MOTOROLA 4069UB

SEMICONDUCTOR TECHNICAL DATA
The MC14069UB hex inverter is constructed with MOS P–channel and
N–channel enhancement mode devices in a single monolithic structure.
These inverters find primary use where low power dissipation and/or high
noise immunity is desired. Each of the six inverters is a single stage to
minimize propagation delays.
L SUFFIX
CERAMIC
CASE 632
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low–Power TTL Loads or One Low–Power
Schottky TTL Load Over the Rated Temperature Range
• Triple Diode Protection on All Inputs (see Page 5–2)
• Pin–for–Pin Replacement for CD4069UB
• Meets JEDEC UB Specifications
P SUFFIX
PLASTIC
CASE 646
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D SUFFIX
SOIC
CASE 751A
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
VDD
Parameter
DC Supply Voltage
Value
Unit
– 0.5 to + 18.0
V
ORDERING INFORMATION
MC14XXXUBCP
MC14XXXUBCL
MC14XXXUBD
Vin, Vout
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
Iin, Iout
Input or Output Current (DC or Transient),
per Pin
± 10
mA
PD
Power Dissipation, per Package†
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
260
_C
TL
Lead Temperature (8–Second Soldering)
TA = – 55° to 125°C for all packages.
PIN ASSIGNMENT
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
LOGIC DIAGRAM
1
2
3
4
5
6
9
8
11
10
13
12
CIRCUIT SCHEMATIC
(1/6 OF CIRCUIT SHOWN)
VDD
IN 1
1
14
VDD
OUT 1
2
13
IN 6
IN 2
3
12
OUT 6
OUT 2
4
11
IN 5
IN 3
5
10
OUT 5
OUT 3
6
9
IN 4
VSS
7
8
OUT 4
VDD = PIN 14
VSS = PIN 7
INPUT*
OUTPUT
VSS
* Double diode protection on all
inputs not shown.
20 ns
PULSE
GENERATOR
Plastic
Ceramic
SOIC
VDD
14
OUTPUT
INPUT
INPUT
7
VSS
CL
20 ns
VDD
90%
50%
10%
tPHL
tPLH
90%
50%
10%
OUTPUT
tTHL
VSS
VOH
VOL
tTLH
Figure 1. Switching Time Test Circuit and Waveforms
REV 3
1/94
CMOS LOGIC DATA
MOTOROLA
Motorola, Inc. 1995
MC14069UB
1
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
Output Voltage
Vin = VDD
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
Vin = 0
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
“0” Level
VIL
5.0
10
15
—
—
—
1.0
2.0
2.5
—
—
—
2.25
4.50
6.75
1.0
2.0
2.5
—
—
—
1.0
2.0
2.5
5.0
10
15
4.0
8.0
12.5
—
—
—
4.0
8.0
12.5
2.75
5.50
8.25
—
—
—
4.0
8.0
12.5
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
0.25
0.5
1.0
—
—
—
0.0005
0.0010
0.0015
0.25
0.5
1.0
—
—
—
7.5
15
30
µAdc
IT
5.0
10
15
Input Voltage
(VO = 4.5 Vdc)
(VO = 9.0 Vdc)
(VO = 13.5 Vdc)
“1” Level
VIH
(VO = 0.5 Vdc)
(VO = 1.0 Vdc)
(VO = 1.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current**†
(Dynamic plus Quiescent,
Per Gate) (CL = 50 pF)
Output Rise and Fall Times**
(CL = 50 pF)
tTLH, tTHL = (1.35 ns/pF) CL + 33 ns
tTLH, tTHL = (0.60 ns/pF) CL + 20 ns
tTLH, tTHL = (0.40 ns/pF) CL + 20 ns
tTLH,
tTHL
Propagation Delay Times**
(CL = 50 pF)
tPLH, tPHL = (0.90 ns/pF) CL + 20 ns
tPLH, tPHL = (0.36 ns/pF) CL + 22 ns
tPLH, tPHL = (0.26 ns/pF) CL + 17 ns
tPLH,
tPHL
mAdc
IT = (0.3 µA/kHz) f + IDD/6
IT = (0.6 µA/kHz) f + IDD/6
IT = (0.9 µA/kHz) f + IDD/6
µAdc
ns
5.0
10
15
—
—
—
—
—
—
—
—
—
100
50
40
200
100
80
—
—
—
—
—
—
ns
5.0
10
15
—
—
—
—
—
—
—
—
—
65
40
30
125
75
55
—
—
—
—
—
—
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However,
precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance
circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must
be left open.
MC14069UB
2
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
–A–
14
9
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
–T–
L
K
SEATING
PLANE
F
G
D
N
M
J
14 PL
0.25 (0.010)
M
T A
S
14 PL
0.25 (0.010)
M
T B
P SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
14
8
1
7
B
A
F
L
C
J
N
H
G
D
SEATING
PLANE
MOTOROLA CMOS LOGIC DATA
K
M
S
DIM
A
B
C
D
F
G
J
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.245
0.280
0.155
0.200
0.015
0.020
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.94
6.23
7.11
3.94
5.08
0.39
0.50
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15_
0.51
1.01
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
MC14069UB
3
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
G
M
F
–T–
M
K
D 14 PL
0.25 (0.010)
M
T B
S
M
R X 45 _
C
SEATING
PLANE
B
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
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MC14069UB
4
◊
*MC14069UB/D*
MOTOROLA CMOSMC14069UB/D
LOGIC DATA