MOTOROLA MC14013

SEMICONDUCTOR TECHNICAL DATA
! L SUFFIX
CERAMIC
CASE 632
The MC14013B dual type D flip–flop is constructed with MOS P–channel
and N–channel enhancement mode devices in a single monolithic structure.
Each flip–flop has independent Data, (D), Direct Set, (S), Direct Reset, (R),
and Clock (C) inputs and complementary outputs (Q and Q). These devices
may be used as shift register elements or as type T flip–flops for counter and
toggle applications.
P SUFFIX
PLASTIC
CASE 646
•
•
•
•
Static Operation
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Logic Edge–Clocked Flip–Flop Design
Logic state is retained indefinitely with clock level either high or low;
information is transferred to the output only on the positive–going edge
of the clock pulse
• Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
• Pin–for–Pin Replacement for CD4013B
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MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
Parameter
VDD
DC Supply Voltage
Value
Unit
– 0.5 to + 18.0
V
D SUFFIX
SOIC
CASE 751A
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
TA = – 55° to 125°C for all packages.
BLOCK DIAGRAM
Vin, Vout
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
lin, lout
Input or Output Current (DC or Transient),
per Pin
± 10
mA
6
PD
Power Dissipation, per Package†
500
mW
5
D
Tstg
Storage Temperature
– 65 to + 150
_C
260
_C
3
C
TL
Lead Temperature (8–Second Soldering)
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
TRUTH TABLE
Inputs
Clock†
Plastic
Ceramic
SOIC
S
R
Q
1
Q
2
Q
13
Q
12
4
8
9
D
11
C
S
Outputs
Data
Reset
Set
Q
Q
0
0
0
0
1
1
0
0
1
0
X
0
0
Q
Q
X
X
1
0
0
1
X
X
0
1
1
0
X
X
1
1
1
1
R
10
No
Change
VDD = PIN 14
VSS = PIN 7
X = Don’t Care
† = Level Change
REV 3
1/94
MOTOROLA
Motorola, Inc. 1995
CMOS LOGIC DATA
MC14013B
45
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
Output Voltage
Vin = VDD or 0
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
Vin = 0 or VDD
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
1.0
2.0
4.0
—
—
—
0.002
0.004
0.006
1.0
2.0
4.0
—
—
—
30
60
120
µAdc
IT
5.0
10
15
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
(VO = 0.5 or 4.5 Vdc) “1” Level
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
mAdc
IT = (0.75 µA/kHz) f + IDD
IT = (1.5 µA/kHz) f + IDD
IT = (2.3 µA/kHz) f + IDD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
This device contains protection circuitry to guard against damage
due to high static voltages or electric fields. However, precautions must
be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, Vin and
Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either VSS or VDD). Unused outputs must be left open.
MC14013B
46
PIN ASSIGNMENT
QA
1
14
VDD
QA
2
13
QB
CA
3
12
QB
RA
4
11
CB
DA
5
10
RB
SA
6
9
DB
VSS
7
8
SB
MOTOROLA CMOS LOGIC DATA
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SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time
Clock to Q, Q
tPLH, tPHL = (1.7 ns/pF) CL + 90 ns
tPLH, tPHL = (0.66 ns/pF) CL + 42 ns
tPLH, tPHL = (0.5 ns/pF) CL + 25 ns
tPLH
tPHL
VDD
Min
Typ #
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
Unit
ns
ns
5.0
10
15
—
—
—
175
75
50
350
150
100
Set to Q, Q
tPLH, tPHL = (1.7 ns/pF) CL + 90 ns
tPLH, tPHL = (0.66 ns/pF) CL + 42 ns
tPLH, tPHL = (0.5 ns/pF) CL + 25 ns
5.0
10
15
—
—
—
175
75
50
350
150
100
Reset to Q, Q
tPLH, tPHL = (1.7 ns/pF) CL + 265 ns
tPLH, tPHL = (0.66 ns/pF) CL + 67 ns
tPLH, tPHL = (0.5 ns/pF) CL + 50 ns
5.0
10
15
—
—
—
225
100
75
450
200
150
Setup Times**
tsu
5.0
10
15
40
20
15
20
10
7.5
—
—
—
ns
Hold Times**
th
5.0
10
15
40
20
15
20
10
7.5
—
—
—
ns
tWL, tWH
5.0
10
15
250
100
70
125
50
35
—
—
—
ns
fcl
5.0
10
15
—
—
—
4.0
10
14
2.0
5.0
7.0
MHz
tTLH
tTHL
5.0
10
15
—
—
—
—
—
15
5.0
4.0
µs
—
tWL, tWH
5.0
10
15
250
100
70
125
50
35
—
—
—
ns
5
10
15
80
45
35
0
5
5
—
—
—
5
10
15
50
30
25
– 35
– 10
–5
—
—
—
Clock Pulse Width
Clock Pulse Frequency
Clock Pulse Rise and Fall Time
Set and Reset Pulse Width
trem
Removal Times
Set
Reset
ns
* The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** Data must be valid for 250 ns with a 5 V supply, 100 ns with 10 V, and 70 ns with 15 V.
LOGIC DIAGRAM
(1/2 of Device Shown)
S
C
C
Q
D
C
C
C
C
C
C
Q
C
C
C
R
MOTOROLA CMOS LOGIC DATA
MC14013B
47
20 ns
20 ns
90%
50%
10%
D
tsu (L)
th
tsu (H)
C
tWH
SET OR
RESET
20 ns
VDD
90%
50%
tw
VSS
10%
tPHL
VSS
20 ns
90%
50%
tw
tPLH
tPHL
VOH
10%
VDD
VSS
VOH
50%
Q OR Q
VOL
tTLH
trem
20 ns
CLOCK
90%
50%
10%
Q
20 ns
VSS
20 ns
VDD
90%
50%
10%
tWL
1
fcl
tPLH
VDD
VOL
tTHL
Inputs R and S low.
Figure 1. Dynamic Signal Waveforms
(Data, Clock, and Output)
Figure 2. Dynamic Signal Waveforms
(Set, Reset, Clock, and Output)
TYPICAL APPLICATIONS
n–STAGE SHIFT REGISTER
1
D
nth
2
D
Q
D
Q
D
Q
C
Q
C
Q
C
Q
Q
CLOCK
BINARY RIPPLE UP–COUNTER (Divide–by–2n)
1
CLOCK
nth
2
D
Q
D
Q
D
Q
C
Q
C
Q
C
Q
Q
T FLIP–FLOP
MODIFIED RING COUNTER (Divide–by–(n+1))
1
nth
2
D
Q
D
Q
D
Q
C
Q
C
Q
C
Q
Q
CLOCK
MC14013B
48
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
–A–
14
9
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
–T–
L
K
SEATING
PLANE
F
G
D
N
M
J
14 PL
0.25 (0.010)
M
T A
S
14 PL
0.25 (0.010)
M
T B
P SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
14
8
1
7
B
A
F
L
C
J
N
H
G
D
SEATING
PLANE
MOTOROLA CMOS LOGIC DATA
K
M
S
DIM
A
B
C
D
F
G
J
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.245
0.280
0.155
0.200
0.015
0.020
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.94
6.23
7.11
3.94
5.08
0.39
0.50
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15_
0.51
1.01
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
MC14013B
49
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
G
M
F
–T–
M
K
D 14 PL
0.25 (0.010)
M
T B
S
M
R X 45 _
C
SEATING
PLANE
B
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
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MC14013B
50
◊
*MC14013B/D*
MOTOROLA CMOS LOGIC
DATA
MC14013B/D