ETC 2.25511E+11

DISCRETE CERAMICS
DATA SHEET
C-Array: Class 2, X7R 16 V, 25 V
and 50 V
Noble Metal Electrode
Surface mount ceramic
multilayer capacitors
Product specification
Supersedes data of 1st November 1999
File under Discrete Ceramics, ACM2
2000 Jul 18
Philips Components
Product specification
Surface mount ceramic
multilayer capacitors
FEATURES
• 0612 (4 × 0603) capacitors (of the
same capacitance value) per array
• Less than 50% board space of an
equivalent discrete component
• High volumetric efficiency
• Dense dielectric layers
• Supplied in tape on reel or loose in
bag
C-Array: Class 2, X7R 16 V, 25 V and 50 V
Noble Metal Electrode
QUICK REFERENCE DATA
DESCRIPTION
VALUE
Rated voltage UR (DC)
16 V; 25 V; 50 V (IEC)
Capacitance (E12 series):
16 V
10 nF to 100 nF
25 V
10 nF to 68 nF
50 V
220 pF to 10 nF
Tolerance on capacitance
±10%; ±20%
• Increased throughput, by time
saved in mounting
Sectional specifications
IEC 60384-10, second edition 1989-04;
also based on CECC 32 100
• Cost savings on manufacturing
time.
Detailed specification
based on CECC 32 101-801
Climatic category (IEC 6068)
55/125/56
APPLICATIONS
• Professional electronics
• High density consumer electronics
• Automotive.
handbook, halfpage
DESCRIPTION
Each capacitor element consists of a
rectangular block of ceramic dielectric
in which a number of interleaved
precious metal electrodes are
contained. This structure gives rise to
a high capacitance per unit volume.
CCA833
Fig.1 Simplified outline.
The inner electrodes are connected to
the two terminations, silver dipped
with a barrier layer of plated nickel
and finally covered with a layer of
plated tin (NiSn). An outline of the
structure is shown in Fig.1.
2000 Jul 18
2
Philips Components
Product specification
Surface mount ceramic
multilayer capacitors
C-Array: Class 2, X7R 16 V, 25 V and 50 V
Noble Metal Electrode
MECHANICAL DATA
T
L
handbook, 4 columns
W
B
CCB404
P
A
For dimensions see Table 1.
Fig.2 Dimensional outline.
Physical dimensions
Table 1
Capacitor dimensions for product size 0612 (4 × 0603); see Fig.2
CASE
SIZE
T
L
W
MIN.
MAX.
0.80 ±0.10
1.20 ±0.10
A
B
P
0.40 ±0.1
0.30 ±0.2
0.80 ±0.1
Dimensions in millimetres
0612
(4 × 0603)
3.20 ±0.15
1.60 ±0.15
Dimensions in inches
0612
0.125 ±0.006 0.063 ±0.006 0.032 ±0.004 0.048 ±0.004 0.016 ±0.004 0.012 ±0.008 0.031 ±0.004
(4 × 0603)
2000 Jul 18
3
Philips Components
Product specification
Surface mount ceramic
multilayer capacitors
C-Array: Class 2, X7R 16 V, 25 V and 50 V
Noble Metal Electrode
DIMENSIONS OF SOLDER LANDS
E
D
B
handbook, 4 columns
A
C
CCC314
solder land
For dimensions see Table 2.
Fig.3 Recommended dimensions of solder lands.
Table 2
Solder land dimensions; see Fig.3
FOOTPRINT DIMENSIONS
(mm)
CASE
SIZE
0612
(4 × 0603)
2000 Jul 18
A
B
C
D
E
2.54 ±0.15
0.89 ±0.10
0.76 ±0.10
0.80 ±0.10
0.45 ±0.10
4
Philips Components
Product specification
Surface mount ceramic
multilayer capacitors
C-Array: Class 2, X7R 16 V, 25 V and 50 V
Noble Metal Electrode
SELECTION CHART
C
(pF)
LAST TWO DIGITS
OF 12NC
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
10000
12000
15000
18000
22000
27000
33000
39000
47000
56000
68000
82000
100000
14
15
16
17
18
19
21
22
23
24
25
26
27
28
29
31
32
33
34
35
36
37
38
39
41
42
43
44
45
46
47
48
49
16 V
25 V
50 V
0612 (4 × 0603)
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
1.2 ±0.1
Values in shaded cells indicate thickness classification.
