MOTOROLA MC14027

! SEMICONDUCTOR TECHNICAL DATA
! " The MC14027B dual J–K flip–flop has independent J, K, Clock (C), Set (S)
and Reset (R) inputs for each flip–flop. These devices may be used in
control, register, or toggle functions.
L SUFFIX
CERAMIC
CASE 620
•
•
•
•
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Logic Swing Independent of Fanout
Logic Edge–Clocked Flip–Flop Design —
Logic state is retained indefinitely with clock level either high or low;
information is transferred to the output only on the positive–going edge
of the clock pulse
• Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
• Pin–for–Pin Replacement for CD4027B
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MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
VDD
Parameter
DC Supply Voltage
Value
Unit
– 0.5 to + 18.0
V
Vin, Vout
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
lin, lout
Input or Output Current (DC or Transient),
per Pin
± 10
mA
PD
Power Dissipation, per Package†
Tstg
Storage Temperature
TL
Lead Temperature (8–Second Soldering)
500
mW
– 65 to + 150
_C
260
_C
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
TRUTH TABLE
Inputs
C†
Outputs*
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
TA = – 55° to 125°C for all packages.
BLOCK DIAGRAM
7
6
J
3
C
5
K
J
K
S
R
Qn+1
Qn+1
1
X
0
0
0
1
0
9
X
0
0
0
1
1
0
10
J
0
X
0
0
0
0
1
X
1
0
0
1
0
1
13
C
1
1
0
0
Qo
Qo
Qo
11
K
X
X
0
0
X
Qn
Qn
X
X
1
0
X
1
0
X
X
X
0
1
X
0
1
X
X
X
1
1
1
X = Don’t Care
† = Level Change
1
X
‡ = Present State
* = Next State
S
R
Q
1
Q
2
Q
15
Q
14
4
Qn‡
X
Plastic
Ceramic
SOIC
No
Change
S
R
12
VDD = PIN 16
VSS = PIN 8
This device contains protection circuitry to guard against damage
due to high static voltages or electric fields. However, precautions must
be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, Vin and
Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either VSS or VDD). Unused outputs must be left open.
REV 3
1/94
MOTOROLA
Motorola, Inc. 1995
CMOS LOGIC DATA
MC14027B
107
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
Output Voltage
Vin = VDD or 0
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
Vin = 0 or VDD
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
1.0
2.0
4.0
—
—
—
0.002
0.004
0.006
1.0
2.0
4.0
—
—
—
30
60
120
µAdc
IT
5.0
10
15
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
(VO = 0.5 or 4.5 Vdc) “1” Level
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
IOH
Source
Sink
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
Vdc
mAdc
IT = (0.8 µA/kHz) f + IDD
IT = (1.6 µA/kHz) f + IDD
IT = (2.4 µA/kHz) f + IDD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
PIN ASSIGNMENT
MC14027B
108
QA
1
16
VDD
QA
2
15
QB
CA
3
14
QB
RA
4
13
CB
KA
5
12
RB
JA
6
11
KB
SA
7
10
JB
VSS
8
9
SB
MOTOROLA CMOS LOGIC DATA
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SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 12.5 ns
tTLH,
tTHL
Propagation Delay Times**
Clock to Q, Q
tPLH, tPHL = (1.7 ns/pF) CL + 90 ns
tPLH, tPHL = (0.66 ns/pF) CL + 42 ns
tPLH, tPHL = (0.5 ns/pF) CL + 25 ns
tPLH,
tPHL
VDD
Min
Typ #
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
Unit
ns
ns
5.0
10
15
—
—
—
175
75
50
350
150
100
Set to Q, Q
tPLH, tPHL = (1.7 ns/pF) CL + 90 ns
tPLH, tPHL = (0.66 ns/pF) CL + 42 ns
tPLH, tPHL = (0.5 ns/pF) CL + 25 ns
5.0
10
15
—
—
—
175
75
50
350
150
100
Reset to Q, Q
tPLH, tPHL = (1.7 ns/pF) CL + 265 ns
tPLH, tPHL = (0.66 ns/pF) CL + 67 ns
tPLH, tPHL = (0.5 ns/pF) CL + 50 ns
5.0
10
15
—
—
—
350
100
75
450
200
150
Setup Times
tsu
5.0
10
15
140
50
35
70
25
17
—
—
—
ns
Hold Times
th
5.0
10
15
140
50
35
70
25
17
—
—
—
ns
tWH, tWL
5.0
10
15
330
110
75
165
55
38
—
—
—
ns
fcl
5.0
10
15
—
—
—
3.0
9.0
13
1.5
4.5
6.5
MHz
tTLH, tTHL
5.0
10
15
—
—
—
—
—
—
15
5.0
4.0
µs
Set
5
10
15
90
45
35
10
5
3
—
—
—
Reset
5
10
15
50
25
20
– 30
– 15
– 10
—
—
—
5.0
10
15
250
100
70
125
50
35
—
—
—
Clock Pulse Width
Clock Pulse Frequency
Clock Pulse Rise and Fall Time
Removal Times
Set and Reset Pulse Width
trem
tWH
ns
ns
* The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
MOTOROLA CMOS LOGIC DATA
MC14027B
109
20 ns
20 ns
VDD
90%
50%
10%
J
20 ns
K
90%
50%
10%
tsu
tsu
20 ns
th
90%
50%
10%
C
tWH
VSS
20 ns
VDD
VSS
20 ns
VDD
VSS
20 ns
90%
SET OR
RESET
tw
tWL
1
fcl
tPLH
tPHL
VOH
90%
50%
10%
Q
CLOCK
tTLH
20 ns
VDD
50%
50%
Q or Q
20 ns
10%
tw
tPLH
tPHL
Inputs R and S low.
For the measurement of tWH, I/fcl, and PD
the Inputs J and K are kept high.
VSS
trem
20 ns
90%
VOL
tTHL
10%
VDD
VSS
VOH
50%
VOL
Figure 1. Dynamic Signal Waveforms
(J, K, Clock, and Output)
Figure 2. Dynamic Signal Waveforms
(Set, Reset, Clock, and Output)
LOGIC DIAGRAM
(1/2 of Device Shown)
S
Q
C
J
C
C
C
K
C
C
C
C
R
Q
C
C
MC14027B
110
C
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
J
16 PL
0.25 (0.010)
MOTOROLA CMOS LOGIC DATA
M
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MC14027B
111
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
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MC14027B
112
◊
*MC14027B/D*
MOTOROLA CMOS LOGIC
DATA
MC14027B/D