INTEGRATED CIRCUITS 74AVC16836A 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) Product specification Supersedes data of 2000 May 02 This Material Copyrighted by Its Respective Manufacturer 2000 Aug 03 Philips Semiconductors Product specification 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) FEATURES 74AVC16836A PIN CONFIGURATION • Wide supply voltage range of 1.2 V to 3.6 V • Complies with JEDEC standard no. 8-1A/5/7. • CMOS low power consumption • Input/output tolerant up to 3.6 V • DCO (Dynamic Controlled Output) circuit dynamically changes output impedance, resulting in noise reduction without speed degradation • Low inductance multiple VCC and GND pins for minimum noise and ground bounce • Power off disables 74AVC16836A outputs, permitting Live Insertion • Integrated input diodes to minimize input overshoot and undershoot • Full PC133 solution provided when used with PCK2509S or PCK2510S and CBT16292 DESCRIPTION The 74AVC16836A is a 20-bit universal bus driver. Data flow is controlled by output enable (OE), latch enable (LE) and clock inputs (CP). This product is designed to have an extremely fast propagation delay and a minimum amount of power consumption. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor (Live Insertion). A Dynamic Controlled Output (DCO) circuitry is implemented to support termination line drive during transient. See the graphs on page 8 for typical curves. CP OE 1 56 Y0 2 55 A0 Y1 3 54 A1 GND 4 53 GND Y2 5 52 A2 Y3 6 51 A3 VCC 7 50 VCC Y4 8 49 A4 Y5 9 48 A5 Y6 10 47 A6 GND 11 46 GND Y7 12 45 A7 Y8 13 44 A8 Y9 14 43 A9 Y10 15 42 A10 Y11 16 41 A11 Y12 17 40 A12 GND 18 39 GND Y13 19 38 A13 Y14 20 37 A14 Y15 21 36 A15 VCC 22 35 VCC Y16 23 34 A16 Y17 24 33 A17 GND 25 32 GND Y18 26 31 A18 Y19 27 30 A19 NC 28 29 LE SH00159 QUICK REFERENCE DATA GND = 0 V; Tamb = 25°C; tr = tf ≤ 2.0 ns; CL = 30 pF. SYMBOL PARAMETER CONDITIONS tPHL/tPLH Propagation delay An to Yn VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V tPHL/tPLH Propagation delay LE to Yn; CP to Yn VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V CI Input capacitance CPD Power dissipation capacitance per buffer VI = GND to VCC1 TYPICAL UNIT 2.4 1.7 1.5 ns 2.7 2.1 1.7 ns 3.8 pF Outputs enabled 25 Output disabled 6 pF NOTE: 1. CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi + S (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in V; S (CL × VCC2 × fo) = sum of outputs. ORDERING INFORMATION PACKAGES 56-Pin Plastic Thin Shrink Small Outline (TSSOP) Type II 2000 Aug 03 This Material Copyrighted by Its Respective Manufacturer 2 TEMPERATURE RANGE ORDER CODE DRAWING NUMBER –40°C to +85°C 74AVC16836A DGG SOT364-1 853-2211 24282 Philips Semiconductors Product specification 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) PIN DESCRIPTION LOGIC SYMBOL (IEEE/IEC) PIN NUMBER SYMBOL 28 NC NAME AND FUNCTION No connection 2, 3, 5, 6, 8, 9, 10, 12, 13, 14, 15, 16, 17, 19, 20, 21, 23, 24, 26, 27 Y0 to Y19 4, 11, 18, 25, 32, 35, 39, 46, 53 GND Ground (0V) 7, 22, 35, 50 VCC 1 29 56 Data outputs OE 1 CP 56 LE 29 EN1 2C3 C3 G2 Y0 2 55 Positive supply voltage Y1 3 54 Output enable input (active LOW) 5 52 OE Y2 Y3 6 Latch enable input (active LOW) 8 49 LE Y4 Y5 9 48 Clock input Y6 10 47 Y7 12 45 Y8 13 44 Y9 14 43 Y10 15 42 Y11 16 41 Y12 17 40 Y13 19 38 Y14 20 37 Y15 21 36 Y16 23 34 Y17 24 33 26 31 27 30 CP 55, 54, 52, 51, 49, 48, 47, 45, 44, 43, 