Thickness classification and packaging quantities
8 mm TAPE WIDTH
AMOUNT PER REEL
THICKNESS
CLASSIFICATION
(mm)
0.8 ±0.1
1.2 ±0.1
2000 Jul 18
∅180 mm; 7"
∅330 mm; 13"
PAPER
BLISTER
PAPER
BLISTER
4000
4000
4000
4000
10000
10000
10000
10000
5
Philips Components
Product specification
Surface mount ceramic
multilayer capacitors
C-Array: Class 2, X7R 16 V, 25 V and 50 V
Noble Metal Electrode
ORDERING INFORMATION
Components may be ordered by using either a simple 15-digit clear text code or Philips unique 12NC.
Clear text code
EXAMPLE: 06122R104K7B200
SIZE
CODE
TEMP.
CHAR.
0612
(4 × 0603)
2R = X7R
CAPACITANCE
TOL.
104 = 100000 pF;
the third digit
signifies the
multiplying factor:
1 = × 10
2 = × 100
3 = × 1000
4 = × 10000
K = ±10%
M = ±20%
VOLTAGE
7 = 16 V
8 = 25 V
9 = 50 V
TERMINATION
B = NiSn
PACKAGING
2 = 180 mm; 7" paper
3 = 330 mm; 13" paper
B = 180 mm; 7" blister
F = 330 mm; 13" blister
MARKING
SERIES
0 = no marking
0 = conv.
ceramic
Ordering code 12NC
handbook, full pagewidth
2 2 X X
X X X
X 6 X X X
Capacitance value(1)
Carrier type
50 blister
55 paper
Tolerance
6 ±10%
7 ±20%
Rated voltage - Termination
10 16 V; NiSn
12 25 V; NiSn
14 50/63 V; NiSn
Size
6 0612 (4 × 0603)
CCB549
Packaging(2)
1 reel: ∅180 mm; 7"
5 reel: ∅330 mm; 13"
(1) Refer to chapter “Selection chart”.
(2) Amount on reel depends on thickness classification, see section “Thickness classification and packaging quantities”.
2000 Jul 18
6
Philips Components
Product specification
Surface mount ceramic
multilayer capacitors
C-Array: Class 2, X7R 16 V, 25 V and 50 V
Noble Metal Electrode
ELECTRICAL CHARACTERISTICS FOR CLASS 2, CAPACITORS
Class 2 capacitors; X7R dielectric; NiSn terminations
Unless otherwise stated all electrical values apply at an ambient temperature of 23 ±3 °C, an atmospheric pressure of
86 to 106 kPa, and a relative humidity of 63 to 67%.
DESCRIPTION
VALUE
Capacitance (E12 series):
16 V
10 nF to 100 nF
25 V
10 nF to 68 nF
50 V
220 pF to 10 nF
Tolerance on capacitance after 1000 hours
±10%; ±20%
Test voltage (DC) for 1 minute
2.5 × UR
Tan δ; note 1:
16 V
≤3.5%
25 V and 50 V
≤2.5%
Insulation resistance after 1 minute at UR (DC):
C ≤ 10 nF
Rins × C ≥ 105 MΩ
C > 10 nF
Rins × C > 1000 s
Ageing
typical 1% per time decade
Note
1. Measured at 1 V, 1 kHz, using a four-gauge method.
2000 Jul 18
7
Philips Components
Product specification
Surface mount ceramic
multilayer capacitors
C-Array: Class 2, X7R 16 V, 25 V and 50 V
Noble Metal Electrode
CCB558
CCB559
0
600
handbook, halfpage
handbook, halfpage
∆C
C
(%)
tan δ
(× 10−4)
1
−20
400
1
2
2
3
3
−40
200
−60
0
20
40
VDC (V)
0
−60
60
Curve 1 = 16 V product.
Curve 2 = 25 V product.
Curve 3 = 50 V product.
