DISCRETE CERAMICS DATA SHEET C-Array: Class 1, NP0 50 V Noble Metal Electrode Surface mount ceramic multilayer capacitors Product specification Supersedes data of 1st November 1999 File under Discrete Ceramics, ACM2 2000 JuL 18 Philips Components Product specification Surface mount ceramic multilayer capacitors FEATURES • 4 × 0603 capacitors (of the same capacitance value) per array • Less than 50% board space of an equivalent discrete component • High volumetric efficiency • Dense dielectric layers • Supplied in tape on reel or loose in bag • Increased throughput, by time saved in mounting C-Array: Class 1, NP0 50 V Noble Metal Electrode QUICK REFERENCE DATA DESCRIPTION VALUE Rated voltage UR (DC) 50 V (IEC) Capacitance range (E12 series) 10 pF to 1 nF Tolerance on capacitance ±5%; ±10% Sectional specifications IEC 60384-10, second edition 1989-04; also based on CECC 32 100 Detailed specification based on CECC 32 101-801 Climatic category (IEC 60068) 55/125/56 • Cost savings on manufacturing time. APPLICATIONS handbook, halfpage • Professional electronics • High density consumer electronics • Automotive. CCA833 DESCRIPTION Each capacitor element consists of a rectangular block of ceramic dielectric in which a number of interleaved precious metal electrodes are contained. This structure gives rise to a high capacitance per unit volume. Fig.1 Simplified outline. The inner electrodes are connected to the two terminations, silver dipped with a barrier layer of plated nickel and finally covered with a layer of plated tin (NiSn). An outline of the structure is shown in Fig.1. 2000 JuL 18 2 Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 1, NP0 50 V Noble Metal Electrode MECHANICAL DATA T L handbook, 4 columns W B A P CCA610 For dimensions see Table 1. Fig.2 Dimensional outline. Physical dimensions Table 1 Capacitor dimensions for product size 0612 (4 × 0603); see Fig.2 CASE SIZE L W T A B P 1.60 ±0.15 0.80 ±0.10 0.40 ±0.10 0.30 ±0.20 0.80 ±0.10 0.063 ±0.006 0.032 ±0.004 0.016 ±0.004 0.012 ±0.008 0.031 ±0.004 Dimensions in millimetres 0612 (4 × 0603) 3.20 ±0.15 Dimensions in inches 0612 (4 × 0603) 2000 JuL 18 0.125 ±0.006 3 Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 1, NP0 50 V Noble Metal Electrode DIMENSIONS OF SOLDER LANDS E D B handbook, 4 columns A C CCC314 solder land For dimensions see Table 2. Fig.3 Recommended dimensions of solder lands. Table 2 Solder land dimensions; see Fig.3 FOOTPRINT DIMENSIONS (mm) CASE SIZE 0612 (4 × 0603) 2000 JuL 18 A B C D E 2.54 ±0.15 0.89 ±0.10 0.76 ±0.10 0.80 ±0.10 0.45 ±0.10 4 Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 1, NP0 50 V Noble Metal Electrode SELECTION CHART C (pF) LAST TWO DIGITS OF 12NC 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 23 24 25 26 27 28 29 31 32 33 34 35 36 37 38 39 41 42 43 44 45 46 47 48 49 50 V 0612 (4 × 0603) thickness classification: 0.8 ±0.1 Thickness classification and packaging quantities 8 mm TAPE WIDTH AMOUNT PER REEL THICKNESS CLASSIFICATION (mm) ∅180 mm; 7" PAPER BLISTER 4000 4000 0.8 ±0.1 2000 JuL 18 5 Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 1, NP0 50 V Noble Metal Electrode ORDERING INFORMATION Components may be ordered by using either a simple 15-digit clear text code or Philips unique 12NC. Clear text code EXAMPLE: 0612CG102J9B200 SIZE CODE TEMP. CHAR. 0612 (4 × 0603) CG = NP0 CAPACITANCE 102 = 1000 pF; the third digit signifies the multiplying factor: 9=×1 2 = × 100 3 = × 1000 TOL. J = ±5% K = ±10% VOLTAGE TERMINATION 9 = 50 V B = NiSn PACKAGING 2 = 180 mm; 7" paper B = 180 mm; 7" blister MARKING 0 = no marking Ordering code 12NC handbook, full pagewidth 2 2 X X X X X X 1 X X X Capacitance value(1) Carrier type 50 blister 55 paper Tolerance 5 ±5% 6 ±10% Termination 14 NiSn Size 6 0612 (4 × 0603) CCA682 Packaging(2) 1 reel: ∅180 mm; 7" reel (1) Refer to chapter “Selection chart”. (2) Amount on reel depends on thickness classification, see section “Thickness classification and packaging quantities”. 2000 JuL 18 6 SERIES 0 = conv. ceramic Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 1, NP0 50 V Noble Metal Electrode ELECTRICAL CHARACTERISTICS FOR CLASS 1, CAPACITORS Class 1 capacitors; NP0 dielectric; NiSn terminations Unless otherwise stated all electrical values apply at an ambient temperature of 23 ±3 °C, an atmospheric pressure of 86 to 106 kPa, and a relative humidity of 63 to 67%. DESCRIPTION VALUE Capacitance range (E12 series); note 1 10 pF to 1 nF Tolerance on capacitance after 1000 hours ±5%; ±10% Tan δ; note 1 ≤0.1% Test voltage (DC) for 1 minute 2.5 × UR Insulation resistance after 1 minute at UR (DC) >100000 MΩ Temperature coefficient (0 ±30) × 10−6/K Note 1. Measured at 1 V, 1 MHz for C ≤ 1000 pF and at 1 V, 1 kHz for C > 1000 pF, using a four-gauge method. 