42, 41, 40, 38, 37, 36, 34, 33, 31, 30 74AVC16836A A0 to A19 Data inputs LOGIC SYMBOL OE Y18 CP Y19 1∇ 1 51 3D A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 SH00160 FUNCTION TABLE LE INPUTS D A1 Y1 LE CP TO THE 17 OTHER CHANNELS H L X Z ↑ SH00201 TYPICAL INPUT (DATA OR CONTROL) OUTPUTS OE LE CP A H X X X L L X L L L L X H H L H ↑ L L L H ↑ H H L H H X Y01 L H L X Y02 = = = = = Z HIGH voltage level LOW voltage level Don’t care High impedance “off” state LOW-to-HIGH level transition NOTES: 1. Output level before the indicated steady-state input conditions were established, provided that CP is high before LE goes low. 2. Output level before the indicated steady-state input conditions were established. VCC A1 SH00200 2000 Aug 03 This Material Copyrighted by Its Respective Manufacturer 3 Philips Semiconductors Product specification 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) 74AVC16836A SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM SDRAM 168-pin SDR SDRAM DIMM SDRAM BACK SIDE FRONT SIDE AVC16836A AVC16836A AVC16836A PCK2509S or PCK2510S The PLL clock distribution device and AVC registered drivers reduce signal loads on the memory controller and prevent timing delays and waveform distortions that would cause unreliable operation SW00409 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC VI VO Tamb tr, tf PARAMETER CONDITIONS MIN MAX UNIT DC supply voltage (according to JEDEC Low Voltage Standards) 1.65 2.3 3.0 1.95 2.7 3.6 V DC supply voltage (for low voltage applications) 1.2 3.6 V DC Input voltage range 0 3.6 V DC output voltage range; output 3-State 0 3.6 DC output voltage range; output HIGH or LOW state 0 VCC Operating free-air temperature range Input rise and fall times –40 +85 VCC = 1.65 to 2.3 V 0 30 VCC = 2.3 to 3.0 V 0 20 VCC = 3.0 to 3.6 V 0 10 V °C ns/V ABSOLUTE MAXIMUM RATINGS In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0 V). PARAMETER SYMBOL VCC CONDITIONS DC supply voltage RATING UNIT –0.5 to +4.6 V IIK DC input diode current VI t0 VI DC input voltage For all inputs1 IOK DC output diode current VO uVCC or VO t 0 VO DC output voltage; output 3-State Note 1 VO DC output voltage; output HIGH or LOW state Note 1 –0.5 to VCC +0.5 V IO DC output source or sink current VO = 0 to VCC IGND, ICC Tstg PTOT DC VCC or GND current Storage temperature range Power dissipation per package –plastic thin-medium-shrink (TSSOP) For temperature range: –40 to +125 °C above +55°C derate linearly with 8 mW/K NOTE: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2000 Aug 03 This Material Copyrighted by Its Respective Manufacturer 4 –50 mA –0.5 to 4.6 V "50 mA –0.5 to 4.6 V "50 mA "100 mA –65 to +150 °C 600 mW Philips Semiconductors Product specification 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) 74AVC16836A DC ELECTRICAL CHARACTERISTICS Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V). LIMITS SYMBOL PARAMETER TEST CONDITIONS Temp = -40°C to +85°C MIN VCC = 1.2 V VIH VIL VOH VOL II IOFF IOZ O ICC HIGH level Input voltage UNIT TYP1 MAX VCC – – 0.65VCC 0.9 – VCC = 2.3 to 2.7 V 1.7 1.2 – VCC = 3.0 to 3.6 V VCC = 1.65 to 1.95 V 2.0 1.5 – VCC = 1.2 V – – GND VCC = 1.65 to 1.95 V – 0.9 0.35VCC VCC = 2.3 to 2.7 V – 1.2 0.7 VCC = 3.0 to 3.6 V – 1.5 0.8 VCC = 1.65 to 3.6 V; VI = VIH or VIL; IO = –100 µA 0 20 VCC0.20 VCC – VCC = 1.65 V; VI = VIH or VIL; IO = –4 mA VCC0.45 VCC0.10 – VCC = 2.3 V; VI = VIH or VIL; IO = –8 mA VCC0.55 VCC0.28 – VCC = 3.0 V; VI = VIH or VIL; IO = –12 mA VCC0.70 VCC0.32 – VCC = 1.65 to 3.6 V; VI = VIH or VIL; IO = 100 µA – GND 0 20 0.20 VCC = 1.65 V; VI = VIH or VIL; IO = 4 mA – 0.10 0.45 VCC = 2.3 V; VI = VIH or VIL; IO = 8 mA – 0.26 0.55 VCC = 3.0 V; VI = VIH or VIL; IO = 12 mA – 0.36 0.70 Input In ut leakage current VCC = 3 3.6 6 V; VI = VCC or GND – 0.1 2.5 3-State output OFF-state current VCC = 0 V; VI or VO = 3.6 V – 0.1 10 VCC = 1.65 to 2.7 V; VI = VIH or VIL; VO = VCC or GND – 0.1 5 VCC = 3.0 to 3.6 V; VI = VIH or VIL; VO = VCC or GND – 0.1 10 VCC = 1.65 to 2.7 V; VI = VCC or GND; IO = 0 – 0.1 20 VCC = 3.0 to 3.6 V; VI = VCC or GND; IO = 0 – 0.2 40 LOW level Input voltage HIGH level output voltage g LOW level output voltage g 3 State output OFF-state 3-State OFF state current Quiescent supply current NOTE: 1. All typical values are at Tamb = 25°C. 2000 Aug 03 This Material Copyrighted by Its Respective Manufacturer 5 V V V V µA µA µA µA Philips Semiconductors Product specification 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) 74AVC16836A AC CHARACTERISTICS GND = 0 V; tr = tf ≤ 2.0 ns; CL = 30 pF LIMITS SYMBOL PARAMETER WAVEFORM VCC = 1.5 ± 0.1 V VCC = 1.2 V VCC = 3.3 ± 0.3 V VCC = 2.5 ± 0.2 V VCC = 1.8 ± 0.15 V MIN TYP1 MAX MIN TYP1 MAX MIN TYP1 MAX MIN MAX TYP UNIT Propagation delay An to Yn 1, 7 0.7 1.5 2.7 0.8 1.7 3.2 1.0 2.4 4.4 2.0 5.3 4.7 ns Propagation delay LE to Yn 2, 7 0.7 1.7 3.4 1.0 2.1 3.5 1.5 2.7 5.0 2.0 5.6 5.0 ns Propagation delay CP to Yn 3, 7 0.7 1.6 3.0 0.8 1.7 3.2 1.2 2.3 4.1 2.0 4.7 5.7 ns tPZH/tPZL 3-State output enable time OE to Yn 6, 7 1.0 1.9 3.6 1.0 2.4 4.0 1.5 3.0 5.4 2.5 6.8 6.0 ns tPHZ/tPLZ 3-State output disable time OE to Yn 6, 7 1.0 2.5 4.8 1.0 2.1 4.7 1.5 3.7 7.5 2.5 7.6 6.6 ns CP pulse width HIGH or LOW 3, 7 1.0 – – 1.2 – – 2.0 – – – – – ns LE pulse width HIGH 2, 7 1.0 – – 1.2 – – 2.0 – – – – – ns Set-up time An to CP 5, 7 0.2 0 – 0.3 0 – 0.2 0 – 0.3 – 0 ns Set-up time An to LE 4, 7 0.3 0 – 0.6 0.2 – 0.9 0.4 – 1.3 – 1.2 ns Hold time An to CP 5, 7 1.2 0.5 – 0.6 0.2 – 0.6 0.2 – 0.6 – 0.1 ns Hold time An to LE 4, 7 1.0 0.5 – 0.5 0.1 – 0.4 0 – 0.2 – –0.7 ns Maximum clock pulse frequency 3, 7 500 – – 400 – – 250 – – – – – MHz tPHL/tPLH tW tSU S th fmax NOTE: 1. All typical values are measured at Tamb = 25°C and at VCC = 1.8 V, 2.5 V, 3.3 V. 2000 Aug 03 This Material Copyrighted by Its Respective Manufacturer 6 Philips Semiconductors Product specification 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) 74AVC16836A ÉÉÉ ÉÉÉÉÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉÉÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉÉÉÉÉÉ ÉÉÉ AC WAVEFORMS FOR VCC = 3.0 V TO 3.6 V RANGE VI VM = 0.5 VCC VX = VOL + 0.300 V VY = VOH – 0.300 V VOL and VOH are the typical output voltage drop that occur with the output load. VI = VCC An INPUT VM GND th th tSU tSU VI LE INPUT AC WAVEFORMS FOR VCC = 2.3 V TO 2.7 V AND VCC < 2.3 V RANGE VM GND NOTE: The shaded areas indicate when the input is permitted to change for predictable output performance. VM = 0.5VCC at VCC = 2.3 to 2.7 V SH00166 VM = 0.5 VCC VX = VOL + 0.15 V VY = VOH – 0.15 V VOL and VOH are the typical output voltage drop that occur with the output load. VI = VCC Waveform 4. Data set-up and hold times for the An input to the LE input VI VI VM CP INPUT An INPUT VM GND GND tsu tsu tPLH tPHL VI Yn OUTPUT An INPUT VM GND VOL NOTE: VM = 0.5VCC at VCC = 2.3 to 2.7 V ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉ th th VOH VOH SH00132 VM Yn OUTPUT Waveform 1. Input (An) to output (Yn) propagation delay VOL NOTE: The shaded areas indicate when the input is permitted to change for predictable output performance. VM = 0.5VCC at VCC = 2.3 to 2.7 V SH00136 VI LE INPUT VM VM Waveform 5. Data set-up and hold times for the An input to the clock CP input tW GND tPHL tPLH VOH VI VM Yn OUTPUT VOL nOE INPUT VM NOTE: VM = 0.5 VCC at VCC = 2.3 to 2.7 V SH00165 GND Waveform 2. Latch enable input (LE) pulse width, the latch enable input to output (Yn) propagation delays. tPLZ tPZL VCC OUTPUT LOW-to-OFF OFF-to-LOW 1/fMAX VI CP INPUT GND VOL VM VM tPHZ tPZH tW tPHL VOH tPLH OUTPUT HIGH-to-OFF OFF-to-HIGH VOH Yn OUTPUT VM VX VM VY VM GND outputs enabled VOL NOTE: VM = 0.5VCC at VCC = 2.3 to 2.7 V 2000 Aug 03 outputs enabled SH00135 NOTE: VM = 0.5VCC at VCC = 2.3 to 2.7 V Waveform 3. The clock (CP) to Yn propagation delays, the clock pulse width and the maximum clock frequency. This Material Copyrighted by Its Respective Manufacturer outputs disabled SH00137 Waveform 6. 3-State enable and disable times 7 Philips Semiconductors Product specification 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) TEST CIRCUIT 74AVC16836A GRAPHS S1 3.5 RL VO VI PULSE GENERATOR 2 * VCC Open GND VOL OUTPUT VOLTAGE (V) VCC D.U.T. RT RL CL Test Circuit for switching times 3 2.5 VCC = 3.3 V 2 1.5 VCC = 2.5 V 1 VCC = 1.8 V 0.5 0 0 DEFINITIONS 50 100 150 200 250 I OL OUTPUT CURRENT (mA) RL = Load resistor CL = Load capacitance includes jig and probe capacitance RT = Termination resistance should be equal to ZOUT of pulse generators. SH00204 SWITCH POSITION TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH S1 Open 2 VCC GND VCC VI RL < 2.3 V VCC 1000 Ω 2.3–2.7 V VCC 500 Ω 3.0 V VCC 500 Ω Figure 1. Output voltage (VOL) vs. output current (IOL) 3.5 VOH OUTPUT VOLTAGE (V) SV01018 Waveform 7. Load circuitry for switching times 3.0 2.5 2.0 1.5 1.0 V = 3.3 V 0.5 CC 0.0 –250 VCC = 2.5 V –200 –150 VCC = 1.8 V –100 –50 0 I OH OUTPUT CURRENT (mA) SH00205 Figure 2. Output voltage (VOH) vs. output current (IOH) A Dynamic Controlled Output (DCO) circuit is designed in. During the transition, it initially lowers the output impedance to effectively drive the load and, subsequently, raises the impedance to reduce noise. Figures 1 and 2 show VOL vs. IOL and VOH vs. IOH curves to illustrate the output impedance and drive capability of the circuit. At the beginning of the signal transition, the DCO circuit provides a maximum dynamic drive that is equivalent to a high drive standard output device. 2000 Aug 03 This Material Copyrighted by Its Respective Manufacturer 8 Philips Semiconductors Product specification 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm 2000 Aug 03 This Material Copyrighted by Its Respective Manufacturer 9 74AVC16836A SOT364-1 Philips Semiconductors Product specification 20-bit registered driver with inverted register enable and Dynamic Controlled Outputs (3-State) 74AVC16836A Data sheet status Data sheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Copyright Philips Electronics North America Corporation 2000 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 Date of release: 08-00 Document order number: 2000 Aug 03 This Material Copyrighted by Its Respective Manufacturer 10 9397-750 07393