BallLock™ BGA Socket Covered by patents and/or patents applied for. FEATURES: • Any grid size available on either 1.27mm [.050”] or 1.50mm [.059”] pitch. • Lidless design - ball locks into two-fingered contact. • Ultra-low profile socket adds only .050 [1.27] to overall package height (.100 [2.54] with SnapAdapt™ pins). • Optional Corner guides aid in package insertion (not used with SnapAdapt™ pins). • Consult Data Sheet Nos. 23003 and 23004 for Aries BallNest™ Socket. SPECIFICATIONS: • Socket body is UL 94V-0 FR-4. • Optional lead-in guides are black UL 94V-0 glass-filled Thermoplastic (PPS). • Contacts are Beryllium Copper Alloy per QQ-C-533. • Contact plating is either 100µ [2.54µm] min. 90/10 Tin/Lead per MIL-T10727 or 10µ [.25µm] min. Gold per MIL-G-45204 over 30µ [.76µm] Nickel per QQ-N-290. • Solder ball terminations are 90/10 Lead/Tin. • Solder paste is 63/37 eutectic. • Solder mask is “dryfilm.” • Inductance≤1ηH/cont. @ 100MHz approx. (under testing). • Capacitance≤1pf/contact @ 100MHz approx. (under testing). • Contact resistance=10mOhms initial, 20mOhms @10 cycles (under testing). • Durability=10 cycles max.; up to 50 cycles with SnapAdaptTM pin. • Insertion Force=50 grams/contact avg. (approximate); 40 grams/contact initial when used with SnapAdaptTM pin. • Withdrawal Force=20 grams/contact max. (approximate). • Socket accepts BGA devices with .030 [.76] dia. balls. MOUNTING CONSIDERATIONS: • Suggested PCB pad size=.025±.003 [.64±.08] dia. ALL Note: Aries specializes in custom design and production. In addition to the standard products shown on this page, special materials, platings, sizes, and configurations can be furnished, depending on quantities. Aries reserves the right to change product specifications without notice. ORDERING INFORMATION (for socket w/out corner guides only) XXX-BGXXXXX-7XX No. of positions (256 shown) Ball Grid Array Footprint designator (assigned by factory) DIMENSIONS: INCHES [MILLIMETERS] All tolerances ± .005 [.13] Pitch U=1.50mm V=1.27mm Plating: 0=Tin 1=Gold Contact Type: 7=BallLock surface mount solder ball contact “A”=BGA PACKAGE SIZE + .085 [2.29] unless otherwise specified “B”=(NO. OF POSITIONS PER ROW - 1) X BGA PITCH “C”=BGA PACKAGE SIZE + .015 [.25] Use Aries’ BGA Note: Part number assigned by “D”=BGA PACKAGE SIZE + .060 [1.52] factory when ordering Order Sheet, Data socket with corner guides. Sheet No. 23000, for prompt quotations. BGA Package with SMT SnapAdapt™ pins in lieu of solder balls. Consult Data Sheet No. 23012 and 23013 for details. Optional corner guides BGA Package w/ .030 [.76] dia. solder balls BallLock™ CONTACT Corner guides not used with SnapAdapt™ pins. http://www.arieselec.com • [email protected] NORTH AMERICA Frenchtown, NJ USA TEL: (908) 996-6841 FAX: (908) 996-3891 UK/IRELAND/GB TEL: +44 870 240 0249 FAX: +44 1653 600493 [email protected] EUROPE/MAINLAND/HOLLAND TEL: +31 78 615 94 65 FAX: +31 78 615 43 11 23002 [email protected] REV.E PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED