a 0 volt core supply voltage, the Rev. PrG | The sleep mode reduces dynamic power dissipation by disabling the clock to the processor core (CCLK). The PLL and system clock (SCLK), however, continue to operate in this mode. Typically an external event or RTC activity wakes up the processor. When in the sleep mode, asserting a wakeup enabled in the SIC_IWRx registers causes the processor to sense the value of the BYPASS bit in the PLL control register (PLL_CTL). If BYPASS is disabled, the processor transitions to the full on mode. If BYPASS is enabled, the processor transitions to the active mode. System DMA access to L1 memory is not supported in sleep mode. Page 14 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Deep Sleep Operating Mode—Maximum Dynamic Power Savings The deep sleep mode maximizes dynamic power savings by disabling the clocks to the processor core (CCLK) and to all synchronous peripherals (SCLK). Asynchronous peripherals, such as the RTC, may still be running but cannot access internal resources or external memory. This powered-down mode can only be exited by assertion of the reset interrupt (RESET) or by an asynchronous interrupt generated by the RTC. When in deep sleep mode, an RTC asynchronous interrupt causes the processor to transition to the Active mode. Assertion of RESET while in deep sleep mode causes the processor to transition to the full on mode. the internal logic of the processor into its own power domain, separate from the RTC and other I/O, the processor can take advantage of dynamic power management without affecting the RTC or other I/O devices. There are no sequencing requirements for the various power domains, but all domains must be powered according to the appropriate Specifications table for processor Operating Conditions; even if the feature/peripheral is not used. Table 5. Power Domains Power Domain All internal logic, except RTC, Memory, USB, OTP RTC internal logic and crystal I/O Memory logic USB PHY logic OTP logic All other I/O Hibernate State—Maximum Static Power Savings The hibernate state maximizes static power savings by disabling the voltage and clocks to the processor core (CCLK) and to all of the synchronous peripherals (SCLK). The internal voltage regulator (ADSP-BF523/525/527 only) for the processor can be shut off by writing b#00 to the FREQ bits of the VR_CTL register. This setting sets the internal power supply voltage (VDDINT) to 0 V to provide the lowest static power dissipation. Any critical information stored internally (for example, memory contents, register contents, and other information) must be written to a non-volatile storage device prior to removing power if the processor state is to be preserved. Writing b#00 to the FREQ bits also causes EXT_WAKE0 and EXT_WAKE1 to transition low, which can be used to signal an external voltage regulator to shut down. Since VDDEXT and VDDMEM can still be supplied in this mode, all of the external pins three-state, unless otherwise specified. This allows other devices that may be connected to the processor to still have power applied without drawing unwanted current. The Ethernet or USB modules can wake up the internal supply regulator (ADSP-BF525 and ADSP-BF527 only) or signal an external regulator to wake up using EXT_WAKE0 or EXT_WAKE1. If PG15 does not connect as a PHYINT signal to an external PHY device, PG15 can be pulled low by any other device to wake the processor up. The processor can also be woken up by a real-time clock wakeup event or by asserting the RESET pin. All hibernate wakeup events initiate the hardware reset sequence. Individual sources are enabled by the VR_CTL register. The EXT_WAKEx signals are provided to indicate the occurrence of wakeup events. As long as VDDEXT is applied, the VR_CTL register maintains its state during hibernation. All other internal registers and memories, however, lose their content in the hibernate state. State variables may be held in external SRAM or SDRAM. The SCKELOW bit in the VR_CTL register controls whether or not SDRAM operates in self-refresh mode, which allows it to retain its content while the processor is in hibernate and through the subsequent reset sequence. Power Savings As shown in Table 5, the processor supports six different power domains, which maximizes flexibility while maintaining compliance with industry standards and conventions. By isolating Rev. PrG | VDD Range VDDINT VDDRTC VDDMEM VDDUSB VDDOTP VDDEXT The dynamic power management feature of the processor allows both the processor’s input voltage (VDDINT) and clock frequency (fCCLK) to be dynamically controlled. The power dissipated by a processor is largely a function of its clock frequency and the square of the operating voltage. For example, reducing the clock frequency by 25% results in a 25% reduction in dynamic power dissipation, while reducing the voltage by 25% reduces dynamic power dissipation by more than 40%. Further, these power savings are additive, in that if the clock frequency and supply voltage are both reduced, the power savings can be dramatic, as shown in the following equations. Power Savings Factor V DDINTRED 2 f CCLKRED T RED = -------------------------- × -------------------------------- × --------------- f CCLKNOM V DDINTNOM T NOM % Power Savings = ( 1 – Power Savings Factor ) × 100% where the variables in the equations are: fCCLKNOM is the nominal core clock frequency fCCLKRED is the reduced core clock frequency VDDINTNOM is the nominal internal supply voltage VDDINTRED is the reduced internal supply voltage TNOM is the duration running at fCCLKNOM TRED is the duration running at fCCLKRED ADSP-BF523/525/527 VOLTAGE REGULATION The ADSP-BF523/525/527 provides an on-chip voltage regulator that can generate processor core voltage levels from an external supply. Figure 5 shows the typical external components required to complete the power management system. The regulator controls the internal logic voltage levels and is programmable with the voltage regulator control register (VR_CTL) in increments of 50 mV. To reduce standby power Page 15 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data consumption, the internal voltage regulator can be programmed to remove power to the processor core while keeping I/O power supplied. While in the hibernate state, all external supplies (VDDEXT, VDDMEM, VDDUSB, VDDOTP) can still be applied, eliminating the need for external buffers. VDDRTC must be applied at all times for correct hibernate operation. The voltage regulator can be activated from this power down state either through an RTC wakeup, a USB wakeup, an ethernet wakeup, or by asserting the RESET pin, each of which then initiates a boot sequence. The regulator can also be disabled and bypassed at the user’s discretion. 2.25V TO 3.6V INPUT VOLTAGE RANGE VDDEXT (LOW-INDUCTANCE) SET OF DECOUPLING CAPACITORS VDDEXT + 100μF 100μF 10μH 100nF VDDINT + + FDS9431A 10μ F LOW ESR ZHCS1000 ADSP-BF522/524/526 VOLTAGE REGULATION The ADSP-BF522/524/526 processor requires an external voltage regulator to power the VDDINT domain. To reduce standby power consumption, the external voltage regulator can be signaled through EXT_WAKE0 or EXT_WAKE1 to remove power from the processor core. These identical signals are high-true for power-up and may be connected directly to the low-true shut down input of many common regulators. While in the hibernate state, all external supplies (VDDEXT, VDDMEM, VDDUSB, VDDOTP) can still be applied, eliminating the need for external buffers. VDDRTC must be applied at all times for correct hibernate operation. The external voltage regulator can be activated from this power down state either through an RTC wakeup, a USB wakeup, an ethernet wakeup, or by asserting the RESET pin, each of which then initiates a boot sequence. EXT_WAKE0 or EXT_WAKE1 indicate a wakeup to the external voltage regulator. The Power Good (PG) input signal allows the processor to start only after the internal voltage has reached a chosen level. In this way, the startup time of the external regulator is detected after hibernation. For a complete description of the Power Good functionality, refer to the ADSP-BF52x Blackfin Processor Hardware Reference. SS/PG 100μF CLOCK SIGNALS VROUT SHORT AND LOWINDUCTANCE WIRE EXT_WAKE1 SEE H/W REFERENCE, SYSTEM DESIGN CHAPTER, TO DETERMINE VALUE VRSEL If an external clock is used, it should be a TTL compatible signal and must not be halted, changed, or operated below the specified frequency during normal operation. This signal is connected to the processor’s CLKIN pin. When an external clock is used, the XTAL pin must be left unconnected. GND NOTE: DESIGNER SHOULD MINIMIZE TRACE LENGTH TO FDS9431A. Figure 5. ADSP-BF523/525/527 Voltage Regulator Circuit The voltage regulator has two modes set by the VRSEL pin—the normal pulse width control of an external FET and the external supply mode which can signal a power down during hibernate to an external regulator. Set VRSEL to VDDEXT to use an external regulator or set VRSEL to GND to use the internal regulator. In the external mode VROUT becomes EXT_WAKE1. If the internal regulator is used, EXT_WAKE0 can control other power sources in the system during the hibernate state. Both signals are high-true for power-up and may be connected directly to the low-true shut down input of many common regulators. The mode of the SS/PG (Soft Start/Power Good) signal also changes according to the state of VRSEL. When using an internal regulator, the SS/PG pin is Soft Start, and when using an external regulator, it is Power Good. The Soft Start feature is recommended to reduce the inrush currents and to reduce VDDINT voltage overshoot when coming out of hibernate or changing voltage levels. The Power Good (PG) input signal allows the processor to start only after the internal voltage has reached a chosen level. In this way, the startup time of the external regulator is detected after hibernation. For a complete description of Soft Start and Power Good functionality, refer to the ADSPBF52x Blackfin Processor Hardware Reference. Rev. PrG | The processor can be clocked by an external crystal, a sine wave input, or a buffered, shaped clock derived from an external clock oscillator. Alternatively, because the processor includes an on-chip oscillator circuit, an external crystal may be used. For fundamental frequency operation, use the circuit shown in Figure 6. A parallel-resonant, fundamental frequency, microprocessor-grade crystal is connected across the CLKIN and XTAL pins. The onchip resistance between CLKIN and the XTAL pin is in the 500 kΩ range. Further parallel resistors are typically not recommended. The two capacitors and the series resistor shown in Figure 6 fine tune phase and amplitude of the sine frequency. The capacitor and resistor values shown in Figure 6 are typical values only. The capacitor values are dependent upon the crystal manufacturers’ load capacitance recommendations and the PCB physical layout. The resistor value depends on the drive level Page 16 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data specified by the crystal manufacturer. The user should verify the customized values based on careful investigations on multiple devices over temperature range. SDRAM interface, but it functions as a reference signal in other timing specifications as well. While active by default, it can be disabled using the EBIU_SDGCTL and EBIU_AMGCTL registers. BLACKFIN “FINE” ADJUSTMENT REQUIRES PLL SEQUENCING CLKOUT TO PLL CIRCUITRY “COARSE” ADJUSTMENT ON-THE-FLY EN CLKBUF 560 ⍀ PLL 0.5× to 64× CLKIN EN CLKIN CCLK ÷ 1 to 15 SCLK VCO XTAL 330 ⍀* 18 pF * ÷ 1, 2, 4, 8 FOR OVERTONE OPERATION ONLY: SCLK ≤ CCLK SCLK ≤ 133 MHz 18 pF * Figure 7. Frequency Modification Methods NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED, DEPENDING ON THE CRYSTAL AND LAYOUT. PLEASE ANALYZE CAREFULLY. FOR FREQUENCIES ABOVE 33 MHz, THE SUGGESTED CAPACITOR VALUE OF 18 pF SHOULD BE TREATED AS A MAXIMUM, AND THE SUGGESTED RESISTOR VALUE SHOULD BE REDUCED TO 0 ⍀. Figure 6. External Crystal Connections A third-overtone crystal can be used for frequencies above 25 MHz. The circuit is then modified to ensure crystal operation only at the third overtone, by adding a tuned inductor circuit as shown in Figure 6. A design procedure for third-overtone operation is discussed in detail in application note (EE-168) Using Third Overtone Crystals with the ADSP-218x DSP on the Analog Devices website (www.analog.com)—use site search on “EE-168.” The CLKBUF pin is an output pin, which is a buffered version of the input clock. This pin is particularly useful in Ethernet applications to limit the number of required clock sources in the system. In this type of application, a single 25 MHz or 50 MHz crystal may be applied directly to the processor. The 25 MHz or 50 MHz output of CLKBUF can then be connected to an external Ethernet MII or RMII PHY device. If instead of a crystal, an external oscillator is used at CLKIN, CLKBUF will not have the 40/60 duty cycle required by some devices. The CLKBUF output is active by default and can be disabled for power savings reasons using the VR_CTL register. The Blackfin core runs at a different clock rate than the on-chip peripherals. As shown in Figure 7, the core clock (CCLK) and system peripheral clock (SCLK) are derived from the input clock (CLKIN) signal. An on-chip PLL is capable of multiplying the CLKIN signal by a programmable 0.5× to 64× multiplication factor (bounded by specified minimum and maximum VCO frequencies). The default multiplier is 10×, but it can be modified by a software instruction sequence. All on-chip peripherals are clocked by the system clock (SCLK). The system clock frequency is programmable by means of the SSEL3–0 bits of the PLL_DIV register. The values programmed into the SSEL fields define a divide ratio between the PLL output (VCO) and the system clock. SCLK divider values are 1 through 15. Table 6 illustrates typical system clock ratios. Note that the divisor ratio must be chosen to limit the system clock frequency to its maximum of fSCLK. The SSEL value can be changed dynamically without any PLL lock latencies by writing the appropriate values to the PLL divisor register (PLL_DIV). Table 6. Example System Clock Ratios Signal Name SSEL3–0 0001 0110 1010 | Example Frequency Ratios (MHz) VCO SCLK 100 100 300 50 500 50 The core clock (CCLK) frequency can also be dynamically changed by means of the CSEL1–0 bits of the PLL_DIV register. Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in Table 7. This programmable core clock capability is useful for fast core frequency modifications. Table 7. Core Clock Ratios On-the-fly frequency changes can be effected by simply writing to the PLL_DIV register. The maximum allowed CCLK and SCLK rates depend on the applied voltages VDDINT, VDDEXT, and VDDMEM; the VCO is always permitted to run up to the frequency specified by the part’s speed grade. The CLKOUT pin reflects the SCLK frequency to the off-chip world. It is part of the Rev. PrG Divider Ratio VCO/SCLK 1:1 6:1 10:1 Page 17 of 80 | Signal Name CSEL1–0 00 01 10 11 February 2009 Divider Ratio VCO/CCLK 1:1 2:1 4:1 8:1 Example Frequency Ratios (MHz) VCO CCLK 300 300 300 150 500 125 200 25 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data The maximum CCLK frequency not only depends on the part's speed grade (see Page 80), it also depends on the applied VDDINT voltage. See Table 12 and Table 15 for details. The maximal system clock rate (SCLK) depends on the chip package and the applied VDDINT, VDDEXT, and VDDMEM voltages (see Table 14 and Table 17). BOOTING MODES The processor has several mechanisms (listed in Table 8) for automatically loading internal and external memory after a reset. The boot mode is defined by four BMODE input pins dedicated to this purpose. There are two categories of boot modes. In master boot modes the processor actively loads data from parallel or serial memories. In slave boot modes the processor receives data from external host devices. The boot modes listed in Table 8 provide a number of mechanisms for automatically loading the processor’s internal and external memories after a reset. By default, all boot modes use the slowest meaningful configuration settings. Default settings can be altered via the initialization code feature at boot time or by proper OTP programming at pre-boot time. The BMODE pins of the reset configuration register, sampled during poweron resets and software-initiated resets, implement the modes shown in Table 8. Table 8. Booting Modes BMODE3–0 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Description Idle - No boot Boot from 8- or 16-bit external flash memory Boot from 16-bit asynchronous FIFO Boot from serial SPI memory (EEPROM or flash) Boot from SPI host device Boot from serial TWI memory (EEPROM/flash) Boot from TWI host Boot from UART0 Host Boot from UART1 Host Reserved Boot from SDRAM Boot from OTP memory Boot from 8-bit NAND flash via NFC using PORTF data pins Boot from 8-bit NAND flash via NFC using PORTH data pins Boot from 16-Bit Host DMA Boot from 8-Bit Host DMA • Idle/no boot mode (BMODE = 0x0) — In this mode, the processor goes into idle. The idle boot mode helps recover from illegal operating modes, such as when the OTP memory has been misconfigured. • Boot from 8-bit or 16-bit external flash memory (BMODE = 0x1) — In this mode, the boot kernel loads the first block header from address 0x2000 0000, and (depending on instructions contained in the header) the boot Rev. PrG | Page 18 of 80 | kernel performs an 8- or 16-bit boot or starts program execution at the address provided by the header. By default, all configuration settings are set for the slowest device possible (3-cycle hold time, 15-cycle R/W access times, 4-cycle setup). The ARDY is not enabled by default, but it can be enabled through OTP programming. Similarly, all interface behavior and timings can be customized through OTP programming. This includes activation of burst-mode or page-mode operation. In this mode, all asynchronous interface signals are enabled at the port muxing level. • Boot from 16-bit asynchronous FIFO (BMODE = 0x2) — In this mode, the boot kernel starts booting from address 0x2030 0000. Every 16-bit word that the boot kernel has to read from the FIFO must be requested by placing a low pulse on the DMAR1 pin. • Boot from serial SPI memory, EEPROM or flash (BMODE = 0x3) — 8-, 16-, 24-, or 32-bit addressable devices are supported. The processor uses the PG1 GPIO pin to select a single SPI EEPROM/flash device and submits a read command and successive address bytes (0x00) until a valid 8-, 16-, 24-, or 32-bit addressable device is detected. Pull-up resistors are required on the SPISEL1 and MISO pins. By default, a value of 0x85 is written to the SPI_BAUD register. • Boot from SPI host device (BMODE = 0x4) — The processor operates in SPI slave mode and is configured to receive the bytes of the LDR file from an SPI host (master) agent. The HWAIT signal must be interrogated by the host before every transmitted byte. A pull-up resistor is required on the SPISS input. A pull-down on the serial clock (SCK) may improve signal quality and booting robustness. • Boot from serial TWI memory, EEPROM/flash (BMODE = 0x5) — The processor operates in master mode and selects the TWI slave connected to the TWI with the unique ID 0xA0. The processor submits successive read commands to the memory device starting at internal address 0x0000 and begins clocking data into the processor. The TWI memory device should comply with the Philips I2C® Bus Specification version 2.1 and should be able to auto-increment its internal address counter such that the contents of the memory device can be read sequentially. By default, a PRESCALE value of 0xA and a TWI_CLKDIV value of 0x0811 are used. Unless altered by OTP settings, an I2C memory that takes two address bytes is assumed. The development tools ensure that data booted to memories that cannot be accessed by the Blackfin core is written to an intermediate storage location and then copied to the final destination via memory DMA. • Boot from TWI host (BMODE = 0x6) — The TWI host selects the slave with the unique ID 0x5F. The processor replies with an acknowledgement and the host then downloads the boot stream. The TWI host agent should comply with the Philips I2C Bus Specification February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data version 2.1. An I2C multiplexer can be used to select one processor at a time when booting multiple processors from a single TWI. • Boot from UART0 host on Port G (BMODE = 0x7) — Using an autobaud handshake sequence, a boot-stream formatted program is downloaded by the host. The host selects a bit rate within the UART clocking capabilities. When performing the autobaud, the UART expects a “@” (0x40) character (eight bits data, one start bit, one stop bit, no parity bit) on the UART0RX pin to determine the bit rate. The UART then replies with an acknowledgement composed of 4 bytes (0xBF, the value of UART0_DLL, the value of UART0_DLH, then 0x00). The host can then download the boot stream. To hold off the host the Blackfin processor signals the host with the boot host wait (HWAIT) signal. Therefore, the host must monitor HWAIT before every transmitted byte. • Boot from UART1 host on Port F (BMODE = 0x8). Same as BMODE = 0x7 except that the UART1 port is used. • Boot from SDRAM (BMODE = 0xA) This is a warm boot scenario, where the boot kernel starts booting from address 0x0000 0010. The SDRAM is expected to contain a valid boot stream and the SDRAM controller must be configured by the OTP settings. • Boot from OTP memory (BMODE = 0xB) — This provides a stand-alone booting method. The boot stream is loaded from on-chip OTP memory. By default, the boot stream is expected to start from OTP page 0x40 and can occupy all public OTP memory up to page 0xDF. This is 2560 bytes. Since the start page is programmable, the maximum size of the boot stream can be extended to 3072 bytes. Parameter D1:D0 Page Size (excluding spare area) D2 Spare Area Size D5:D4 Block Size (excluding spare area) D6 Bus width BMODE = 0xC, the processor configures PORTF GPIO pins PF7:0 for the NAND data pins and PORTH pins PH15:10 for the NAND control signals. BMODE = 0xD, the processor configures PORTH GPIO pins PH7:0 for the NAND data pins and PORTH pins PH15:10 for the NAND control signals. For correct device operation pull-up resistors are required on both ND_CE (PH10) and ND_BUSY (PH13) signals. By default, a value of 0x0033 is written to the NFC_CTL register. The booting procedure always starts by booting from byte 0 of block 0 of the NAND flash device. NAND flash boot supports the following features: —Device Auto Detection —Error Detection & Correction for maximum reliability —No boot stream size limitation —Peripheral DMA providing efficient transfer of all data (excluding the ECC parity data) —Software-configurable boot mode for booting from boot streams spanning multiple blocks, including bad blocks —Software-configurable boot mode for booting from multiple copies of the boot stream, allowing for handling of bad blocks and uncorrectable errors —Configurable timing via OTP memory Small page NAND flash devices must have a 512-byte page size, 32 pages per block, a 16-byte spare area size, and a bus configuration of 8 bits. By default, all read requests from the NAND flash are followed by four address cycles. If the NAND flash device requires only three address cycles, the device must be capable of ignoring the additional address cycles. Table 9. Fourth Byte for Large Page Devices Bit • Boot from 8-bit external NAND flash memory (BMODE = 0xC and BMODE = 0xD) — In this mode, auto detection of the NAND flash device is performed. Value Meaning 00 01 10 11 1K byte 2K byte 4K byte 8K byte 00 01 8 byte/512 byte 16 byte/512 byte 00 01 10 11 64K byte 128K byte 256K byte 512K byte 00 01 x8 not supported The small page NAND flash device must comply with the following command set: —Reset: 0xFF —Read lower half of page: 0x00 —Read upper half of page: 0x01 —Read spare area: 0x50 For large-page NAND-flash devices, the four-byte electronic signature is read in order to configure the kernel for booting, which allows support for multiple large-page devices. The fourth byte of the electronic signature must comply with the specification in Table 9. D3, D7 Not Used for configuration Any NAND flash array configuration from Table 9, excluding 16-bit devices, that also complies with the command set listed below are directly supported by the boot kernel. There are no restrictions on the page size or block size as imposed by the small-page boot kernel. Rev. PrG | Page 19 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data troller, which then returns using an RTS instruction. The routine may also by the final application, which will never return to the boot kernel. For devices consisting of a five-byte signature, only four are read. The fourth must comply as outlined above. Large page devices must support the following command set: —Reset: 0xFF —Read Electronic Signature: 0x90 —Read: 0x00, 0x30 (confirm command) Large-page devices must not support or react to NAND flash command 0x50. This is a small-page NAND flash command used for device auto detection. By default, the boot kernel will always issue five address cycles; therefore, if a large page device requires only four cycles, the device must be capable of ignoring the additional address cycles. • Boot from 16-Bit Host DMA (BMODE = 0xE) — In this mode, the host DMA port is configured in 16-bit Acknowledge mode, with little endian data formatting. Unlike other modes, the host is responsible for interpreting the boot stream. It writes data blocks individually into the Host DMA port. Before configuring the DMA settings for each block, the host may either poll the ALLOW_CONFIG bit in HOST_STATUS or wait to be interrupted by the HWAIT signal. When using HWAIT, the host must still check ALLOW_CONFIG at least once before beginning to configure the Host DMA Port. After completing the configuration, the host is required to poll the READY bit in HOST_STATUS before beginning to transfer data. When the host sends an HIRQ control command, the boot kernel issues a CALL instruction to address 0xFFA0 0000. It is the host's responsibility to ensure that valid code has been placed at this address. The routine at 0xFFA0 0000 can be a simple initialization routine to configure internal resources, such as the SDRAM controller, which then returns using an RTS instruction. The routine may also by the final application, which will never return to the boot kernel. • Boot from 8-Bit Host DMA (BMODE = 0xF) — In this mode, the Host DMA port is configured in 8-bit interrupt mode, with little endian data formatting. Unlike other modes, the host is responsible for interpreting the boot stream. It writes data blocks individually into the Host DMA port. Before configuring the DMA settings for each block, the host may either poll the ALLOW_CONFIG bit in HOST_STATUS or wait to be interrupted by the HWAIT signal. When using HWAIT, the host must still check ALLOW_CONFIG at least once before beginning to configure the Host DMA Port. The host will receive an interrupt from the HOST_ACK signal every time it is allowed to send the next FIFO depths worth (sixteen 32-bit words) of information. When the host sends an HIRQ control command, the boot kernel issues a CALL instruction to address 0xFFA0 0000. It is the host's responsibility to ensure valid code has been placed at this address. The routine at 0xFFA0 0000 can be a simple initialization routine to configure internal resources, such as the SDRAM con- Rev. PrG | For each of the boot modes, a 16-byte header is first read from an external memory device. The header specifies the number of bytes to be transferred and the memory destination address. Multiple memory blocks may be loaded by any boot sequence. Once all blocks are loaded, program execution commences from the address stored in the EVT1 register. Prior to booting, the pre-boot routine interrogates the OTP memory. Individual boot modes can be customized or even disabled based on OTP programming. External hardware, especially booting hosts, may watch the HWAIT signal to determine when the pre-boot has finished and the boot kernel starts the boot process. By programming OTP memory, the user can also instruct the pre-boot routine to customize the PLL, Internal Voltage Regulator (ADSP-BF523/525/527 only), SDRAM Controller, and Asynchronous Memory Controller. The boot kernel differentiates between a regular hardware reset and a wakeup-from-hibernate event to speed up booting in the later case. Bits 6-4 in the system reset configuration (SYSCR) register can be used to bypass the pre-boot routine and/or boot kernel in case of a software reset. They can also be used to simulate a wakeup-from-hibernate boot in the software reset case. The boot process can be further customized by “initialization code.” This is a piece of code that is loaded and executed prior to the regular application boot. Typically, this is used to configure the SDRAM controller or to speed up booting by managing the PLL, clock frequencies, wait states, or serial bit rates. The boot ROM also features C-callable function that can be called by the user application at run time. This enables secondstage boot or boot management schemes to be implemented with ease. INSTRUCTION SET DESCRIPTION The Blackfin processor family assembly language instruction set employs an algebraic syntax designed for ease of coding and readability. The instructions have been specifically tuned to provide a flexible, densely encoded instruction set that compiles to a very small final memory size. The instruction set also provides fully featured multifunction instructions that allow the programmer to use many of the processor core resources in a single instruction. Coupled with many features more often seen on microcontrollers, this instruction set is very efficient when compiling C and C++ source code. In addition, the architecture supports both user (algorithm/application code) and supervisor (O/S kernel, device drivers, debuggers, ISRs) modes of operation, allowing multiple levels of access to core processor resources. Page 20 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data The assembly language, which takes advantage of the processor’s unique architecture, offers the following advantages: • Seamlessly integrated DSP/MCU features are optimized for both 8-bit and 16-bit operations. • A multi-issue load/store modified-Harvard architecture, which supports two 16-bit MAC or four 8-bit ALU + two load/store + two pointer updates per cycle. • All registers, I/O, and memory are mapped into a unified 4G byte memory space, providing a simplified programming model. Reference on the Analog Devices website (www.analog.com)— use site search on “EE-68.” This document is updated regularly to keep pace with improvements to emulator support. RELATED DOCUMENTS The following publications that describe the ADSPBF522/524/526 and ADSP-BF523/525/527 processors (and related processors) can be ordered from any Analog Devices sales office or accessed electronically on our website: • Getting Started With Blackfin Processors • ADSP-BF52x Blackfin Processor Hardware Reference (volumes 1 and 2) • Microcontroller features, such as arbitrary bit and bit-field manipulation, insertion, and extraction; integer operations on 8-, 16-, and 32-bit data-types; and separate user and supervisor stack pointers. • Code density enhancements, which include intermixing of 16-bit and 32-bit instructions (no mode switching, no code segregation). Frequently used instructions are encoded in 16 bits. DEVELOPMENT TOOLS The processor is supported with a complete set of CROSSCORE® software and hardware development tools, including Analog Devices emulators and VisualDSP++® development environment. The same emulator hardware that supports other Blackfin processors also fully emulates the ADSP-BF522/524/526 and ADSP-BF523/525/527 processors. EZ-KIT Lite® Evaluation Board For evaluation of ADSP-BF522/524/526 and ADSP-BF523/525/527 processors, use the EZ-KIT Lite boards available from Analog Devices. Order using part numbers ADZS-BF526-EZLITE or ADZS-BF527-EZLITE. The boards come with on-chip emulation capabilities and is equipped to enable software development. Multiple daughter cards are available. • Blackfin Processor Programming Reference • ADSP-BF522/524/526 Blackfin Processor Anomaly List • ADSP-BF523/525/527 Blackfin Processor Anomaly List LOCKBOX SECURE TECHNOLOGY DISCLAIMER Analog Devices products containing Lockbox Secure Technology are warranted by Analog Devices as detailed in the Analog Devices Standard Terms and Conditions of Sale. To our knowledge, the Lockbox Secure Technology, when used in accordance with the data sheet and hardware reference manual specifications, provides a secure method of implementing code and data safeguards. However, Analog Devices does not guarantee that this technology provides absolute