2000 JuL 18 7 Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 1, NP0 50 V Noble Metal Electrode MEA614 MEA608 10 15 handbook, ∆ C halfpage tan δ (x 10 – 4) C (%) 10 7.5 5 0 5 –5 2.5 – 10 – 15 0 0 Fig.4 10 20 30 40 50 V DC (V) – 40 Typical capacitance change with respect to the capacitance at 1 V as a function of DC voltage. 0 Fig.5 40 80 120 T ( oC) Typical tan δ as a function of temperature. CCA075 MEA607 104 handbook, halfpage f (MHz) 40 TC (x10 6/K) 103 20 102 0 20 10 40 1 40 0 40 80 120 o T ( C) 1 10 102 103 C (pF) 104 L = 0.6 nH (dotted line). L = 1 nH (solid line). L = 1.5 nH (broken line). Fig.6 2000 JuL 18 Typical temperature coefficient as a function of temperature. Fig.7 8 Series resonance frequency as a function of capacitance. Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 1, NP0 50 V Noble Metal Electrode MEA625 10 3 IZI ( Ω) ESR (m Ω) 10 pF 102 MEA628 10 4 100 pF 500 MHz 103 200 MHz 10 1000 pF 100 MHz 50 MHz 1 102 10 –1 10 –2 1 102 10 f (MHz) 10 103 1 10 102 C (pF) 103 Typical values (solid lines). Maximum values (broken lines). Measuring equipment HP4191A. Fig.8 Typical impedance (Z) as a function of frequency. Fig.9 MEA630 10 4 Q 103 500 MHz 200 MHz 100 MHz 50 MHz 102 10 1 10 102 C (pF) 10 3 Typical values (solid lines). Minimum values (broken lines). Measuring equipment HP4191A. Fig.10 Quality factor (Q) as a function of the capacitance. 2000 JuL 18 9 Equivalent series resistance (ESR) as a function of capacitance. Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 1, NP0 50 V Noble Metal Electrode TESTS AND REQUIREMENTS Table 3 Test procedures and requirements IEC IEC 60384-10/ 60068-2 CECC 32 100 TEST CLAUSE METHOD TEST PROCEDURE REQUIREMENTS 4.4 mounting the capacitors may be mounted no visible damage on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive 4.5 visual inspection and any applicable method using dimension check ×10 magnification in accordance with specification 4.6.1 capacitance f = 1 kHz; measuring voltage (measured 1 Vrms at 20 °C 1000 hours after date of manufacture) within specified tolerance 4.6.2 tan δ in accordance with specification 4.6.3 insulation resistance at UR (DC) for 1 minute f = 1 kHz; measuring voltage 1 Vrms at 20 °C in accordance with specification 4.6.4 voltage proof 2.5 × UR for 1 minute no breakdown or flashover 4.7.1 temperature characteristic between minimum and maximum temperature in accordance with specification 4.8 adhesion a force of 5 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate no visible damage 4.9 bond strength of plating on end face mounted in accordance with IEC 60384 10, paragraph 4.4 no visible damage ∆C/C: ±10% conditions: bending 1 mm at a rate of 1 mm/s, radius jig 340 mm 4.10 2000 JuL 18 Tb resistance to soldering heat; jig clamps to the second component in the longitudinal line 260 ±5 °C for 10 ±0.5 s in a static the terminations shall be well solder bath tinned after recovery resistance to leaching; jig clamps to the second component in the longitudinal line 260 ±5 °C for 30 ±1 s in a static solder bath ∆C/C: ±10% 10 using visual enlargement of ×10, dissolution of the terminations shall not exceed 10% Philips Components Product specification Surface mount ceramic multilayer capacitors IEC IEC 60384-10/ 60068-2 CECC 32 100 TEST CLAUSE METHOD TEST C-Array: Class 1, NP0 50 V Noble Metal Electrode PROCEDURE REQUIREMENTS 4.11 Ta solderability; jig clamps to the second component in the longitudinal line zero hour test, and test after storage (20 to 24 months) in original packing in normal atmosphere; unmounted chips completely immersed for 2 ±0.5 s in a solder bath at 235 ±5 °C the terminations shall be well tinned 4.12 Na rapid change of temperature preconditioning: between minimum and maximum temperature, 5 cycles no visible damage after 24 hours recovery: ∆C/C: ≤15% 4.14 Ca damp heat preconditioning: 56 days at 40 °C; 90 to 95% RH; UR applied after 48 hours recovery: ∆C/C: ±15% tan δ: 7% Rins: 1000 MΩ or RiCR ≥ 25 s, whichever is less 4.15 2000 JuL 18 endurance preconditioning: 2 × UR at 125 °C for 1000 hours, recovery 48 ±4 hours at room temperature 11 after 48 hours recovery: ∆C/C: ±20% tan δ: 7% Rins: 2000 MΩ or RiCR ≥ 50 s, whichever is less