Fig.4
Typical capacitance change with respect
to the capacitance at 1 V as a function
of DC voltage at 25 °C.
CCB560
10
5
0
−5
−10
Fig.6
2000 Jul 18
−20
60
100
140
T (°C)
Fig.5 Typical tan δ as a function of temperature.
15
−15
−60
20
Curve 1 = 16 V product.
Curve 2 = 25 V product.
Curve 3 = 50 V product.
handbook,
∆C halfpage
C
(%)
−20
20
60
100
140
T (°C)
Typical capacitance change as
a function of temperature.
8
Philips Components
Product specification
Surface mount ceramic
multilayer capacitors
C-Array: Class 2, X7R 16 V, 25 V and 50 V
Noble Metal Electrode
TESTS AND REQUIREMENTS
Table 3
Test procedures and requirements
IEC
IEC
60384-10/
60068-2
CECC 32 100
TEST
CLAUSE
METHOD
TEST
PROCEDURE
REQUIREMENTS
4.4
mounting
the capacitors may be mounted
no visible damage
on printed-circuit boards or
ceramic substrates by applying
wave soldering, reflow soldering
(including vapour phase
soldering) or conductive adhesive
4.5
visual inspection and any applicable method using
dimension check
×10 magnification
in accordance with specification
4.6.1
capacitance
f = 1 kHz; measuring voltage
(measured
1 Vrms at 20 °C
1000 hours after
date of manufacture)
within specified tolerance
4.6.2
tan δ
in accordance with specification
4.6.3
insulation resistance at UR (DC) for 1 minute
f = 1 kHz; measuring voltage
1 Vrms at 20 °C
in accordance with specification
4.6.4
voltage proof
2.5 × UR for 1 minute
no breakdown or flashover
4.7.1
temperature
characteristic
between minimum and maximum
temperature
in accordance with specification
4.8
adhesion
a force of 5 N applied for 10 s to
the line joining the terminations
and in a plane parallel to the
substrate
no visible damage
4.9
bond strength of
plating on end face
mounted in accordance with
IEC 60384 10, paragraph 4.4
no visible damage
∆C/C: ±10%
conditions: bending
1 mm at a rate of 1 mm/s,
radius jig 340 mm
4.10
2000 Jul 18
Tb
resistance to
soldering heat; jig
clamps to the
second component
in the longitudinal
line
260 ±5 °C for 10 ±0.5 s in a static the terminations shall be well
solder bath
tinned after recovery
resistance to
leaching; jig clamps
to the second
component in the
longitudinal line
260 ±5 °C for 30 ±1 s in a static
solder bath
∆C/C: ±10%
9
using visual enlargement of
×10, dissolution of the
terminations shall not
exceed 10%
Philips Components
Product specification
Surface mount ceramic
multilayer capacitors
IEC
IEC
60384-10/
60068-2
CECC 32 100
TEST
CLAUSE
METHOD
TEST
C-Array: Class 2, X7R 16 V, 25 V and 50 V
Noble Metal Electrode
PROCEDURE
REQUIREMENTS
4.11
Ta
solderability; jig
clamps to the
second component
in the longitudinal
line
zero hour test, and test after
storage (20 to 24 months) in
original packing in normal
atmosphere;
unmounted chips completely
immersed for 2 ±0.5 s in a solder
bath at 235 ±5 °C
the terminations shall be well
tinned
4.12
Na
rapid change of
temperature
preconditioning:
between minimum and maximum
temperature, 5 cycles
no visible damage
after 24 hours recovery:
∆C/C: ≤15%
4.14
Ca
damp heat
preconditioning:
56 days at 40 °C; 90 to 95% RH;
UR applied
after 48 hours recovery:
∆C/C: ±15%
tan δ: 7%
Rins: 1000 MΩ or RiCR ≥ 25 s,
whichever is less
4.15
2000 Jul 18
endurance
preconditioning:
2 × UR at 125 °C for 1000 hours,
recovery 48 ±4 hours at room
temperature
10
after 48 hours recovery:
∆C/C: ±20%
tan δ: 7%
Rins: 2000 MΩ or RiCR ≥ 50 s,
whichever is less