security. ACCORDINGLY, ANALOG DEVICES HEREBY DISCLAIMS ANY AND ALL EXPRESS AND IMPLIED WARRANTIES THAT THE LOCKBOX SECURE TECHNOLOGY CANNOT BE BREACHED, COMPROMISED OR OTHERWISE CIRCUMVENTED AND IN NO EVENT SHALL ANALOG DEVICES BE LIABLE FOR ANY LOSS, DAMAGE, DESTRUCTION OR RELEASE OF DATA, INFORMATION, PHYSICAL PROPERTY OR INTELLECTUAL PROPERTY. DESIGNING AN EMULATOR-COMPATIBLE PROCESSOR BOARD (TARGET) The Analog Devices family of emulators are tools that every system developer needs in order to test and debug hardware and software systems. Analog Devices has supplied an IEEE 1149.1 JTAG Test Access Port (TAP) on each JTAG processor. The emulator uses the TAP to access the internal features of the processor, allowing the developer to load code, set breakpoints, observe variables, observe memory, and examine registers. The processor must be halted to send data and commands, but once an operation has been completed by the emulator, the processor system is set running at full speed with no impact on system timing. To use these emulators, the target board must include a header that connects the processor’s JTAG port to the emulator. For details on target board design issues including mechanical layout, single processor connections, multiprocessor scan chains, signal buffering, signal termination, and emulator pod logic, see (EE-68) Analog Devices JTAG Emulation Technical Rev. PrG | Page 21 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data SIGNAL DESCRIPTIONS Signal definitions for the ADSP-BF522/524/526 and ADSP-BF523/525/527 processors are listed in Table 10. In order to maintain maximum function and reduce package size and ball count, some balls have dual, multiplexed functions. In cases where ball function is reconfigurable, the default state is shown in plain text, while the alternate function is shown in italics. All pins are three-stated during and immediately after reset, with the exception of the external memory interface, asynchronous and synchronous memory control, and the buffered XTAL output pin (CLKBUF). On the external memory interface, the control and address lines are driven high, with the exception of CLKOUT, which toggles at the system clock rate. All I/O pins have their input buffers disabled with the exception of the pins that need pull-ups or pull-downs, as noted in Table 10. It is strongly advised to use the available IBIS models to ensure that a given board design meets overshoot/undershoot and signal integrity requirements. If no IBIS simulation is performed, it is strongly recommended to add series resistor terminations for all Driver Types A, C and D. The termination resistors should be placed near the processor to reduce transients and improve signal integrity. The resistance value, typically 33 Ω or 47 Ω, should be chosen to match the average board trace impedance. Additionally, adding a parallel termination to CLKOUT may prove useful in further enhancing signal integrity. Be sure to verify overshoot/undershoot and signal integrity specifications on actual hardware. Table 10. Signal Descriptions Type Function Driver Type1 ADDR19–1 O A DATA15–0 I/O Data Bus A ABE1–0/SDQM1–0 O Byte Enables/Data Mask A A Signal Name EBIU Address Bus AMS3–0 O Bank Select ARDY I Hardware Ready Control AOE O Output Enable A ARE O Read Enable A AWE O Write Enable A SRAS O SDRAM Row Address Strobe A SCAS O SDRAM Column Address Strobe A SWE O SDRAM Write Enable A SCKE O SDRAM Clock Enable A CLKOUT O SDRAM Clock Output B SA10 O SDRAM A10 Signal A SMS O SDRAM Bank Select A Rev. PrG | Page 22 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 10. Signal Descriptions (Continued) Signal Name Driver Type1 Type Function USB 2.0 HS OTG USB_DP I/O Data + (This ball should be pulled low when USB is unused or not present.) F USB_DM I/O Data - (This ball should be pulled low when USB is unused or not present.) USB_XI I USB Crystal Input (This ball should be pulled low when USB is unused or not present.) F USB_XO O USB Crystal Output (This ball should be left unconnected when USB is unused F or not present.) USB_ID I USB OTG mode (This ball should be pulled low when USB is unused or not present.) USB_VREF I USB voltage reference (Connect to GND through a 0.1 μF capacitor, or leave unconnected if USB is unused or not present.) USB_RSET I USB resistance set. (This ball should be left unconnected when USB is unused or not present.) USB_VBUS F I/O 5V USB VBUS (USB_VBUS is an output only during initialization of USB OTG session request pulses. Host mode or OTG type A mode require that an external voltage source of 5V, at 8mA or more–per the OTG specification–be applied to VBUS. Other OTG modes require that this external voltage be disabled. This ball should be pulled low when USB is unused or not present.) Port F: GPIO and Multiplexed Peripherals PF0/PPI D0/DR0PRI /ND_D0A I/O GPIO/PPI Data 0/SPORT0 Primary Receive Data /NAND Alternate Data 0 C PF1/PPI D1/RFS0/ND_D1A I/O GPIO/PPI Data 1/SPORT0 Receive Frame Sync /NAND Alternate Data 1 C PF2/PPI D2/RSCLK0/ND_D2A I/O GPIO/PPI Data 2/SPORT0 Receive Serial Clock /NAND Alternate Data 2/Alternate Capture Input 0 D PF3/PPI D3/DT0PRI/ND_D3A I/O GPIO/PPI Data 3/SPORT0 Transmit Primary Data /NAND Alternate Data 3 C PF4/PPI D4/TFS0/ND_D4A/TACLK0 I/O GPIO/PPI Data 4/SPORT0 Transmit Frame Sync /NAND Alternate Data 4/Alternate Timer Clock 0 C PF5/PPI D5/TSCLK0/ND_D5A/TACLK1 I/O GPIO/PPI Data 5/SPORT0 Transmit Serial Clock /NAND Alternate Data 5/Alternate Timer Clock 1 D PF6/PPI D6/DT0SEC/ND_D6A/TACI0 I/O GPIO/PPI Data 6/SPORT0 Transmit Secondary Data /NAND Alternate Data 6/Alternate Capture Input 0 C PF7/PPI D7/DR0SEC/ND_D7A/TACI1 I/O GPIO/PPI Data 7/SPORT0 Receive Secondary Data /NAND Alternate Data 7/Alternate Capture Input 1 C PF8/PPI D8/DR1PRI I/O GPIO/PPI Data 8/SPORT1 Primary Receive Data C PF9/PPI D9/RSCLK1/SPISEL6 I/O GPIO/PPI Data 9/SPORT1 Receive Serial Clock/SPI Slave Select 6 D PF10/PPI D10/RFS1/SPISEL7 I/O GPIO/PPI Data 10/SPORT1 Receive Frame Sync/SPI Slave Select 7 C PF11/PPI D11/TFS1/CZM I/O GPIO/PPI Data 11/SPORT1 Transmit Frame Sync/Counter Zero Marker C PF12/PPI D12/DT1PRI/SPISEL2/CDG I/O GPIO/PPI Data 12/SPORT1 Transmit Primary Data/SPI Slave Select 2/Counter Down Gate C PF13/PPI D13/TSCLK1/SPISEL3/CUD I/O GPIO/PPI Data 13/SPORT1 Transmit Serial Clock/SPI Slave Select 3/Counter Up D Direction PF14/PPI D14/DT1SEC/UART1TX I/O GPIO/PPI Data 14/SPORT1 Transmit Secondary Data/UART1 Transmit C PF15/PPI D15/DR1SEC/UART1RX/TACI3 I/O GPIO/PPI Data 15/SPORT1 Receive Secondary Data /UART1 Receive /Alternate Capture Input 3 C Port G: GPIO and Multiplexed Peripherals Rev. PrG | Page 23 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 10. Signal Descriptions (Continued) Signal Name Driver Type1 Type Function PG0/HWAIT I/O GPIO/Boot Host Wait2 C PG1/SPISS/SPISEL1 I/O GPIO/SPI Slave Select Input/SPI Slave Select 1 C PG2/SCK I/O GPIO/SPI Clock D PG3/MISO/DR0SECA I/O GPIO/SPI Master In Slave Out/Sport 0 Alternate Receive Data Secondary C PG4/MOSI/DT0SECA I/O GPIO/SPI Master Out Slave In/Sport 0 Alternate Transmit Data Secondary C PG5/TMR1/PPI_FS2 I/O GPIO/Timer1/PPI Frame Sync2 C PG6/DT0PRIA/TMR2/PPI_FS3 I/O GPIO/SPORT0 Alternate Primary Transmit Data / Timer2 / PPI Frame Sync3 C PG7/TMR3/DR0PRIA/UART0TX I/O GPIO/Timer3/Sport 0 Alternate Receive Data Primary/UART0 Transmit C PG8/TMR4/RFS0A/UART0RX/TACI4 I/O GPIO/Timer 4/Sport 0 Alternate Receive Clock/Frame Sync /UART0 Receive/Alternate Capture Input 4 C PG9/TMR5/RSCLK0A/TACI5 I/O GPIO/Timer5/Sport 0 Alternate Receive Clock /Alternate Capture Input 5 D PG10/TMR6/TSCLK0A/TACI6 I/O GPIO/Timer 6 /Sport 0 Alternate Transmit /Alternate Capture Input 6 D PG11/TMR7/HOST_WR I/O GPIO/Timer7/Host DMA Write Enable C PG12/DMAR1/UART1TXA/HOST_ACK I/O GPIO/DMA Request 1/Alternate UART1 Transmit/Host DMA Acknowledge C PG13/DMAR0/UART1RXA/HOST_ADDR/TACI2 I/O GPIO/DMA Request 0/Alternate UART1 Receive/Host DMA Address/Alternate Capture Input 2 C PG14/TSCLK0A1/MDC/HOST_RD I/O GPIO/SPORT0 Alternate 1 Transmit/Ethernet Management Channel Clock /Host DMA Read Enable D PG153/TFS0A/MII PHYINT/RMII MDINT/HOST_CE I/O GPIO/SPORT0 Alternate Transmit Frame Sync/Ethernet/MII PHY Interrupt/RMII C Management Channel Data Interrupt/Host DMA Chip Enable Port H: GPIO and Multiplexed Peripherals PH0/ND_D0/MIICRS/RMIICRSDV/HOST_D0 I/O GPIO/NAND D0/Ethernet MII or RMII Carrier Sense/Host DMA D0 C PH1/ND_D1/ERxER/HOST_D1 I/O GPIO/NAND D1/Ethernet MII or RMII Receive Error/Host DMA D1 C PH2/ND_D2/MDIO/HOST_D2 I/O GPIO/NAND D2/Ethernet Management Channel Serial Data/Host DMA D2 C PH3/ND_D3/ETxEN/HOST_D3 I/O GPIO/NAND D3/Ethernet MII Transmit Enable/Host DMA D3 C PH4/ND_D4/MIITxCLK/RMIIREF_CLK/HOST_D4 I/O GPIO/NAND D4/Ethernet MII or RMII Reference Clock/Host D4 C PH5/ND_D5/ETxD0/HOST_D5 I/O GPIO/NAND D5/Ethernet MII or RMII Transmit D0/Host DMA D5 C PH6/ND_D6/ERxD0/HOST_D6 I/O GPIO/NAND D6/Ethernet MII or RMII Receive D0/Host DMA D6 C PH7/ND_D7/ETxD1/HOST_D7 I/O GPIO/NAND D7/Ethernet MII or RMII Transmit D1/Host DMA D7 C PH8/SPISEL4/ERxD1/HOST_D8/TACLK2 I/O GPIO/Alternate Capture Input 2/Ethernet MII or RMII Receive D1/Host DMA D8 C /SPI Slave Select 4 PH9/SPISEL5/ETxD2/HOST_D9/TACLK3 I/O GPIO/SPI Slave Select 5/Ethernet MII Transmit D2/Host DMA D9 /Alternate Timer Clock 3 PH10/ND_CE/ERxD2/HOST_D10 I/O GPIO/NAND Chip Enable/Ethernet MII Receive D2/Host DMA D10 C PH11/ND_WE/ETxD3/HOST_D11 I/O GPIO/NAND Write Enable/Ethernet MII Transmit D3/Host DMA D11 C PH12/ND_RE/ERxD3/HOST_D12 I/O GPIO/NAND Read Enable/Ethernet MII Receive D3/Host DMA D12 C PH13/ND_BUSY/ERxCLK/HOST_D13 I/O GPIO/NAND Busy/Ethernet MII Receive Clock/Host DMA D13 C PH14/ND_CLE/ERxDV/HOST_D14 I/O GPIO/NAND Command Latch Enable/Ethernet MII or RMII Receive Data Valid/Host DMA D14 C PH15/ND_ALE/COL/HOST_D15 I/O GPIO/NAND Address Latch Enable/Ethernet MII Collision/Host DMA Data 15 C Rev. PrG | Page 24 of 80 | February 2009 C ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 10. Signal Descriptions (Continued) Type Function Driver Type1 PJ0: PPI_FS1/TMR0 I/O PPI Frame Sync1/Timer0 C PJ1: PPI_CLK/TMRCLK I PPI Clock/Timer Clock PJ2: SCL I/O 5V TWI Serial Clock (This pin is an open-drain output and requires a pull-up resistor.4) E PJ3: SDA I/O 5V TWI Serial Data (This pin is an open-drain output and requires a pull-up resistor.4) E Signal Name Port J: Multiplexed Peripherals Real Time Clock RTXI I RTC Crystal Input (This ball should be pulled low when not used.) RTXO O RTC Crystal Output TCK I JTAG Clock TDO O JTAG Serial Data Out TDI I JTAG Serial Data In JTAG Port C TMS I JTAG Mode Select TRST I JTAG Reset (This ball should be pulled low if the JTAG port is not used.) EMU O Emulation Output I Clock/Crystal Input C Clock CLKIN XTAL O Crystal Output CLKBUF O Buffered XTAL Output I Reset C Mode Controls RESET NMI I Nonmaskable Interrupt (This ball should be pulled high when not used.) BMODE3–0 I Boot Mode Strap 3-0 ADSP-BF523/525/527 Voltage Regulation I/F VRSEL I Internal/External Voltage Regulator Select VROUT/EXT_WAKE1 O External FET Drive/Wake up Indication 1 G EXT_WAKE0 O Wake up Indication 0 C SS/PG I Soft Start/Power Good EXT_WAKE1 O Wake up Indication 1 C EXT_WAKE0 O Wake up Indication 0 C PG I Power Good ADSP-BF522/524/526 Voltage Regulation I/F Rev. PrG | Page 25 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 10. Signal Descriptions (Continued) Signal Name Driver Type1 Type Function Power Supplies ALL SUPPLIES MUST BE POWERED See Operating Conditions for ADSP-BF523/525/527 on Page 29, and see Operating Conditions for ADSP-BF522/524/526 on Page 27. VDDEXT P I/O Power Supply VDDINT P Internal Power Supply VDDRTC P Real Time Clock Power Supply VDDUSB P 3.3 V USB Phy Power Supply VDDMEM P MEM Power Supply VDDOTP P OTP Power Supply VPPOTP P OTP Programming Voltage VSS G Ground for All Supplies 1 See Output Drive Currents on Page 64 for more information about each driver type. 2 HWAIT must be pulled high or low to configure polarity. It is driven as an output and toggle during processor boot. See Booting Modes on Page 18. 3 When driven low, this ball can be used to wake up the processor from the hibernate state, either in normal GPIO mode or in Ethernet mode as MII PHYINT. If the ball is used for wake up, enable the feature with the PHYWE bit in the VR_CTL register, and pull-up the ball with a resistor. 4 Consult version 2.1 of the I2C specification for the proper resistor value. Rev. PrG | Page 26 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data SPECIFICATIONS Specifications are subject to change without notice. OPERATING CONDITIONS FOR ADSP-BF522/524/526 Parameter VDDINT VDDEXT1 VDDRTC2 VDDMEM3 VDDOTP VPPOTP Conditions VDDUSB VIH VIH VIH VIHTWI VIL VIL VIL VILTWI TJ Internal Supply Voltage External Supply Voltage RTC Power Supply Voltage MEM Supply Voltage OTP Supply Voltage OTP Programming Voltage For Reads For Writes4 USB Supply Voltage5 High Level Input Voltage6, 7 High Level Input Voltage6, 7 High Level Input Voltage6, 7 High Level Input Voltage Low Level Input Voltage6, 7 Low Level Input Voltage6, 7 Low Level Input Voltage6, 7 Low Level Input Voltage Junction Temperature TJ Junction Temperature TJ Junction Temperature VDDEXT/VDDMEM = 1.90 V VDDEXT/VDDMEM = 2.75 V VDDEXT/VDDMEM = 3.6 V VDDEXT = 1.90 V/2.75 V/3.6 V VDDEXT/VDDMEM = 1.7 V VDDEXT/VDDMEM = 2.25 V VDDEXT/VDDMEM = 3.0 V VDDEXT = minimum 289-Ball CSP_BGA @ TAMBIENT = 0°C to +70°C 208-Ball CSP_BGA @ TAMBIENT = 0°C to +70°C 208-Ball CSP_BGA @ TAMBIENT = –40°C to +85°C Min tbd 1.70 2.25 1.70 2.25 Nominal tbd 1.8, 2.5 or 3.3 Max tbd 3.6 3.6 3.6 2.75 Unit V V V V V 2.25 6.9 3.0 1.1 1.7 2.0 0.7 x VBUSTWI –0.3 –0.3 –0.3 –0.3 0 2.5 7.0 3.3 2.75 7.1 3.6 3.6 3.6 3.6 VBUSTWI8 0.6 0.7 0.8 0.3 x VBUSTWI9 +105 V V V V V V V V V V V °C 0 +105 °C –40 +105 °C 1 1.8, 2.5 or 3.3 2.5 Must remain powered (even if the associated function is not used). If not used, power with VDDEXT. 3 Balls that use VDDMEM are DATA15–0, ADDR19–1, ABE1–0, ARE, AWE, AOE, AMS3–0, ARDY, SA10, SWE, SCAS, CLKOUT, SRAS, SMS, SCKE. These balls are not tolerant to voltages higher than VDDMEM. 4 The VPPOTP voltage for writes must only be applied when programming OTP memory. There is a finite amount of cumulative time that this voltage may be applied (dependent on voltage and junction temperature) over the lifetime of the part. Please see Table 27 on Page 36 for details. 5 When not using the USB peripheral on the ADSP-BF524/BF526 or terminating VDDUSB on the ADSP-BF522, VDDUSB must be powered by VDDEXT. 6 Bidirectional balls (PF15–0, PG15–0, PH15–0) and input balls (RTXI, TCK, TDI, TMS, TRST, CLKIN, RESET, NMI, and BMODE3–0) of the ADSPBF522/523/524/525/526/527 processors are 3.3 V tolerant (always accept up to 3.6 V maximum VIH). Voltage compliance (on outputs, VOH) is limited by the VDDEXT supply voltage. 7 Parameter value applies to all input and bidirectional balls, except USB_DP, USB_DM, USB_VBUS, SDA, and SCL. 8 The VIHTWI min and max value vary with the selection in the TWI_DT field of the NONGPIO_DRIVE register. See VBUSTWI min and max values in Table 11. 9 SDA and SCL are pulled up to VBUSTWI. See Table 11. 2 Rev. PrG | Page 27 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 11 shows settings for TWI_DT in the NONGPIO_DRIVE register. Set this register prior to using the TWI port. Table 11. TWI_DT Field Selections and VDDEXT/VBUSTWI TWI_DT 000 (default)1 001 010 011 100 101 110 111 (reserved) 1 VDDEXT Nominal 3.3 1.8 2.5 1.8 3.3 1.8 2.5 – VBUSTWI Minimum 2.97 1.7 2.97 2.97 4.5 2.25 2.25 – VBUSTWI Nominal 3.3 1.8 3.3 3.3 5 2.5 2.5 – VBUSTWI Maximum 3.63 1.98 3.63 3.63 5.5 2.75 2.75 – Unit V V V V V V V – Designs must comply with the VDDEXT and VBUSTWI voltages specified for the default TWI_DT setting for correct JTAG boundary scan operation during reset. ADSP-BF522/524/526 Clock Related Operating Conditions Table 12 describes the core clock timing requirements for the ADSP-BF522/524/526 processors. Take care in selecting MSEL, SSEL, and CSEL ratios so as not to exceed the maximum core clock and system clock (see Table 14). Table 13 describes phaselocked loop operating conditions. Table 12. Core Clock (CCLK) Requirements—ADSP-BF522/524/526 Processors—All Speed Grades1 Parameter fCCLK fCCLK fCCLK fCCLK fCCLK Max 4003 350 300 TBD TBD Unit MHz MHz MHz MHz MHz Maximum Speed Grade1 Unit MHz VDDEXT/VDDMEM = 1.8 V/2.5 V/3.3 V Nominal 80 tbd Unit MHz MHz Core Clock Frequency (VDDINT =tbd2 V minimum) Core Clock Frequency (VDDINT =tbd4 V minimum) Core Clock Frequency (VDDINT = tbd5 V minimum) Core Clock Frequency (VDDINT = tbd V minimum) Core Clock Frequency (VDDINT = tbd V minimum) 1 See the Ordering Guide on Page 80. Preliminary data indicates a value of 1.33 V. 3 Applies only to 400 MHz speed grade only. See the Ordering Guide on Page 80. 4 Preliminary data indicates a value of 1.235 V. 5 Preliminary data indicates a value of 1.14 V. 2 Table 13. Phase-Locked Loop Operating Conditions Parameter fVCO 1 Voltage Controlled Oscillator (VCO) Frequency Minimum 50 See the Ordering Guide on Page 80. Table 14. ADSP-BF522/524/526 Processors Maximum SCLK Conditions Parameter fSCLK fSCLK 1 CLKOUT/SCLK Frequency (VDDINT ≥ tbd V)1 CLKOUT/SCLK Frequency (VDDINT < tbd V) fSCLK must be less than or equal to fCCLK and is subject to additional restrictions for SDRAM interface operation. See Table 34 on Page 44. Rev. PrG | Page 28 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data OPERATING CONDITIONS FOR ADSP-BF523/525/527 Parameter VDDINT VDDEXT Internal Supply Voltage1 External Supply Voltage2, 3 Conditions VDDEXT External Supply Voltage2, 3 VDDRTC VDDMEM VDDOTP VPPOTP VDDUSB VIH VIH VIH VIHTWI VIL VIL VIL VILTWI TJ RTC Power Supply Voltage4 MEM Supply Voltage2, 5 OTP Supply Voltage2 OTP Programming Voltage2 USB Supply Voltage6 High Level Input Voltage7, 8 High Level Input Voltage7, 8 High Level Input Voltage7, 8 High Level Input Voltage Low Level Input Voltage7, 8 Low Level Input Voltage7, 8 Low Level Input Voltage7, 8 Low Level Input Voltage Junction Temperature TJ Junction Temperature TJ Junction Temperature Internal Voltage Regulator Disabled Internal Voltage Regulator Enabled VDDEXT/VDDMEM = 1.90 V VDDEXT/VDDMEM = 2.75 V VDDEXT/VDDMEM = 3.6 V VDDEXT = 1.90 V/2.75 V/3.6 V VDDEXT/VDDMEM = 1.7 V VDDEXT/VDDMEM = 2.25 V VDDEXT/VDDMEM = 3.0 V VDDEXT = minimum 289-Ball CSP_BGA @ TAMBIENT = 0°C to +70°C 208-Ball CSP_BGA @ TAMBIENT = 0°C to +70°C 208-Ball CSP_BGA @ TAMBIENT = –40°C to +85°C Min 0.95 1.70 1.8, 2.5 or 3.3 Max 1.26 3.6 2.25 2.5 or 3.3 3.6 V 3.6 3.6 2.75 2.75 3.6 3.6 3.6 3.6 VBUSTWI9 0.6 0.7 0.8 0.3 x VBUSTWI10 +105 V V V V V V V V V V V V V °C 0 +105 °C –40 +105 °C 2.25 1.70 2.25 2.25 3.0 1.1 1.7 2.0 0.7 x VBUSTWI –0.3 –0.3 –0.3 –0.3 0 1 Nominal 1.8, 2.5 or 3.3 2.5 2.5 3.3 Unit V V The voltage regulator can generate VDDINT at levels of 1.00 V to 1.20 V with –5% to +5% tolerance when VRCTL is programmed with the sysctl API. This specification is only guaranteed when the API is used. 2 Must remain powered (even if the associated function is not used). 3 VDDEXT is the supply to the voltage regulator and GPIO. 4 If not used, power with VDDEXT. 5 Balls that use VDDMEM are DATA15–0, ADDR19–1, ABE1–0, ARE, AWE, AOE, AMS3–0, ARDY, SA10, SWE, SCAS, CLKOUT, SRAS, SMS, SCKE. These balls are not tolerant to voltages higher than VDDMEM. 6 When not using the USB peripheral on the ADSP-BF525/BF527 or terminating VDDUSB on the ADSP-BF523, VDDUSB must be powered by VDDEXT. 7 Bidirectional balls (PF15–0, PG15–0, PH15–0) and input balls (RTXI, TCK, TDI, TMS, TRST, CLKIN, RESET, NMI, and BMODE3–0) of the ADSPBF522/523/524/525/526/527 processors are 3.3 V tolerant (always accept up to 3.6 V maximum VIH). Voltage compliance (on outputs, VOH) is limited by the VDDEXT supply voltage. 8 Parameter value applies to all input and bidirectional balls, except USB_DP, USB_DM, USB_VBUS, SDA, and SCL. 9 The VIHTWI min and max value vary with the selection in the TWI_DT field of the NONGPIO_DRIVE register. See VBUSTWI min and max values in Table 11 on Page 28. 10 SDA and SCL are pulled up to VBUSTWI. See Table 11 on Page 28. Rev. PrG | Page 29 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data ADSP-BF523/525/527 Clock Related Operating Conditions Table 15 describes the core clock timing requirements for the ADSP-BF523/525/527 processors. Take care in selecting MSEL, SSEL, and CSEL ratios so as not to exceed the maximum core clock and system clock (see Table 17). Table 16 describes phaselocked loop operating conditions. Table 15. Core Clock (CCLK) Requirements—ADSP-BF523/525/527 Processors—All Speed Grades1 Parameter fCCLK fCCLK fCCLK Core Clock Frequency (VDDINT =1.14 V minimum)2 Core Clock Frequency (VDDINT =1.093 V minimum)3 Core Clock Frequency (VDDINT = 0.95 V minimum) Internal Regulator Setting 1.20 V 1.15 V 1.0 V Max 600 533 400 Unit MHz MHz MHz Minimum 50 Maximum Speed Grade1 Unit MHz 1 See the Ordering Guide on Page 80. Applies only to 600 MHz speed grades. See the Ordering Guide on Page 80. 3 Applies only to 533 MHz and 600 MHz speed grades. See the Ordering Guide on Page 80. 2 Table 16. Phase-Locked Loop Operating Conditions Parameter fVCO 1 Voltage Controlled Oscillator (VCO) Frequency See the Ordering Guide on Page 80. Table 17. ADSP-BF523/525/527 Processors Maximum SCLK Conditions Parameter fSCLK fSCLK VDDEXT/VDDMEM = 1.8 V Nominal1 100 100 CLKOUT/SCLK Frequency (VDDINT ≥ 1.14 V)2 CLKOUT/SCLK Frequency (VDDINT < 1.14 V)2 1 VDDEXT/VDDMEM = 2.5 V/3.3 V Nominal Unit 3 133 MHz 100 MHz If either VDDEXT or VDDMEM are operating at 1.8V nominal, fSCLK is constrained to 100MHz. fSCLK must be less than or equal to fCCLK and is subject to additional restrictions for SDRAM interface operation. See Table 34 on Page 44. 3 Rounded number. Actual test specification is SCLK period of 7.5 ns. See Table 34 on Page 44. 2 Rev. PrG | Page 30 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data ELECTRICAL CHARACTERISTICS Table 18. Common Electrical Characteristics For All ADSP-BF522/523/524/525/526/527 Processors Parameter Test Conditions Min Typical Max Unit VOH High Level Output Voltage VDDEXT /VDDMEM = 1.7 V, IOH = –0.5 mA 1.35 V VOH High Level Output Voltage VDDEXT /VDDMEM = 2.25 V, IOH = –0.5 mA 2.0 V VOH High Level Output Voltage VDDEXT /VDDMEM = 3.0 V, IOH = –0.5 mA 2.4 V VOL Low Level Output Voltage VDDEXT /VDDMEM = 1.7/2.25/3.0 V, IOL = 2.0 mA 0.4 V IIH High Level Input Current1 VDDEXT /VDDMEM =3.6 V, VIN = 3.6 V 10.0 μA IIL Low Level Input Current1 VDDEXT /VDDMEM =3.6 V, VIN = 0 V 10.0 μA IIHP High Level Input Current JTAG2 VDDEXT = 3.6 V, VIN = 3.6 V 75.0 μA IOZH Three-State Leakage Current3 VDDEXT /VDDMEM= 3.6 V, VIN = 3.6 V 10.0 μA IOZHTWI Three-State Leakage Current4 VDDEXT =3.0 V, VIN = 5.5 V 10.0 μA 10.0 μA 3 IOZL Three-State Leakage Current VDDEXT /VDDMEM= 3.6 V, VIN = 0 V CIN Input Capacitance 5 fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V 6 5 8 Typical Max pF 1 Applies to input balls. Applies to JTAG input balls (TCK, TDI, TMS, TRST). 3 Applies to three-statable balls. 4 Applies to bidirectional balls SCL and SDA. 5 Applies to all signal balls. 6 Guaranteed, but not tested. 2 Table 19. Electrical Characteristics For ADSP-BF522/524/526 Processors Parameter IDDDEEPSLEEP 1 Test Conditions VDDINT Current in Deep Sleep Mode Min VDDINT = 1.0 V, fCCLK = 0 MHz, fSCLK = 0 MHz, TJ = 25°C, ASF = 0.00 Unit TBD mA IDDSLEEP VDDINT Current in Sleep Mode VDDINT = 1.0 V, fSCLK = 25 MHz, TJ = 25°C TBD mA IDD-IDLE VDDINT Current in Idle VDDINT = 1.0 V, fCCLK = 50 MHz, TJ = 25°C, ASF = 0.44 TBD mA IDD-TYP VDDINT Current VDDINT = 1.0 V, fCCLK = 400 MHz, TJ = 25°C, ASF = 1.00 TBD mA IDD-TYP VDDINT Current VDDINT = 1.15 V, fCCLK = 533 MHz, TJ = 25°C, ASF = 1.00 TBD mA IDD-TYP VDDINT Current VDDINT = 1.2 V, fCCLK = 600 MHz, TJ = 25°C, ASF = 1.00 TBD mA Rev. PrG | Page 31 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 19. Electrical Characteristics For ADSP-BF522/524/526 Processors (Continued) Parameter Test Conditions Min Typical Max Unit Hibernate State Current VDDEXT =VDDMEM =VDDRTC = VDDUSB = 3.30 V, VDDOTP =VPPOTP =2.5 V, TJ = 25°C, CLKIN = 0 MHz with voltage regulator off (VDDINT = 0 V) TBD μA IDDRTC VDDRTC Current VDDRTC = 3.3 V, TJ = 25°C TBD μA IDDUSB-FS VDDUSB Current in Full/Low Speed Mode VDDUSB = 3.3 V, TJ = 25°C, Full Speed USB Transmit TBD mA IDDUSB-HS VDDUSB Current in High Speed VDDUSB = 3.3 V, TJ = 25°C, High Mode Speed USB Transmit TBD mA IDDSLEEP1, 3 VDDINIT Current in Sleep Mode fCCLK = 0 MHz, fSCLK > 0 MHz IDDDEEPSLEEP1, 3 VDDINT Current in Deep Sleep Mode fCCLK = 0 MHz, fSCLK = 0 MHz IDDINT3, 5 VDDINT Current fCCLK > 0 MHz, fSCLK ≥ 0 MHz IDDHIBERNATE 1, 2 Table 22 + (TBD × VDDINT × fSCLK)4 mA4 Table 22 mA mA Table 22 + (Table 24 × ASF) + (TBD × VDDINT × fSCLK) 1 See the ADSP-BF522/523/524/525/526/527 Blackfin Processor Hardware Reference Manual for definition of sleep, deep sleep, and hibernate operating modes. Includes current on VDDEXT, VDDUSB, VDDMEM, VDDOTP, and VPPOTP supplies. Clock inputs are tied high or low. 3 Guaranteed maximum specifications. 4 Unit for VDDINT is V (Volts). Unit for fSCLK is MHz. Example: TBD V, TBD MHz would be TBD x TBD x TBD = TBD mA adder. 5 See Table 21 for the list of IDDINT power vectors covered. 2 Table 20. Electrical Characteristics For ADSP-BF523/525/527 Processors Parameter Test Conditions IDDDEEPSLEEP1 VDDINT Current in Deep Sleep Mode IDDSLEEP Min Typical Max Unit 10 mA VDDINT Current in Sleep Mode VDDINT = 1.0 V, fSCLK = 25 MHz, TJ = 25°C 15 mA IDD-IDLE VDDINT Current in Idle VDDINT = 1.0 V, fCCLK = 50 MHz, TJ = 25°C, ASF = 0.44 49 mA IDD-TYP VDDINT Current VDDINT = 1.0 V, fCCLK = 400 MHz, TJ = 25°C, ASF = 1.00 98 mA IDD-TYP VDDINT Current VDDINT = 1.15 V, fCCLK = 533 MHz, TJ = 25°C, ASF = 1.00 149 mA IDD-TYP VDDINT Current VDDINT = 1.2 V, fCCLK = 600 MHz, TJ = 25°C, ASF = 1.00 176 mA VDDINT = 1.0 V, fCCLK = 0 MHz, fSCLK = 0 MHz, TJ = 25°C, ASF = 0.00 Rev. PrG | Page 32 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 20. Electrical Characteristics For ADSP-BF523/525/527 Processors (Continued) Parameter Test Conditions Min Typical Max Unit Hibernate State Current VDDEXT =VDDMEM =VDDRTC = VDDUSB = 3.30 V, VDDOTP =VPPOTP =2.5 V, TJ = 25°C, CLKIN = 0 MHz with voltage regulator off (VDDINT = 0 V) 40 μA IDDRTC VDDRTC Current VDDRTC = 3.3 V, TJ = 25°C 20 μA IDDUSB-FS VDDUSB Current in Full/Low Speed Mode VDDUSB = 3.3 V, TJ = 25°C, Full Speed USB Transmit 9 mA IDDUSB-HS VDDUSB Current in High Speed VDDUSB = 3.3 V, TJ = 25°C, Mode High Speed USB Transmit 25 mA IDDSLEEP1, 3 VDDINIT Current in Sleep Mode fCCLK = 0 MHz, fSCLK > 0 MHz IDDDEEPSLEEP1, 3 VDDINT Current in Deep Sleep Mode fCCLK = 0 MHz, fSCLK = 0 MHz IDDINT3, 5 VDDINT Current fCCLK > 0 MHz, fSCLK ≥ 0 MHz IDDHIBERNATE 1, 2 Table 23 + (0.43 × VDDINT × fSCLK)4 mA4 Table 23 mA mA Table 23 + (Table 25 × ASF) + (0.43 × VDDINT × fSCLK) 1 See the ADSP-BF522/523/524/525/526/527 Blackfin Processor Hardware Reference Manual for definition of sleep, deep sleep, and hibernate operating modes. Includes current on VDDEXT, VDDUSB, VDDMEM, VDDOTP, and VPPOTP supplies. Clock inputs are tied high or low. 3 Guaranteed maximum specifications. 4 Unit for VDDINT is V (Volts). Unit for fSCLK is MHz. Example: TBD V, TBD MHz would be TBD x TBD x TBD = TBD mA adder. 5 See Table 21 for the list of IDDINT power vectors covered. 2 Total Power Dissipation Total power dissipation has two components: 1. Static, including leakage current 2. Dynamic, due to transistor switching characteristics Many operating conditions can also affect power dissipation, including temperature, voltage, operating frequency, and processor activity. Electrical Characteristics on Page 31 shows the current dissipation for internal circuitry (VDDINT). IDDDEEPSLEEP specifies static power dissipation as a function of voltage (VDDINT) and temperature (see Table 22 or Table 23), and IDDINT specifies the total power specification for the listed test conditions, including the dynamic component as a function of voltage (VDDINT) and frequency (Table 24 or Table 25). There are two parts to the dynamic component. The first part is due to transistor switching in the core clock (CCLK) domain. This part is subject to an Activity Scaling Factor (ASF) which represents application code running on the processor core and L1/L2 memories (Table 21). Rev. PrG | The ASF is combined with the CCLK Frequency and VDDINT dependent data in Table 24 or Table 25 to calculate this part. The second part is due to transistor switching in the system clock (SCLK) domain, which is included in the IDDINT specification equation. Table 21. Activity Scaling Factors (ASF)1 IDDINT Power Vector IDD-PEAK IDD-HIGH IDD-TYP IDD-APP IDD-NOP IDD-IDLE 1 Page 33 of 80 | Activity Scaling Factor (ASF) 1.29 1.26 1.00 0.88 0.72 0.44 See Estimating Power for ASDP-BF534/BF536/BF537 Blackfin Processors (EE-297). The power vector information also applies to the ADSP-BF52x processors. February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 22. ADSP-BF522/524/526 Static Current - IDD-DEEPSLEEP (mA)1 2 TJ (°C) –40 –20 0 25 40 55 70 85 100 105 1 2 TBD V TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD V TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Voltage (VDDINT)2 TBD V TBD V TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD V TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD V TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD V TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD V TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 1.25 V 18.0 22.9 30.9 47.6 62.5 83.2 110.2 145.1 189.7 209.3 1.30 V 21.0 26.4 35.3 53.7 70.0 92.6 122.0 159.8 208.1 229.2 Values are guaranteed maximum IDDDEEPSLEEP for non-automotive 400 MHz speed-grade devices. Valid temperature and voltage ranges are model-specific. See Operating Conditions for ADSP-BF522/524/526 on Page 27. Table 23. ADSP-BF523/525/527 Static Current - IDD-DEEPSLEEP (mA)1 2 TJ (°C) –40 –20 0 25 40 55 70 85 100 105 1 2 0.95 V 6.5 9.0 13.2 22.3 30.8 42.9 59.1 80.4 109.3 120.8 1.00 V 7.8 10.6 15.2 25.4 34.8 47.9 65.6 88.6 118.7 132.1 Voltage (VDDINT)2 1.10 V 1.15 V 11.1 13.1 14.6 17.0 20.4 23.5 32.8 37.2 44.1 49.6 59.9 66.9 80.8 89.7 107.8 119.2 143.2 157.4 158.8 174.2 1.05 V 9.3 12.4 17.7 28.9 39.2 53.6 72.9 97.9 130.5 144.7 1.20 V 15.4 19.8 27.0 42.1 55.7 74.6 99.4 131.5 172.8 190.9 Values are guaranteed maximum IDDDEEPSLEEP for non-automotive 400 MHz speed-grade devices. Valid temperature and voltage ranges are model-specific. See Operating Conditions for ADSP-BF523/525/527 on Page 29. Rev. PrG | Page 34 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 24. ADSP-BF522/524/526 Dynamic Current in CCLK Domain (mA, with ASF = 1.0)1 fCCLK (MHz)2 400 300 200 100 1 2 TBD V TBD TBD TBD TBD TBD V TBD TBD TBD TBD Voltage (VDDINT)2 TBD V TBD V TBD TBD TBD TBD TBD TBD TBD TBD TBD V TBD TBD TBD TBD TBD V TBD TBD TBD TBD TBD V TBD TBD TBD TBD TBD V TBD TBD TBD TBD The values are not guaranteed as stand-alone maximum specifications. They must be combined with static current per the equations of Electrical Characteristics on Page 31. Valid frequency and voltage ranges are model-specific. See Operating Conditions for ADSP-BF522/524/526 on Page 27. Table 25. ADSP-BF523/525/527 Dynamic Current in CCLK Domain (mA, with ASF = 1.0)1 fCCLK (MHz)2 600 533 500 400 300 200 100 1 2 0.95 V n/a n/a n/a 69.8 53.4 36.9 20.5 1.00 V n/a n/a n/a 74.3 56.9 39.4 22.0 Voltage (VDDINT)2 1.10 V 1.15 V n/a 130.4 110.3 116.7 103.1 109.1 83.6 88.5 64.1 68.0 44.6 47.4 25.3 27.0 1.05 V n/a n/a 97.3 78.9 60.4 41.9 23.6 1.20 V 137.6 123.3 115.0 93.5 71.8 50.1 28.8 1.25 V 145.1 129.8 121.3 98.6 75.8 53.0 30.6 1.30 V 152.5 136.4 127.7 103.9 80.0 56.0 32.5 The values are not guaranteed as stand-alone maximum specifications. They must be combined with static current per the equations of Electrical Characteristics on Page 31. Valid frequency and voltage ranges are model-specific. See Operating Conditions for ADSP-BF523/525/527 on Page 29. Rev. PrG | Page 35 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data ABSOLUTE MAXIMUM RATINGS Stresses greater than those listed in the table may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameter Rating –0.3 V to +1.26 V Internal Supply Voltage (VDDINT), for ADSP-BF523/525/527 processors TBD V to TBD V Internal Supply Voltage (VDDINT), for ADSP-BF522/524/526 processors External (I/O) Supply Voltage (VDDEXT/VDDMEM) –0.3 V to +3.8 V Input Voltage1, 2 –0.5 V to +3.6 V Input Voltage 1, 2, 3 –0.5 V to +5.25 V Output Voltage Swing –0.5 V to VDDEXT /VDDMEM+0.5 V Load Capacitance5 200 pF IOH/IOL Current per Pin Group6 80 mA (max) Storage Temperature Range –65°C to +150°C Junction Temperature Underbias +110°C Table 27. Maximum OTP Memory Programming Time for ADSP-BF522/524/526 Processors Temperature (TJ) VPPOTP Voltage (V) 25°C 85°C 110°C 125°C 6.9 tbd sec tbd sec tbd sec tbd sec 7.0 2400 sec tbd sec tbd sec tbd sec 7.1 1000 sec tbd sec tbd sec tbd sec The Absolute Maximum Ratings table specifies the maximum total source/sink (IOH/IOL) current for a group of pins. Permanent damage can occur if this value is exceeded. To understand this specification, if pins PH4, PH3, PH2, PH1, and PH0 from group 1 in the Total Current Pin Groups table, each were sourcing or sinking 2 mA each, the total current for those pins would be 10 mA. This would allow up to 70 mA total that could be sourced or sunk by the remaining pins in the group without damaging the device. For a list of all groups and their pins, see the Total Current Pin Groups table. Note that the VOL and VOL specifications have separate per-pin maximum current requirements, see the Electrical Characteristics For ADSPBF522/524/526 Processors and Electrical Characteristics For ADSP-BF523/525/527 Processors tables. –0.5 V to +5.5 V Input Voltage1, 2, 4 time for the ADSP-BF522/524/526 processors is shown in Table 27. The ADSP-BF523/525/527 processors do not have a similar restriction. 1 Applies to 100% transient duty cycle. For other duty cycles see Table 26. 2 Applies only when VDDEXT is within specifications. When VDDEXT is outside specifications, the range is VDDEXT ± 0.2 Volts. 3 Applies to balls SCL and SDA. 4 Applies to balls USB_DP, USB_DM, and USB_VBUS. 5 For proper SDRAM controller operation, the maximum load capacitance is 50 pF (at 3.3 V) or 30 pF (at 2.5 V) for ADDR19–1, DATA15–0, ABE1–0/SDQM1–0, CLKOUT, SCKE, SA10, SRAS, SCAS, SWE, and SMS. 6 For more information, see description preceeding Table 28. Table 28. Total Current Pin Groups Table 26. Maximum Duty Cycle for Input Transient Voltage1 VIN Min (V) VIN Max (V) Maximum Duty Cycle TBD TBD 100 % TBD TBD 40% TBD TBD 25% TBD TBD 15% TBD TBD 10% 1 Applies to all signal balls with the exception of CLKIN, XTAL, VROUT/EXT_WAKE1. When programming OTP memory on the ADSPBF522/524/526 processors, the VPPOTP ball must be set to the write value specified in the Operating Conditions for ADSPBF522/524/526 on Page 27. There is a finite amount of cumulative time that the write voltage may be applied (dependent on voltage and junction temperature) to VPPOTP over the lifetime of the part. Therefore, maximum OTP memory programming Rev. PrG | Page 36 of 80 | Group 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pins in Group PH4, PH3, PH2, PH1, PH0, PF15, PF14, PF13 PF12, SDA, SCL, PF11, PF10, PF9, PF8, PF7 PF6, PF5, PF4, PF3, PF2, PF1, PF0, PPI_FS1 PPI_CLK, PG15, PG14, PG13, PG12, PG11, PG10, PG9 PG8, PG7, PG6, PG5, PG4, BMODE3, BMODE2, BMODE1 BMODE0, PG3, PG2, PG1, PG0, TDI, TDO, EMU, TCK, TRST, TMS, DATA15, DATA14, DATA13, DATA12, DATA11, DATA10 DATA9, DATA8, DATA7, DATA6, DATA5, DATA4 DATA3, , DATA2, , DATA1, , DATA0, ADDR19, ADDR18 ADDR17, ADDR16, ADDR15, ADDR14, ADDR13 ADDR12, ADDR11, ADDR10, ADDR9, ADDR8, ADDR7 ADDR6, ADDR5, ADDR4, ADDR3, ADDR2, ADDR1 ABE1, ABE0, SA10, SWE, SCAS, SRAS SMS, SCKE, ARDY, AWE, ARE, AOE AMS3, AMS2, AMS1, AMS0, CLKOUT February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data ESD SENSITIVITY ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. PACKAGE INFORMATION The information presented in Figure 8 and Table 29 provides details about the package branding for the ADSPBF522/524/526 and ADSP-BF523/525/527 processors. For a complete listing of product availability, see Ordering Guide on Page 80. a ADSP-BF52x tppZccc vvvvvv.x n.n yyww country_of_origin B Figure 8. Product Information on Package Table 29. Package Brand Information Brand Key Field Description ADSP-BF52x Product Name1 t Temperature Range pp Package Type Z RoHS Compliant Designation ccc See Ordering Guide vvvvvv.x Assembly Lot Code n.n Silicon Revision yyww Date Code 1 See product names in the Ordering Guide on Page 80. Rev. PrG | Page 37 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data TIMING SPECIFICATIONS Clock and Reset Timing Table 30 and Figure 9 describe clock and reset operations. Per the CCLK and SCLK timing specifications in Table 12 to Table 17, combinations of CLKIN and clock multipliers must not select core/peripheral clocks in excess of the processor's speed grade. Table 30. Clock and Reset Timing Parameter Timing Requirements CLKIN Period tCKIN tCKINL CLKIN Low Pulse1 tCKINH CLKIN High Pulse1 tWRST RESET Asserted Pulse Width Low2 Switching Characteristic tBUFDLAY CLKIN to CLKBUF Delay Min Max Unit 20.0 10.0 10.0 11 × tCKIN 100.0 ns ns ns ns 10 ns 1 Applies to bypass mode and non-bypass mode. 2 Applies after power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2000 CLKIN cycles, while RESET is asserted, assuming stable power supplies and CLKIN (not including start-up time of external clock oscillator). tCKIN CLKIN tCKINL tCKINH tBUFDLAY tBUFDLAY CLKBUF tWRST RESET Figure 9. Clock and Reset Timing Rev. PrG | Page 38 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Asynchronous Memory Read Cycle Timing Table 31. Asynchronous Memory Read Cycle Timing Parameter Timing Requirements tSDAT DATA15–0 Setup Before CLKOUT tHDAT DATA15–0 Hold After CLKOUT tSARDY ARDY Setup Before CLKOUT tHARDY ARDY Hold After CLKOUT Switching Characteristics Output Delay After CLKOUT1 tDO tHO Output Hold After CLKOUT 1 1 VDDMEM = 1.8 V Min Max VDDMEM = 2.5/3.3 V Min Max Unit 2.1 0.9 4.0 0.2 2.1 0.8 4.0 0.2 ns ns ns ns 6.0 6.0 0.8 ns ns 0.8 Output balls include AMS3–0, ABE1–0, ADDR19–1, AOE, ARE. SETUP 2 CYCLES PROGRAMMED READ ACCESS 4 CYCLES HOLD 1 CYCLE ACCESS EXTENDED 3 CYCLES CLKOUT tDO tHO AMSx ABE1–0 ABE, ADDRESS ADDR19–1 AOE tDO tHO ARE tHARDY tSARDY tHARDY ARDY tSARDY tSDAT tHDAT DATA15–0 READ Figure 10. Asynchronous Memory Read Cycle Timing Rev. PrG | Page 39 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Asynchronous Memory Write Cycle Timing Table 32. Asynchronous Memory Write Cycle Timing VDDMEM = 1.8 V Min Max Parameter Timing Requirements tSARDY ARDY Setup Before CLKOUT tHARDY ARDY Hold After CLKOUT Switching Characteristics tDDAT DATA15–0 Disable After CLKOUT tENDAT DATA15–0 Enable After CLKOUT Output Delay After CLKOUT1 tDO tHO Output Hold After CLKOUT 1 1 4.0 0.2 4.0 0.2 6.0 0.0 PROGRAMMED WRITE ACCESS 2 CYCLES ACCESS EXTENDED 1 CYCLE HOLD 1 CYCLE t DO t HO AMSx ABE1–0 ABE, ADDRESS tDO tHO AWE t HARDY t SARDY ARDY tSARDY t ENDAT DATA15–0 t DDAT WRITE DATA Figure 11. Asynchronous Memory Write Cycle Timing Rev. PrG | Page 40 of 80 | 6.0 0.8 CLKOUT ADDR19–1 6.0 6.0 0.8 February 2009 Unit ns ns 0.0 Output balls include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE. SETUP 2 CYCLES VDDMEM = 2.5/3.3 V Min Max ns ns ns ns ADSP-BF522/523/524/525/526/527 Preliminary Technical Data NAND Flash Controller Interface Timing Table 33 and Figure 12 on Page 41 through Figure 16 on Page 43 describe NAND Flash Controller Interface operations. Table 33. NAND Flash Controller Interface Timing Parameter Write Cycle Switching Characteristics tCWL ND_CE Setup Time to AWE Low tCH ND_CE Hold Time From AWE High tCLEWL ND_CLE Setup Time to AWE Low tCLH ND_CLE Hold Time From AWE high tALEWL ND_ALE Setup Time to AWE Low tALH ND_ALE Hold Time From AWE High tWP1 AWE Low to AWE high tWHWL AWE High to AWE Low tWC1 AWE Low to AWE Low tDWS1 Data Setup Time for a Write Access tDWH Data Hold Time for a Write Access Read Cycle Switching Characteristics tCRL ND_CE Setup Time to ARE Low tCRH ND_CE Hold Time From ARE High 1 tRP ARE Low to ARE High tRHRL ARE High to ARE Low tRC1 ARE Low to ARE Low Timing Requirements tDRS Data Setup Time for a Read Transaction tDRH Data Hold Time for a Read Transaction Write Followed by Read Switching Characteristics tWHRL AWE High to ARE Low 1 2 Min ns ns ns ns ns ns ns ns ns ns ns 1.0 × tSCLK – 4 3.0 × tSCLK – 4 (RD_DLY +1.0) × tSCLK – 4 4.0 × tSCLK – 4 (RD_DLY +5.0) × tSCLK – 4 ns ns ns ns ns 8.02 0.0 ns ns 5.0 × tSCLK – 4 ns tCH ND_CE ND_CLE tCLH tCLEWL tALH tALEWL ND_ALE tWP AWE tDWS tDWH ND_D0-D7 Figure 12. NAND Flash Controller Interface Timing - Command Write Cycle Rev. PrG | Page 41 of 80 | Unit 1.0 × tSCLK – 4 3.0 × tSCLK – 4 0.0 2.5 × tSCLK – 4 0.0 2.5 × tSCLK – 4 (WR_DLY +1.0) × tSCLK – 4 4.0 × tSCLK – 4 (WR_DLY +5.0) × tSCLK – 4 (WR_DLY +1.5) × tSCLK – 4 2.5 × tSCLK – 4 WR_DLY and RD_DLY are defined in the NFC_CTL register. The only parameter that differs from 1.8V to 2.5/3.3V operation is tDRS, which is 8.0ns at 2.5/3.3V and is 11ns at 1.8V. tCWL Max February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data tCWL ND_CE tCLEWL ND_CLE ND_ALE tALH tALEWL tWP tALH tALEWL tWHWL tWP AWE tWC tDWS tDWH tDWS tDWH ND_D0-D7 Figure 13. NAND Flash Controller Interface Timing - Address Write Cycle tCWL ND_CE tCLEWL ND_CLE tALEWL ND_ALE tWP tWHWL tWP AWE tWC ARE tDWS tDWS tDWH tDWH ND_D0-D7 Figure 14. NAND Flash Controller Interface Timing - Data Write Operation Rev. PrG | Page 42 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data tCRH tCRL ND_CE ND_CLE ND_ALE AWE tRC tRP tDRS tRP tRHRL ARE tDRH tDRS tDRH ND_D0-D7 Figure 15. NAND Flash Controller Interface Timing - Data Read Operation tCWL ND_CE ND_CLE tCLH tCLEWL ND_ALE tWP AWE tWHRL tRP ARE tDWS tDWH tDRS tDWH ND_D0-D7 Figure 16. NAND Flash Controller Interface Timing - Write Followed by Read Operation Rev. PrG | Page 43 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data SDRAM Interface Timing Table 34. SDRAM Interface Timing Parameter ADSP-BF522/524/526 ADSP-BF523/525/527 VDDMEM = 1.8 V VDDMEM = 1.8 V Min VDDMEM = 2.5/3.3 V Max Min Max Min Max VDDMEM = 2.5/3.3 V Min Max Unit Timing Requirements tSSDAT Data Setup Before CLKOUT 1.5 1.5 1.5 1.5 ns tHSDAT Data Hold After CLKOUT 0.8 0.8 1.0 0.8 ns Switching Characteristics tSCLK CLKOUT Period1 12.5 12.5 10 7.5 ns tSCLKH CLKOUT Width High 2.5 2.5 2.5 2.5 ns tSCLKL CLKOUT Width Low 2.5 2.5 2.5 2.5 ns tDCAD Command, Address, Data Delay After CLKOUT tHCAD Command, Address, Data Hold After CLKOUT 2 tDSDAT Data Disable After CLKOUT tENSDAT Data Enable After CLKOUT 1 2 2 4.4 1.0 4.4 1.0 5.0 0.0 4.0 1.0 5.0 0.0 4.0 1.0 5.0 0.0 ns 4.0 0.0 ns ns ns The tSCLK value is the inverse of the fSCLK specification discussed in Table 14 and Table 17. Package type and reduced supply voltages affect the best-case values listed here. Command balls include: SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE. tSCLK tSCLKH CLKOUT tSSDAT tSCLKL tHSDAT DATA (IN) tDCAD tENSDAT tDSDAT tHCAD DATA (OUT) tDCAD COMMAND, ADDRESS (OUT) tHCAD NOTE: COMMAND = SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE. Figure 17. SDRAM Interface Timing Rev. PrG | Page 44 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data External DMA Request Timing Table 35 and Figure 18 describe the External DMA Request operations. Table 35. External DMA Request Timing Parameter Timing Parameters tDR tDH tDMARACT tDMARINACT 1 VDDEXT/VDDMEM = 1.8 V1 Min Max DMARx Asserted to CLKOUT High Setup CLKOUT High to DMARx Deasserted Hold Time DMARx Active Pulse Width DMARx Inactive Pulse Width 8.0 0.0 1.0 × tSCLK 1.75 × tSCLK VDDEXT/VDDMEM = 2.5/3.3 V Min Max Unit 6.0 0.0 1.0 × tSCLK 1.75 × tSCLK ns ns ns ns Because the external DMA control pins are part of the VDDEXT power domain and the CLKOUT signal is part of the VDDMEM power domain, systems in which VDDEXT and VDDMEM are NOT equal may require level shifting logic for correct operation. CLKOUT tDR DMAR0/1 (Active Low) DMAR0/1 (Active High) tDH tDMARACT tDMARINACT tDMARACT tDMARINACT Figure 18. External DMA Request Timing Rev. PrG | Page 45 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Parallel Peripheral Interface Timing Table 36 and Figure 19 on Page 46, Figure 23 on Page 50, and Figure 25 on Page 51 describe parallel peripheral interface operations. Table 36. Parallel Peripheral Interface Timing Parameter Timing Requirements tPCLKW PPI_CLK Width1 tPCLK PPI_CLK Period1 Timing Requirements - GP Input and Frame Capture Modes tSFSPE External Frame Sync Setup Before PPI_CLK (Nonsampling Edge for Rx, Sampling Edge for Tx) tHFSPE External Frame Sync Hold After PPI_CLK tSDRPE Receive Data Setup Before PPI_CLK tHDRPE Receive Data Hold After PPI_CLK Switching Characteristics - GP Output and Frame Capture Modes tDFSPE Internal Frame Sync Delay After PPI_CLK tHOFSPE Internal Frame Sync Hold After PPI_CLK tDDTPE Transmit Data Delay After PPI_CLK tHDTPE Transmit Data Hold After PPI_CLK 1 ADSP-BF522/524/526 VDDEXT = VDDEXT = 1.8 V 2.5/3.3 V Min Max Min Max ADSP-BF523/525/527 VDDEXT = VDDEXT = 1.8 V 2.5/3.3 V Min Max Min Max Unit 6.4 25.0 6.4 25.0 6.0 15.0 6.0 15.0 ns ns 6.7 6.7 6.7 6.7 ns 1.0 3.5 1.5 1.0 3.5 1.5 1.0 3.5 1.6 1.0 3.5 1.5 ns ns ns 8.8 1.7 8.8 1.7 8.8 1.8 1.8 DATA1 IS SAMPLED PPI_CLK POLC = 0 PPI_CLK POLC = 1 tSFSPE t HFSPE POLS = 1 PPI_FS1 POLS = 0 POLS = 1 PPI_FS2 POLS = 0 tSDRPE t HDRPE PPI_DATA Figure 19. PPI GP Rx Mode with External Frame Sync Timing Rev. PrG | Page 46 of 80 | February 2009 1.7 8.8 PPI_CLK frequency cannot exceed fSCLK/2 DATA0 IS SAMPLED 8.0 8.0 1.7 8.0 1.8 8.0 1.8 ns ns ns ns ADSP-BF522/523/524/525/526/527 Preliminary Technical Data DATA DRIVING/ FRAME SYNC SAMPLING EDGE DATA DRIVING/ FRAME SYNC SAMPLING EDGE PPI_CLK POLC = 0 PPI_CLK POLC = 1 t HFSPE t SFSPE POLS = 1 PPI_FS1 POLS = 0 POLS = 1 PPI_FS2 POLS = 0 t t DDTPE HDTPE PPI_DATA Figure 20. PPI GP Tx Mode with External Frame Sync Timing FRAME SYNC IS DRIVEN OUT DATA0 IS SAMPLED POLC = 0 PPI_CLK PPI_CLK POLC = 1 tDFSPE tHOFSPE POLS = 1 PPI_FS1 POLS = 0 POLS = 1 PPI_FS2 POLS = 0 tSDRPE tHDRPE PPI_DATA Figure 21. PPI GP Rx Mode with Internal Frame Sync Timing Rev. PrG | Page 47 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 FRAME SYNC IS DRIVEN OUT Preliminary Technical Data DATA0 IS DRIVEN OUT PPI_CLK POLC = 0 PPI_CLK POLC = 1 t DFSPE tHOFSPE POLS = 1 PPI_FS1 POLS = 0 POLS = 1 PPI_FS2 POLS = 0 tDDTPE t HDTPE PPI_DATA DATA0 Figure 22. PPI GP Tx Mode with Internal Frame Sync Timing Rev. PrG | Page 48 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Serial Ports Table 37 through Table 40 on Page 51 and Figure 23 on Page 50 through Figure 25 on Page 51 describe serial port operations. Table 37. Serial Ports—External Clock Parameter ADSP-BF522/524/526 ADSP-BF523/525/527 VDDEXT = 1.8 V VDDEXT = 1.8 V Min Max VDDEXT = 2.5/3.3 V Min Max Min Max VDDEXT = 2.5/3.3 V Min Max Unit Timing Requirements tSFSE TFSx/RFSx Setup Before TSCLKx/RSCLKx1 3.0 3.0 3.0 3.0 ns tHFSE TFSx/RFSx Hold After TSCLKx/RSCLKx1 3.0 3.0 3.0 3.0 ns 3.0 3.0 3.0 3.0 ns tSDRE Receive Data Setup Before RSCLKx 1 1 tHDRE Receive Data Hold After RSCLKx 3.6 3.6 3.5 3.0 ns tSCLKEW TSCLKx/RSCLKx Width 5.4 5.4 7.0 4.5 ns tSCLKE TSCLKx/RSCLKx Period 18.0 18.0 20.0 15.0 ns Switching Characteristics tDFSE TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2 tHOFSE TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)1 tDDTE Transmit Data Delay After TSCLKx1 tHDTE Transmit Data Hold After TSCLKx 12.0 0.0 12.0 0.0 12.0 1 0.0 10.0 0.0 12.0 0.0 10.0 ns 0.0 10.0 0.0 ns 10.0 ns 0.0 ns 1 Referenced to sample edge. 2 Referenced to drive edge. Table 38. Serial Ports—Internal Clock Parameter ADSP-BF522/524/526 ADSP-BF523/525/527 VDDEXT = 1.8 V VDDEXT = 1.8 V Min Max VDDEXT = 2.5/3.3 V Min Max Min Max VDDEXT = 2.5/3.3 V Min Max Unit Timing Requirements tSFSI TFSx/RFSx Setup Before TSCLKx/RSCLKx1 11.3 1 11.3 11.0 9.6 ns tHFSI TFSx/RFSx Hold After TSCLKx/RSCLKx –1.5 –1.5 –1.5 –1.5 ns tSDRI Receive Data Setup Before RSCLKx1 11.3 11.3 11.0 9.6 ns tHDRI Receive Data Hold After RSCLKx1 –1.5 –1.5 –1.5 –1.5 ns Switching Characteristics tSCLKIW TSCLKx/RSCLKx Width 5.4 5.4 4.5 4.5 ns tSCLKI TSCLKx/RSCLKx Period 18.0 18.0 20.0 15.0 ns tDFSI TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2 tHOFSI TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)1 tDDTI Transmit Data Delay After TSCLKx1 tHDTI 1 2 Transmit Data Hold After TSCLKx 3.0 −4.0 −4.0 3.0 −1.8 1 Referenced to sample edge. Referenced to drive edge. Rev. PrG 3.0 | Page 49 of 80 | February 2009 3.0 −1.0 3.0 −1.8 3.0 −1.0 3.0 −1.8 ns 3.0 −1.5 ns ns ns ADSP-BF522/523/524/525/526/527 Preliminary Technical Data DATA RECEIVE—INTERNAL CLOCK DATA RECEIVE—EXTERNAL CLOCK DRIVE EDGE DRIVE EDGE SAMPLE EDGE SAMPLE EDGE tSCLKIW tSCLKEW RSCLKx RSCLKx tDFSI tDFSE tHOFSI tSFSI tHFSI tHOFSE RFSx tSFSE tHFSE tSDRE tHDRE RFSx tSDRI tHDRI DRx DRx NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RSCLKx OR TSCLKx CAN BE USED AS THE ACTIVE SAMPLING EDGE. DATA TRANSMIT—INTERNAL CLOCK DRIVE EDGE DATA TRANSMIT—EXTERNAL CLOCK DRIVE EDGE SAMPLE EDGE tSCLKIW SAMPLE EDGE tSCLKEW TSCLKx TSCLKx tDFSI tDFSE tHOFSI tSFSI tHFSI tHOFSE TFSx tSFSE tHFSE TFSx tDDTI tDDTE tHDTI tHDTE DTx DTx NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RSCLKx OR TSCLKx CAN BE USED AS THE ACTIVE SAMPLING EDGE. Figure 23. Serial Ports Table 39. Serial Ports—Enable and Three-State Parameter ADSP-BF522/524/526 ADSP-BF523/525/527 VDDEXT = 1.8 V VDDEXT = 1.8 V Min Max VDDEXT = 2.5/3.3 V Min Max Min Max VDDEXT = 2.5/3.3 V Min Max Unit Switching Characteristics tDTENE Data Enable Delay from External TSCLKx1 tDDTTE Data Disable Delay from External TSCLKx1 tDTENI