DISCRETE CERAMICS DATA SHEET C-Array: Class 2, X7R 16 V, 25 V and 50 V Noble Metal Electrode Surface mount ceramic multilayer capacitors Product specification Supersedes data of 1st November 1999 File under Discrete Ceramics, ACM2 2000 Jul 18 Philips Components Product specification Surface mount ceramic multilayer capacitors FEATURES • 0612 (4 × 0603) capacitors (of the same capacitance value) per array • Less than 50% board space of an equivalent discrete component • High volumetric efficiency • Dense dielectric layers • Supplied in tape on reel or loose in bag C-Array: Class 2, X7R 16 V, 25 V and 50 V Noble Metal Electrode QUICK REFERENCE DATA DESCRIPTION VALUE Rated voltage UR (DC) 16 V; 25 V; 50 V (IEC) Capacitance (E12 series): 16 V 10 nF to 100 nF 25 V 10 nF to 68 nF 50 V 220 pF to 10 nF Tolerance on capacitance ±10%; ±20% • Increased throughput, by time saved in mounting Sectional specifications IEC 60384-10, second edition 1989-04; also based on CECC 32 100 • Cost savings on manufacturing time. Detailed specification based on CECC 32 101-801 Climatic category (IEC 6068) 55/125/56 APPLICATIONS • Professional electronics • High density consumer electronics • Automotive. handbook, halfpage DESCRIPTION Each capacitor element consists of a rectangular block of ceramic dielectric in which a number of interleaved precious metal electrodes are contained. This structure gives rise to a high capacitance per unit volume. CCA833 Fig.1 Simplified outline. The inner electrodes are connected to the two terminations, silver dipped with a barrier layer of plated nickel and finally covered with a layer of plated tin (NiSn). An outline of the structure is shown in Fig.1. 2000 Jul 18 2 Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V Noble Metal Electrode MECHANICAL DATA T L handbook, 4 columns W B CCB404 P A For dimensions see Table 1. Fig.2 Dimensional outline. Physical dimensions Table 1 Capacitor dimensions for product size 0612 (4 × 0603); see Fig.2 CASE SIZE T L W MIN. MAX. 0.80 ±0.10 1.20 ±0.10 A B P 0.40 ±0.1 0.30 ±0.2 0.80 ±0.1 Dimensions in millimetres 0612 (4 × 0603) 3.20 ±0.15 1.60 ±0.15 Dimensions in inches 0612 0.125 ±0.006 0.063 ±0.006 0.032 ±0.004 0.048 ±0.004 0.016 ±0.004 0.012 ±0.008 0.031 ±0.004 (4 × 0603) 2000 Jul 18 3 Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V Noble Metal Electrode DIMENSIONS OF SOLDER LANDS E D B handbook, 4 columns A C CCC314 solder land For dimensions see Table 2. Fig.3 Recommended dimensions of solder lands. Table 2 Solder land dimensions; see Fig.3 FOOTPRINT DIMENSIONS (mm) CASE SIZE 0612 (4 × 0603) 2000 Jul 18 A B C D E 2.54 ±0.15 0.89 ±0.10 0.76 ±0.10 0.80 ±0.10 0.45 ±0.10 4 Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V Noble Metal Electrode SELECTION CHART C (pF) LAST TWO DIGITS OF 12NC 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10000 12000 15000 18000 22000 27000 33000 39000 47000 56000 68000 82000 100000 14 15 16 17 18 19 21 22 23 24 25 26 27 28 29 31 32 33 34 35 36 37 38 39 41 42 43 44 45 46 47 48 49 16 V 25 V 50 V 0612 (4 × 0603) 0.8 ±0.1 0.8 ±0.1 0.8 ±0.1 1.2 ±0.1 Values in shaded cells indicate thickness classification. Thickness classification and packaging quantities 8 mm TAPE WIDTH AMOUNT PER REEL THICKNESS CLASSIFICATION (mm) 0.8 ±0.1 1.2 ±0.1 2000 Jul 18 ∅180 mm; 7" ∅330 mm; 13" PAPER BLISTER PAPER BLISTER 4000 4000 4000 4000 10000 10000 10000 10000 5 Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V Noble Metal Electrode ORDERING INFORMATION Components may be ordered by using either a simple 15-digit clear text code or Philips unique 12NC. Clear text code EXAMPLE: 06122R104K7B200 SIZE CODE TEMP. CHAR. 0612 (4 × 0603) 2R = X7R CAPACITANCE TOL. 104 = 100000 pF; the third digit signifies the multiplying factor: 1 = × 10 2 = × 100 3 = × 1000 4 = × 10000 K = ±10% M = ±20% VOLTAGE 7 = 16 V 8 = 25 V 9 = 50 V TERMINATION B = NiSn PACKAGING 2 = 180 mm; 7" paper 3 = 330 mm; 13" paper B = 180 mm; 7" blister F = 330 mm; 13" blister MARKING SERIES 0 = no marking 0 = conv. ceramic Ordering code 12NC handbook, full pagewidth 2 2 X X X X X X 6 X X X Capacitance value(1) Carrier type 50 blister 55 paper Tolerance 6 ±10% 7 ±20% Rated voltage - Termination 10 16 V; NiSn 12 25 V; NiSn 14 50/63 V; NiSn Size 6 0612 (4 × 0603) CCB549 Packaging(2) 1 reel: ∅180 mm; 7" 5 reel: ∅330 mm; 13" (1) Refer to chapter “Selection chart”. (2) Amount on reel depends on thickness classification, see section “Thickness classification and packaging quantities”. 