Data Enable Delay from Internal TSCLKx1 tDDTTI 1 Data Disable Delay from Internal TSCLKx 0.0 0.0 10.0 –2.0 1 –2.0 3.0 Referenced to drive edge. DRIVE DRIVE TSCLKx tDTENE/I tDDTTE/I DTx Figure 24. Serial Ports — Enable and Three-State Rev. PrG | Page 50 of 80 | 0.0 10.0 February 2009 0.0 tSCLK+1 –2.0 3.0 –2.0 tSCLK+1 ns tSCLK+1 ns ns tSCLK+1 ns ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 40. Serial Ports — External Late Frame Sync Parameter ADSP-BF522/524/526 ADSP-BF523/525/527 VDDEXT = 1.8 V VDDEXT = 1.8 V Min Max VDDEXT = 2.5/3.3 V Min Max Min Max VDDEXT = 2.5/3.3 V Min Max Unit Switching Characteristics tDDTLFSE Data Delay from Late External TFSx or External RFSx in multi-channel mode with MFD = 01, 2 tDTENLFSE Data Enable from External RFSx in multi-channel mode with MFD = 01, 2 1 2 10.0 0.0 10.0 0.0 When in multi-channel mode, TFSx enable and TFSx valid follow tDTENLFSE and tDDTLFSE. If external RFSx/TFSx setup to RSCLKx/TSCLKx > tSCLKE/2 then tDDTTE/I and tDTENE/I apply, otherwise tDDTLFSE and tDTENLFSE apply. EXTERNAL RFSx IN MULTI-CHANNEL MODE WITH MCE = 1 DRIVE RSCLKx SAMPLE DRIVE tSFSE/I tHOFSE/I RFSx tDTENLFSE 1ST BIT DTx tDDTLFSE LATE EXTERNAL TFSx DRIVE TSCLKx SAMPLE DRIVE tHOFSE/I tSFSE/I TFSx DTx 1ST BIT tDDTLFSE Figure 25. Serial Ports — External Late Frame Sync Rev. PrG | Page 51 of 80 | February 2009 12.0 0.0 10.0 ns 0.0 ns ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Serial Peripheral Interface (SPI) Port—Master Timing Table 41 and Figure 26 describe SPI port master operations. Table 41. Serial Peripheral Interface (SPI) Port—Master Timing Parameter Timing Requirements Data Input Valid to SCK Edge (Data tSSPIDM Input Setup) tHSPIDM SCK Sampling Edge to Data Input Invalid Switching Characteristics SPISELx low to First SCK Edge tSDSCIM Serial Clock High Period tSPICHM Serial Clock Low Period tSPICLM tSPICLK Serial Clock Period Last SCK Edge to SPISELx High tHDSM Sequential Transfer Delay tSPITDM tDDSPIDM SCK Edge to Data Out Valid (Data Out Delay) tHDSPIDM SCK Edge to Data Out Invalid (Data Out Hold) ADSP-BF522/524/526 VDDEXT = 2.5/3.3 V VDDEXT = 1.8 V Min Max Min Max ADSP-BF523/525/527 VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V Min Max Min Max Unit 11.6 11.6 11.6 9.6 ns –1.5 –1.5 –1.5 –1.5 ns 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 4 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 4 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 4 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 4 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 ns ns ns ns ns ns ns 6 –1.0 6 6 –1.0 –1.0 –1.0 SPISELx (OUTPUT) tSDSCIM tSPICHM tSPICLM tSPICLM tSPICHM tSPICLK tHDSM SCK (CPOL = 0) (OUTPUT) SCK (CPOL = 1) (OUTPUT) tHDSPIDM MOSI (OUTPUT) tDDSPIDM MSB LSB CPHA = 1 tSSPIDM MISO (INPUT) MSB VALID LSB VALID tHDSPIDM MOSI (OUTPUT) CPHA = 0 MISO (INPUT) tDDSPIDM MSB tSSPIDM tHSPIDM LSB tHSPIDM MSB VALID LSB VALID Figure 26. Serial Peripheral Interface (SPI) Port—Master Timing Rev. PrG | Page 52 of 80 | February 2009 6 tSPITDM ns ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Serial Peripheral Interface (SPI) Port—Slave Timing Table 42 and Figure 27 describe SPI port slave operations. Table 42. Serial Peripheral Interface (SPI) Port—Slave Timing ADSP-BF522/524/526 VDDEXT = 2.5/3.3 V VDDEXT = 1.8 V Min Max Min Max Parameter Timing Requirements Serial Clock High Period tSPICHS tSPICLS Serial Clock Low Period Serial Clock Period tSPICLK Last SCK Edge to SPISS Not Asserted Sequential Transfer Delay SPISS Assertion to First SCK Edge Data Input Valid to SCK Edge (Data Input Setup) SCK Sampling Edge to Data Input Invalid tHSPID Switching Characteristics SPISS Assertion to Data Out Active tDSOE SPISS Deassertion to Data High Impedance tDSDHI SCK Edge to Data Out Valid (Data Out Delay) tDDSPID tHDSPID SCK Edge to Data Out Invalid (Data Out Hold) tHDS tSPITDS tSDSCI tSSPID ADSP-BF523/525/527 VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V Min Max Min Max Unit 2 × tSCLK –1.5 2 × tSCLK –1.5 4× tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 1.6 2 × tSCLK –1.5 2 × tSCLK –1.5 4× tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 1.6 2 × tSCLK –1.5 2 × tSCLK –1.5 4× tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 1.6 2 × tSCLK –1.5 2 × tSCLK –1.5 4× tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 2 × tSCLK –1.5 1.6 ns ns ns 1.6 1.6 1.6 1.6 ns 0 0 12.0 8.5 10 0 0 0 12.0 8.5 10 0 0 0 12.0 8.5 10 0 0 SPISS (INPUT) tSPICHS tSPICLS tSPICLS tSPICHS tSPICLK tHDS SCKx (CPOL = 0) (INPUT) tSDSCI SCKx (CPOL = 1) (INPUT) tDSOE tDDSPID tHDSPID MISOx (OUTPUT) tSSPID MOSIx (INPUT) LSB tHSPID MSB VALID tDSOE LSB VALID tHDSPID tDSDHI tDDSPID MSB LSB tHSPID CPHA = 0 MOSIx (INPUT) tDSDHI MSB CPHA = 1 MISOx (OUTPUT) tDDSPID tSSPID MSB VALID LSB VALID Figure 27. Serial Peripheral Interface (SPI) Port—Slave Timing Rev. PrG | Page 53 of 80 | February 2009 0 0 tSPITDS ns ns ns ns 10.3 ns 8 ns 10 ns ns ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Universal Serial Bus (USB) On-The-Go—Receive and Transmit Timing Table 43 describes the USB On-The-Go receive and transmit operations. Table 43. USB On-The-Go—Receive and Transmit Timing ADSP-BF522/524/526 ADSP-BF523/525/527 VDDEXT = VDDEXT = 1.8 V VDDEXT = VDDEXT = 1.8 V 2.5/3.3 V 2.5/3.3 V Min Max Min Max Min Max Min Max Unit Parameter Timing Requirements fUSBS USB_XI Frequency FSUSB USB_XI Clock Frequency Stability 9 –50 33.3 50 9 –50 33.3 50 9 –50 33.3 50 9 –50 33.3 MHz 50 ppm Universal Asynchronous Receiver-Transmitter (UART) Ports—Receive and Transmit Timing Figure 28 describes the UART ports receive and transmit operations. The maximum baud rate is SCLK/16. There is some latency between the generation of internal UART interrupts and the external data operations. These latencies are negligible at the data transmission rates for the UART. CLKOUT (SAMPLE CLOCK) UARTx Rx DATA(5-8) STOP RECEIVE INTERNAL UART RECEIVE UART RECEIVE BIT SET BY DATA STOP ; CLEARED BY FIFO READ INTERRUPT START UARTx Tx DATA(5-8) STOP (1-2) TRANSMIT INTERNAL UART TRANSMIT INTERRUPT UART TRANSMIT BIT SET BY PROGRAM; CLEARED BY WRITE TO TRANSMIT Figure 28. UART Ports—Receive and Transmit Timing Rev. PrG | Page 54 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data General-Purpose Port Timing Table 44 and Figure 29 describe general-purpose port operations. Table 44. General-Purpose Port Timing ADSP-BF522/524/526 VDDEXT = VDDEXT = 1.8 V 2.5/3.3 V Min Max Min Max Parameter Timing Requirement General-Purpose Port Ball Input Pulse Width tSCLK + 1 tWFI Switching Characteristics General-Purpose Port Ball Output Delay from 0 tGPOD CLKOUT Low tSCLK + 1 9.66 0 CLKOUT tGPOD GPIO OUTPUT tWFI GPIO INPUT Figure 29. General-Purpose Port Timing Rev. PrG | Page 55 of 80 | February 2009 ADSP-BF523/525/527 VDDEXT = VDDEXT = 1.8 V 2.5/3.3 V Min Max Min Max tSCLK + 1 9.66 0 tSCLK + 1 8.2 0 Unit ns 6.5 ns ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Timer Cycle Timing Table 45 and Figure 30 describe timer expired operations. The input signal is asynchronous in “width capture mode” and “external clock mode” and has an absolute maximum input frequency of (fSCLK/2) MHz. Table 45. Timer Cycle Timing ADSP-BF522/524/526 VDDEXT = 1.8 V Parameter Min ADSP-BF523/525/527 VDDEXT = 2.5/3.3 V Max Min Max VDDEXT = 1.8 V Min Max VDDEXT = 2.5/3.3 V Min Max Unit Timing Characteristics tWL Timer Pulse Width Input Low (Measured In SCLK Cycles)1 tSCLK tSCLK tSCLK tSCLK ns tWH Timer Pulse Width Input High (Measured In SCLK Cycles)1 tSCLK tSCLK tSCLK tSCLK ns tTIS Timer Input Setup Time Before CLKOUT Low2 5 5 8.1 6.2 ns tTIH Timer Input Hold Time After CLKOUT Low2 –2 –2 –2 –2 ns Switching Characteristics tHTO Timer Pulse Width Output (Measured In SCLK Cycles) tTOD Timer Output Update Delay After CLKOUT High 1 2 tSCLK (232–1)tSCLK tSCLK (232–1)tSCLK 8.1 tSCLK–1 (232–1)tSCLK 8.1 6 tSCLK–1 (232–1)tSCLK ns 6 ns The minimum pulse widths apply for TMRx signals in width capture and external clock modes. They also apply to the PF15 or PPI_CLK signals in PWM output mode. Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize programmable flag inputs. CLKOUT tTOD TMRX OUTPUT tHTO tTIS tTIH TMRx INPUT tWH, tWL Figure 30. Timer Cycle Timing Rev. PrG | Page 56 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Timer Clock Timing Table 46 and Figure 31 describe timer clock timing. Table 46. Timer Clock Timing VDDEXT = 1.8 V Parameter Min Max VDDEXT = 2.5/3.3 V Min Max Unit 12.0 ns Switching Characteristic tTODP Timer Output Update Delay After PPI_CLK High 12.0 PPI_CLK tTODP TMRx OUTPUT Figure 31. Timer Clock Timing Up/Down Counter/Rotary Encoder Timing Table 47. Up/Down Counter/Rotary Encoder Timing Parameter Timing Requirements tWCOUNT Up/Down Counter/Rotary Encoder Input Pulse Width tCIS Counter Input Setup Time Before CLKOUT Low1 Counter Input Hold Time After CLKOUT Low1 tCIH 1 VDDEXT = 1.8 V Min Max tSCLK + 1 4.0 4.0 Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize counter inputs. CLK OUT tCIS tCIH CUD/CDG/CZM tWCOUNT Figure 32. Up/Down Counter/Rotary Encoder Timing Rev. PrG | Page 57 of 80 | February 2009 VDDEXT = 2.5/3.3 V Min Max tSCLK + 1 4.0 4.0 Unit ns ns ns ADSP-BF522/523/524/525/526/527 Preliminary Technical Data HOSTDP A/C Timing- Host Read Cycle Table 48 describe the HOSTDP A/C Host Read Cycle timing requirements. Table 48. Host Read Cycle Timing Requirements Parameter Timing Requirements tSADRDL HOST_ADDR and HOST_CE Setup before HOST_RD falling edge tHADRDH HOST_ADDR and HOST_CE Hold after HOST_RD rising edge tRDWL HOST_RD pulse width low (ACK mode) ADSP-BF522/524/526, VDDEXT = 2.5/3.3 V VDDEXT = 1.8 V Min Max Min Max ADSP-BF523/525/527 VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V Min Max Min Max Unit 4 4 4 4 ns 2.5 2.5 2.5 2.5 ns tDRDYRDL + tDRDYRDL + tDRDYRDL + tDRDYRDL + tRDYPRD + tRDYPRD + tRDYPRD + tRDYPRD + tDRDHRDY tDRDHRDY tDRDHRDY tDRDHRDY tRDWL HOST_RD pulse width low 1.5 × tSCLK 1.5 × tSCLK 1.5 × tSCLK 1.5 × tSCLK (INT mode) + 8.7 + 8.7 + 8.7 + 8.7 tRDWH HOST_RD pulse width high or time 2 × tSCLK 2 × tSCLK 2 × tSCLK 2 × tSCLK between HOST_RD rising edge and HOST_WR falling edge tDRDHRDY HOST_RD rising edge delay after 0 0 0 0 HOST_ACK rising edge (ACK mode) Switching Characteristics tSDATRDY Data valid prior HOST_ACK rising 4.5 3.5 4.5 3.5 edge (ACK mode) 1.5 × tSCLK tDRDYRDL Host_ACK assertion delay after 1.5 × tSCLK 1.5 × tSCLK 1.5 × tSCLK HOST_RD/HOST_CE (ACK mode) tRDYPRD HOST_ACK low pulse-width for NM1 NM1 NM1 NM1 Read access (ACK mode) tDDARWH Data disable after HOST_RD 9.0 9.0 9.0 9.0 tACC Data valid after HOST_RD falling 1.5 × tSCLK 1.5 × tSCLK 1.5 × tSCLK 1.5 × tSCLK edge (INT mode) tHDARWH Data hold after HOST_RD rising 1.0 1.0 1.0 1.0 edge 1 NM (Not Measured) — This parameter is not measured, because the time for which HOST_ACK is low is system design dependent. HOST_ADDR HOST_CE tSADRDL tHADRDH tRDWL HOST_RD HOST_ACK tDRDYRDL tRDYPRD tRDWH tDRDHRDY tSDATRDY tDDARWH tHDARWH HOST_D15-0 tACC Figure 33. HOSTDP A/C- Host Read Cycle Rev. PrG | Page 58 of 80 | February 2009 ns ns ns ns ns ns ns ns ns ns ADSP-BF522/523/524/525/526/527 Preliminary Technical Data HOSTDP A/C Timing- Host Write Cycle Table 49 describes the HOSTDP A/C Host Write Cycle timing requirements. Table 49. Host Write Cycle Timing Requirements Parameter Timing Requirements tSADWRL HOST_ADDR/HOST_CE Setup before HOST_WR falling edge tHADWRH HOST_ADDR/HOST_CE Hold after HOST_WR rising edge tWRWL HOST_WR pulse width low (ACK mode) HOST_WR pulse width low (INT mode) tWRWH HOST_WR pulse width high or time between HOST_WR rising edge and HOST_RD falling edge tDWRHRDY HOST_WR rising edge delay after HOST_ACK rising edge (ACK mode) tHDATWH Data Hold after HOST_WR rising edge tSDATWH Data Setup before HOST_WR rising edge Switching Characteristics tDRDYWRL HOST_ACK low delay after HOST_WR/HOST_CE asserted (ACK mode) tRDYPWR HOST_ACK low pulse-width for Write access (ACK mode) 1 ADSP-BF522/524/526 VDDEXT = 2.5/3.3 V VDDEXT = 1.8 V Min Max Min Max ADSP-BF523/525/527 VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V Min Max Min Max Unit 4 4 4 4 ns 2.5 2.5 2.5 2.5 ns tDRDYWRL + tRDYPRD + tDWRHRDY 1.5 × tSCLK + 8.7 2 × tSCLK tDRDYWRL + tRDYPRD + tDWRHRDY 1.5 × tSCLK + 8.7 2 × tSCLK tDRDYWRL + tRDYPRD + tDWRHRDY 1.5 × tSCLK + 8.7 2 × tSCLK tDRDYWRL + tRDYPRD + tDWRHRDY 1.5 × tSCLK + 8.7 2 × tSCLK ns 0 0 0 0 ns 2.5 2.5 2.5 2.5 ns 2.5 2.5 2.5 2.5 ns 1.5 × tSCLK 1.5 × tSCLK 1.5 × tSCLK NM1 NM1 NM1 NM (Not Measured) — This parameter is not measured, because the time for which HOST_ACK is low is system design dependent. HOST_ADDR HOST_CE tSADWRL tHADWRH tWRWL HOST_WR HOST_ACK tDRDYWRL tRDYPWR tWRWH tDWRHRDY tSDATWH tHDATWH HOST_D15-0 Figure 34. HOSTDP A/C- Host Write Cycle Rev. PrG | Page 59 of 80 | February 2009 ns ns 1.5 × tSCLK ns NM1 ns ADSP-BF522/523/524/525/526/527 Preliminary Technical Data 10/100 Ethernet MAC Controller Timing Table 50 through Table 55 and Figure 35 through Figure 40 describe the 10/100 Ethernet MAC Controller operations. Table 50. 10/100 Ethernet MAC Controller Timing: MII Receive Signal Parameter tERXCLKF 1 ERxCLK Frequency (fSCLK = SCLK Frequency) ERxCLK Width (tERxCLK = ERxCLK Period) Rx Input Valid to ERxCLK Rising Edge (Data In Setup) ERxCLK Rising Edge to Rx Input Invalid (Data In Hold) tERXCLKW tERXCLKIS tERXCLKIH 1 VDDEXT = 1.8 V Min Max None 25 + 1% fSCLK + 1% tERxCLK x 40% tERxCLK x 60% 7.5 7.5 VDDEXT = 2.5/3.3 V Min Max None 25 + 1% fSCLK + 1% tERxCLK x 35% tERxCLK x 65% 7.5 7.5 Unit MHz ns ns ns MII inputs synchronous to ERxCLK are ERxD3–0, ERxDV, and ERxER. Table 51. 10/100 Ethernet MAC Controller Timing: MII Transmit Signal Parameter tETXCLKF 1 tETXCLKW tETXCLKOV tETXCLKOH 1 VDDEXT = 1.8 V Min Max ETxCLK Frequency (fSCLK = SCLK Frequency) None 25 + 1% fSCLK + 1% ETxCLK Width (tETxCLK = ETxCLK Period) tETxCLK x 40% tETxCLK x 60% ETxCLK Rising Edge to Tx Output Valid (Data Out Valid) 20 ETxCLK Rising Edge to Tx Output Invalid (Data Out 0 Hold) VDDEXT = 2.5/3.3 V Min Max None 25 + 1% fSCLK + 1% tETxCLK x 35% tETxCLK x 65% 20 0 Unit MHz ns ns ns MII outputs synchronous to ETxCLK are ETxD3–0. Table 52. 10/100 Ethernet MAC Controller Timing: RMII Receive Signal Parameter1 tEREFCLKF tEREFCLKW tEREFCLKIS tEREFCLKIH 1 REF_CLK Frequency (fSCLK = SCLK Frequency) EREF_CLK Width (tEREFCLK = EREFCLK Period) Rx Input Valid to RMII REF_CLK Rising Edge (Data In Setup) RMII REF_CLK Rising Edge to Rx Input Invalid (Data In Hold) VDDEXT = 1.8 V VDDEXT = 2.5/3.3 V Min Max Min Max None 50 + 1% None 50 + 1% 2 x fSCLK + 1% 2 x fSCLK + 1% tEREFCLK x 40% tEREFCLK x 60% tEREFCLK x 35% tEREFCLK x 65% 4 4 2 2 Unit MHz ns ns ns RMII inputs synchronous to RMII REF_CLK are ERxD1–0, RMII CRS_DV, and ERxER. Table 53. 10/100 Ethernet MAC Controller Timing: RMII Transmit Signal Parameter1 tEREFCLKOV tEREFCLKOH 1 ADSP-BF522/524/526 VDDEXT = VDDEXT = 1.8 V 2.5/3.3 V Min Max Min Max 8.1 8.1 RMII REF_CLK Rising Edge to Tx Output Valid (Data Out Valid) RMII REF_CLK Rising Edge to Tx Output Invalid (Data Out Hold) 2 RMII outputs synchronous to RMII REF_CLK are ETxD1–0. Rev. PrG | Page 60 of 80 | February 2009 2 ADSP-BF523/525/527 VDDEXT = VDDEXT = 1.8 V 2.5/3.3 V Min Max Min Max Unit 7.5 7.5 ns 2 2 ns ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 54. 10/100 Ethernet MAC Controller Timing: MII/RMII Asynchronous Signal VDDEXT = 1.8 V Parameter 1, 2 Min VDDEXT = 2.5/3.3 V Max Min Max Unit tECOLH COL Pulse Width High tETxCLK x 1.5 tERxCLK x 1.5 tETxCLK x 1.5 tERxCLK x 1.5 ns tECOLL COL Pulse Width Low tETxCLK x 1.5 tERxCLK x 1.5 tETxCLK x 1.5 tERxCLK x 1.5 ns tECRSH CRS Pulse Width High tETxCLK x 1.5 tETxCLK x 1.5 ns tECRSL CRS Pulse Width Low tETxCLK x 1.5 tETxCLK x 1.5 ns 1 MII/RMII asynchronous signals are COL and CRS. These signals are applicable in both MII and RMII modes. The asynchronous COL input is synchronized separately to both the ETxCLK and the ERxCLK, and the COL input must have a minimum pulse width high or low at least 1.5 times the period of the slower of the two clocks. 2 The asynchronous CRS input is synchronized to the ETxCLK, and the CRS input must have a minimum pulse width high or low at least 1.5 times the period of ETxCLK. Table 55. 10/100 Ethernet MAC Controller Timing: MII Station Management Parameter1 ADSP-BF522/524/526 ADSP-BF523/525/527 VDDEXT = 1.8 V VDDEXT = 1.8 V Min Max VDDEXT = 2.5/3.3 V Min Max Min Max VDDEXT = 2.5/3.3 V Min Max Unit tMDIOS MDIO Input Valid to MDC Rising Edge (Setup) 11.5 11.5 10 10 ns tMDCIH MDC Rising Edge to MDIO Input Invalid (Hold) 11.5 11.5 10 10 ns tMDCOV MDC Falling Edge to MDIO Output Valid 25 25 25 25 ns tMDCOH MDC Falling Edge to MDIO Output Invalid (Hold) –1 –1 –1 –1 ns 1 MDC/MDIO is a 2-wire serial bidirectional port for controlling one or more external PHYs. MDC is an output clock whose minimum period is programmable as a multiple of the system clock SCLK. MDIO is a bidirectional data line. tERXCLK ERx_CLK tERXCLKW ERxD3-0 ERxDV ERxER tERXCLKIS tERXCLKIH Figure 35. 10/100 Ethernet MAC Controller Timing: MII Receive Signal tETXCLK MII TxCLK tETXCLKW tETXCLKOH ETxD3-0 ETxEN tETXCLKOV Figure 36. 10/100 Ethernet MAC Controller Timing: MII Transmit Signal Rev. PrG | Page 61 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data tREFCLK RMII _REF_CLK tREFCLKW ERxD1-0 ERxDV ERxER tREFCLKIS tREFCLKIH Figure 37. 10/100 Ethernet MAC Controller Timing: RMII Receive Signal tREFCLK RMII _REF_CLK tREFCLKOH ETxD1-0 ETxEN tREFCLKOV Figure 38. 10/100 Ethernet MAC Controller Timing: RMII Transmit Signal MII CRS, COL tECRSH tECOLH tECRSL tECOLL Figure 39. 10/100 Ethernet MAC Controller Timing: Asynchronous Signal MDC (OUTPUT) tMDCOH MDIO (OUTPUT) tMDCOV MDIO (INPUT) tMDIOS tMDCIH Figure 40. 10/100 Ethernet MAC Controller Timing: MII Station Management Rev. PrG | Page 62 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data JTAG Test And Emulation Port Timing Table 56 and Figure 41 describe JTAG port operations. Table 56. JTAG Port Timing VDDEXT = 1.8 V Parameter Min Max VDDEXT = 2.5/3.3 V Min Max Unit Timing Parameters tTCK TCK Period 20 20 ns tSTAP TDI, TMS Setup Before TCK High 4 4 ns tHTAP TDI, TMS Hold After TCK High 4 4 ns 12 12 ns 5 5 ns 4 4 TCK System Inputs Setup Before TCK High tSSYS System Inputs Hold After TCK High tHSYS 1 1 2 TRST Pulse Width (measured in TCK cycles) tTRSTW Switching Characteristics TDO Delay from TCK Low tDTDO System Outputs Delay After TCK Low tDSYS 3 1 10 10 ns 12 12 ns System Inputs = DATA15–0, ARDY, SCL, SDA, PF15–0, PG15–0, PH15–0, TCK, TRST, RESET, NMI, BMODE3–0. 50 MHz Maximum 3 System Outputs = DATA15–0, ADDR19–1, ABE1–0, AOE, ARE, AWE, AMS3–0, SRAS, SCAS, SWE, SCKE, CLKOUT, SA10, SMS, SCL, SDA, PF15–0, PG15–0, PH15–0, TDO, EMU. 2 tTCK TCK tSTAP tHTAP TMS TDI tDTDO TDO tSSYS tHSYS SYSTEM INPUTS tDSYS SYSTEM OUTPUTS Figure 41. JTAG Port Timing Rev. PrG | Page 63 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data OUTPUT DRIVE CURRENTS Figure 42 through Figure 56 show typical current-voltage characteristics for the output drivers of the ADSP-BF523/525/527 and ADSP-BF522/524/526 processors. The curves represent the current drive capability of the output drivers. See Table 10 on Page 22 for information about which driver type corresponds to a particular ball. 240 200 160 200 VDDEXT = 3.3V @ 25°C 160 VDDEXT = 3.0V @ 105°C 80 VOH 40 0 – 40 – 80 VOL – 120 VDDEXT = 3.6V @ – 40°C VDDEXT = 3.3V @ 25°C VDDEXT = 3.0V @ 105°C 120 SOURCE CURRENT (mA) 120 SOURCE CURRENT (mA) VDDEXT = 3.6V @ – 40°C 80 VOH 40 0 – 40 – 80 – 120 VOL – 160 – 160 – 200 – 240 – 200 0 0.5 1.0 1.5 2.0 2.5 3.0 0 3.5 0.5 1.0 1.5 2.0 SOURCE VOLTAGE (V) 3.5 160 160 VDDEXT = 2.75V @ – 40°C VDDEXT = 2.75V @ – 40°C 120 VDDEXT = 2.5V @ 25°C 120 VDDEXT = 2.5V @ 25°C VDDEXT = 2.25V @ 105°C 80 VDDEXT = 2.25V @ 105°C 40 VOH 0 – 40 – 80 VOL SOURCE CURRENT (mA) 80 SOURCE CURRENT (mA) 3.0 Figure 45. Driver Type B Current (3.3V VDDEXT/VDDMEM) Figure 42. Driver Type A Current (3.3V VDDEXT/VDDMEM) – 120 40 VOH 0 – 40 – 80 VOL – 120 – 160 – 200 – 160 0 0.5 1.0 1.5 2.0 0 2.5 0.5 1.0 1.5 2.0 2.5 SOURCE VOLTAGE (V) SOURCE VOLTAGE (V) Figure 46. Driver Type B Current (2.5V VDDEXT/VDDMEM) Figure 43. Driver Type A Current (2.5V VDDEXT/VDDMEM) 80 80 VDDEXT = 1.9V @ – 40°C 60 VDDEXT = 1.9V @ – 40°C 60 VDDEXT = 1.8V @ 25°C VDDEXT = 1.7V @ 105°C 20 0 – 20 VOL – 40 – 60 SOURCE CURRENT (mA) VOH VDDEXT = 1.8V @ 25°C VDDEXT = 1.7V @ 105°C 40 40 SOURCE CURRENT (mA) 2.5 SOURCE VOLTAGE (V) VOH 20 0 – 20 – 40 VOL – 60 – 80 – 100 – 80 0 0.5 1.0 1.5 0 0.5 SOURCE VOLTAGE (V) 1.0 1.5 SOURCE VOLTAGE (V) Figure 47. Driver Type B Current (1.8V VDDEXT/VDDMEM) Figure 44. Driver Type A Current (1.8V VDDEXT/VDDMEM) Rev. PrG | Page 64 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data 100 160 120 VDDEXT = 3.3V @ 25°C 60 VDDEXT = 3.0V @ 105°C 40 VOH 20 0 – 20 – 40 VOL – 60 VDDEXT = 3.3V @ 25°C VDDEXT = 3.0V @ 105°C 80 SOURCE CURRENT (mA) SOURCE CURRENT (mA) VDDEXT = 3.6V @ – 40°C VDDEXT = 3.6V @ – 40°C 80 VOH 40 0 – 40 – 80 VOL – 120 – 80 – 100 – 160 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 0.5 1.0 1.5 SOURCE VOLTAGE (V) Figure 48. Driver Type C Current (3.3V VDDEXT/VDDMEM) 3.0 3.5 120 VDDEXT = 2.75V @ – 40°C VDDEXT = 2.75V @ – 40°C 100 VDDEXT = 2.5V @ 25°C VDDEXT = 2.5V @ 25°C 80 VDDEXT = 2.25V @ 105°C 40 VDDEXT = 2.25V @ 105°C 60 20 VOH 0 – 20 – 40 VOL SOURCE CURRENT (mA) SOURCE CURRENT (mA) 2.5 Figure 51. Driver Type D Current (3.3V VDDEXT/VDDMEM) 80 60 2.0 SOURCE VOLTAGE (V) 40 VOH 20 0 – 20 – 40 – 60 VOL – 80 – 60 – 100 – 80 – 120 0 0.5 1.0 1.5 2.0 2.5 0 0.5 1.0 SOURCE VOLTAGE (V) Figure 49. Drive Type C Current (2.5V VDDEXT/VDDMEM) 2.5 60 VDDEXT = 1.9V @ – 40°C VDDEXT = 1.9V @ – 40°C VDDEXT = 1.8V @ 25°C VDDEXT = 1.7V @ 105°C VDDEXT = 1.8V @ 25°C VDDEXT = 1.7V @ 105°C 40 VOH 10 0 – 10 VOL – 20 SOURCE CURRENT (mA) 20 SOURCE CURRENT (mA) 2.0 Figure 52. Driver Type D Current (2.5V VDDEXT/VDDMEM) 40 30 1.5 SOURCE VOLTAGE (V) 20 VOH 0 – 20 VOL – 40 – 30 – 40 0 0.5 1.0 – 60 1.5 0 0.5 SOURCE VOLTAGE (V) 1.0 1.5 SOURCE VOLTAGE (V) Figure 50. Driver Type C Current (1.8V VDDEXT/VDDMEM) Rev. PrG Figure 53. Driver Type D Current (1.8V VDDEXT/VDDMEM) | Page 65 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data 60 VDDEXT = 3.6V @ – 40°C 50 VDDEXT = 3.3V @ 25°C 40 VDDEXT = 3.0V @ 105°C SOURCE CURRENT (mA) 30 20 10 0 – 10 – 20 – 30 VOL – 40 – 50 – 60 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 SOURCE VOLTAGE (V) Figure 54. Driver Type E Current (3.3V VDDEXT/VDDMEM) 40 VDDEXT = 2.75V @ – 40°C 30 VDDEXT = 2.5V @ 25°C VDDEXT = 2.25V @ 105°C SOURCE CURRENT (mA) 20 10 0 –10 VOL – 20 – 30 – 40 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 SOURCE VOLTAGE (V) Figure 55. Driver Type E Current (2.5V VDDEXT/VDDMEM) 20 VDDEXT = 1.9V @ – 40°C 15 VDDEXT = 1.8V @ 25°C VDDEXT = 1.7V @ 105°C SOURCE CURRENT (mA) 10 5 0 –5 VOL – 10 – 15 – 20 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 SOURCE VOLTAGE (V) Figure 56. Driver Type E Current (1.8V VDDEXT/VDDMEM) Rev. PrG | Page 66 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data TEST CONDITIONS Output Disable Time Measurement All timing parameters appearing in this data sheet were measured under the conditions described in this section. Figure 57 shows the measurement point for AC measurements (except output enable/disable). The measurement point VMEAS is VDDEXT/2 or VDDMEM/2 for VDDEXT/VDDMEM (nominal) = 1.8 V/2.5 V/3.3 V. Output balls are considered to be disabled when they stop driving, go into a high impedance state, and start to decay from their output high or low voltage. The output disable time tDIS is the difference between tDIS_MEASURED and tDECAY as shown on the left side of Figure 58. t DIS = t DIS_MEASURED – t DECAY INPUT OR OUTPUT V MEAS The time for the voltage on the bus to decay by ΔV is dependent on the capacitive load CL and the load current IL. This decay time can be approximated by the equation: VMEAS t DECAY = ( C L ΔV ) ⁄ I L The time tDECAY is calculated with test loads CL and IL, and with ΔV equal to 0.25 V for VDDEXT/VDDMEM (nominal) = 2.5 V/3.3 V and 0.15 V for VDDEXT/VDDMEM (nominal) = 1.8V. Figure 57. Voltage Reference Levels for AC Measurements (Except Output Enable/Disable) Output Enable Time Measurement Output balls are considered to be enabled when they have made a transition from a high impedance state to the point when they start driving. The output enable time tENA is the interval from the point when a reference signal reaches a high or low voltage level to the point when the output starts driving as shown on the right side of Figure 58. REFERENCE SIGNAL tDIS_MEASURED tDIS tENA_MEASURED tENA VOH (MEASURED) VOL (MEASURED) VOH (MEASURED) ⴚ ⌬V VOH(MEASURED) VTRIP (HIGH) VOL (MEASURED) + ⌬V VTRIP (LOW) VOL (MEASURED) tDECAY OUTPUT STOPS DRIVING The time tDIS_MEASURED is the interval from when the reference signal switches, to when the output voltage decays ΔV from the measured output high or output low voltage. Example System Hold Time Calculation To determine the data output hold time in a particular system, first calculate tDECAY using the equation given above. Choose ΔV to be the difference between the processor’s output voltage and the input threshold for the device requiring the hold time. CL is the total bus capacitance (per data line), and IL is the total leakage or three-state current (per data line). The hold time will be tDECAY plus the various output disable times as specified in the Timing Specifications on Page 38 (for example tDSDAT for an SDRAM write cycle as shown in SDRAM Interface Timing on Page 44). tTRIP OUTPUT STARTS DRIVING HIGH IMPEDANCE STATE Figure 58. Output Enable/Disable The time tENA_MEASURED is the interval, from when the reference signal switches, to when the output voltage reaches VTRIP(high) or VTRIP(low). For VDDEXT/VDDMEM (nominal) = 1.8V, VTRIP (high) is 1.05V, and VTRIP (low) is 0.75V. For VDDEXT/VDDMEM (nominal) = 2.5V, VTRIP (high) is 1.5V and VTRIP (low) is 1.0V. For VDDEXT/VDDMEM (nominal) = 3.3V, VTRIP (high) is 1.9V, and VTRIP (low) is 1.4V. Time tTRIP is the interval from when the output starts driving to when the output reaches the VTRIP(high) or VTRIP(low) trip voltage. Time tENA is calculated as shown in the equation: t ENA = t ENA_MEASURED – t TRIP If multiple balls (such as the data bus) are enabled, the measurement value is that of the first ball to start driving. Rev. PrG | Page 67 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Capacitive Loading Output delays and holds are based on standard capacitive loads of an average of 6 pF on all balls (see Figure 59). VLOAD is equal to (VDDEXT/VDDMEM) /2. The graphs of Figure 60 through Figure 71 show how output rise time varies with capacitance. The delay and hold specifications given should be derated by a factor derived from these figures. The graphs in these figures may not be linear outside the ranges shown. TESTER PIN ELECTRONICS 50: VLOAD T1 DUT OUTPUT 45: 70: ZO = 50:(impedance) TD = 4.04 r 1.18 ns 50: 4pF 0.5pF 2pF 400: NOTES: THE WORST CASE TRANSMISSION LINE DELAY IS SHOWN AND CAN BE USED FOR THE OUTPUT TIMING ANALYSIS TO REFELECT THE TRANSMISSION LINE EFFECT AND MUST BE CONSIDERED. THE TRANSMISSION LINE (TD), IS FOR LOAD ONLY AND DOES NOT AFFECT THE DATA SHEET TIMING SPECIFICATIONS. ANALOG DEVICES RECOMMENDS USING THE IBIS MODEL TIMING FOR A GIVEN SYSTEM REQUIREMENT. IF NECESSARY, A SYSTEM MAY INCORPORATE EXTERNAL DRIVERS TO COMPENSATE FOR ANY TIMING DIFFERENCES. Figure 59. Equivalent Device Loading for AC Measurements (Includes All Fixtures) Rev. PrG | Page 68 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data 9 12 tRISE 8 tFALL 6 4 2 tRISE = 1.8V @ 25°C RISE AND FALL TIME (10% TO 90%) RISE AND FALL TIME (10% TO 90%) 8 10 tRISE 7 6 tFALL 5 4 3 2 tRISE = 1.8V @ 25°C 1 tFALL = 1.8V @ 25°C tFALL = 1.8V @ 25°C 0 0 0 50 100 150 0 200 50 Figure 60. Driver Type A Typical Rise and Fall Times (10%–90%) versus Load Capacitance (1.8V VDDEXT/VDDMEM) 150 7 6 tRISE 5 tFALL 4 3 2 1 tRISE = 2.5V @ 25°C RISE AND FALL TIME (10% TO 90%) 7 6 5 tRISE 4 tFALL 3 2 1 tRISE = 2.5V @ 25°C tFALL = 2.5V @ 25°C tFALL = 2.5V @ 25°C 0 0 0 50 100 150 200 0 50 LOAD CAPACITANCE (pF) 100 150 200 LOAD CAPACITANCE (pF) Figure 61. Driver Type A Typical Rise and Fall Times (10%–90%) versus Load Capacitance (2.5V VDDEXT/VDDMEM) Figure 64. Driver Type B Typical Rise and Fall Times (10%–90%) versus Load Capacitance (2.5V VDDEXT/VDDMEM) 6 6 5 tRISE 4 tFALL 3 2 1 tRISE = 3.3V @ 25°C RISE AND FALL TIME (10% TO 90%) RISE AND FALL TIME (10% TO 90%) 200 Figure 63. Driver Type B Typical Rise and Fall Times (10%–90%) versus Load Capacitance (1.8V VDDEXT/VDDMEM) 8 RISE AND FALL TIME (10% TO 90%) 100 LOAD CAPACITANCE (pF) LOAD CAPACITANCE (pF) 5 tRISE 4 tFALL 3 2 1 tRISE = 3.3V @ 25°C tFALL = 3.3V @ 25°C 0 tFALL = 3.3V @ 25°C 0 0 50 100 150 200 0 LOAD CAPACITANCE (pF) 50 100 150 200 LOAD CAPACITANCE (pF) Figure 62. Driver Type A Typical Rise and Fall Times (10%–90%) versus Load Capacitance (3.3V VDDEXT/VDDMEM) Rev. PrG | Page 69 of 80 | Figure 65. Driver Type B Typical Rise and Fall Times (10%–90%) versus Load Capacitance (3.3V VDDEXT/VDDMEM) February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data 14 20 tRISE 15 tFALL 10 5 tRISE = 1.8V @ 25°C RISE AND FALL TIME (10% TO 90%) RISE AND FALL TIME (10% TO 90%) 25 12 tRISE 10 tFALL 8 6 4 2 tRISE = 1.8V @ 25°C tFALL = 1.8V @ 25°C tFALL = 1.8V @ 25°C 0 0 0 50 100 150 0 200 50 LOAD CAPACITANCE (pF) Figure 66. Driver Type C Typical Rise and Fall Times (10%–90%) versus Load Capacitance (1.8V VDDEXT/VDDMEM) 200 10 9 14 12 tRISE 10 tFALL 8 6 4 2 tRISE = 2.5V @ 25°C RISE AND FALL TIME (10% TO 90%) RISE AND FALL TIME (10% TO 90%) 150 Figure 69. Driver Type D Typical Rise and Fall Times (10%–90%) versus Load Capacitance (1.8V VDDEXT/VDDMEM) 16 50 100 150 7 tRISE 6 tFALL 5 4 3 2 tRISE = 2.5V @ 25°C tFALL = 2.5V @ 25°C 0 0 0 8 1 tFALL = 2.5V @ 25°C 0 200 50 Figure 67. Driver Type C Typical Rise and Fall Times (10%–90%) versus Load Capacitance (2.5V VDDEXT/VDDMEM) 150 12 7 tRISE 10 8 tFALL 6 4 tRISE = 3.3V @ 25°C RISE AND FALL TIME (10% TO 90%) 8 6 tRISE 5 tFALL 4 3 2 1 tRISE = 3.3V @ 25°C tFALL = 3.3V @ 25°C 0 tFALL = 3.3V @ 25°C 0 0 50 100 150 200 Figure 70. Driver Type D Typical Rise and Fall Times (10%–90%) versus Load Capacitance (2.5V VDDEXT/VDDMEM) 14 2 100 LOAD CAPACITANCE (pF) LOAD CAPACITANCE (pF) RISE AND FALL TIME (10% TO 90%) 100 LOAD CAPACITANCE (pF) 200 0 LOAD CAPACITANCE (pF) 50 100 150 200 LOAD CAPACITANCE (pF) Figure 68. Driver Type C Typical Rise and Fall Times (10%–90%) versus Load Capacitance (3.3V VDDEXT/VDDMEM) Rev. PrG | Page 70 of 80 | Figure 71. Driver Type D Typical Rise and Fall Times (10%–90%) versus Load Capacitance (3.3V VDDEXT/VDDMEM) February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data ENVIRONMENTAL CONDITIONS Table 58. Thermal Characteristics (BC-289-2) To determine the junction temperature on the application printed circuit board use: Parameter θJA θJMA θJMA θJB θJC ΨJT ΨJT ΨJT T J = T CASE + ( Ψ JT × P D ) where: TJ = Junction temperature (ⴗC) TCASE = Case temperature (ⴗC) measured by customer at top center of package. ΨJT = From Table 58 PD = Power dissipation — For a description, see Total Power Dissipation on Page 33. Values of θJA are provided for package comparison and printed circuit board design considerations. θJA can be used for a first order approximation of TJ by the equation: T J = T A + ( θ JA × P D ) where: TA = Ambient temperature (ⴗC) Values of θJC are provided for package comparison and printed circuit board design considerations when an external heat sink is required. Values of θJB are provided for package comparison and printed circuit board design considerations. In Table 58, airflow measurements comply with JEDEC standards JESD51-2 and JESD51-6, and the junction-to-board measurement complies with JESD51-8. The junction-to-case measurement complies with MIL-STD-883 (Method 1012.1). All measurements use a 2S2P JEDEC test board. Table 57. Thermal Characteristics (BC-208-1) Parameter θJA θJMA θJMA θJB θJC ΨJT ΨJT ΨJT Condition 0 linear m/s air flow 1 linear m/s air flow 2 linear m/s air flow 0 linear m/s air flow 1 linear m/s air flow 2 linear m/s air flow Typical 23.20 20.20 19.20 13.05 6.92 0.18 0.27 0.32 Rev. PrG Unit ⴗC/W ⴗC/W ⴗC/W ⴗC/W ⴗC/W ⴗC/W ⴗC/W ⴗC/W | Page 71 of 80 | February 2009 Condition 0 linear m/s air flow 1 linear m/s air flow 2 linear m/s air flow 0 linear m/s air flow 1 linear m/s air flow 2 linear m/s air flow Typical 34.5 31.1 29.8 20.3 8.8 0.24 0.44 0.53 Unit ⴗC/W ⴗC/W ⴗC/W ⴗC/W ⴗC/W ⴗC/W ⴗC/W ⴗC/W ADSP-BF522/523/524/525/526/527 Preliminary Technical Data 289-BALL CSP_BGA BALL ASSIGNMENT Table 59 lists the CSP_BGA balls by signal mnemonic. Table 60 on Page 73 lists the CSP_BGA by ball number. Table 59. 