2000 Jul 18 6 Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V Noble Metal Electrode ELECTRICAL CHARACTERISTICS FOR CLASS 2, CAPACITORS Class 2 capacitors; X7R dielectric; NiSn terminations Unless otherwise stated all electrical values apply at an ambient temperature of 23 ±3 °C, an atmospheric pressure of 86 to 106 kPa, and a relative humidity of 63 to 67%. DESCRIPTION VALUE Capacitance (E12 series): 16 V 10 nF to 100 nF 25 V 10 nF to 68 nF 50 V 220 pF to 10 nF Tolerance on capacitance after 1000 hours ±10%; ±20% Test voltage (DC) for 1 minute 2.5 × UR Tan δ; note 1: 16 V ≤3.5% 25 V and 50 V ≤2.5% Insulation resistance after 1 minute at UR (DC): C ≤ 10 nF Rins × C ≥ 105 MΩ C > 10 nF Rins × C > 1000 s Ageing typical 1% per time decade Note 1. Measured at 1 V, 1 kHz, using a four-gauge method. 2000 Jul 18 7 Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V Noble Metal Electrode CCB558 CCB559 0 600 handbook, halfpage handbook, halfpage ∆C C (%) tan δ (× 10−4) 1 −20 400 1 2 2 3 3 −40 200 −60 0 20 40 VDC (V) 0 −60 60 Curve 1 = 16 V product. Curve 2 = 25 V product. Curve 3 = 50 V product. Fig.4 Typical capacitance change with respect to the capacitance at 1 V as a function of DC voltage at 25 °C. CCB560 10 5 0 −5 −10 Fig.6 2000 Jul 18 −20 60 100 140 T (°C) Fig.5 Typical tan δ as a function of temperature. 15 −15 −60 20 Curve 1 = 16 V product. Curve 2 = 25 V product. Curve 3 = 50 V product. handbook, ∆C halfpage C (%) −20 20 60 100 140 T (°C) Typical capacitance change as a function of temperature. 8 Philips Components Product specification Surface mount ceramic multilayer capacitors C-Array: Class 2, X7R 16 V, 25 V and 50 V Noble Metal Electrode TESTS AND REQUIREMENTS Table 3 Test procedures and requirements IEC IEC 60384-10/ 60068-2 CECC 32 100 TEST CLAUSE METHOD TEST PROCEDURE REQUIREMENTS 4.4 mounting the capacitors may be mounted no visible damage on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive 4.5 visual inspection and any applicable method using dimension check ×10 magnification in accordance with specification 4.6.1 capacitance f = 1 kHz; measuring voltage (measured 1 Vrms at 20 °C 1000 hours after date of manufacture) within specified tolerance 4.6.2 tan δ in accordance with specification 4.6.3 insulation resistance at UR (DC) for 1 minute f = 1 kHz; measuring voltage 1 Vrms at 20 °C in accordance with specification 4.6.4 voltage proof 2.5 × UR for 1 minute no breakdown or flashover 4.7.1 temperature characteristic between minimum and maximum temperature in accordance with specification 4.8 adhesion a force of 5 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate no visible damage 4.9 bond strength of plating on end face mounted in accordance with IEC 60384 10, paragraph 4.4 no visible damage ∆C/C: ±10% conditions: bending 1 mm at a rate of 1 mm/s, radius jig 340 mm 4.10 2000 Jul 18 Tb resistance to soldering heat; jig clamps to the second component in the longitudinal line 260 ±5 °C for 10 ±0.5 s in a static the terminations shall be well solder bath tinned after recovery resistance to leaching; jig clamps to the second component in the longitudinal line 260 ±5 °C for 30 ±1 s in a static solder bath ∆C/C: ±10% 9 using visual enlargement of ×10, dissolution of the terminations shall not exceed 10% Philips Components Product specification Surface mount ceramic multilayer capacitors IEC IEC 60384-10/ 60068-2 CECC 32 100 TEST CLAUSE METHOD TEST C-Array: Class 2, X7R 16 V, 25 V and 50 V Noble Metal Electrode PROCEDURE REQUIREMENTS 4.11 Ta solderability; jig clamps to the second component in the longitudinal line zero hour test, and test after storage (20 to 24 months) in original packing in normal atmosphere; unmounted chips completely immersed for 2 ±0.5 s in a solder bath at 235 ±5 °C the terminations shall be well tinned 4.12 Na rapid change of temperature preconditioning: between minimum and maximum temperature, 5 cycles no visible damage after 24 hours recovery: ∆C/C: ≤15% 4.14 Ca damp heat preconditioning: 56 days at 40 °C; 90 to 95% RH; UR applied after 48 hours recovery: ∆C/C: ±15% tan δ: 7% Rins: 1000 MΩ or RiCR ≥ 25 s, whichever is less 4.15 2000 Jul 18 endurance preconditioning: 2 × UR at 125 °C for 1000 hours, recovery 48 ±4 hours at room temperature 10 after 48 hours recovery: ∆C/C: ±20% tan δ: 7% Rins: 2000 MΩ or RiCR ≥ 50 s, whichever is less