289-Ball CSP_BGA Ball Assignment (Alphabetically by Signal) Signal Ball Signal Ball Signal Ball Signal Ball Signal Ball Signal Ball Signal No. No. No. No. No. No. ABE0/SDQM0 AB9 DATA9 P1 GND N9 VPPOTP AB11 PH12 M23 VDDEXT N17 VDDMEM ABE1/SDQM1 AC9 DATA10 P2 GND N10 PF0 A7 PH13 N22 VDDEXT P17 VDDMEM ADDR1 AB8 DATA11 R2 GND N11 PF1 B8 PH14 N23 VDDEXT R17 VDDMEM ADDR2 AC8 DATA12 N1 GND N12 PF2 A8 PH15 P22 VDDEXT T17 VDDMEM ADDR3 AB7 DATA13 N2 GND N13 PF3 B9 PPI_CLK/TMRCLK A6 VDDEXT U17 VDDMEM ADDR4 AC7 DATA14 M2 GND N14 PF4 B11 PPI_FS1/TMR0 B7 VDDINT B5 VDDMEM ADDR5 AC6 DATA15 M1 GND N15 PF5 B10 RESET V22 VDDINT H8 VDDMEM ADDR6 AB6 EMU J2 GND P9 PF6 B12 RTXI U23 VDDINT H9 VDDMEM ADDR7 AB4 EXT_WAKE0 AC19 GND P10 PF7 B13 RTXO V23 VDDINT H10 VDDMEM ADDR8 AB5 GND A1 GND P11 PF8 B16 SA10 AC10 VDDINT H11 VDDMEM ADDR9 AC5 GND A23 GND P12 PF9 A20 SCAS AC11 VDDINT H12 VDDMEM ADDR10 AC4 GND B6 GND P13 PF10 B15 SCKE AB13 VDDINT H13 VDDOTP ADDR11 AB3 GND1 G16 GND P14 PF11 B17 SCL B22 VDDINT H14 VDDRTC ADDR12 AC3 GND G17 GND P15 PF12 B18 SDA C22 VDDINT H15 VDDUSB ADDR13 AB2 GND1 H17 GND R9 PF13 B19 SMS AC13 VDDINT H16 VDDUSB ADDR14 AC2 GND H22 GND R10 PF14 A9 SRAS AB12 VDDINT J8 NC ADDR15 AA2 GND1 J22 GND R11 PF15 A10 SS/PG AC20 VDDINT J16 VROUT/EXT_WAKE1 ADDR16 W2 GND J9 GND R12 PG0 H2 SWE AB10 VDDINT K8 VRSEL/VDDEXT ADDR17 Y2 GND J10 GND R13 PG1 G1 TCK L1 VDDINT K16 XTAL ADDR18 AA1 GND J11 GND R14 PG2 H1 TDI J1 VDDINT L8 ADDR19 AB1 GND J12 GND R15 PG3 F1 TDO K1 VDDINT L16 AMS0 AC17 GND J13 GND T22 PG4 D1 TMS L2 VDDINT M8 AMS1 AB16 GND J14 GND AC1 PG5 D2 TRST K2 VDDINT M16 AMS2 AC16 GND J15 GND AC23 PG6 C2 USB_DM AB21 VDDINT N8 AMS3 AB15 GND K9 NC A15 PG7 B1 USB_DP AA22 VDDINT N16 AOE AC15 GND K10 NC A16 PG8 C1 USB_ID Y22 VDDINT P8 ARDY AC14 GND K11 NC A17 PG9 B2 USB_RSET AC21 VDDINT P16 ARE AB17 GND K12 NC A18 PG10 B4 USB_VBUS AB20 VDDINT R8 AWE AB14 GND K13 NC A19 PG11 B3 USB_VREF AC22 VDDINT R16 BMODE0 G2 GND K14 NC A21 PG12 A2 USB_XI AB23 VDDINT T8 BMODE1 F2 GND K15 NC A22 PG13 A3 USB_XO AA23 VDDINT T9 BMODE2 E1 GND L9 NC B20 PG14 A4 VDDEXT G7 VDDINT T10 BMODE3 E2 GND L10 NC B21 PG15 A5 VDDEXT G8 VDDINT T11 CLKBUF AB19 GND L11 NC B23 PH0 A11 VDDEXT G9 VDDINT T12 CLKIN R23 GND L12 NC C23 PH1 A12 VDDEXT G10 VDDINT T13 CLKOUT AB18 GND L13 NC D22 PH2 A13 VDDEXT G11 VDDINT T14 DATA0 Y1 GND L14 NC D23 PH3 B14 VDDEXT G12 VDDINT T15 DATA1 V2 GND L15 NC E22 PH4 A14 VDDEXT G13 VDDINT T16 DATA2 W1 GND M9 NC E23 PH5 K23 VDDEXT G14 VDDMEM J7 DATA3 U2 GND M10 NC F22 PH6 K22 VDDEXT G15 VDDMEM K7 DATA4 V1 GND M11 NC F23 PH7 L23 VDDEXT H7 VDDMEM L7 DATA5 U1 GND M12 NC G22 PH8 L22 VDDEXT J17 VDDMEM M7 DATA6 T2 GND M13 NC H23 PH9 T23 VDDEXT K17 VDDMEM N7 DATA7 T1 GND M14 NC J23 PH10 M22 VDDEXT L17 VDDMEM P7 DATA8 R1 GND M15 NMI U22 PH11 R22 VDDEXT M17 VDDMEM R7 NOTE: In this table, BOLD TYPE indicates the sole signal/function for that ball on ADSP-BF522/524/526 processors. 1 For ADSP-BF52xC compatibility, connect this ball to VDDEXT. Rev. PrG | Page 72 of 80 | February 2009 Ball No. T7 U7 U8 U9 U10 U11 U12 U13 U14 U15 U16 AC12 W23 W22 Y23 G23 AC18 AB22 P23 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 60. 289-Ball CSP_BGA Ball Assignment (Numerically by Ball Number) Ball Signal Ball Signal Ball Signal Ball Signal Ball Signal Ball Signal Ball Signal No. No. No. No. No. No. No. A1 GND B23 NC H22 GND L22 PH8 P22 PH15 U22 NMI AC5 ADDR9 A2 PG12 C1 PG8 H23 NC L23 PH7 P23 XTAL U23 RTXI AC6 ADDR5 A3 PG13 C2 PG6 J1 TDI M1 DATA15 R1 DATA8 V1 DATA4 AC7 ADDR4 A4 PG14 C22 SDA J2 EMU M2 DATA14 R2 DATA11 V2 DATA1 AC8 ADDR2 A5 PG15 C23 NC J7 VDDMEM M7 VDDMEM R7 VDDMEM V22 RESET AC9 ABE1/SDQM1 A6 PPI_CLK/TMRCLK D1 PG4 J8 VDDINT M8 VDDINT R8 VDDINT V23 RTXO AC10 SA10 A7 PF0 D2 PG5 J9 GND M9 GND R9 GND W1 DATA2 AC11 SCAS A8 PF2 D22 NC J10 GND M10 GND R10 GND W2 ADDR16 AC12 VDDOTP A9 PF14 D23 NC J11 GND M11 GND R11 GND W22 VDDUSB AC13 SMS A10 PF15 E1 BMODE2 J12 GND M12 GND R12 GND W23 VDDRTC AC14 ARDY A11 PH0 E2 BMODE3 J13 GND M13 GND R13 GND Y1 DATA0 AC15 AOE A12 PH1 E22 NC J14 GND M14 GND R14 GND Y2 ADDR17 AC16 AMS2 A13 PH2 E23 NC J15 GND M15 GND R15 GND Y22 USB_ID AC17 AMS0 A14 PH4 F1 PG3 J16 VDDINT M16 VDDINT R16 VDDINT Y23 VDDUSB AC18 VROUT/EXT_WAKE1 A15 NC F2 BMODE1 J17 VDDEXT M17 VDDEXT R17 VDDEXT AA1 ADDR18 AC19 EXT_WAKE0 A16 NC F22 NC J22 GND1 M22 PH10 R22 PH11 AA2 ADDR15 AC20 SS/PG A17 NC F23 NC J23 NC M23 PH12 R23 CLKIN AA22 USB_DP AC21 USB_RSET A18 NC G1 PG1 K1 TDO N1 DATA12 T1 DATA7 AA23 USB_XO AC22 USB_VREF A19 NC G2 BMODE0 K2 TRST N2 DATA13 T2 DATA6 AB1 ADDR19 AC23 GND A20 PF9 G7 VDDEXT K7 VDDMEM N7 VDDMEM T7 VDDMEM AB2 ADDR13 A21 NC G8 VDDEXT K8 VDDINT N8 VDDINT T8 VDDINT AB3 ADDR11 A22 NC G9 VDDEXT K9 GND N9 GND T9 VDDINT AB4 ADDR7 A23 GND G10 VDDEXT K10 GND N10 GND T10 VDDINT AB5 ADDR8 B1 PG7 G11 VDDEXT K11 GND N11 GND T11 VDDINT AB6 ADDR6 B2 PG9 G12 VDDEXT K12 GND N12 GND T12 VDDINT AB7 ADDR3 B3 PG11 G13 VDDEXT K13 GND N13 GND T13 VDDINT AB8 ADDR1 B4 PG10 G14 VDDEXT K14 GND N14 GND T14 VDDINT AB9 ABE0/SDQM0 B5 VDDINT G15 VDDEXT K15 GND N15 GND T15 VDDINT AB10 SWE B6 GND G16 GND1 K16 VDDINT N16 VDDINT T16 VDDINT AB11 VPPOTP B7 PPI_FS1/TMR0 G17 GND K17 VDDEXT N17 VDDEXT T17 VDDEXT AB12 SRAS B8 PF1 G22 NC K22 PH6 N22 PH13 T22 GND AB13 SCKE B9 PF3 G23 NC K23 PH5 N23 PH14 T23 PH9 AB14 AWE B10 PF5 H1 PG2 L1 TCK P1 DATA9 U1 DATA5 AB15 AMS3 B11 PF4 H2 PG0 L2 TMS P2 DATA10 U2 DATA3 AB16 AMS1 B12 PF6 H7 VDDEXT L7 VDDMEM P7 VDDMEM U7 VDDMEM AB17 ARE B13 PF7 H8 VDDINT L8 VDDINT P8 VDDINT U8 VDDMEM AB18 CLKOUT B14 PH3 H9 VDDINT L9 GND P9 GND U9 VDDMEM AB19 CLKBUF B15 PF10 H10 VDDINT L10 GND P10 GND U10 VDDMEM AB20 USB_VBUS B16 PF8 H11 VDDINT L11 GND P11 GND U11 VDDMEM AB21 USB_DM B17 PF11 H12 VDDINT L12 GND P12 GND U12 VDDMEM AB22 VRSEL/VDDEXT B18 PF12 H13 VDDINT L13 GND P13 GND U13 VDDMEM AB23 USB_XI B19 PF13 H14 VDDINT L14 GND P14 GND U14 VDDMEM AC1 GND B20 NC H15 VDDINT L15 GND P15 GND U15 VDDMEM AC2 ADDR14 B21 NC H16 VDDINT L16 VDDINT P16 VDDINT U16 VDDMEM AC3 ADDR12 B22 SCL H17 GND1 L17 VDDEXT P17 VDDEXT U17 VDDEXT AC4 ADDR10 NOTE: In this table, BOLD TYPE indicates the sole signal/function for that ball on ADSP-BF522/524/526 processors. 1 For ADSP-BF52xC compatibility, connect this ball to VDDEXT. Rev. PrG | Page 73 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Figure 72 shows the top view of the BC-289-2 CSP_BGA ball configuration. Figure 73 shows the bottom view of the BC-2892 CSP_BGA ball configuration. A1 BALL PAD CORNER A B C D E F G H J K L TOP VIEW M N P KEY: R V DDINT GND T NC U V V DDEXT I/O V DDMEM W Y AA AB AC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Figure 72. 289-Ball CSP_BGA Ball Configuration (Top View) A1 BALL PAD CORNER A B C D E BOTTOM VIEW F G H KEY: J K V L DDINT M N V DDEXT P R T U V W Y AA AB AC 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Figure 73. 289-Ball CSP_BGA Ball Configuration (Bottom View) Rev. PrG | Page 74 of 80 | February 2009 GND NC I/O V DDMEM ADSP-BF522/523/524/525/526/527 Preliminary Technical Data 208-BALL CSP_BGA BALL ASSIGNMENT Table 61 lists the CSP_BGA balls by signal mnemonic. Table 62 on Page 76 lists the CSP_BGA by ball number. Table 61. 208-Ball CSP_BGA Ball Assignment (Alphabetically by Signal) Signal Ball Signal No. Ball Signal No. Ball Signal No. Ball Signal No. Ball Signal No. Ball No. ABE0/SDQM0 V19 DATA2 Y7 GND L12 PG6 M2 G19 VDDINT P14 ABE1/SDQM1 V20 DATA3 W7 GND L13 PG7 L1 SWE T20 VDDMEM L8 ADDR01 W20 DATA4 Y6 GND M9 PG8 L2 TCK V2 VDDMEM M7 SS/PG ADDR02 W19 DATA5 W6 GND M10 PG9 K1 TDI R1 VDDMEM M8 ADDR03 Y19 DATA6 Y5 GND M11 PG10 K2 TDO T1 VDDMEM N7 ADDR04 W18 DATA7 W5 GND M12 PG11 J1 TMS U2 VDDMEM N8 ADDR05 Y18 Y4 GND M13 PG12 J2 TRST U1 VDDMEM P7 ADDR06 W17 DATA9 W4 GND N9 PG13 H1 USB_DM F20 VDDMEM P8 ADDR07 Y17 DATA10 Y3 GND N10 PG14 H2 USB_DP E20 VDDMEM P9 ADDR08 W16 DATA11 W3 GND N11 PG15 G1 USB_ID C20 VDDMEM P10 ADDR09 Y16 DATA12 Y2 GND N12 PH0 A7 USB_RSET D20 VDDMEM P11 ADDR10 W15 DATA13 W2 GND N13 PH1 B7 USB_VBUS E19 VDDOTP R20 ADDR11 Y15 W1 GND Y1 A8 USB_VREF H19 VDDRTC A16 DATA8 DATA14 PH2 ADDR12 W14 DATA15 V1 GND Y20 PH3 B8 USB_XI A19 VDDUSB D19 ADDR13 Y14 EMU T2 NMI B19 PH4 A9 USB_XO A18 VDDUSB G20 ADDR14 W13 EXT_WAKE0 J20 VPPOTP L19 PH5 B9 VDDEXT G7 VROUT/EXT_WAKE1 H20 ADDR15 Y13 A1 PF0 F1 PH6 B10 VDDEXT G8 VRSEL/VDDEXT F19 VDDEXT G9 XTAL A10 GND ADDR16 W12 GND A17 PF1 E1 PH7 B11 ADDR17 Y12 A20 PF2 E2 PH8 A12 VDDEXT G10 ADDR18 W11 GND B20 PF3 D1 PH9 B12 G11 ADDR19 Y11 H9 PF4 D2 PH10 A13 VDDEXT H7 AMS0 J19 GND H10 PF5 C1 PH11 B13 VDDEXT H8 AMS1 K19 GND H11 PF6 C2 PH12 B14 VDDEXT J7 AMS2 M19 GND H12 PF7 B1 PH13 B15 VDDEXT J8 AMS3 L20 H13 PF8 B2 PH14 B16 VDDEXT K7 GND GND GND VDDEXT AOE N20 GND J9 PF9 A2 PH15 B17 VDDEXT K8 ARDY P19 GND J10 PF10 B3 PPI_CLK/TMRCLK G2 VDDEXT L7 ARE M20 GND J11 PF11 A3 PPI_FS1/TMR0 F2 VDDINT G12 AWE N19 GND J12 PF12 B5 RESET B18 VDDINT G13 BMODE0 Y10 J13 PF13 A5 RTXI A14 VDDINT G14 BMODE1 W10 GND GND K9 PF14 B6 RTXO A15 VDDINT H14 BMODE2 Y9 GND K10 PF15 A6 SA10 U19 VDDINT J14 BMODE3 W9 GND K11 PG0 R2 SCAS U20 VDDINT K14 CLKBUF C19 GND K12 PG1 P1 SCKE P20 VDDINT L14 CLKIN A11 GND K13 PG2 P2 SCL A4 VDDINT M14 CLKOUT K20 GND L9 PG3 N1 SDA B4 VDDINT N14 DATA0 Y8 GND L10 PG4 N2 SMS R19 VDDINT P12 DATA1 W8 GND L11 PG5 M1 SRAS T19 VDDINT P13 NOTE: In this table, BOLD TYPE indicates the sole signal/function for that ball on ADSP-BF522/524/526 processors. Rev. PrG | Page 75 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Table 62. 208-Ball CSP_BGA Ball Assignment (Numerically by Ball Number) Ball No. Signal Ball No. Signal Ball No. Signal Ball No. Signal Ball No. Signal Ball No. Signal A1 GND B19 NMI H13 GND L19 VPPOTP R1 TDI Y3 DATA10 A2 PF9 B20 GND H14 VDDINT L20 AMS3 R2 PG0 Y4 DATA8 A3 PF11 C1 PF5 H19 USB_VREF M1 PG5 R19 SMS Y5 DATA6 A4 SCL C2 PF6 H20 VROUT/EXT_WAKE1 M2 PG6 R20 VDDOTP Y6 DATA4 A5 PF13 C19 CLKBUF J1 PG11 M7 VDDMEM T1 TDO Y7 DATA2 A6 PF15 C20 USB_ID J2 PG12 M8 VDDMEM T2 EMU Y8 DATA0 A7 PH0 D1 PF3 J7 VDDEXT M9 GND T19 SRAS Y9 BMODE2 A8 PH2 D2 PF4 J8 VDDEXT M10 GND T20 SWE Y10 BMODE0 A9 PH4 D19 VDDUSB J9 GND M11 GND U1 TRST Y11 ADDR19 A10 XTAL D20 USB_RSET J10 GND M12 GND U2 TMS Y12 ADDR17 A11 CLKIN E1 PF1 J11 GND M13 GND U19 SA10 Y13 ADDR15 A12 PH8 E2 PF2 J12 GND M14 VDDINT U20 SCAS Y14 ADDR13 A13 PH10 E19 USB_VBUS J13 GND M19 AMS2 V1 DATA15 Y15 ADDR11 A14 RTXI E20 USB_DP J14 VDDINT M20 ARE V2 TCK Y16 ADDR9 A15 RTXO F1 PF0 J19 AMS0 N1 PG3 V19 ABE0/SDQM0 Y17 ADDR7 A16 VDDRTC F2 PPI_FS1/TMR0 J20 EXT_WAKE0 N2 PG4 V20 ABE1/SDQM1 Y18 ADDR5 A17 GND F19 VRSEL/VDDEXT K1 PG9 N7 VDDMEM W1 DATA14 Y19 ADDR3 A18 USB_XO F20 USB_DM K2 PG10 N8 VDDMEM W2 DATA13 Y20 GND A19 USB_XI G1 PG15 K7 VDDEXT N9 GND W3 DATA11 A20 GND G2 PPI_CLK/TMRCLK K8 VDDEXT N10 GND W4 DATA9 B1 PF7 G7 VDDEXT K9 GND N11 GND W5 DATA7 B2 PF8 G8 VDDEXT K10 GND N12 GND W6 DATA5 B3 PF10 G9 VDDEXT K11 GND N13 GND W7 DATA3 B4 SDA G10 VDDEXT K12 GND N14 VDDINT W8 DATA1 B5 PF12 G11 VDDEXT K13 GND N19 AWE W9 BMODE3 B6 PF14 G12 VDDINT K14 VDDINT N20 AOE W10 BMODE1 B7 PH1 G13 VDDINT K19 AMS1 P1 PG1 W11 ADDR18 B8 PH3 G14 VDDINT K20 CLKOUT P2 PG2 W12 ADDR16 B9 PH5 G19 SS/PG L1 PG7 P7 VDDMEM W13 ADDR14 B10 PH6 G20 VDDUSB L2 PG8 P8 VDDMEM W14 ADDR12 B11 PH7 H1 PG13 L7 VDDEXT P9 VDDMEM W15 ADDR10 B12 PH9 H2 PG14 L8 VDDMEM P10 VDDMEM W16 ADDR8 B13 PH11 H7 VDDEXT L9 GND P11 VDDMEM W17 ADDR6 B14 PH12 H8 VDDEXT L10 GND P12 VDDINT W18 ADDR4 B15 PH13 H9 GND L11 GND P13 VDDINT W19 ADDR2 B16 PH14 H10 GND L12 GND P14 VDDINT W20 ADDR1 B17 PH15 H11 GND L13 GND P19 ARDY Y1 GND B18 RESET H12 GND L14 VDDINT P20 SCKE Y2 DATA12 NOTE: In this table, BOLD TYPE indicates the sole signal/function for that ball on ADSP-BF522/524/526 processors. Rev. PrG | Page 76 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data Figure 74 shows the top view of the CSP_BGA ball configuration. Figure 75 shows the bottom view of the CSP_BGA ball configuration. A1 BALL PAD CORNER A B C D E F G H J K L M N P R T U V W Y KEY: VDDINT GND VDDEXT I/O VDDMEM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 TOP VIEW Figure 74. 208-Ball CSP_BGA Ball Configuration (Top View) A1 BALL PAD CORNER A B C D E F G H J K L M N P R T U V W Y KEY: VDDINT GND VDDEXT I/O VDDMEM 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 BOTTOM VIEW Figure 75. 208-Ball CSP_BGA Ball Configuration (Bottom View) Rev. PrG | Page 77 of 80 | February 2009 ADSP-BF522/523/524/525/526/527 Preliminary Technical Data OUTLINE DIMENSIONS Dimensions in Figure 76, 289-Ball CSP_BGA (BC-289-2) are shown in millimeters. 0.5 BSC BALL PITCH 12.00 BSC SQ A1 BALL PAD CORNER 11.00 BSC SQ A1 BALL PAD CORNER CL A B C D E F G H J K L M N P R T U V W Y AA AB AC CL 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 TOP VIEW 1.40 1.26 1.11 BOTTOM VIEW 0.20 MIN DETAIL A SIDE VIEW NOTES 1. DIMENSIONS ARE IN MILLIMETERS. 2. COMPLIES WITH JEDEC REGISTERED OUTLINE MO-195, VARIATION AJ AND EXCEPTION TO PACKAGE HEIGHT AND BALL HEIGHT. 3. MINIMUM BALL HEIGHT 0.20 0.08 MAX COPLANARITY 0.35 BALL DIAMETER 0.30 0.25 Figure 76. 289-Ball CSP_BGA (BC-289-2) Rev. PrG | Page 78 of 80 | February 2009 SEATING PLANE DETAIL A ADSP-BF522/523/524/525/526/527 Preliminary Technical Data 17.10 17.00 SQ 16.90 A1 CORNER INDEX AREA 20 18 16 14 12 10 8 6 4 2 19 17 15 13 11 9 7 5 3 1 A1 BALL CORNER A B C D E F G H J K L M N P R T U V W Y 15.20 BSC SQ 0.80 BSC TOP VIEW BOTTOM VIEW DETAIL A *1.75 1.61 1.46 DETAIL A 1.36 1.26 1.16 0.35 NOM 0.30 MIN SEATING PLANE *0.50 0.45 0.40 BALL DIAMETER COPLANARITY 0.12 *COMPLIANT TO JEDEC STANDARDS MO-205-AM WITH EXCEPTION TO PACKAGE HEIGHT AND BALL DIAMETER. Figure 77. 208-Ball CSP_BGA (BC-208-2) SURFACE MOUNT DESIGN Table 63 is provided as an aide to PCB design. For industrystandard design recommendations, refer to IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. Table 63. Surface Mount Design Supplement Package 289-Ball CSP_BGA 208-Ball CSP_BGA Ball Attach Type Solder Mask Defined Solder Mask Defined Rev. PrG | Page 79 of 80 | Solder Mask Opening 0.26 mm diameter 0.40 mm diameter February 2009 Ball Pad Size 0.35 mm diameter 0.50 mm diameter ADSP-BF522/523/524/525/526/527 Preliminary Technical Data ORDERING GUIDE Table 64. ADSP-BF523/525/527 Processors Model ADSP-BF523KBCZ-6 ADSP-BF523KBCZ-5 ADSP-BF525KBCZ-6 ADSP-BF525KBCZ-5 ADSP-BF527KBCZ-6 ADSP-BF527KBCZ-5 ADSP-BF523KBCZ-6A ADSP-BF523BBCZ-5A ADSP-BF525KBCZ-6A ADSP-BF525BBCZ-5A ADSP-BF527KBCZ-6A ADSP-BF527BBCZ-5A 1 2 Temperature Range1 0ºC to +70ºC Package Description 289-Ball Chip Scale Package Ball Grid Array (CSP_BGA) 0ºC to +70ºC 289-Ball Chip Scale Package Ball Grid Array (CSP_BGA) 0ºC to +70ºC 289-Ball Chip Scale Package Ball Grid Array (CSP_BGA) 0ºC to +70ºC 289-Ball Chip Scale Package Ball Grid Array (CSP_BGA) 0ºC to +70ºC 289-Ball Chip Scale Package Ball Grid Array (CSP_BGA) 0ºC to +70ºC 289-Ball Chip Scale Package Ball Grid Array (CSP_BGA) 0ºC to +70ºC 208-Ball Chip Scale Package Ball Grid Array (CSP_BGA) –40ºC to +85ºC 208-Ball Chip Scale Package Ball Grid Array (CSP_BGA) 0ºC to +70ºC 208-Ball Chip Scale Package Ball Grid Array (CSP_BGA) –40ºC to +85ºC 208-Ball Chip Scale Package Ball Grid Array (CSP_BGA) 0ºC to +70ºC 208-Ball Chip Scale Package Ball Grid Array (CSP_BGA) –40ºC to +85ºC 208-Ball Chip Scale Package Ball Grid Array (CSP_BGA) Package Instruction Operating Voltage Option Rate (Max) (Nom) BC-289-2 600 MHz 1.2 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O BC-289-2 533 MHz 1.15 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O BC-289-2 600 MHz 1.2 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O BC-289-2 533 MHz 1.15 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O BC-289-2 600 MHz 1.2 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O BC-289-2 533 MHz 1.15 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O BC-208-2 600 MHz 1.2 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O BC-208-2 533 MHz 1.15 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O BC-208-2 600 MHz 1.2 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O BC-208-2 533 MHz 1.15 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O BC-208-2 600 MHz 1.2 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O BC-208-2 533 MHz 1.15 V internal2, 1.8 V, 2.5 V, or 3.3 V I/O Referenced temperature is ambient temperature. This is the nominal voltage required to run at the nominal instruction rate. Lesser frequencies may require lower operating voltages. Please see Table 12 and Table 15 for details. Table 65. ADSP-BF522/524/526 Processors Model ADSP-BF526KBCZ-4X Temperature Range1 0ºC to +70ºC Package Description 289-Ball Chip Scale Package Ball Grid Array (CSP_BGA) ADSP-BF526BBCZ-4AX –40ºC to +85ºC 208-Ball Chip Scale Package Ball Grid Array (CSP_BGA) ADSP-BF526BBCZ-3AX –40ºC to +85ºC 208-Ball Chip Scale Package Ball Grid Array (CSP_BGA) 1 Package Instruction Operating Voltage Option Rate (Max) (Nom) BC-289-2 400 MHz tbd V internal, 1.8 V, 2.5 V, or 3.3 V I/O BC-208-2 400 MHz tbd V internal, 1.8 V, 2.5 V, or 3.3 V I/O BC-208-2 300 MHz tbd V internal, 1.8 V, 2.5 V, or 3.3 V I/O Referenced temperature is ambient temperature. ©2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. PR06675-0-2/09(PrG) Rev. PrG | Page 80 of 80 | February 2009